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August 2001

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Subject:
From:
James Jackson <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Thu, 16 Aug 2001 11:48:53 US/CENTRAL
Content-Type:
text/plain
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text/plain (99 lines)
Hello Mitch,

Reread my e-mail... I said 'package', not 'footprint'.

Chris said... "Same question with package types....", and that was what I was
answering.

Regards,

James Jackson
Oztronics


> Hi James,
>
> I've never got a "footprint" pattern from JEDEC, have you? I've gone to
> the JEDEC site to see package dimensions, but I never understood them to
> have land patterns or footprints for the packages. I've never known them
> to be invloved with the manufacturing side of the packages, only the
> packages themselves. Am I wrong? If I am, would someone please tell me
> where they hide the footprints?
>
> I think it's great that an organization is finally trying to convince
> the manufacturers to "use" a standard package, and I'm still hoping IPC
> can convince all us designers to use their land pattern standards. We'll
> see. ;)
>
> TIA.
>
> Mitch
>
> ---------Included Message----------
> >      Date: Wed, 15 Aug 2001 21:39:39 -0500
> >      From: "James Jackson" <[log in to unmask]>
> >      Reply-To: ""(Designers Council Forum)""
> <[log in to unmask]>, "James Jackson" <[log in to unmask]>
> >      To: <[log in to unmask]>
> >      Subject: Re: [DC] SM footprints and standards
> >
> >      Chris,
> >
> >      I believe that JEDEC is the controlling organization for the
> package styles here in the U.S.
> >
> >      You will see several references in the IPC-SM-782 to this.
> >
> >      I think that the way it works, is that a company creates a new
> package style, and submits it to the JEDEC committee, where it is voted
> on and when approved becomes an 'official' pattern.
> >
> >      The Japanese have their equivalent to the JEDEC (the EIAJ) - and
> this causes some pattern differences, at times - but the companies are
> now realizing the benefits of 'playing together' when creating new
> patterns.
> >
> >      Regards,
> >
> >      James Jackson
> >      Oztronics
> >
> >
> >        I have several links to surface mount standards, but what I
> would like to know
> >        is who actually makes the standards for these footprints?
> >        Is it IC makers and they are adopted such organizations as
> IPC?
> >        Are the IPC standards THE standard or are they a collection of
> >        others?
> >
> >        I understand there are some European standards as well. Who
> >        controls these? (These may be a Gary questions)
> >
> >        I've found standards or actually descriptions at several
> different sites and
> >        want to ensure all are correct.
> >
> >        Same question with package types....
> >
> >
> >        CR
> >
> ---------End of Included Message----------
> _____________________________________________________________
> Tired of limited space on Yahoo and Hotmail?
> Free 100 Meg email account available at http://www.dacafe.com
>
>
>

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