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Reply To: | (Designers Council Forum) |
Date: | Wed, 14 Mar 2007 21:28:57 -0500 |
Content-Type: | text/plain |
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You may already know this, but there are materials
with similar characteristics that are better suited to
multilayer constructions, if you can get away with it.
Maybe compare your needs to Rogers 4350?
We tried that on a previous project and it was good
enough for our 2.7GHz, and saved a ton of money too.
(My only experience with teflon is single-layer
circuits bonded to aluminum palettes, so I can't
help you with your real question.)
good luck,
Jack
On 3/13/07, Post, Devon <[log in to unmask]> wrote:
>
> Does anyone have a contact or companies that they work with, and are
> willing to share, that can build a multilayer board out of
> high-frequency teflon dielectrics using fusion bonding as their
> lamination method for these dielectrics.
>
> These would be research type boards with currently no mass production
> planned.
>
> Devon
>
> ========================================================================
> Devon J. Post - C.I.D. Mayo Foundation
> <mailto:[log in to unmask]> 200 First Street SW
> Voice: (507) 538-5479 Sn 2-134C
> Fax: (507) 284-9171 Rochester, MN 55905
> Internet: http://www.mayo.edu/sppdg/sppdg_home_page.html
> ========================================================================
>
>
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