By “auto wash” I mean any post cleaning operations for flux or paste
removal.
  
In my experience, some PCB assemblers post clean their boards even if
“no-clean” flux was used.  Conversely, some component manufacturers specify
on datasheet that their parts should not be post cleaned after soldering.

Has the methodology and chemistry of post cleaning changed recently?
Need I no longer worry, or must I still task myself with going through
datasheets to see if post cleaning is a sin?

I'm looking for some sort of boilerplate Class 2 note to put on assembly
drawings about this phenomenon.  

Thanks,

Gary M. Koven, C.I.D.
Dynazign, Inc.
Charlotte, NC, USA
Veteran of the Marsh School

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