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1996

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Subject:
THERMAL MASS IN SMD REFLOW PROCESS
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Date:
Thu, 28 Mar 96 09:08:18 EST
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QUESTION, PORTIONS OF A SMD PCB DESIGN ARE SWITCHING VOLTAGE CONVERTERS AND 
RECOMMENDED LAYOUT CALLS FOR MASSIVE COPPER TRACES TO MINIMIZE INDUCTANCE. 
THE REST OF THE PCB IS NORMAL SMD USING TRACE NARROWING PER RECOMENDATIONS 
IN IPC-SM-782 SECTION 3.6.2.2 . MY QUESTION IS WETHER THIS WILL CAUSE 
PROBLEMS DURING REFLOW DUE TO DIFFERING THERMAL MASS ACROSS THE PCB?


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