Frank & Andre,
One additional piece of info that might come in handy:
If the copper plating thickness in the hole is greater than .03mm then
the hole size can be reduce by one class level and still meet
requirements.
Thanks
Tony Cosentino
PCB Engineer - Tekelec
[log in to unmask]
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
Andre Demers
Sent: Monday, July 11, 2005 2:38 PM
To: [log in to unmask]
Subject: Re: [DC] .8mm bga, IPC class 3 design
Hi Frank,
My experience is that if you can't use the minimum required class 3 via
as specified in IPC-2222, then you have to go to Blind or Micro-vias,
unless you can fanout the BGA connections to larger vias that meet class
three requirements. (Not possible if your part has 5 or more rows of
balls to connect)
If you go the blind/buried route, then check out IPC-2226, the Design
standard for High Density Interconnect (HDI) boards for more
information.
Regards,
Andre Demers, C.I.D.
Senior PCB Designer, Coordinator
cmrsummit Technologies
329 March Road, Suite 203
Kanata ON K2K 2E1
Canada
Telephone: 613.599.3881
Toll Free: 877.428.1229
Pager: 613.368.0506
Fax: 613.599.7889
[log in to unmask] <mailto:[log in to unmask]> www.cmrsummit.com
<http://www.cmrsummit.com/>
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]]On Behalf Of Frank
A Bergmeister
Sent: July 11, 2005 2:07 PM
To: [log in to unmask]
Subject: [DC] .8mm bga, IPC class 3 design
I have a design that has a few .8mm bga's on it. Everything I read says
to
use a via with a .018 pad and .008 drill. I never see what class the
boards are being built to. My question is ... can PCB manufacturers
make a
board with that via to class 3? We have one manufacturer that wants the
pad .016 over what he drills (+.005 over our drill chart).
What vias are people using for class 3 designs? Any board manufacturers
on
the mailing list?
Any input is welcomed.
Thanks,
Frank
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