Depending how good the fab. house is they may like the gang better due to
the fact that they can meet the individual pin/pad mask technic...

Regard's, Fred Dark Jr.

At 06:55 PM 2/2/2004 +0530, Oommen Mathews wrote:
>Hi.,
>
>
>     For fine pitch QFP and SOP components (.5 mm or less) which type of
> solder mask is preferred in a fab point of view ? Gang solder mask or
> individual pin/pad mask ?
>
>
>regards,
>Oommen Mathews
>
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