DESIGNERCOUNCIL Archives

December 1997

DesignerCouncil@IPC.ORG

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Subject:
From:
Steve Collins <[log in to unmask]>
Reply To:
DesignerCouncil Mail Forum.
Date:
Thu, 4 Dec 1997 07:35:34 -0700
Content-Type:
text/plain
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text/plain (51 lines)
Yes you do have what on the surface seems to be a simple solution but when
you have a library full of parts designed and boards designed and don't
have the time to go back and change these parts globally, I really needed
an answer to my questions. I hope that Cliff's answer to my e-mail does not
stifle other people to communicate their inputs as well.

Steve Collins

----------
> From: Cliff Lamson <[log in to unmask]>
> To: [log in to unmask]
> Subject: Re: [DC] Gen: Soldermask Adhesion
> Date: Wednesday, December 03, 1997 2:18 PM
>
> The solution is really quite simple- don't bond parts to the s/m, design
the soldermask so that you have openings where the adhesive will be, ie,
bond to the bare
> laminate material.
>
> Cliff Lamson                            phone: 407-727-5158
> Designer 3 / CADD Group Leader          pager: 407-690-8594
> Harris G.A.S.D., MS22/4842              fax:   407-727-4430
> P.O. Box 94000                          email: [log in to unmask]
> Melbourne, FL 32902                     smtp:  [log in to unmask]
>
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