DESIGNERCOUNCIL Archives

January 1998

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Subject:
From:
Ken Barrett <[log in to unmask]>
Reply To:
DesignerCouncil Mail Forum.
Date:
Wed, 21 Jan 1998 15:41:26 -0800
Content-Type:
text/plain
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text/plain (105 lines)
....and how does ipc2510-2519 play against Valor's ODB++ ?  Valor is
pushing this
big time these days.
Ken Barrett
Cisco Systems


Leonard Toohey wrote:
>
> All,
>
> Just finished an article in the January 98' issue of PC Fabrication that
> talks
> about yet another CAD to CAM "standard". This one is based on EDIF...
> >From what I gleaned from the article this Gertrude effort sounds like it
> has
> the exact same goals as the DTS effort.
>
> Question.... Are these really two seperate efforts with very similar
> goals?
> Please tell me it ain't so.....
>
> Thanks,
>
> LT
>
> > -----Original Message-----
> > From: Dieter Bergman [SMTP:[log in to unmask]]
> > Sent: Wednesday, September 10, 1997 8:15 AM
> > To:   [log in to unmask]
> > Subject:      Re: [DC] [DESIGNERCOUNCIL] IPC-2511
> >
> > Ken,
> >
> > The IPC-2511 is one of a series of standards being developed under a
> > project that IPC calls Data Transfer Solution (DTS). It is work in
> > progress intended to improve the manner in which industry sends data
> > between design and manufacture and back.   DTS'97 calls the new format
> > GenCAM. It is based on the Mitron format and syntax known as GenCAD.
> > GenCAD is used by many companies to perform printed board assembly
> > functions.
> >
> > There are nine documents in GenCAM under the single number IPC-2510.
> > The 2511 provides generic descriptions of the format; 2512 is for
> > administrative data; 2513 for drawings; 2514 printed board
> > fabrication; 2515 bare board testing;  2516 assembly; 2517 in-circuit
> > test; 2518 list of materials, and 2519 information modelling
> > relationships.
> >
> > GenCAM like GenCAD is keyword driven and is a flat ASCII file.  The
> > file is divided into various sections to describe the information
> > necessary to build a board, assemble all the components, and test the
> > final product.  The committee is building on the strengths of GenCAD
> > and enhancing the format so that it covers both assembly and board
> > fabrication.
> >
> > We hope to have a proposal available for industry review by late 1997.
> > It will probably be posted for down loading on the IPC web site.  If
> > you are interested in working with the committee while they finish
> > their work please let me know.  We meet on the average every month and
> > review where we stand.  The next meeting is during IPCworks scheduled
> > to be held in Washington DC at the beginning of October.
> >
> > Harry Parkinson, DEC is the chairman of the project.  Let us know if
> > you would like more information.
> >
> > Dieter Bergman
> >
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