Hi,

Just looked at the new SMT footprint (7351) spec and noticed the pads
are all round ended. Seems that over the years the spec has drifted from
square to round.

what benefits are there in fabrication, assembly, repair, test, ...

782 had some land patterns with full round preferred, some others
optional, yet others typical, although interestingly the picture often
was of a rounded corner not rounded end. All SOIC in 782 have square
corners, now in 7351 the SOIC have round ends, will the Chip comps and
SOTs too?

Does this have a scientific reason for it?

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