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June 2004

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Subject:	Re: VIA in Pad
From:	Dave Schaefer <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Fri, 25 Jun 2004 10:37:47 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (56 lines)

If "Via in Pad" refers to laser microvias, this is a fairly common practice,
and likely everyone owns a product (digital camera, cell phone, camcorder)
than uses this type of design.  If properly designed and fabricated you
should have no problems manufacturing the assembly.

Check the DC archives, as there's probably a wealth of information on the
subject.

Dave
 
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Tom
Parkinson
Sent: Friday, June 25, 2004 10:14 AM
To: [log in to unmask]
Subject: [DC] VIA in Pad

We're a CM.  One of our customers is asking us to build a board assembly
that will be using BGAs with VIAs in pads.  They are in the design stages at
this point, and we have some concerns with having a Via in the middle of a
BGA pad.  Anyone have suggestions and/or experience with this??

Thanks


Tom Parkinson - Quality System Manager - CIT
WinTronics, Inc.
Ph: 724-981-5770 Ext. 235
Fax: 724-981-1772
 

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