Resolution 1 is what being used these day's... Even tent component
side and have solder side with drill size plus.15mm has been done on
ENIG designs... Should be good for HASL

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
Sanchez-Benavides, Erika
Sent: Thursday, May 31, 2007 10:10 AM
To: [log in to unmask]
Subject: [DC] Plated thru hole vias covered with soldermask on both
sides with HASL

Hi!

Due to the wave soldering process for PTH components, our assembly
process guideline indicate to cover vias with soldermask in those areas.
But as you know, Plated thru hole vias covered with soldermask on both
sides with HASL solder or other manufacturing chemicals might be clogged
in the vias and out-gas (blow out) during assembly or remain in the hole
and corroid the copping in the via.

There are two suggestions from our PCB suppliers:

 Resolution1: PCB supplier to add a clearance to the soldermask: (drill
size plus.15mm). 
	With this option, we are not going to have the via covered, but
I am not sure if this is enough
	to avoid problems (pearls, solder passing through the via...)
during wave soldering process.

Resolution2: PCB supplier will tent the vias on both sides by adding a
barrel relief to prevent their 
	assembly problems.

In your opinion, what would be the best option? Is there an alternative
option you may see?

Thank you very much in advance,

Erika E. Sanchez
Siemens VDO
Guadalajara Development Center
E-Mail: [log in to unmask]
Internet: http://www.siemensvdo.com

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