Hello Konrad,

Zuken has a first order thermal analysis package that might possibly work
for you depending on the toolset you are currently using. It provides the
user with a thermal map indicating potential hotspots on the board and flags
components that are close to or exceeding their maximum operating
temperatures. It includes a number of controls for such things as air flow
and direction, etc. There are other more extensive analysis packages on the
market but the price tag on those tend to go up dramatically as well as the
knowledge required to operate and analyze. Although it could be what you
might need. Please give me a call if you wish to discuss it further.

Best Regards,

Tim Mullin
Technical Product Manager
Zuken USA, Inc.
Tel: 253-853-3860  *  Fax: 253-853-3861
Email: [log in to unmask]
Web Site: www.zuken.com

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]]On Behalf Of
Konrad Iten
Sent: Monday, September 30, 2002 11:20 AM
To: [log in to unmask]
Subject: [DC] Thermal Management Solutions


Hi All

I'm looking for a thermal solution on a multilayer board (~ 300mm x 200mm)
with about 7000 components ( mostly R,C,SOT23) and fine pitch BGA's (1mm
spacing). Components are on both sides. It's going to be up to 600W.

Which solution(s) could I use to get this done ?


Your help is much appreciated,
  Konrad

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