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June 1999


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Table of Contents:

未讀取的主旨: Epoxy (2 messages)
未讀取的主旨: RE: [TN] Don't Open Attachments!!!!!! (2 messages)
未讀取的主旨: RE: [TN] Tantalum caps and the big bang (2 messages)
"Sign off" is this possible? (6 messages)
"WPS" and "ASAHI" (4 messages)
(no subject) (6 messages)
- gerber to QUAD PNP software? (2 messages)
: Chip-off on component body (3 messages)
: Personal 870 (Applicon) software (3 messages)
: Ramifications (20 messages)
<No subject> (6 messages)
adhesives (4 messages)
Admin Message (6 messages)
Admin Message....... (1 message)
ADMIN MESSAGE: Autoresponders, etc. (2 messages)
AirVac Rep. Tampa, FL area (2 messages)
Alternate PWB materials (8 messages)
Alternate PWB materials [Taiyo SM] (2 messages)
Anode basket for Tin plating (3 messages)
another darn test delete it (1 message)
Ant-tombstoning paste (2 messages)
Any GOOD recommendations for Career WEB sites? (8 messages)
AOI -color or grayscale (2 messages)
AOI-color or grayscale? (4 messages)
ASSY: Sampling plans (13 messages)
Automated assembly line recommendations needed. (2 messages)
AW: [TN] IPC-2221 Conductor Spacing - More Questions - Further Qu estions (1 message)
AW: [TN] IPC-2221 Table 6.1 Conductor Spacing (1 message)
Backplanes and Laminate sizes (2 messages)
BALL BONDING (7 messages)
Belcore's ionic contamination standard (6 messages)
BGA Consultation (2 messages)
BGA reliability testing (12 messages)
BGA reliability testing -Reply (2 messages)
Black Hole Process (2 messages)
Black Oxide Thickness Control (6 messages)
Board mfg. Dynavision? (2 messages)
Board mfg. Dynavision? -Reply (1 message)
Bridging (2 messages)
Bright Tin (4 messages)
Bright Tin Plating (4 messages)
Bulk fed parts (4 messages)
Byers Digi-Scope (2 messages)
CAD software for facilities planning (10 messages)
Camalot 1800 (2 messages)
Carrier Materials (10 messages)
Ceramic PCB Info? (2 messages)
Cleanliness (4 messages)
Cleanliness Problem (4 messages)
clear plastic (4 messages)
Comment on: What it would be like living in Australia (1 message)
Compare CEM-1, CEM-3 and FR4 (2 messages)
Conductive Adhesive (3 messages)
Conductive Transparency (8 messages)
Conformal Coating (4 messages)
conformal coating compatability (4 messages)
Conformal Coatings (1 message)
contact for test coupons? (6 messages)
Continuous flex circuits (2 messages)
Copper Anodes (6 messages)
copper foil spec (2 messages)
Copper thickness issues (2 messages)
Crimping Standard (4 messages)
current loop (4 messages)
Design software for flex (2 messages)
Dimensionally Stable Anodes (4 messages)
Disappearing Solder ? (4 messages)
Documenting Notches (4 messages)
Don't Open Attachments!!!!!! (10 messages)
down again? (2 messages)
DPM Levels (2 messages)
Dull discolored solder joints. (6 messages)
duplicate messages (4 messages)
Duplicate Messages Duplicate Messages (2 messages)
E-mail Charges: (2 messages)
E-mail Charges: Response from Pete Stark (CA Congressman) (2 messages)
Edge Connector for .125" thick PWB (6 messages)
EDT CAD (1 message)
Effects of moisture on TDR measurements (1 message)
Electroless Silver (2 messages)
Embedment, potting (4 messages)
Epoxy (10 messages)
Escape path and decoupling for 225-Ball BGA (fwd) (4 messages)
ESD Issues (12 messages)
Fab Gold barrier lubricant (3 messages)
Fab Gold barrier lubricant <IPC TN> (1 message)
Fab: Tap and die callouts (20 messages)
Facilities planning software (6 messages)
Fingerprints (8 messages)
Fingerprints II (10 messages)
flip-chip bonding (4 messages)
from jpl (10 messages)
Fuji IP feeders vs. Hover-Davis IP style feeders (1 message)
FW: Castin (2 messages)
Fw: Subject: Please read the la (2 messages)
Fw: Subject: Please read the last lines (8 messages)
FW: Vibration Analysis [Question: PWB natural freq = ?] <IPC TN> (1 message)
FW: What it would be like living in Australia (3 messages)
Fwd: Charges for E-mail, Fw: Please read & Pass Along (22 messages)
FWD: [TN] Scrap PCB's Recycled (2 messages)
Gluing components (14 messages)
Gold Plating Service's (6 messages)
HASL Solder Height (1 message)
heat cycles allowed per joint for rework purposes (2 messages)
Heat Sink Assembly (6 messages)
Here's one for the UK Technetters. (2 messages)
hi-density capacitors (4 messages)
High Precision Drill Press (4 messages)
High temperature IC precision contacts (1 message)
Hoax, Virus and Urban Myths websites (was RE: [TN] Fwd: Charges f or E-mail, Fw: Please read & Pass Along) (1 message)
ICT Test Pads on PWB (2 messages)
Imersion Silver (6 messages)
Immersion Gold Fabrication Processes / Specifications (6 messages)
Immersion Silver (6 messages)
Immersion Silver [HASL Alternatives] <IPC TN> (8 messages)
Info on Fuji CP-3 placement machine (4 messages)
INTERCONNECT 38999 (4 messages)
Ionic contamination after pumice (10 messages)
IPC Announces Lead-Free Alternative Electronic Forum (1 message)
IPC E-Mail Forum Update (1 message)
IPC Membership (5 messages)
IPC Standards (6 messages)
IPC Standards updates (2 messages)
IPC-2221 Conductor Spacing - More Questions (2 messages)
IPC-2221 Table 6.1 Conductor Spacing (1 message)
IPC-4101/24 vs IPC-4101/25 (2 messages)
IPC-610A versus IPC-610B (1 message)
IPC-A610B Solder Requirements For Heat Sink/Ground Pane PTHs (4 messages)
IPC-SM-785 Failure Definition (4 messages)
IPCWorks '99 Registration (2 messages)
ITRI's Equipment Survey Release Date? (2 messages)
J-STD-001 (1 message)
just wondering (1 message)
large component tape & reel (2 messages)
Lead Frames (2 messages)
Lead free (2 messages)
Lead solderability (6 messages)
Legend Inks (1 message)
Lo Behold-Voids!!!!!!!!! (4 messages)
Looking for the resistive spec for flux on the finished ... (4 messages)
Looking for the resistive spec for flux on the finished assembly board (3 messages)
Looking for training / class in the Silicon Valley (4 messages)
LPISM (8 messages)
Macdermid 9241 copper plating bath (6 messages)
Magic solder? (10 messages)
Manual inspection related stuff (4 messages)
Manufacturing process (6 messages)
Marking bad boards? (10 messages)
Marking Sleeves (4 messages)
MELF SCHOTTKY DIODES (4 messages)
metal clad laminate (2 messages)
METAL CLAD LAMINATE. (4 messages)
missing marking on components (2 messages)
Mod Wires in Circuit Board Assemblies (10 messages)
negative force (4 messages)
NEODC Meeting Reminder (2 messages)
New IPC Video Workshop on "Microvias & High Density Interconnects" (1 message)
New IPC Video Workshop on Peter Turney's ABC & ABM Book (1 message)
New IPC Workshop video on "Surface Mount Problem Solving" (1 message)
New IPC Workshop Video on "Zero Defect Soldering" (1 message)
Ni. Plating (4 messages)
No clean flux evaluation (2 messages)
None (3 messages)
Not read: Epoxy (2 messages)
Organic Solderability Preservative! (2 messages)
Organic Soldereability Preservative. (6 messages)
OSP Process! (2 messages)
other surface finishes (2 messages)
Outside test service (12 messages)
Pad Discoloration??? (4 messages)
Pad/Via size for 144 pin CSP (.8mm pitch) (4 messages)
PBGA reliability modeling (2 messages)
PCB design verification hardtool (2 messages)
PCB Outlines needed (2 messages)
Photoimageable dielectric layer (2 messages)
plateable epoxy (3 messages)
Plated Through-Hole (2 messages)
PP Bend Mark?? (2 messages)
Press-fit Connector Assembly (3 messages)
Press-fit Connector Assembly -Reply (1 message)
press-fit connector assembly, force gage (1 message)
Process and Material Combination (1 message)
Protel vs PADS....views? (6 messages)
PTH copper thickness issues (1 message)
PTH Plating Thickness (12 messages)
PTH Problem (8 messages)
Purchasing a Dynapert 318HR with 60 way feeder. (4 messages)
Quad 100 (6 messages)
Question (3 messages)
Rakon USA phone # (2 messages)
Ramifications (2 messages)
ramifications - repost of TI Voltage Regulator (2 messages)
Ramifications and reposting of an (2 messages)
Re : just wondering (2 messages)
Read: Epoxy (25 messages)
Read: RE: [TN] Don't Open Attachments!!!!!! (2 messages)
Read: RE: [TN] Tantalum caps and the big bang (2 messages)
Read: [TN] Tantalum caps and the big bang (8 messages)
Reflow Rework Rates (1 message)
Registration Issues ? (1 message)
Removal of silicone oil from a PWB (2 messages)
Removing calcium from water (28 messages)
Removing Fluoride from water (2 messages)
Research (2 messages)
Reworking of PGAs (8 messages)
Sancta simplicitas (6 messages)
Score depth ( web thickness ) (8 messages)
Scrap PCB's Recycled (6 messages)
Server crash (2 messages)
Sign Off (3 messages)
Silicon Valley - 6/17- Alt Surface Finishes & Microvias (2 messages)
SIR testing of reworked PWA's (6 messages)
slot in pcb (4 messages)
Smart Card Connector, double-sided contacts (4 messages)
Solder balls forming on top side during wave soldering. (4 messages)
Solder Mask (4 messages)
Solder paste disposal (9 messages)
Solder Paste in through hole (8 messages)
Solder Paste Measurement (2 messages)
Solder Thickness (5 messages)
soldering stations (8 messages)
Solderpaste height (1 message)
Source for CQFP-240 land pattern (1 message)
Source for land pattern (2 messages)
Specifying copper thickness (6 messages)
Spray fluxing...........How do you do it right (11 messages)
stencil thickness (12 messages)
Suggestions on how to maintain clean / dry wet process area (2 messages)
Sv: Re: [TN] Immersion Silver [HASL Alternatives] <IPC TN> (2 messages)
Taiyo Soldermask (2 messages)
Tantalum Capacitors and the Big Bang (6 messages)
Tantalum caps and the big bang (12 messages)
Tantalum caps and the big bang: Clarification (2 messages)
TechNet Digest - 3 Jun 1999 - Special issue (4 messages)
TechNet Digest - 4 Jun 1999 - Special issue (2 messages)
TECHNOLOGY TRANSFER- SILVER THROUGH HOLE (2 messages)
Temp cycling and vibration testing. (8 messages)
Test (2 messages)
test post (2 messages)
Test to schooner.kodak.com (1 message)
test-please ignore (1 message)
Thermal data (2 messages)
Thermocouple technology (8 messages)
Through holes metalization for ceramic (6 messages)
Tied pins (1 message)
Tin/Lead Solder Spec.on 63/37alloy (6 messages)
Trace current capacity (3 messages)
Traceability requirements (2 messages)
True Position (17 messages)
True Position Responses (2 messages)
U.V. Curable legend ink (3 messages)
U.V. Curable legend ink -Reply (1 message)
UK & Europe TechNetters (8 messages)
Under Stress (2 messages)
underside wiper rolls (8 messages)
underside wiper rolls (in the UK?) (1 message)
Unicam and FABmaster (1 message)
unsubscribe (5 messages)
Urgent Need: Colight Parts (1 message)
Used Equipment from Suppliers (2 messages)
USPS News release on Rumored Surcharge (2 messages)
vendors for SIR testing (2 messages)
Vibration Analysis (4 messages)
Voiding, through plating, conventional (6 messages)
Wave Sloder Shutdown (14 messages)
Wave Solder Shutdown (4 messages)
Weight loss (3 messages)
What is the reliability impact on PCB's with exposed glass fibers and exposed I/L metal????? (1 message)
What is True Position? (2 messages)
White Residue on solder joints (2 messages)
Wrong user group (2 messages)
www.pcbworld.com (2 messages)
X-RAY LAMINIGRAPHY (3 messages)
X-RAY LAMINIGRAPHY -Reply (1 message)
zipped_files.exe EMAIL Virus (2 messages)
[CN] Chemical Inventory Software (1 message)
[CN] IPC News Release: IPC Launches Lead-free Electronic Forum (1 message)
[CN] IPC Standards updates (1 message)
[CN] SIR testing of reworked PWA's (1 message)
[DC] "Ultra" thin PC Boards (3 messages)
[DC] AW: [DC] PAD TO VIA SPACING (1 message)
[DC] Double posting: [TN] [DC] Specctra OEM contracts (1 message)
[DC] Gerber Conversion (1 message)
[DC] Grid Settings (1 message)
[DC] hi-density capacitors (1 message)
[DC] High Speed Printed Circuit Design Workshop (1 message)
[DC] Inconsistent Gerber Output (2 messages)
[DC] NEODC Meeting Reminder (1 message)
[DC] Origin of green?? (1 message)
[DC] Silkscreen feature in between fine pitch (9 messages)
[DC] Specctra OEM contracts (1 message)
[DC] Via holes within SMD pads (1 message)
[DC] Via Holes Within SMD Pads ... (1 message)
[TN] Bright Tin (2 messages)
[TN] True Position (2 messages)
[[TN] heat cycles allowed per joint for rework purposes] (2 messages)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

