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Reply To: | (Designers Council Forum) |
Date: | Wed, 6 Dec 2017 09:31:31 -0600 |
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Thanks everyone for the responses.
If people are still using them,
and it is being added to the CID course,
doesn't it seem like there should at least be a sentence about it in the
Land Pattern Standard IPC-7351?
(personally, I like the idea of using u-shaped paste screen apertures, if
that works as well)
On Mon, Dec 4, 2017 at 12:38 PM, Wecome Cherie <[log in to unmask]> wrote:
> HI Jack,
>
> Yes. Kate Mayer added this to the latest CID course as the best way to
> deal with MELF's. It still works and is the most reliable footprint that
> you can use with them. The trick is to take the solder mask out from
> underneath the component as well. I can send you a snapshot if you need one.
>
> Cherie Litson
>
> In a message dated 12/4/2017 8:56:59 AM Pacific Standard Time,
> [log in to unmask] writes:
>
> I am using MELF components on my current design,
> which I haven't seen much this century.
> But I remember way back when we used "U-shaped" land shapes.
>
> I notice the current Land Pattern standard (IPC-7351) recommends
> rectangular,
> but at least one person has wondered if we should use U-shaped "just in
> case".
> I generally resist that kind of philosophy unless there is science behind
> it.
> Is anyone using U-shaped pads anymore?
> (Is anyone using MELFs anymore? (smile))
>
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