Harry Charles, of the Applied Physics Lab at Johns Hopkins University,
wrote about a design tool that investigates trade-offs between technology
and cost for MCM applications.
See his paper "Cost versus technology trade-offs for multichip modules",
p. 295-300, in ISHM's (now IMAPS') International Journal of Microcircuits
and Electronic Packaging, vol.19, no.3, 3rd Quarter 1996. In the article
he discusses the design tool MCM DATA (tm) . The results of this tool as
applied to three MCM applications are also summarized.
I'm curious as to anyone's experience in using this tool.
Hope this helps.
Michael S. Alderete
Sr. Engineer, packaging
Aerojet Corp.
PO Box 0296
Azusa, CA 91702-0296
818-812-2216 FAX
EMAIL:
[log in to unmask]
----------
From: michael.jeremias[SMTP:[log in to unmask]]
Sent: Friday, June 27, 1997 7:14 AM
To: TechNet; DesignerCouncil
Cc: jeremias
Subject: Expert Systems
Dear collegues,
Who has experiences with expertsystems or knowledge based systems in the
fields as follow ?
Design of PCBs - Multichipmodules (cost estimations,
designspecification, architecture, substrat selection)-
Are shells available?
I am looking forward to contributions?
Daimler-Benz Aerospace
Technical Operations
Michael Jeremias
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