未讀取的主旨: Epoxy

未讀取的主旨: Epoxy

Weber Chuang <[log in to unmask]>

Tue, 15 Jun 1999 11:05:05 +0800

28 lines

未讀取的主旨: Epoxy

Weber Chuang <[log in to unmask]>

Tue, 15 Jun 1999 11:05:05 +0800

39 lines

New Thread

未讀取的主旨: RE: [TN] Don't Open Attachments!!!!!!

未讀取的主旨: RE: [TN] Don't Open Attachments!!!!!!

Weber Chuang <[log in to unmask]>

Tue, 15 Jun 1999 11:05:04 +0800

29 lines

未讀取的主旨: RE: [TN] Don't Open Attachments!!!!!!

Weber Chuang <[log in to unmask]>

Tue, 15 Jun 1999 11:05:04 +0800

40 lines

New Thread

未讀取的主旨: RE: [TN] Tantalum caps and the big bang

未讀取的主旨: RE: [TN] Tantalum caps and the big bang

Weber Chuang <[log in to unmask]>

Mon, 7 Jun 1999 09:17:22 +0800

29 lines

未讀取的主旨: RE: [TN] Tantalum caps and the big bang

Weber Chuang <[log in to unmask]>

Mon, 7 Jun 1999 09:17:22 +0800

40 lines

New Thread

"Sign off" is this possible?

"Sign off" is this possible?

franco vezzoli <[log in to unmask]>

Thu, 3 Jun 1999 16:02:09 +0200

30 lines

"Sign off" is this possible?

franco vezzoli <[log in to unmask]>

Thu, 3 Jun 1999 16:02:09 +0200

41 lines

Re: "Sign off" is this possible?

Ian Squires <[log in to unmask]>

Fri, 4 Jun 1999 12:06:12 +0000

89 lines

Re: "Sign off" is this possible?

Ian Squires <[log in to unmask]>

Fri, 4 Jun 1999 12:06:12 +0000

99 lines

"Sign off" is this possible?

Thomas Martin <[log in to unmask]>

Fri, 4 Jun 1999 10:54:42 -0400

69 lines

"Sign off" is this possible?

Thomas Martin <[log in to unmask]>

Fri, 4 Jun 1999 10:54:42 -0400

80 lines

New Thread

"WPS" and "ASAHI"

"WPS" and "ASAHI"

Feng Yi,BISC PD IE(BJ) <[log in to unmask]>

Fri, 4 Jun 1999 10:02:59 +0800

97 lines

"WPS" and "ASAHI"

Feng Yi,BISC PD IE(BJ) <[log in to unmask]>

Fri, 4 Jun 1999 10:02:59 +0800

108 lines

Re: "WPS" and "ASAHI"

Thorup, John <[log in to unmask]>

Fri, 4 Jun 1999 07:04:05 -0700

54 lines

Re: "WPS" and "ASAHI"

Thorup, John <[log in to unmask]>

Fri, 4 Jun 1999 07:04:05 -0700

65 lines

New Thread

(no subject)

(no subject)

Sheila Akins <[log in to unmask]>

Fri, 4 Jun 1999 05:21:31 EDT

37 lines

(no subject)

Sheila Akins <[log in to unmask]>

Fri, 4 Jun 1999 05:21:31 EDT

47 lines

Re: (no subject)

Matthew Lamkin <[log in to unmask]>

Fri, 4 Jun 1999 10:57:14 +0100

72 lines

Re: (no subject)

Matthew Lamkin <[log in to unmask]>

Fri, 4 Jun 1999 10:57:14 +0100

83 lines

Re: (no subject)

Severson, Scott M. <[log in to unmask]>

Fri, 4 Jun 1999 07:18:18 -0500

67 lines

Re: (no subject)

Severson, Scott M. <[log in to unmask]>

Fri, 4 Jun 1999 07:18:18 -0500

77 lines

New Thread

- gerber to QUAD PNP software?

Re: - gerber to QUAD PNP software?

Jon Moore <[log in to unmask]>

Sat, 12 Jun 1999 19:39:43 EDT

35 lines

Re: - gerber to QUAD PNP software?

