Past and current use of micro vias (blind and buried) with no issues or
problems at this point using highly qualified suppliers. I'll show you my
pictures With blind vias, plated over, hope you don't mind small dimples on
SMT solder termination areas. This technology gets you down to the next
layer where the dogbone for under 1 mm pitch BGA's is located, etc.

Reliability issues still not resolved for long term but IPC-D-279 should
soon as will the joint IPC/JPCA- 2315 design guidelines from a design
perspective. Again, it all depends on the supplier process management
capabilities. More are coming forward without having done any of what you
request so beware. Mostly the technology you want has been done for some time.

MoonMan

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