Hello All, I recently has a problem with one of our venders... We received some boards that had ATE\ICT testpoints using vias... However the vias had soldermask in the barrel of the vias and the ATE\ICT test probe did not make contact... We have had the below note on our drawing for years and never had this problem, only with this specific vender... Would the note below be appropriate, or should there be more to it... I would appreciate the input...


Regard's, Fred Dark Jr.


4. SOLDER MASK: USE SMOBC PROCESS (SOLDER MASK OVER BARE COPPER).  SOLDER
MASK TO BE LPI (LIQUID PHOTO IMAGEABLE), WITH VIA HOLES PLUGGED, APPLIED TO
BOTH SIDES PER THE APPROPRIATE ARTWORK LAYER.  SOLDER MASK REGISTRATION
SHALL BE +/- .005

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