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Subject:	LGA land pattern
From:	Mark Larson <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Tue, 26 Aug 2008 09:18:28 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (17 lines)

Hi,
does anybody have experience with designing footprints for a rectangular pad
on an LGA? the LGA is 5mm sq with 8 .35mm  .65mm rectagular metalization on
bottom. for those not familiar, an LGA is a BGA without the solder ball,
hence, cannot simply reduce pad size 80% of ball size

the specific LGA is a MEMSic MMC3002xM

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