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April 2001

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Subject:
From:
"Gheen, Sharon" <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Fri, 20 Apr 2001 14:43:47 -0500
Content-Type:
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text/plain (84 lines)
Hello Cor,  I want to introduce myself and my company.  TMP. Worldwide.  I
am Sharon Gheen  I have the express honor of being part of the IPC.  I do
work full time for the leading Technical Staffing firm in the WORLD.
Honestly!!  Check us out on the web..  Anyway I was hoping that I might call
you to chat. I am always looking for designers and positions for designers.
Since the PCB design community is really so closely knit, I like to meet and
net work with all the talented designers I can.  Would it be ok for me to
call you?  (I'll need your number)  Or I have inserted all my phone numbers.
Thanks so much for your time.  Enjoy the weekend.                Sincerely
Sharon

 Sharon K. Gheen
Account Executive
[log in to unmask]
tmp.worldwide
(Parent company of monster.com)
4900 SW Meadows Road, Suite 100
Lake Oswego, OR 97035
Toll Free 888-278-2272
Phone: 503-635-4658
Fax     : 503-635-6067






-----Original Message-----
From: Cor Coolen [mailto:[log in to unmask]]
Sent: Thursday, April 19, 2001 10:53 PM
To: [log in to unmask]
Subject: [DC] Paste screening of Through Hole Test Vias


Hello to  all of you,


Currently,we  are designing a double sided reflow board.
All our  assembled boards  have to pass electrical test, preferably on a bed
of nails.
Is it  good practice to close all  through hole testvias by paste screening
in order to create good
vacuum conditions when testing ?
So, I want to include these vias in the paste screen artwork.  What is a
good diameter in the paste
screen for closing vias with a finished hole diameter of 8 mil ?
Is there not a risk that the solder paste will flow through the via holes
and causing shorts at the other side
during the second step of reflowing ? The board has a thickness of 95 mil.
Anyone has some experience in this matter ?

Thanks in advance.

Cor Coolen

Board Designer


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