Subject: | |
From: | |
Reply To: | (Designers Council Forum) |
Date: | Tue, 26 Aug 2008 08:59:52 -0700 |
Content-Type: | text/plain |
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I used a couple Linear Tech #LTM4601EV#PBF (Digikey #LTM4601EV#PBF-ND)
118-Pin LGAs. I was fortunate to have a recommended land pattern in the
datasheet. If you're not using a Linear part, you can most likely find some
information on their website. The hard part is getting all the strapping
vias in between the pads, especially if your board is > 0.062".
PCB Libraries calculator would be a great help as suggested.
Jim
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Mark
Larson
Sent: Tuesday, August 26, 2008 7:18 AM
To: [log in to unmask]
Subject: [DC] LGA land pattern
Hi,
does anybody have experience with designing footprints for a rectangular pad
on an LGA? the LGA is 5mm sq with 8 .35mm .65mm rectagular metalization on
bottom. for those not familiar, an LGA is a BGA without the solder ball,
hence, cannot simply reduce pad size 80% of ball size
the specific LGA is a MEMSic MMC3002xM
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