I just finished my first surface mount board which has five chips with
the following footprints:

     SSO48 (1ea), QFP 14x20-100 (2ea), SQFP 14x14-100 (1ea), and a QFP
28x28-160

I used the information from IPC's surface mount land pattern caculator
and had ten prototype boards built. All of the surface mount chips were
hand installed on the prototype boards and then tested.

We're now in the process of ordering production boards and one assembly
house we talked to said the "toe" area of the pad should be increased
and that I should have used the IPC standard for the footprint.

My question is this - If the chip manufacturer doesn't have a suggested
footprint what do I go by to generate the appropriate land pattern? My
assumption was that the numbers given on the calculator web page were
appropriate. What am I missing?

By the way, I have IPC SM-782 on order but unfortunately it is on
backorder for two weeks. My other beef is that I didn't get the IPC
Designer's Council member's discount when I ordered what I believe was a
DESIGN guideline!

Thanks in advance for your response.

Mike Blackburn
Sr. Designer
Novar Controls Corp.
Copley, OH 44321

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