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May 2002

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Date:
Fri, 10 May 2002 10:53:52 -0400
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Jerry,

You are correct there is a reference in IPC-2222 section 10.3
to "When UL requirements are imposed, the area shall be within the limits
approved by UL for the printed board manufacturer."

Now the nickel question is which UL spec?

Maybe some of the folk on the IPC email forum would care to answer.

thanks

dave





Jerry Schwartz <[log in to unmask]> on 05/10/2002 09:53:03 AM

Please respond to [log in to unmask]

To:   "[log in to unmask]" <[log in to unmask]>
cc:
Subject:  RE: [PCB_FORUM] cross hatch patterns


Dave,

     See IPC-2222 section 10.3 "Large Conductive Areas" page 21. It
references UL.

Regards,
                Jerry Schwartz, CID
                IPC Certified Interconnect Designer
Jerry Schwartz, CID                    Designer 3
Harris Corporation GCSD             Voice (321)-727-5474
P.O. Box 37, MS 1/9843              Fax   (321)-729-5990
Melbourne, FL 32902-0037           Pager (321)-690-9797
mailto:[log in to unmask]
http://www.harris.com




-----Original Message-----
From: dave seymour [mailto:[log in to unmask]]
Sent: Friday, May 10, 2002 9:20 AM
To: [log in to unmask]
Subject: RE: [PCB_FORUM] cross hatch patterns



John,

Now I'm curious.

What UL Spec says you can't have solid copper plane?

dave






John LaFevers <[log in to unmask]> on 05/10/2002 09:05:08 AM

Please respond to [log in to unmask]

To:   "[log in to unmask]" <[log in to unmask]>
cc:
Subject:  RE: [PCB_FORUM] cross hatch patterns



In  some cases...UL....they have a requirement not to permit continuous
copper  larger than a penny..therefore hatch meets this  standard...

John LaFevers
Jabil Circuits
727-803-5379
-----Original Message-----
From: Dianne Boehm  [mailto:[log in to unmask]]
Sent: Friday, May 10, 2002 8:56  AM
To: [log in to unmask]
Subject: RE: [PCB_FORUM]  cross hatch patterns


In my  previous life as a designer for Military sub contractors, cross
hatch planes  were
a  requirement, for the following reasons:

Large  areas of coppers can blister
Better  bonding adhesion between layers



Dianne L. Boehm
Lead Support Application Engineer
Customer Support
PCB  Systems Division

Cadence Design Systems, Inc.
16279 Laguna Canyon Road
Irvine, California 92618
Direct Tel  (800) 995-9754  Pacific Standard Time


-----Original Message-----
From: punty  [mailto:[log in to unmask]]
Sent: Thursday, May 09, 2002 9:07  PM
To: [log in to unmask]
Subject: [PCB_FORUM]  cross hatch patterns


hi friends,

i would like to know the purpose of cross hatch  patterns used in the
PCB's? what are its advantages and  disadvantages?

thanx in advance
punty

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