Jon Moore <[log in to unmask]>

Sat, 12 Jun 1999 19:39:43 EDT

45 lines

New Thread

: Chip-off on component body

: Chip-off on component body

Poh Kong Hui <[log in to unmask]>

Sun, 20 Jun 1999 03:57:15 +0800

22 lines

Re: : Chip-off on component body

Ian Boyton <[log in to unmask]>

Mon, 21 Jun 1999 02:41:01 PDT

67 lines

Re: : Chip-off on component body

Bill Davis <[log in to unmask]>

Wed, 23 Jun 1999 08:54:45 -0700

51 lines

New Thread

: Personal 870 (Applicon) software

: Personal 870 (Applicon) software

May William D CNIN <[log in to unmask]>

Mon, 21 Jun 1999 12:14:39 -0500

25 lines

Re: : Personal 870 (Applicon) software

SDB <[log in to unmask]>

Mon, 21 Jun 1999 21:04:00 -0700

45 lines

Re: : Personal 870 (Applicon) software

Bill Davis <[log in to unmask]>

Wed, 23 Jun 1999 08:48:58 -0700

69 lines

New Thread

: Ramifications

: Ramifications

Kasprzak, Bill (esd) US <[log in to unmask]>

Sat, 5 Jun 1999 08:39:00 PDT

48 lines

: Ramifications

Kasprzak, Bill (esd) US <[log in to unmask]>

Sat, 5 Jun 1999 08:39:00 PDT

59 lines

Re: : Ramifications

Eric Christison <[log in to unmask]>

Sat, 5 Jun 1999 09:28:37 -0500

68 lines

Re: : Ramifications

Eric Christison <[log in to unmask]>

Sat, 5 Jun 1999 09:28:37 -0500

79 lines

Re: : Ramifications

Stephen R. Gregory <[log in to unmask]>

Sat, 5 Jun 1999 15:58:43 EDT

103 lines

Re: : Ramifications

Stephen R. Gregory <[log in to unmask]>

Sat, 5 Jun 1999 15:58:43 EDT

113 lines

Re: : Ramifications

Graham Naisbitt <[log in to unmask]>

Sun, 6 Jun 1999 16:52:14 +0100

101 lines

Re: : Ramifications

Graham Naisbitt <[log in to unmask]>

Sun, 6 Jun 1999 16:52:14 +0100

111 lines

Re: : Ramifications

[log in to unmask]

Mon, 7 Jun 1999 07:45:26 EDT

144 lines

Re: : Ramifications

Ed Cosper <[log in to unmask]>

Mon, 7 Jun 1999 08:21:54 -0400

98 lines

Re: : Ramifications

Ed Cosper <[log in to unmask]>

Mon, 7 Jun 1999 08:21:54 -0400

108 lines

Re: : Ramifications

Thorup, John <[log in to unmask]>

Mon, 7 Jun 1999 07:12:14 -0700

137 lines

Re: : Ramifications

Thorup, John <[log in to unmask]>

Mon, 7 Jun 1999 07:12:14 -0700

148 lines

Re: : Ramifications

Paul Klasek <[log in to unmask]>

Sun, 6 Jun 1999 18:06:39 -0700

104 lines

Re: : Ramifications

[log in to unmask]

Mon, 7 Jun 1999 07:45:26 EDT

154 lines

Re: : Ramifications

Bill Davis <[log in to unmask]>

Mon, 7 Jun 1999 08:39:00 -0700

153 lines

Re: : Ramifications

Paul Klasek <[log in to unmask]>

Sun, 6 Jun 1999 18:06:39 -0700

114 lines

Re: : Ramifications

Bill Davis <[log in to unmask]>

Mon, 7 Jun 1999 08:39:00 -0700

163 lines

: Ramifications

Kasprzak, Bill (esd) US <[log in to unmask]>

Tue, 8 Jun 1999 08:12:00 PDT

39 lines

: Ramifications

Kasprzak, Bill (esd) US <[log in to unmask]>

Tue, 8 Jun 1999 08:12:00 PDT

50 lines

New Thread

<No subject>

<No subject>

Andrew McGlasson <[log in to unmask]>

Tue, 1 Jun 1999 08:05:39 +0100

84 lines

<No subject>

Andrew McGlasson <[log in to unmask]>

Tue, 1 Jun 1999 08:05:39 +0100

94 lines

<No subject>

Ross McKay <[log in to unmask]>

Tue, 8 Jun 1999 21:52:40 NZST

74 lines

<No subject>

Tom Richardson <[log in to unmask]>

Fri, 11 Jun 1999 12:42:48 -0400

130 lines

<No subject>

Michael Fenner <[log in to unmask]>

Fri, 18 Jun 1999 23:52:59 +0100

40 lines

<No subject>

Ted Wiktorowicz <[log in to unmask]>

Fri, 25 Jun 1999 11:02:47 -0400

10 lines

New Thread

adhesives

adhesives

Bob Vanech <[log in to unmask]>

Thu, 3 Jun 1999 14:33:41 +0000

34 lines

adhesives

Bob Vanech <[log in to unmask]>

Thu, 3 Jun 1999 14:33:41 +0000

45 lines

Re: adhesives

KELLY M SCHRIVER <[log in to unmask]>

Fri, 4 Jun 1999 10:32:00 -0400

39 lines

Re: adhesives

KELLY M SCHRIVER <[log in to unmask]>

Fri, 4 Jun 1999 10:32:00 -0400

49 lines

New Thread

Admin Message

Admin Message

Gayatri Sardeshpande <[log in to unmask]>

Fri, 18 Jun 1999 12:26:04 -0500

27 lines

Admin Message

Gayatri Sardeshpande <[log in to unmask]>

Fri, 18 Jun 1999 12:58:59 -0500

26 lines

Re: Admin Message

fraley , barrie <[log in to unmask]>

Fri, 18 Jun 1999 16:37:08 -0400

40 lines

Re: Admin Message

Energy Technology Systems <[log in to unmask]>

Fri, 18 Jun 1999 14:15:23 -0700

41 lines

Re: Admin Message

Bev Christian <[log in to unmask]>

Fri, 18 Jun 1999 17:01:45 -0500

42 lines

Re: Admin Message

Gayatri Sardeshpande <[log in to unmask]>

Mon, 21 Jun 1999 10:23:46 -0500

53 lines

New Thread

Admin Message.......

Admin Message.......

Gayatri Sardeshpande <[log in to unmask]>

Fri, 25 Jun 1999 10:47:35 -0500

33 lines

New Thread

ADMIN MESSAGE: Autoresponders, etc.

ADMIN MESSAGE: Autoresponders, etc.

Jack Crawford <[log in to unmask]>

Mon, 14 Jun 1999 14:38:52 -0500

56 lines

ADMIN MESSAGE: Autoresponders, etc.

Jack Crawford <[log in to unmask]>

Mon, 14 Jun 1999 14:38:52 -0500

67 lines

New Thread

AirVac Rep. Tampa, FL area

AirVac Rep. Tampa, FL area

John Mastorides <[log in to unmask]>

Fri, 11 Jun 1999 10:42:19 -0400

27 lines

AirVac Rep. Tampa, FL area

John Mastorides <[log in to unmask]>

Fri, 11 Jun 1999 10:42:19 -0400

38 lines

New Thread

Alternate PWB materials

Re: Alternate PWB materials

Jason Smith <[log in to unmask]>

Tue, 1 Jun 1999 13:04:05 -0400

26 lines

Re: Alternate PWB materials

Jason Smith <[log in to unmask]>

Tue, 1 Jun 1999 13:04:05 -0400

37 lines

Re: Alternate PWB materials

Richard Miller <[log in to unmask]>

Tue, 1 Jun 1999 13:54:53 -0400

30 lines

Re: Alternate PWB materials

Richard Miller <[log in to unmask]>

Tue, 1 Jun 1999 13:54:53 -0400

40 lines

Re: Alternate PWB materials

Anne Ledger <[log in to unmask]>

Tue, 1 Jun 1999 14:55:16 -0400

66 lines

Re: Alternate PWB materials

Anne Ledger <[log in to unmask]>

Tue, 1 Jun 1999 14:55:16 -0400

76 lines

Re: Alternate PWB materials

Ted Wiktorowicz <[log in to unmask]>

Tue, 1 Jun 1999 15:17:08 -0400

62 lines

Re: Alternate PWB materials

Ted Wiktorowicz <[log in to unmask]>

Tue, 1 Jun 1999 15:17:08 -0400

72 lines

New Thread

Alternate PWB materials [Taiyo SM]

Re: Alternate PWB materials [Taiyo SM]

Alderete, Michael <[log in to unmask]>

Tue, 1 Jun 1999 18:35:03 -0700

114 lines

Re: Alternate PWB materials [Taiyo SM]

Alderete, Michael <[log in to unmask]>

Tue, 1 Jun 1999 18:35:03 -0700

125 lines

New Thread

Anode basket for Tin plating

Anode basket for Tin plating

Albert Mok <[log in to unmask]>

Wed, 30 Jun 1999 08:39:08 +0800

22 lines

Re: Anode basket for Tin plating

[log in to unmask]

Wed, 30 Jun 1999 02:50:08 EDT

17 lines

Re: Anode basket for Tin plating

Roger Mouton <[log in to unmask]>

Wed, 30 Jun 1999 11:43:07 EDT

19 lines

New Thread

another darn test delete it

another darn test delete it

Jack Crawford <[log in to unmask]>

Mon, 21 Jun 1999 17:17:07 -0500

10 lines

New Thread

Ant-tombstoning paste

Ant-tombstoning paste

Narayana Vishy-CVN002 <[log in to unmask]>

Fri, 4 Jun 1999 16:29:52 +0800

29 lines

Ant-tombstoning paste

Narayana Vishy-CVN002 <[log in to unmask]>

Fri, 4 Jun 1999 16:29:52 +0800

40 lines

New Thread

Any GOOD recommendations for Career WEB sites?

