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September 2007

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Subject:	Design for Manufacture Workshop Sponsored by The IPC and The FED
From:	Michelle Michelotti <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Mon, 17 Sep 2007 15:07:43 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (51 lines)

IPC and FED Design for Manufacture Workshop

October 2, 2007 - Berlin, Germany

 

Designing printed boards is more difficult today than ever before.
Printed board designers are faced with the continuing design issues of
surface mount vs. through-hole technology, what materials to use, board
size and layer count, how to incorporate electrical testing, what new
specifications are being used in the design process and many other
topics. The IPC/FED Design for Manufacture Workshop will acquaint
designers with increasingly sophisticated PCB fabrication technologies.
The course will address trade-offs for designs that have both
through-hole and surface mount components; the differences between rigid
and flexible printed boards; and the tolerance characteristics that make
sense using the capabilities of today's manufacturing equipment. This
workshop has been designed so that each topic can be discussed either
during the presentation or the breaks. 

Sponsored by the IPC and the FED, this intensive workshop will be held
on Tuesday, October 2, 2007, in Berlin, Germany. Attendees will have a
unique opportunity to obtain firsthand information on design issues that
affect manufacturing from information provided during the workshop, and
the panel discussion at the conclusion of the workshop. 

 

If you are interested in this workshop, please visit
http://www.ipc.org/calendar/2007/DFMBerlin10_07/DFM_Berlin.htm.  For any
questions, please contact Michelle Michelotti at
[log in to unmask] <mailto:[log in to unmask]> 

 

 

 

 


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