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Reply To: | (Designers Council Forum) |
Date: | Tue, 3 Jan 2006 15:54:54 -0500 |
Content-Type: | text/plain |
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I've been tasked with developing a single-sided 1.6mm (0.062in)
aluminum-core PCB.
I'm looking for a boilerplate fabrication guideline for layup with
thicknesses of the aluminum core plate and the dielectric.
I will assume that the "finished thickness" would be over copper and
soldermask, same as for a traditional FR-4 board.
I probably do not have time to buy an IPC spec for aluminum-core design and
end-product requirements, but would appreciate also knowing what spec (in
the vein of IPC-6012) to put on the fab drawing.
Thanks and Best Regards,
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Gary M. Koven, C.I.D.
Dynazign, Inc.
Charlotte, NC, USA
Veteran of the Marsh School
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