Re: Any GOOD recommendations for Career WEB sites?

Jon Moore <[log in to unmask]>

Wed, 2 Jun 1999 08:30:34 EDT

33 lines

Re: Any GOOD recommendations for Career WEB sites?

Jon Moore <[log in to unmask]>

Wed, 2 Jun 1999 08:30:34 EDT

43 lines

Re: Any GOOD recommendations for Career WEB sites?

Kathie Lucas <[log in to unmask]>

Wed, 2 Jun 1999 08:49:36 -0600

84 lines

Re: Any GOOD recommendations for Career WEB sites?

Kathie Lucas <[log in to unmask]>

Wed, 2 Jun 1999 08:49:36 -0600

94 lines

Re: Any GOOD recommendations for Career WEB sites?

Bill Davis <[log in to unmask]>

Wed, 2 Jun 1999 14:02:51 -0700

65 lines

Re: Any GOOD recommendations for Career WEB sites?

Bill Davis <[log in to unmask]>

Wed, 2 Jun 1999 14:02:51 -0700

75 lines

Re: Any GOOD recommendations for Career WEB sites?

Bill Davis <[log in to unmask]>

Mon, 7 Jun 1999 08:42:47 -0700

123 lines

Re: Any GOOD recommendations for Career WEB sites?

Bill Davis <[log in to unmask]>

Mon, 7 Jun 1999 08:42:47 -0700

133 lines

New Thread

AOI -color or grayscale

AOI -color or grayscale

Ryan Jennens <[log in to unmask]>

Tue, 1 Jun 1999 17:45:09 -0400

70 lines

AOI -color or grayscale

Ryan Jennens <[log in to unmask]>

Tue, 1 Jun 1999 17:45:09 -0400

81 lines

New Thread

AOI-color or grayscale?

AOI-color or grayscale?

Ryan Jennens <[log in to unmask]>

Tue, 1 Jun 1999 15:35:11 -0400

68 lines

AOI-color or grayscale?

Ryan Jennens <[log in to unmask]>

Tue, 1 Jun 1999 15:35:11 -0400

79 lines

Re: AOI-color or grayscale?

Roland <[log in to unmask]>

Tue, 1 Jun 1999 21:52:11 +0200

128 lines

Re: AOI-color or grayscale?

Roland <[log in to unmask]>

Tue, 1 Jun 1999 21:52:11 +0200

138 lines

New Thread

ASSY: Sampling plans

ASSY: Sampling plans

Sherman Banks <[log in to unmask]>

Wed, 9 Jun 1999 11:26:44 -0700

28 lines

ASSY: Sampling plans

Sherman Banks <[log in to unmask]>

Wed, 9 Jun 1999 11:26:44 -0700

39 lines

Re: ASSY: Sampling plans

"Glenn Pelkey"@[log in to unmask]

Wed, 9 Jun 1999 11:51:52 PDT

38 lines

Re: ASSY: Sampling plans

Jim Wiggers <[log in to unmask]>

Wed, 9 Jun 1999 13:05:53 -0600

57 lines

Re: ASSY: Sampling plans

Jim Wiggers <[log in to unmask]>

Wed, 9 Jun 1999 13:05:53 -0600

67 lines

Re: ASSY: Sampling plans

Eric Kalgren <[log in to unmask]>

Wed, 9 Jun 1999 12:46:57 -0600

50 lines

Re: ASSY: Sampling plans

Eric Kalgren <[log in to unmask]>

Wed, 9 Jun 1999 12:46:57 -0600

61 lines

Re: ASSY: Sampling plans

Dan Brandler <[log in to unmask]>

Wed, 9 Jun 1999 13:59:36 -0700

39 lines

Re: ASSY: Sampling plans

Dan Brandler <[log in to unmask]>

Wed, 9 Jun 1999 13:59:36 -0700

49 lines

Re: ASSY: Sampling plans

Karl Sauter <[log in to unmask]>

Wed, 9 Jun 1999 14:34:01 -0700

71 lines

Re: ASSY: Sampling plans

Karl Sauter <[log in to unmask]>

Wed, 9 Jun 1999 14:34:01 -0700

81 lines

Re: ASSY: Sampling plans

Don Vischulis <[log in to unmask]>

Wed, 9 Jun 1999 16:55:53 -0500

39 lines

Re: ASSY: Sampling plans

Don Vischulis <[log in to unmask]>

Wed, 9 Jun 1999 16:55:53 -0500

50 lines

New Thread

Automated assembly line recommendations needed.

Automated assembly line recommendations needed.

Zaverukha, Ilya/EXWEB2 <[log in to unmask]>

Mon, 21 Jun 1999 09:00:50 -0400

22 lines

Re: Automated assembly line recommendations needed.

Sandi Twist <[log in to unmask]>

Tue, 22 Jun 1999 11:34:10 -0700

49 lines

New Thread

AW: [TN] IPC-2221 Conductor Spacing - More Questions - Further Qu estions

AW: [TN] IPC-2221 Conductor Spacing - More Questions - Further Qu estions

Wanner Bernhard <[log in to unmask]>

Tue, 22 Jun 1999 21:45:58 +0200

115 lines

New Thread

AW: [TN] IPC-2221 Table 6.1 Conductor Spacing

AW: [TN] IPC-2221 Table 6.1 Conductor Spacing

Wanner Bernhard <[log in to unmask]>

Sat, 19 Jun 1999 13:23:35 +0200

42 lines

New Thread

Backplanes and Laminate sizes

Backplanes and Laminate sizes

Janice Lund <[log in to unmask]>

Wed, 9 Jun 1999 15:37:30 -0400

35 lines

Backplanes and Laminate sizes

Janice Lund <[log in to unmask]>

Wed, 9 Jun 1999 15:37:30 -0400

45 lines

New Thread

BALL BONDING

BALL BONDING

Portoghese, John @ NARDAEAST <[log in to unmask]>

Thu, 24 Jun 1999 07:29:58 -0400

17 lines

BALL BONDING

Creswick <[log in to unmask]>

Thu, 24 Jun 1999 08:09:42 -0500

27 lines

Re: BALL BONDING

David D Hillman <[log in to unmask]>

Mon, 28 Jun 1999 10:28:24 -0500

55 lines

Ball Bonding

Kiet Dang <[log in to unmask]>

Tue, 29 Jun 1999 13:52:00 -0700

22 lines

Re: Ball Bonding

[log in to unmask]

Wed, 30 Jun 1999 08:42:10 +0200

38 lines

Re: Ball Bonding

Roger Massey-G14195 <[log in to unmask]>

Wed, 30 Jun 1999 08:21:40 +0100

49 lines

Re: Ball Bonding

joyce <[log in to unmask]>

Wed, 30 Jun 1999 06:12:29 -0400

57 lines

New Thread

Belcore's ionic contamination standard

Belcore's ionic contamination standard

Todd Vorpahl <[log in to unmask]>

Tue, 8 Jun 1999 11:51:50 -0400

34 lines

Belcore's ionic contamination standard

Todd Vorpahl <[log in to unmask]>

Tue, 8 Jun 1999 11:51:50 -0400

45 lines

Re: Belcore's ionic contamination standard

[log in to unmask]

Tue, 8 Jun 1999 14:51:37 EDT

29 lines

Re: Belcore's ionic contamination standard

[log in to unmask]

