Gentlemen,

Thanks for the response...  Hope youlle be patient coz I have lot of
questions for you...I am a bit confused... Im just new in the
business (about a year) . I need some you...

1.  I see that in IPC-SM-782 there are specified conductor thickness
with regards to routing grids... Pls. correct me if Im wrong.. I
specified in my DFM that  Table 3-1 of IPC-D-275 is also
applicable to SMT since 275 in general  discusses all types of board
technology (THT/SMT)...

2.  I am a quite confused with the use of the grid system...  Is
there a general grid system for THT (100 mils ?!?) and
SMT components ???  I use a general grid of 20 mils for pure THT
designs (component placement and routing)... is that correct ???
I havent started with SMT design coz' Im confused about using the
routing grid for components... Can you give me a sample (very plain)
of how to place then route the wires from the components...

3.  Is the rigid board gonna be obsolete ?!? Just curious because of
the technology rapidly growing...

4.  Is the term single-sided PCB with 2 layers the same as
double-sided ???  Is there a single sided board with an inner
layer (ground or power) and is it different from double-sided ???

5.  I dont know how to calculate for the RF leakage,EMI. that sort of
things ...Can you brief me on this...Pls. give a sample...

6.  If I follow the IPC standards,  what is the reliability of my
design ???

7.  Isnt it that in IPC-D-275,  there are different routing
techniques for analog and digital areas... Analog " power and ground
traces placed last "  Digital " power and ground planes first "...
Must that be followed always...  And how can I consider that this
area is now the digital or analog area...  Does it also mean that I
have  to separate, have different terminals, for the power and ground
connections for analog and digital ???

8.  Is air gap and Trace spacing same ???  I saw that for air gap
measure is taken from end of trace to end of another trace... while
in trace spacing, measure is taken from center to center of a trace,
its like measuring its pitch...am I correct ???  WHat will I follow ?

9.  Are footprints for all PCB softwares the same (standardized) ???

10. Any good websites  for SMT(Rigid and Flex manufacturing and
assembly)  learning/information ???

Thanks for your support... More power to the Council  !!!



Regards,
Engr. Jay Bitanga
Value Engineer
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