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December 2017

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Subject:
From:
Jack Olson <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Wed, 6 Dec 2017 09:31:31 -0600
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text/plain (59 lines)
Thanks everyone for the responses.

If people are still using them,
and it is being added to the CID course,
doesn't it seem like there should at least be a sentence about it in the
Land Pattern Standard IPC-7351?
(personally, I like the idea of using u-shaped paste screen apertures, if
that works as well)

On Mon, Dec 4, 2017 at 12:38 PM, Wecome Cherie <[log in to unmask]> wrote:

> HI Jack,
>
> Yes. Kate Mayer added this to the latest CID course as the best way to
> deal with MELF's. It still works and is the most reliable footprint that
> you can use with them. The trick is to take the solder mask out from
> underneath the component as well. I can send you a snapshot if you need one.
>
> Cherie Litson
>
> In a message dated 12/4/2017 8:56:59 AM Pacific Standard Time,
> [log in to unmask] writes:
>
> I am using MELF components on my current design,
> which I haven't seen much this century.
> But I remember way back when we used "U-shaped" land shapes.
>
> I notice the current Land Pattern standard (IPC-7351) recommends
> rectangular,
> but at least one person has wondered if we should use U-shaped "just in
> case".
> I generally resist that kind of philosophy unless there is science behind
> it.
> Is anyone using U-shaped pads anymore?
> (Is anyone using MELFs anymore? (smile))
>
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