Tue, 8 Jun 1999 14:51:37 EDT

39 lines

Re: Belcore's ionic contamination standard

KK Chin <[log in to unmask]>

Tue, 8 Jun 1999 13:34:31 -0700

76 lines

Re: Belcore's ionic contamination standard

KK Chin <[log in to unmask]>

Tue, 8 Jun 1999 13:34:31 -0700

86 lines

New Thread

BGA Consultation

BGA Consultation

Phillips, Peter (NM75) <[log in to unmask]>

Thu, 10 Jun 1999 11:14:52 -0600

31 lines

BGA Consultation

Phillips, Peter (NM75) <[log in to unmask]>

Thu, 10 Jun 1999 11:14:52 -0600

42 lines

New Thread

BGA reliability testing

Re: BGA reliability testing

Jason Smith <[log in to unmask]>

Fri, 11 Jun 1999 15:45:08 -0400

26 lines

Re: BGA reliability testing

Jason Smith <[log in to unmask]>

Fri, 11 Jun 1999 15:45:08 -0400

37 lines

Re: BGA reliability testing

Doug Pauls <[log in to unmask]>

Fri, 11 Jun 1999 17:02:57 EDT

42 lines

Re: BGA reliability testing

Doug Pauls <[log in to unmask]>

Fri, 11 Jun 1999 17:02:57 EDT

52 lines

Re: BGA reliability testing

Jason Smith <[log in to unmask]>

Fri, 11 Jun 1999 17:23:22 -0400

76 lines

Re: BGA reliability testing

Jason Smith <[log in to unmask]>

Fri, 11 Jun 1999 17:23:22 -0400

86 lines

Re: BGA reliability testing

McMonagle, Michael R. <[log in to unmask]>

Sat, 12 Jun 1999 07:44:51 -0500

73 lines

Re: BGA reliability testing

McMonagle, Michael R. <[log in to unmask]>

Sat, 12 Jun 1999 07:44:51 -0500

83 lines

Re: BGA reliability testing

Jack Crawford <[log in to unmask]>

Mon, 14 Jun 1999 10:00:45 -0500

109 lines

Re: BGA reliability testing

Jack Crawford <[log in to unmask]>

Mon, 14 Jun 1999 10:00:45 -0500

119 lines

Re: BGA reliability testing

Jack Crawford <[log in to unmask]>

Mon, 14 Jun 1999 13:47:00 -0500

165 lines

Re: BGA reliability testing

Jack Crawford <[log in to unmask]>

Mon, 14 Jun 1999 13:47:00 -0500

175 lines

New Thread

BGA reliability testing -Reply

Re: BGA reliability testing -Reply

Craig McGlinchy <[log in to unmask]>

Mon, 14 Jun 1999 09:19:29 +1200

34 lines

Re: BGA reliability testing -Reply

Craig McGlinchy <[log in to unmask]>

Mon, 14 Jun 1999 09:19:29 +1200

44 lines

New Thread

Black Hole Process

Black Hole Process

Richard Hamilton <[log in to unmask]>

Fri, 18 Jun 1999 13:45:36 -0700

19 lines

Re: Black Hole Process

Dennis Fritz <[log in to unmask]>

Fri, 18 Jun 1999 22:29:15 EDT

40 lines

New Thread

Black Oxide Thickness Control

Black Oxide Thickness Control

emilio cagmat <[log in to unmask]>

Wed, 2 Jun 1999 16:49:34 +0800

31 lines

Re: Black Oxide Thickness Control

Carano,Michael <[log in to unmask]>

Wed, 2 Jun 1999 11:30:26 -0400

61 lines

Black Oxide Thickness Control

emilio cagmat <[log in to unmask]>

Wed, 2 Jun 1999 16:49:34 +0800

42 lines

Re: Black Oxide Thickness Control

Carano,Michael <[log in to unmask]>

Wed, 2 Jun 1999 11:30:26 -0400

71 lines

Re: Black Oxide Thickness Control

<Rudy Sedlak> <[log in to unmask]>

Thu, 3 Jun 1999 09:47:29 EDT

46 lines

Re: Black Oxide Thickness Control

<Rudy Sedlak> <[log in to unmask]>

Thu, 3 Jun 1999 09:47:29 EDT

56 lines

New Thread

Board mfg. Dynavision?

Board mfg. Dynavision?

Matthias Mansfeld <[log in to unmask]>

Wed, 23 Jun 1999 17:39:02 +0200

30 lines

Re: Board mfg. Dynavision?

[log in to unmask]

Thu, 24 Jun 1999 12:45:08 EDT

18 lines

New Thread

Board mfg. Dynavision? -Reply

Board mfg. Dynavision? -Reply

TPE Engineering TechNet <[log in to unmask]>

Thu, 24 Jun 1999 10:20:27 -0700

12 lines

New Thread

Bridging

Bridging

Michael.Dorney <[log in to unmask]>

Tue, 22 Jun 1999 09:55:16 -0400

23 lines

Re: Bridging

Sunil Gupta <[log in to unmask]>

Wed, 23 Jun 1999 09:33:59 +0530

46 lines

New Thread

Bright Tin

Bright Tin

[log in to unmask]

Tue, 1 Jun 1999 17:05:05 EDT

35 lines

Bright Tin

[log in to unmask]

Tue, 1 Jun 1999 17:05:05 EDT

45 lines

Re: Bright Tin

[log in to unmask]

Wed, 2 Jun 1999 20:49:35 EDT

27 lines

Re: Bright Tin

[log in to unmask]

Wed, 2 Jun 1999 20:49:35 EDT

37 lines

New Thread

Bright Tin Plating

Re: Bright Tin Plating

Nick Beavon <[log in to unmask]>

Tue, 1 Jun 1999 04:45:09 EDT

843 lines

Re: Bright Tin Plating

Nick Beavon <[log in to unmask]>

Tue, 1 Jun 1999 04:45:09 EDT

853 lines

Re: Bright Tin Plating

Phillip E Hinton <[log in to unmask]>

Thu, 3 Jun 1999 09:50:06 EDT

29 lines

Re: Bright Tin Plating

Phillip E Hinton <[log in to unmask]>

Thu, 3 Jun 1999 09:50:06 EDT

40 lines

New Thread

Bulk fed parts

Bulk fed parts

Narayana Vishy-CVN002 <[log in to unmask]>

Fri, 4 Jun 1999 16:27:04 +0800

32 lines

Bulk fed parts

Narayana Vishy-CVN002 <[log in to unmask]>

Fri, 4 Jun 1999 16:27:04 +0800

43 lines

Re: Bulk fed parts

McMonagle, Michael R. <[log in to unmask]>

Fri, 4 Jun 1999 07:31:18 -0500

79 lines

Re: Bulk fed parts

McMonagle, Michael R. <[log in to unmask]>

Fri, 4 Jun 1999 07:31:18 -0500

89 lines

New Thread

Byers Digi-Scope

Byers Digi-Scope

Ted Wiktorowicz <[log in to unmask]>

Mon, 7 Jun 1999 10:17:03 -0400

32 lines

Byers Digi-Scope

Ted Wiktorowicz <[log in to unmask]>

Mon, 7 Jun 1999 10:17:03 -0400

43 lines

New Thread

CAD software for facilities planning

Re: CAD software for facilities planning

Mark Austin <[log in to unmask]>

Tue, 1 Jun 1999 09:02:00 +0100

73 lines

Re: CAD software for facilities planning

Mark Austin <[log in to unmask]>

Tue, 1 Jun 1999 09:02:00 +0100

84 lines

Re: CAD software for facilities planning

金鸿 <[log in to unmask]>

Tue, 1 Jun 1999 13:38:31 +0800

76 lines

Re: CAD software for facilities planning

金鸿 <[log in to unmask]>

Tue, 1 Jun 1999 13:38:31 +0800

86 lines

Re: CAD software for facilities planning

Kathy Stillings <[log in to unmask]>

Tue, 1 Jun 1999 08:18:13 -0400

23 lines

Re: CAD software for facilities planning

Kathy Stillings <[log in to unmask]>

Tue, 1 Jun 1999 08:18:13 -0400

33 lines

Re: CAD software for facilities planning

Loveless, Lainie <[log in to unmask]>

Tue, 1 Jun 1999 09:18:44 -0400

64 lines

Re: CAD software for facilities planning

Loveless, Lainie <[log in to unmask]>

Tue, 1 Jun 1999 09:18:44 -0400

74 lines

Re: CAD software for facilities planning

Richard Hamilton <[log in to unmask]>

Tue, 1 Jun 1999 08:40:36 -0700

104 lines

Re: CAD software for facilities planning

Richard Hamilton <[log in to unmask]>

Tue, 1 Jun 1999 08:40:36 -0700

114 lines

New Thread

Camalot 1800

Camalot 1800

Kinol, Vince <[log in to unmask]>

Tue, 29 Jun 1999 15:25:58 -0400

22 lines

Re: Camalot 1800

Kenneth Kirby <[log in to unmask]>

Tue, 29 Jun 1999 14:34:16 -0500

108 lines

New Thread

Carrier Materials

Carrier Materials

Neil Atkinson <[log in to unmask]>

Fri, 11 Jun 1999 13:28:08 +0100

37 lines

Re: Carrier Materials

Neil Atkinson <[log in to unmask]>

Fri, 11 Jun 1999 15:05:24 +0100

44 lines

Carrier Materials

Neil Atkinson <[log in to unmask]>

Fri, 11 Jun 1999 13:28:08 +0100

48 lines

Re: Carrier Materials

Neil Atkinson <[log in to unmask]>

Fri, 11 Jun 1999 15:05:24 +0100

55 lines

Re: Carrier Materials

Joe Wackerman <[log in to unmask]>

Fri, 11 Jun 1999 08:27:52 -0700

70 lines

Re: Carrier Materials

jim <[log in to unmask]>

Fri, 11 Jun 1999 17:24:07 -0500

74 lines

Re: Carrier Materials

jim <[log in to unmask]>

Fri, 11 Jun 1999 17:24:07 -0500

84 lines

Re: Carrier Materials

Joe Wackerman <[log in to unmask]>

Fri, 11 Jun 1999 08:27:52 -0700

80 lines

Re: Carrier Materials

Jon Moore <[log in to unmask]>

Mon, 14 Jun 1999 11:23:09 EDT

23 lines

Re: Carrier Materials

Jon Moore <[log in to unmask]>

Mon, 14 Jun 1999 11:23:09 EDT

33 lines

New Thread

Ceramic PCB Info?

