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1996

DesignerCouncil@IPC.ORG

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Subject:
From:
Dieter Bergman <[log in to unmask]>
Date:
Mon, 1 Apr 1996 16:08:32 -0600 (CST)
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The following question is one that was provided by designers for
the "A" basic level exam. It is NOT included in the final
published test and is for reference only. The topic is 
Copper Clad Laminate.

     ***********************************************************

130  What is the most commonly used resin system for producing
printed boards?
A.  PTFE
B.  epoxy
C.  polyimide
D.  cyanate ester

                                   select the most correct answer

     ***********************************************************
Previous QOD

129  What are the most common dielectric thicknesses of
copper-clad laminate used to produce double-sided printed boards?
     B.   .75 mm [.030"]
     D.  1.50 mm [.060"]
     F.  2.40 mm [.090"]


Resource: IPC-T-50 Specific Terms, IPC-D275 para.8.5.1, 8.6,
8.6.2

     *************************************************************

Please send comments, constructive critique, or suggestions to
Lisa Williams at 
[log in to unmask]

Dieter Bergman



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