I like this approach and will try to see if they go for this approach... maybe with a reduction to a 10 mil spoke... Thanks...
Regard's, Frederick Dark Jr.
Manager Senior PCB Designer
Crestron Electronics, Inc.
22 Link Drive Rockleigh N.J. 07647
P:201.750.7004 ext.11320
F:210.767.5772
[log in to unmask]<mailto:[log in to unmask]>
________________________________
From: Philip Vanaria [mailto:[log in to unmask]]
Sent: Friday, March 22, 2013 11:47 AM
To: (Designers Council Forum); Fred Dark
Subject: Re: [DC] Heavy copper planes and thru-hole soldering
You could also increase the size of the anti-pad, keeping heat in the hole longer before
distributed to the plane.
Philip Vanaria C.I.D.
Solar Powered Design Services
Certified Interconnect Designer
IPC Designer Certification #10119
Ph. 603-887-0587
http://www.padsdesigner.com/
From: Fred Dark <[log in to unmask]>
To: [log in to unmask]
Sent: Friday, March 22, 2013 10:27 AM
Subject: [DC] Heavy copper planes and thru-hole soldering
Hi Designer council - I have a design where we have a power board that's 8 layers... the technology is surface mount and thru-hole... we are having soldering issues with the thru-hole parts getting the solder to wick up in to the barrel for IPC class 2... the most we have achieved is 30% of the barrel... the stack-up has 5 GND planes that these part connect to as a design requirement from the Ee... the planes are 2oz copper each and the thermals are 15mils that connect the thru-hole pin... component stack-up reference : .065dia pad, .085dia anti-pad and 4 - .015 spokes(45 degree angle), drill .035dia(FHS) component pin dia = .020dia... any suggestions..?
Regard's, Frederick Dark Jr.
Manager Senior PCB Designer
Crestron Electronics, Inc.
22 Link Drive Rockleigh N.J. 07647
P:201.750.7004 ext.11320
F:210.767.5772
[log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>>
This e-mail message and all attachments transmitted with it may contain legally privileged and confidential information intended solely for the use of the addressee. If you are not the intended recipient, you are hereby notified that any reading, dissemination, distribution, copying, or other use of this message or its attachments is strictly prohibited.
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]>
______________________________________________________________________
---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 16.0.
To unsubscribe, send a message to [log in to unmask]<mailto:[log in to unmask]> with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To temporarily stop/(restart) delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL/(MAIL)
For additional information, or contact Keach Sasamori at [log in to unmask]<mailto:[log in to unmask]> or 847-615-7100 ext.2815
---------------------------------------------------------------------------------
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 16.0.
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To temporarily stop/(restart) delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL/(MAIL)
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
---------------------------------------------------------------------------------
|