Ceramic PCB Info?

mjs <[log in to unmask]>

Mon, 7 Jun 1999 13:52:31 -0500

28 lines

Ceramic PCB Info?

mjs <[log in to unmask]>

Mon, 7 Jun 1999 13:52:31 -0500

40 lines

New Thread

Cleanliness

Cleanliness

Tempea, Ioan <[log in to unmask]>

Tue, 15 Jun 1999 10:27:13 -0400

33 lines

Cleanliness

Tempea, Ioan <[log in to unmask]>

Tue, 15 Jun 1999 10:27:13 -0400

44 lines

Re: Cleanliness

Doug Pauls <[log in to unmask]>

Wed, 16 Jun 1999 07:54:13 EDT

103 lines

Re: Cleanliness

Doug Pauls <[log in to unmask]>

Wed, 16 Jun 1999 07:54:13 EDT

113 lines

New Thread

Cleanliness Problem

Cleanliness Problem

VOLPE, RAY <[log in to unmask]>

Mon, 21 Jun 1999 09:49:00 -0400

38 lines

Re: Cleanliness Problem

Phil Crepeau <[log in to unmask]>

Mon, 21 Jun 1999 07:40:12 -0700

53 lines

Re: Cleanliness Problem

Graham Naisbitt <[log in to unmask]>

Mon, 21 Jun 1999 18:06:05 +0100

71 lines

Re: Cleanliness Problem

Sherman Banks <[log in to unmask]>

Tue, 22 Jun 1999 07:15:02 -0700

64 lines

New Thread

clear plastic

Re: clear plastic

Phil Crepeau <[log in to unmask]>

Tue, 1 Jun 1999 07:31:15 -0700

67 lines

Re: clear plastic

Phil Crepeau <[log in to unmask]>

Tue, 1 Jun 1999 07:31:15 -0700

77 lines

Re: clear plastic

KELLY M SCHRIVER <[log in to unmask]>

Tue, 1 Jun 1999 10:45:00 -0400

27 lines

Re: clear plastic

KELLY M SCHRIVER <[log in to unmask]>

Tue, 1 Jun 1999 10:45:00 -0400

37 lines

New Thread

Comment on: What it would be like living in Australia

Comment on: What it would be like living in Australia

[log in to unmask]

Mon, 28 Jun 1999 08:59:21 +0200

36 lines

New Thread

Compare CEM-1, CEM-3 and FR4

Re: Compare CEM-1, CEM-3 and FR4

À̹μö <[log in to unmask]>

Fri, 4 Jun 1999 14:21:57 +0900

62 lines

Re: Compare CEM-1, CEM-3 and FR4

À̹μö <[log in to unmask]>

Fri, 4 Jun 1999 14:21:57 +0900

73 lines

New Thread

Conductive Adhesive

Conductive Adhesive

West, Jim <[log in to unmask]>

Fri, 25 Jun 1999 10:22:54 -0400

35 lines

Re: Conductive Adhesive

Michael Fenner <[log in to unmask]>

Fri, 25 Jun 1999 22:01:02 +0100

109 lines

Conductive Adhesive

[log in to unmask]

Mon, 28 Jun 1999 09:14:34 +0200

66 lines

New Thread

Conductive Transparency

Conductive Transparency

Yu, Rudolph <[log in to unmask]>

Wed, 9 Jun 1999 16:27:22 -0700

57 lines

Conductive Transparency

Yu, Rudolph <[log in to unmask]>

Wed, 9 Jun 1999 16:27:22 -0700

68 lines

Re: Conductive Transparency

David Whalley <[log in to unmask]>

Thu, 10 Jun 1999 10:14:54 +0100

36 lines

Re: Conductive Transparency

David Whalley <[log in to unmask]>

Thu, 10 Jun 1999 10:14:54 +0100

46 lines

Re: Conductive Transparency

Collins, Graham <[log in to unmask]>

Thu, 10 Jun 1999 08:04:43 -0300

54 lines

Re: Conductive Transparency

Jorge Engenharia <[log in to unmask]>

Thu, 10 Jun 1999 09:19:29 -0300

94 lines

Re: Conductive Transparency

Collins, Graham <[log in to unmask]>

Thu, 10 Jun 1999 08:04:43 -0300

64 lines

Re: Conductive Transparency

Jorge Engenharia <[log in to unmask]>

Thu, 10 Jun 1999 09:19:29 -0300

104 lines

New Thread

Conformal Coating

Conformal Coating

Susan James <[log in to unmask]>

Thu, 24 Jun 1999 16:13:14 -0500

53 lines

Re: Conformal Coating

Paul Klasek <[log in to unmask]>

Thu, 24 Jun 1999 17:58:59 -0700

32 lines

Re: Conformal Coating

Graham Naisbitt <[log in to unmask]>

Fri, 25 Jun 1999 13:20:45 +0100

213 lines

Re: Conformal Coating

Dennis Beerman <[log in to unmask]>

Fri, 25 Jun 1999 07:50:05 -0400

33 lines

New Thread

conformal coating compatability

Re: conformal coating compatability

[log in to unmask]

Tue, 1 Jun 1999 13:06:26 EDT

40 lines

Re: conformal coating compatability

[log in to unmask]

Tue, 1 Jun 1999 13:06:26 EDT

50 lines

Re: conformal coating compatability

[log in to unmask]

Wed, 2 Jun 1999 17:56:33 EDT

42 lines

Re: conformal coating compatability

[log in to unmask]

Wed, 2 Jun 1999 17:56:33 EDT

52 lines

New Thread

Conformal Coatings

Conformal Coatings

Susan James <[log in to unmask]>

Tue, 29 Jun 1999 13:01:02 -0500

50 lines

New Thread

contact for test coupons?

Re: contact for test coupons?

Jason Smith <[log in to unmask]>

Mon, 7 Jun 1999 13:14:45 -0400

26 lines

Re: contact for test coupons?

Jason Smith <[log in to unmask]>

Mon, 7 Jun 1999 13:14:45 -0400

37 lines

Re: contact for test coupons?

Sauer, Steven T. <[log in to unmask]>

Mon, 7 Jun 1999 13:37:43 -0400

63 lines

Re: contact for test coupons?

Sauer, Steven T. <[log in to unmask]>

Mon, 7 Jun 1999 13:37:43 -0400

73 lines

Re: contact for test coupons?

Doug Pauls <[log in to unmask]>

Mon, 7 Jun 1999 15:48:01 EDT

53 lines

Re: contact for test coupons?

Doug Pauls <[log in to unmask]>

Mon, 7 Jun 1999 15:48:01 EDT

63 lines

New Thread

Continuous flex circuits

Re: Continuous flex circuits

Narayana Vishy-CVN002 <[log in to unmask]>

Fri, 11 Jun 1999 15:31:18 +0800

57 lines

Re: Continuous flex circuits

Narayana Vishy-CVN002 <[log in to unmask]>

Fri, 11 Jun 1999 15:31:18 +0800

68 lines

New Thread

Copper Anodes

Copper Anodes

Ted Wiktorowicz <[log in to unmask]>

Mon, 14 Jun 1999 10:34:52 -0400

43 lines

Copper Anodes

Ted Wiktorowicz <[log in to unmask]>

Mon, 14 Jun 1999 10:34:52 -0400

54 lines

Re: Copper Anodes

Carano,Michael <[log in to unmask]>

Mon, 14 Jun 1999 15:49:01 +0100

83 lines

Re: Copper Anodes

Carano,Michael <[log in to unmask]>

Mon, 14 Jun 1999 15:49:01 +0100

93 lines

Re: Copper Anodes

<Frank Conti> <[log in to unmask]>

Tue, 15 Jun 1999 19:32:33 EDT

24 lines

Re: Copper Anodes

<Frank Conti> <[log in to unmask]>

Tue, 15 Jun 1999 19:32:33 EDT

34 lines

New Thread

copper foil spec

copper foil spec

Geoff Layhe <[log in to unmask]>

Tue, 8 Jun 1999 17:11:29 +0100

30 lines

copper foil spec

Geoff Layhe <[log in to unmask]>

Tue, 8 Jun 1999 17:11:29 +0100

41 lines

New Thread

Copper thickness issues

Copper thickness issues

Charles Barker <[log in to unmask]>

Fri, 25 Jun 1999 18:20:47 -0500

46 lines

Re: Copper thickness issues

Thomas Waznis <[log in to unmask]>

Fri, 25 Jun 1999 17:38:36 -0700

21 lines

New Thread

Crimping Standard

Crimping Standard

Kath Henderson <[log in to unmask]>

Wed, 16 Jun 1999 09:32:57 +0100

26 lines

Crimping Standard

Kath Henderson <[log in to unmask]>

Wed, 16 Jun 1999 09:32:57 +0100

37 lines

Re: Crimping Standard

Phil Crepeau <[log in to unmask]>

Wed, 16 Jun 1999 07:35:13 -0700

58 lines

Re: Crimping Standard

Phil Crepeau <[log in to unmask]>

Wed, 16 Jun 1999 07:35:13 -0700

68 lines

New Thread

current loop

current loop

Lustig, Steven K.. <[log in to unmask]>

Wed, 2 Jun 1999 15:40:52 -0400

40 lines

current loop

Lustig, Steven K.. <[log in to unmask]>

Wed, 2 Jun 1999 15:40:52 -0400

51 lines

Re: current loop

Ronald J. Leckfor <[log in to unmask]>

Thu, 3 Jun 1999 09:32:53 -0400

92 lines

Re: current loop

Ronald J. Leckfor <[log in to unmask]>

Thu, 3 Jun 1999 09:32:53 -0400

103 lines

New Thread

Design software for flex

Design software for flex

James Barry <[log in to unmask]>

Wed, 16 Jun 1999 10:02:55 -0400

29 lines

Design software for flex

James Barry <[log in to unmask]>

Wed, 16 Jun 1999 10:02:55 -0400

40 lines

New Thread

Dimensionally Stable Anodes

Dimensionally Stable Anodes

<Joseph M. Webb> <[log in to unmask]>

Mon, 7 Jun 1999 13:43:42 -0400

32 lines

Dimensionally Stable Anodes

<Joseph M. Webb> <[log in to unmask]>

Mon, 7 Jun 1999 13:43:42 -0400

43 lines

Re: Dimensionally Stable Anodes

<Rudy Sedlak> <[log in to unmask]>

Tue, 8 Jun 1999 09:28:15 EDT

24 lines

Re: Dimensionally Stable Anodes

<Rudy Sedlak> <[log in to unmask]>

Tue, 8 Jun 1999 09:28:15 EDT

34 lines

New Thread

Disappearing Solder ?

