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Subject:	delamination
From:	Billy Bharath <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Wed, 25 Jan 2006 13:17:57 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (45 lines)

> Hi All,
>       I desperately need some information from the forum. I am
> experiencing a concerning amount of de-lamination on our multi (8) layer
> pcbs from a specific manufacturer. These delams become noticeable only
> after reflow during assembly.
> The manufacturers prelim response include
> *     Delamination is a rare problem and up till now we have never been
> sure of the cause.
> *     We do know  from others that delamination is worse in East Coast of
> South Africa because of the high  humidity and the fact that the pcbs are
> quite hygroscopic
> *     Other causes could be faulty prepreg or moisture during assembly but
> it's always hard to know which.
> *     We notice that these boards have a huge ENIG ground plane, therefore
> the location of the delam will be interesting.
> *     Was the pcbs baked prior to component assembly?
>
> Questions,
> *     Should pcbs that are to be assembled in High humidity areas be
> manufactured using different disciplines.
> *     Must pcbs be vacuumed sealed
> *     What levels of moisture build-up do pcbs experience during
> manufacture .
> *     What degassing processes are introduced during manufacture.
>
> regards
> Billy Bharath
> Prism South Africa
> "For tomorrow belongs to the people who prepare for it today"
> ~ African proverb ~
>
>
>
>
>

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