Allen,
Chapter and verse would be IPC-2221, Sec 10.2.2 "Lands for Surface
Mounting", from which I quote the salient sentence:
"The possibility of heat thieving is reduced by "necking down" the conductor
near the soldering area."
That oughta do it.
Best Regards,
----------------------------
Gary M. Koven, C.I.D.
Engineering Services Manager
Dynazign, Inc.
806 Tyvola Road, Suite 100
Charlotte, NC 28217
P: 704.405.1234 x210
F: 704.405.1402
http://www.dynazign.com/
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Allen T.
Maddox
Sent: Wednesday, July 27, 2005 2:47 PM
To: [log in to unmask]
Subject: [DC] Trace width ratio to pad
Hey Folks,
I was always told to NOT exit a pad, especially a SMT pad, with a trace the
same width of the pad for the reason of dissipating the heat off the pad and
creating soldering issues.
I have an engineer who doesn't believe me and wants proof. Does anyone have
any articles that support what I've been taught, or have I been mislead all
these years?
Thanks,
Allen Maddox C.I.D.
Sr. PC Board Designer
GAI-Tronics, Corp
610-796-5854
PO Box 1060
Reading, PA 19607-1060
[log in to unmask]
www.gai-tronics.com
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