Re: Disappearing Solder ?

KK Chin <[log in to unmask]>

Tue, 1 Jun 1999 09:20:45 -0700

109 lines

Re: Disappearing Solder ?

KK Chin <[log in to unmask]>

Tue, 1 Jun 1999 09:20:45 -0700

119 lines

Re: Disappearing Solder ?

[log in to unmask]

Sat, 5 Jun 1999 07:18:01 EDT

58 lines

Re: Disappearing Solder ?

[log in to unmask]

Sat, 5 Jun 1999 07:18:01 EDT

68 lines

New Thread

Documenting Notches

Documenting Notches

Darrel Therriault <[log in to unmask]>

Mon, 14 Jun 1999 17:14:18 -0700

41 lines

Documenting Notches

Darrel Therriault <[log in to unmask]>

Mon, 14 Jun 1999 17:14:18 -0700

52 lines

Re: Documenting Notches

doug smith <[log in to unmask]>

Mon, 14 Jun 1999 17:31:10 -0700

82 lines

Re: Documenting Notches

doug smith <[log in to unmask]>

Mon, 14 Jun 1999 17:31:10 -0700

93 lines

New Thread

Don't Open Attachments!!!!!!

Don't Open Attachments!!!!!!

Richard Hamilton <[log in to unmask]>

Mon, 14 Jun 1999 08:41:36 -0700

46 lines

Don't Open Attachments!!!!!!

Richard Hamilton <[log in to unmask]>

Mon, 14 Jun 1999 08:41:36 -0700

57 lines

Re: Don't Open Attachments!!!!!!

Mark Simmons <[log in to unmask]>

Mon, 14 Jun 1999 09:29:03 -0700

67 lines

Re: Don't Open Attachments!!!!!!

Mark Simmons <[log in to unmask]>

Mon, 14 Jun 1999 09:29:03 -0700

77 lines

Re: Don't Open Attachments!!!!!!

James Patten <[log in to unmask]>

Mon, 14 Jun 1999 09:47:29 -0700

101 lines

Re: Don't Open Attachments!!!!!!

James Patten <[log in to unmask]>

Mon, 14 Jun 1999 09:47:29 -0700

111 lines

Re: Don't Open Attachments!!!!!!

Richard Hamilton <[log in to unmask]>

Mon, 14 Jun 1999 09:47:04 -0700

106 lines

Re: Don't Open Attachments!!!!!!

Richard Hamilton <[log in to unmask]>

Mon, 14 Jun 1999 09:47:04 -0700

117 lines

Re: Don't Open Attachments!!!!!!

Ronald J. Leckfor <[log in to unmask]>

Mon, 14 Jun 1999 15:00:54 -0400

187 lines

Re: Don't Open Attachments!!!!!!

Ronald J. Leckfor <[log in to unmask]>

Mon, 14 Jun 1999 15:00:54 -0400

198 lines

New Thread

down again?

down again?

Dan Klug <[log in to unmask]>

Tue, 29 Jun 1999 10:27:07 -0700

11 lines

Re: down again?

Lon Weffers <[log in to unmask]>

Wed, 30 Jun 1999 07:19:58 +0200

21 lines

New Thread

DPM Levels

DPM Levels

Ben Hammond <[log in to unmask]>

Wed, 16 Jun 1999 08:51:30 +0100

77 lines

DPM Levels

Ben Hammond <[log in to unmask]>

Wed, 16 Jun 1999 08:51:30 +0100

88 lines

New Thread

Dull discolored solder joints.

Dull discolored solder joints.

Paul Allan <[log in to unmask]>

Tue, 8 Jun 1999 09:17:31 -0700

32 lines

Dull discolored solder joints.

Paul Allan <[log in to unmask]>

Tue, 8 Jun 1999 09:17:31 -0700

43 lines

Re: Dull discolored solder joints.

Kinol, Vince <[log in to unmask]>

Tue, 8 Jun 1999 13:35:34 -0400

42 lines

Re: Dull discolored solder joints.

Kinol, Vince <[log in to unmask]>

Tue, 8 Jun 1999 13:35:34 -0400

52 lines

Re: Dull discolored solder joints.

David D Hillman <[log in to unmask]>

Wed, 9 Jun 1999 06:27:17 -0500

59 lines

Re: Dull discolored solder joints.

David D Hillman <[log in to unmask]>

Wed, 9 Jun 1999 06:27:17 -0500

69 lines

New Thread

duplicate messages

duplicate messages

Energy Technology Systems <[log in to unmask]>

Tue, 1 Jun 1999 14:41:00 -0700

28 lines

duplicate messages

Energy Technology Systems <[log in to unmask]>

Tue, 1 Jun 1999 14:41:00 -0700

39 lines

Re: duplicate messages

Jack Olson <[log in to unmask]>

Wed, 2 Jun 1999 09:23:36 -0700

42 lines

Re: duplicate messages

Jack Olson <[log in to unmask]>

Wed, 2 Jun 1999 09:23:36 -0700

52 lines

New Thread

Duplicate Messages Duplicate Messages

Duplicate Messages Duplicate Messages

Susan James <[log in to unmask]>

Wed, 2 Jun 1999 15:54:48 -0500

29 lines

Duplicate Messages Duplicate Messages

Susan James <[log in to unmask]>

Wed, 2 Jun 1999 15:54:48 -0500

40 lines

New Thread

E-mail Charges:

Re: E-mail Charges:

Ian Squires <[log in to unmask]>

Thu, 10 Jun 1999 09:02:57 +0000

300 lines

Re: E-mail Charges:

Ian Squires <[log in to unmask]>

Thu, 10 Jun 1999 09:02:57 +0000

310 lines

New Thread

E-mail Charges: Response from Pete Stark (CA Congressman)

E-mail Charges: Response from Pete Stark (CA Congressman)

Bill Davis <[log in to unmask]>

Wed, 9 Jun 1999 15:20:14 -0700

218 lines

E-mail Charges: Response from Pete Stark (CA Congressman)

Bill Davis <[log in to unmask]>

Wed, 9 Jun 1999 15:20:14 -0700

229 lines

New Thread

Edge Connector for .125" thick PWB

Edge Connector for .125" thick PWB

Peterson, Gary D <[log in to unmask]>

Thu, 3 Jun 1999 08:58:25 -0600

32 lines

Edge Connector for .125" thick PWB

Peterson, Gary D <[log in to unmask]>

Thu, 3 Jun 1999 08:58:25 -0600

43 lines

Re: Edge Connector for .125" thick PWB

Richard J. Pfeiffer <[log in to unmask]>

Thu, 3 Jun 1999 11:22:16 -0400

24 lines

Re: Edge Connector for .125" thick PWB

Richard J. Pfeiffer <[log in to unmask]>

Thu, 3 Jun 1999 11:22:16 -0400

35 lines

Re: Edge Connector for .125" thick PWB

Beckman, Michael W <[log in to unmask]>

Thu, 3 Jun 1999 10:13:16 -0700

65 lines

Re: Edge Connector for .125" thick PWB

Beckman, Michael W <[log in to unmask]>

Thu, 3 Jun 1999 10:13:16 -0700

75 lines

New Thread

EDT CAD

EDT CAD

Thomas J. Gulley <[log in to unmask]>

Fri, 18 Jun 1999 16:21:45 -0500

28 lines

New Thread

Effects of moisture on TDR measurements

Effects of moisture on TDR measurements

[log in to unmask]

Mon, 28 Jun 1999 11:28:42 -0700

14 lines

New Thread

Electroless Silver

Electroless Silver

[log in to unmask]

Thu, 3 Jun 1999 10:16:12 EDT

28 lines

Electroless Silver

[log in to unmask]

