Hmm... Maybe we should call it a 'heating pad' and take two aspirin for the
inevitable head aches that are bound to follow... :)
LOL
Best regards,
Bill Brooks
PCB Design Engineer, C.I.D.+
Tel: (760)597-1500 Fax: (760)597-1510
Datron World Communications, Inc.
Vista, California
-----Original Message-----
From: Scott, Ron [mailto:[log in to unmask]]
Sent: Wednesday, January 31, 2007 2:42 PM
To: (Designers Council Forum); Brooks,Bill
Subject: RE: [DC] naming conventions?
All,
In my neck of the woods, this is called a thermal pad.The thermal pad
was introduced by TI and is used both as a thermal pad and to connect
ground directly to the substrate of ICs.
Cheers,
Ron Scott C.I.D+
Texas Instruments Inc
Storage Products Group
Tel: 214.567.4715
Cell: 972.816.7978
[log in to unmask]
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
Brooks,Bill
Sent: Wednesday, January 31, 2007 14:00
To: [log in to unmask]
Subject: [DC] naming conventions?
Leslie Gomez and I were discussing standards and Cad library symbols and
footprints and this subject came up...
The question has been asked... is there a 'standard' naming convention
for the large thermal pads used on the underside of chips like the QFN
package?
Some have called it a 'belly pad' others have called it a 'paddle
pin'...
some call it a 'die pad'.
What do you call it and has anyone coined a 'standard name' for it?
(Inquiring minds want to know...) :-)
Reference:
http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf
<http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf>
Best regards,
Bill Brooks - KG6VVP
PCB Design Engineer, C.I.D.+, C.I.I.
DATRON World Communications, Inc.
3030 Enterprise Court, Vista, CA 92083
http://www.dtwc.com
Tel: (760)597-1500 Fax: (760)597-1510
e-mail:[log in to unmask]
IPC Designers Council, San Diego Chapter
http://dcchapters.ipc.org/SanDiego/
Personal Website:
http://pcbwizards.com
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