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Reply To: | DesignerCouncil E-Mail Forum. |
Date: | Mon, 30 Aug 1999 11:30:00 -0700 |
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Thank you very much, everyone who responded about flex circuits. I will
be following every lead, and I hope that you will get some credit when I
give you as the reference.
Thank you too, everyone for the photoplotter advice.
Now if you can help with just one more thing, I'll quiet down, except for
trying to help someone else with an answer.
I have been brain-washed into insisting on "30-50 micro inches 99.99%
pure bondable gold, maximum 50-90 knoop hardness, over 200 micro inches
(min) electrolytic nickel." for all of the thermosonic wire bonding we do
for high temp applications. Does anyone know if palladium will be an
acceptable substitute, and where I can go for answers? Thank you so much
for any help.
Richard
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