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July 2005

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From:	[log in to unmask]
Reply To:	(Designers Council Forum)
Date:	Wed, 13 Jul 2005 16:33:03 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (44 lines)

Hi 

 

 

I have an engineer who is concerned about uniform thickness of solder mask over pad (sharp and well-defined edge), and good adhesion of the solder mask material to the pad (so solder won't undercut it), and removal of residues. This is in the 1mm BGA pad using a dog bone breakout.

 

So what I was wondering is what IPC doc would give me some information and if any of you have any info.

 

Thanks

 

 

Jerry Johnson

 

PC Design Process and Tools Engineer

Agilent Technologies, Inc

1900 Garden of the Gods Road    Telephone: 719-590-2231

Colorado Springs, CO            Email:  [log in to unmask]

 


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