Perfect, just the kind of data I'm looking for!  I really appreciate it.

Thanks,

Dave

At 03:12 PM 4/11/2014, you wrote:
>I designed a board with six 1 Oz copper layers on flex portion with
>no book binder. The flexibility was acceptable for assembly and test.
>
>Lr1 - diagonal cross-hatch GND (width 10/ grid 50 in mils)
>Lr2 - mostly wide power/GND copper traces
>Lr3 - diagonal cross-hatch GND (15/50) staggered 25mils in relationship to L1
>Lr4 - signal traces
>Lr5 - diagonal cross-hatch GND (15/50) staggered 25mils in relationship to L3
>Lr6 - signal traces staggered in relationship to L4
>
>Material used:
>Flex copper clad Adhesiveless polyimide   AP9111 (1 Oz /1 mil THK / 1 Oz)
>Bond ply LF0111 (1mil THK adhesive / 1 mil THK kapton / 1mil THK adhesive
>Coverlay  LF0110  (1mil THK adhesive / 1 mil THK kapton)
>
>You will want to have the solid reference traces for control impedance.
>
>Veronika Anderson C.I.D | Sr. Electrical/Mechanical Design Engineer
>| Excelitas Technologies
>
>Office:  +1 626.967.9521 x 236
>1330 East Cypress Street, Covina, CA 91724 USA
>[log in to unmask]
>www.excelitas.com
>
>-----Original Message-----
>From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
>David Baldwin
>Sent: Friday, April 11, 2014 1:16 PM
>To: [log in to unmask]
>Subject: [DC] Rigid Flex Plane Cross-Hatching & Impedance
>
>I have a rigid-flex design that is too difficult to bend and
>form.  We have 100 ohm DP's going across the flex against solid
>reference planes.  We want to cross hatch the planes in the flex
>regions in an attempt to make it more flexible (along with other adjustments).
>
>1. What are the guidelines for cross-hatching the copper (50%,
>diagonal, orthogonal?) 2. How badly will it affect the
>impedance?  Should I keep the copper solid under the DP's?
>
>Thanks,
>
>Dave
>
>
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