The next revision to the industry's leading land pattern design standard
is here. This popular document covers land pattern design for all types
of passive and active components, including resistors, capacitors,
MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs.  The standard provides
printed board designers with an intelligent land pattern naming
convention, zero component rotations for CAD systems, and three separate
land pattern geometries for each component that allows the user to
select a land pattern based on desired component density.  Revision A
now includes land pattern design guidance for lead free soldering
processes, reflow cycle and profile requirements for components, and new
component families such as numerous forms of chip array packages and
"pull-back" QFN and SON devices.  IPC-7351A includes both the standard
and a IPC-7351A land pattern viewer on CD-ROM from which to access
component and land pattern dimensional data.

 

IPC-7351A will be available at IPC member pricing at the bookstore
during IPC Printed Circuits Expo, APEX and the Designers Summit.  The
table of contents is available here:
http://www.ipc.org/TOC/IPC-7351A.pdf.

 

For more information, visit www.ipc.org/onlinestore.


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