Good Morning,
I'm looking for the best way to specify solder mask thickness, 
particularly when it covers a via or pad, which causes a slight bump. This 
situation can cause excess solder paste on pads, after application using a 
5 mil thick stencil.  I've looked at the IPC-840-SM, but didn't find 
anything that looked like a NOTE, that I can add to my Fabrication 
Drawing.  Or maybe I just missed it.  What wording or diagram do you all 
use for this specification?  I appreciate any help you can be.
Thank You,
Kitty

Kitty Hines
ECAD Librarian/PCB Design CID+
Chamberlain Group, Inc.
(630)516-6655 office
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