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January 2006

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Subject:
From:
"Gary M. Koven" <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Tue, 3 Jan 2006 15:54:54 -0500
Content-Type:
text/plain
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text/plain (30 lines)
I've been tasked with developing a single-sided 1.6mm (0.062in)
aluminum-core PCB.

I'm looking for a boilerplate fabrication guideline for layup with
thicknesses of the aluminum core plate and the dielectric.

I will assume that the "finished thickness" would be over copper and
soldermask, same as for a traditional FR-4 board.

I probably do not have time to buy an IPC spec for aluminum-core design and
end-product requirements, but would appreciate also knowing what spec (in
the vein of IPC-6012) to put on the fab drawing.

Thanks and Best Regards,

----------------------------
Gary M. Koven, C.I.D.
Dynazign, Inc.
Charlotte, NC, USA
Veteran of the Marsh School

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