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September 2009

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Subject:
From:
"Anderson, Veronika" <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Tue, 29 Sep 2009 16:59:06 -0400
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Help needed in interpretation of IPC-6012.

Appendix A (page 37) calls out Table 3-8 and Paragraph 3.6.2.13 for
External Conductor Minimum Thickness after plating.

Table 3-8 shows that Minimum Surface Thickness after processing is 3.295
mils when the starting foil weight is 2 Oz.

Our company specifies the finished copper weight as 2 Oz on the drawing.
We do not specify the starting foil weight. PCB manufacturer is allowed
to choose a material that he has in stock and plate it up to be 2 Oz.

My question is - What minimum surface conductor thickness after
processing shall be targeted if the starting foil weight is not 2 Oz?
(The PWB house insists on having the conductor thickness 2.8 mils after
processing. However, I cannot find such a number in IPC-6012.)
  
Thank you,   

Veronika Anderson, C.I.D.
Senior Electrical / Mechanical Designer
 
PerkinElmer Optoelectronics
1330 East Cypress St.,
Covina, CA 91724
Phone: (626) 967-9521 X 236
E-mail: [log in to unmask]
 

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