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October 2000

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Subject:
From:
Dee Stover <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Mon, 30 Oct 2000 09:08:28 -0700
Content-Type:
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In a recent conversation with my fabricator the subject of dry film came
up.  One problem with dry film is that it is sometimes to thick for surface
mount parts to seat properly.  Depending on what the copper thickness is
the dry film can be thicker.

Good luck.

Dee Stover  [log in to unmask]
Associate Technician Design
National Optical Astronomy Observatory
950 N Cherry Ave
Tucson, AZ 85719
520-318-8489
FAX 520-318-8303



At 09:38 AM 10/30/2000 -0600, you wrote:
>I am looking for some information on dry film soldermask vs. LPI
>soldermask.
>
>Manufacturing wants to change all boards to dry film mask and tent all via
>holes so that when conformal coating is applied to the boards the coating
>does not drip through the holes.
>
>About 2-3 years ago I remember reading an article on problems with dry film
>and alternatives to using dry film. Since I had only used dry film once or
>twice a long time ago I did not save the information and can
>?t find it in
>any back issues of Printed Circuit Design or SMT that I have.
>
>It is my understanding that our main supplier has the facilities to dry
>film and is encouraging the dry film solution. (In my opinion more $ and
>less Competition) Cost is not a big issue since we do not produce large
>quantities of our products.
>
>Any help would be greatly appreciated.
>
>Rod Simon
>
>[log in to unmask]   Flight Vision Inc.       Sugar Grove IL 60554
>630-466-2119
>

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