I just finished reading an article that described adding silksreen
features in between pads on fine pitch components to create an
additional solder barrier between pads.  Does anyone have any experience
doing this?  What is the minimum spacing that you found this to be
effective?  How hard was it to control the registration?  Was this
screen print applied in addition to mask webbing? What was the width and
thickness of the screen print?  Ditron Manufacturing speciallizes in PCB
Assembly so you can imagine how helpful something this simple could be.
any information you can provide would greatly be appreciated.

What about using silkscreen barriers (Circles) around BGA pads?

I haven't used this method in actual practice but appreciate the theory

Talks in advance

Mike Gish
Sr. PCB Designer
Ditron Manufacturing, Inc.

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