Subject: | |
From: | |
Reply To: | (Designers Council Forum) |
Date: | Wed, 2 Jan 2002 15:50:51 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Happy New Year To All,
In order to utilize our current equipment and better
eval the future equipment, I need to some help on the
3- 5 year future of Memory Product.
Typically, at this moment,
DDRDIMM, RIMM, DIMM are 5.25" L and 1 - 1.7" Height,
using from micro BGA, 16 mils pitch component, to 31
mils. For small component, 0402 is the smallest.
144 SODIMM is 2.66 L x 1 - 1.5 H, using the same
components as the above.
The ratio on DIMM is 4 small component/1 TSOP and 8/1
for DDR.
That is what I know for now. This would last for 1
year.
How about the future? Do you have any guild line from
Intel, ADM, Jedec? about component usage, small/big
component ratio, PCB outline? ...
Please advise.
Thanks,
Stacy
__________________________________________________
Do You Yahoo!?
Send your FREE holiday greetings online!
http://greetings.yahoo.com
---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|