When we were using components that required hot bar soldering, we gave an 
extra 0.1" around the soldering bar.
Whether this is what was required or just what we specified I can't 
remember. Its been about four years sine we gave up on hot bar soldering.

My suggestion would be; if it can be done another way, do it.

Ray Johnston
Lead CAD Designer
Rane Corporation
425-355-6000
rayj@rane,com


----- Original Message ----- 
From: "Stephen Hankins" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, April 01, 2008 3:49 PM
Subject: [DC] Pulse Heated Hot Bar Reflow


I am currently working on a design that will use Hot Bar soldering to
fasten a flex circuit to one edge of my pcb.
My question, to anyone familiar with this technique, is how close can I
place adjacent surface mount components that will have already been
reflowed in place?

I've been told that the area directly under the area to be pulse heated
will have to remain free of components, to make sure of flatness in the
jig, but no information was given regarding where the keepout area ends.
Most articles on the web talk about the actual soldering and not design
parameters surrounding the area.

Thanks in advance,
Stephen Hankins
PCB Design
Xantech Corp.
Sylmar, CA.
818 362-0353 x255




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