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February 2007

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Subject:	Re: RoHS component pad sizes
From:	Mark Eckert <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Tue, 27 Feb 2007 16:38:31 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (40 lines)

Although I haven't bought it yet....the "NEW" 7351A says it includes guidance 
for lead free soldering processes.


Here's what it says on the site:
7351A - Generic Requirements for Surface Mount Design and Land Pattern 
Standard 

The next revision to the industry's leading land pattern design standard is 
here! This popular document covers land pattern design for all types of passive 
and active components, including resistors, capacitors, MELFs, SSOPs, 
TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board 
designers with an intelligent land pattern naming convention, zero component 
rotations for CAD systems, and three separate land pattern geometries for 
each component that allows the user to select a land pattern based on 
desired component density. Revision A now includes land pattern design 
guidance for lead free soldering processes, reflow cycle and profile 
requirements for components, and new component families such as numerous 
forms of chip array packages and "pull-back" QFN and SON devices. IPC-7351A 
includes both the standard and a IPC-7351A land pattern viewer on CD-ROM 
from which to access component and land pattern dimensional data. 

http://webvision.ipc.org/scripts/mgrqispi.dll?
APPNAME=IPCWEB&PRGNAME=TOCFRAME&ARGUMENTS=-N,-N,-A,-A,-N50

Mark Eckert
4th Dimension PCB Design
Sunrise, FL
954-240-3600
http://www.pcb-design.com

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