Instead of using 8/8 I have used 8/7.  There shouldn't be any cost
premium to the board fab and you can use a 5 mil grid for routing.


>From: PCB Design Division <[log in to unmask]>
>Reply-To: "DesignerCouncil E-Mail Forum." <[log in to unmask]>,
>PCB Design Division <[log in to unmask]>
>To: [log in to unmask]
>Subject: [DC] Grid Settings
>Date: Thu, 24 Jun 1999 10:55:49 +0300
>
>Dear Experts
>Can anyone tell what suitable grid settings to use when designing
>boards, which have shrink DIP components (70 mil) and standard DIP(100
>mil) and SMT components on the same board. I have read that IPC has
>announced taking the 0.5mm as a standard grid. But I think this won't be
>applicable in our case (isn't it?).
>I have read a lot about grid settings, but till now I don't see the
>point behind caring so much about it. What problems could occur when you
>go down to 0.05mm grid.
>BTW we are using 8 mil (track/gap).
>Any input would appreciated.
>
>--
>Best Regards                                       ```
>Khaled H. Fouad                                   (o o)
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>Senior PCB Designer               |Tel.: +20 (11) 333414  Ext. : 312
>Research & Development Department |Mobile : 010 140 5324
>                                   |Fax.   : +20 (11) 335613
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