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March 2005

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Subject:
From:
George Patrick <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Fri, 18 Mar 2005 09:17:58 -0800
Content-Type:
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text/plain (72 lines)
I would think that most of the solder should wick out to form the meniscus
around the termination and leave the lead sitting pretty much on the pad.
This might be pretty off-base, so I would welcome rebuttals.

This brings up another English problem that came up recently here.  My
manager got all confused about leaded lead-free parts.  You know, the
through-hole (leaded) parts soldered by a lead-free wave.  He had everybody
in the lead-free team buzzing around here like a bunch of bees before we got
it explained to him :)

--
George Patrick
Tektronix, Inc.
Central Engineering, PCB Design Group
P.O. Box 500, M/S 39-512
Beaverton, OR 97077-0001
Phone: 503-627-5272         Fax: 503-627-5587
http://www.tektronix.com    http://www.pcb-designer.com

It's my opinion, not Tektronix'



-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Jack C.
Olson
Sent: Friday, March 18, 2005 09:09
To: [log in to unmask]
Subject: [DC] Floating SMT components?


I have been asked a question that I've never read anything about before, so
I'm hoping someone will know this...

We have a mechanical engineer who is trying to predict the distance between
boards after soldering SMT board-to-board connectors. We know the connector
mating height, but the question is:

"If the connector is sitting in solder-paste, how high will it stay above
the surface of the board?"

Common sense tells me the connector will not be flush to the surface, there
will be some solder under there, and I think we are using 6mil paste
screens. Has anyone had to document something like this before?

Jack

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