Thu, 3 Jun 1999 10:16:12 EDT

39 lines

New Thread

Embedment, potting

Embedment, potting

Wanner Bernhard <[log in to unmask]>

Thu, 24 Jun 1999 16:26:57 +0200

27 lines

Re: Embedment, potting

Werner Engelmaier <[log in to unmask]>

Thu, 24 Jun 1999 20:15:16 EDT

31 lines

Re: Embedment, potting

Phil Crepeau <[log in to unmask]>

Fri, 25 Jun 1999 07:12:59 -0700

32 lines

Re: Embedment, potting

Werner Engelmaier <[log in to unmask]>

Sat, 26 Jun 1999 08:17:57 EDT

36 lines

New Thread

Epoxy

Epoxy

Iain Braddock <[log in to unmask]>

Mon, 14 Jun 1999 11:24:17 +0100

108 lines

Epoxy

Iain Braddock <[log in to unmask]>

Mon, 14 Jun 1999 11:24:17 +0100

119 lines

Re: Epoxy

Glenn Pelkey <[log in to unmask]>

Mon, 14 Jun 1999 09:30:31 PDT

55 lines

Re: Epoxy

Glenn Pelkey <[log in to unmask]>

Mon, 14 Jun 1999 09:30:31 PDT

66 lines

Re: Epoxy

Sunil Gupta <[log in to unmask]>

Wed, 16 Jun 1999 13:57:00 +0530

28 lines

Re: Epoxy

Sunil Gupta <[log in to unmask]>

Wed, 16 Jun 1999 13:57:00 +0530

38 lines

Epoxy

Graham Naisbitt <[log in to unmask]>

Mon, 21 Jun 1999 13:08:15 +0100

80 lines

Re: Epoxy

joyce <[log in to unmask]>

Mon, 21 Jun 1999 20:45:35 -0400

72 lines

Re: Epoxy

Graham Naisbitt <[log in to unmask]>

Wed, 23 Jun 1999 14:20:58 +0100

111 lines

Re: Epoxy

Michael Fenner <[log in to unmask]>

Wed, 23 Jun 1999 19:59:22 +0100

197 lines

New Thread

Escape path and decoupling for 225-Ball BGA (fwd)

Escape path and decoupling for 225-Ball BGA (fwd)

Bob Vanech <[log in to unmask]>

Fri, 18 Jun 1999 18:24:47 +0000

30 lines

Re: Escape path and decoupling for 225-Ball BGA (fwd)

Per Viklund <[log in to unmask]>

Sat, 19 Jun 1999 10:11:13 +0200

107 lines

Re: Escape path and decoupling for 225-Ball BGA (fwd)

Per Viklund <[log in to unmask]>

Sat, 19 Jun 1999 10:14:19 +0200

26 lines

Re: Escape path and decoupling for 225-Ball BGA (fwd)

Beckman, Michael W <[log in to unmask]>

Mon, 21 Jun 1999 11:59:38 -0700

115 lines

New Thread

ESD Issues

ESD Issues

Eric Kalgren <[log in to unmask]>

Fri, 4 Jun 1999 16:23:46 -0600

34 lines

ESD Issues

Eric Kalgren <[log in to unmask]>

Fri, 4 Jun 1999 16:23:46 -0600

45 lines

Re: ESD Issues

McMonagle, Michael R. <[log in to unmask]>

Sat, 5 Jun 1999 08:38:50 -0500

69 lines

Re: ESD Issues

McMonagle, Michael R. <[log in to unmask]>

Sat, 5 Jun 1999 08:38:50 -0500

79 lines

Re: ESD Issues

Thorup, John <[log in to unmask]>

Mon, 7 Jun 1999 06:20:54 -0700

59 lines

Re: ESD Issues

Ronald J. Leckfor <[log in to unmask]>

Mon, 7 Jun 1999 11:06:05 -0400

181 lines

Re: ESD Issues

Thorup, John <[log in to unmask]>

Mon, 7 Jun 1999 06:20:54 -0700

70 lines

Re: ESD Issues

Ronald J. Leckfor <[log in to unmask]>

Mon, 7 Jun 1999 11:06:05 -0400

192 lines

Re: ESD Issues

Paul Klasek <[log in to unmask]>

Mon, 7 Jun 1999 16:19:33 -0700

125 lines

Re: ESD Issues

Paul Klasek <[log in to unmask]>

Mon, 7 Jun 1999 16:19:33 -0700

136 lines

Re: ESD Issues

Finlay Buchan <[log in to unmask]>

Tue, 8 Jun 1999 15:45:13 +0100

103 lines

Re: ESD Issues

Finlay Buchan <[log in to unmask]>

Tue, 8 Jun 1999 15:45:13 +0100

113 lines

New Thread

Fab Gold barrier lubricant

Re: Fab Gold barrier lubricant

Ed Cosper <[log in to unmask]>

Fri, 25 Jun 1999 10:28:45 -0400

78 lines

Re: Fab Gold barrier lubricant

Hinners, Hans - LYPME <[log in to unmask]>

Fri, 25 Jun 1999 16:38:03 -0400

75 lines

Re: Fab Gold barrier lubricant

Jerry Cupples <[log in to unmask]>

Tue, 29 Jun 1999 13:18:48 -0500

49 lines

New Thread

Fab Gold barrier lubricant <IPC TN>

Re: Fab Gold barrier lubricant <IPC TN>

Alderete, Michael <[log in to unmask]>

Mon, 28 Jun 1999 12:03:07 -0700

56 lines

New Thread

Fab: Tap and die callouts

Fab: Tap and die callouts

Ed Cosper <[log in to unmask]>

Tue, 15 Jun 1999 13:52:39 -0400

67 lines

Fab: Tap and die callouts

Ed Cosper <[log in to unmask]>

Tue, 15 Jun 1999 13:52:39 -0400

78 lines

Re: Fab: Tap and die callouts

McGlaughlin, Jeffrey A <[log in to unmask]>

Tue, 15 Jun 1999 13:57:03 -0400

45 lines

Re: Fab: Tap and die callouts

McGlaughlin, Jeffrey A <[log in to unmask]>

Tue, 15 Jun 1999 13:57:03 -0400

55 lines

Re: Fab: Tap and die callouts

Ryan Jennens <[log in to unmask]>

Tue, 15 Jun 1999 14:07:55 -0400

80 lines

Re: Fab: Tap and die callouts

Ryan Jennens <[log in to unmask]>

Tue, 15 Jun 1999 14:07:55 -0400

90 lines

Re: Fab: Tap and die callouts

Keel, Mike <[log in to unmask]>

Tue, 15 Jun 1999 11:16:57 -0700

69 lines

Re: Fab: Tap and die callouts

Keel, Mike <[log in to unmask]>

Tue, 15 Jun 1999 11:16:57 -0700

79 lines

Re: Fab: Tap and die callouts

Jerry Wagner <[log in to unmask]>

Tue, 15 Jun 1999 11:21:51 -0700

44 lines

Re: Fab: Tap and die callouts

Jerry Wagner <[log in to unmask]>

Tue, 15 Jun 1999 11:21:51 -0700

54 lines

Re: Fab: Tap and die callouts

Kathy Stillings <[log in to unmask]>

Tue, 15 Jun 1999 14:46:07 -0400

30 lines

Re: Fab: Tap and die callouts

Kathy Stillings <[log in to unmask]>

Tue, 15 Jun 1999 14:46:07 -0400

40 lines

Re: Fab: Tap and die callouts

Kathy Stillings <[log in to unmask]>

Tue, 15 Jun 1999 14:56:24 -0400

25 lines

Re: Fab: Tap and die callouts

Kathy Stillings <[log in to unmask]>

Tue, 15 Jun 1999 14:56:24 -0400

35 lines

Re: Fab: Tap and die callouts

Larry Jindra <[log in to unmask]>

Tue, 15 Jun 1999 12:15:44 -0700

112 lines

Re: Fab: Tap and die callouts

Larry Jindra <[log in to unmask]>

Tue, 15 Jun 1999 12:15:44 -0700

123 lines

Re: Fab: Tap and die callouts

Ed Cosper <[log in to unmask]>

Tue, 15 Jun 1999 16:49:08 -0400

71 lines

Re: Fab: Tap and die callouts

Ed Cosper <[log in to unmask]>

Tue, 15 Jun 1999 16:49:08 -0400

81 lines

Re: Fab: Tap and die callouts

Pat Lujan <[log in to unmask]>

Wed, 16 Jun 1999 09:03:35 -0600

42 lines

Re: Fab: Tap and die callouts

Pat Lujan <[log in to unmask]>

Wed, 16 Jun 1999 09:03:35 -0600

53 lines

New Thread

Facilities planning software

Facilities planning software

Ted Wiktorowicz <[log in to unmask]>

Fri, 4 Jun 1999 11:54:00 -0400

35 lines

Facilities planning software

Ted Wiktorowicz <[log in to unmask]>

Fri, 4 Jun 1999 11:54:00 -0400

46 lines

Re: Facilities planning software

Beckman, Michael W <[log in to unmask]>

Fri, 4 Jun 1999 09:35:40 -0700

69 lines

Re: Facilities planning software

Beckman, Michael W <[log in to unmask]>

Fri, 4 Jun 1999 09:35:40 -0700

79 lines

Re: Facilities planning software

Richard Hamilton <[log in to unmask]>

Fri, 4 Jun 1999 10:00:33 -0700

69 lines

Re: Facilities planning software

Richard Hamilton <[log in to unmask]>

Fri, 4 Jun 1999 10:00:33 -0700

79 lines

New Thread

Fingerprints

Fingerprints

Tempea, Ioan <[log in to unmask]>

Tue, 1 Jun 1999 14:22:41 -0400

37 lines

Fingerprints

Tempea, Ioan <[log in to unmask]>

Tue, 1 Jun 1999 14:22:41 -0400

48 lines

Re: Fingerprints

Dave Robertson <[log in to unmask]>

Tue, 1 Jun 1999 15:36:12 -0400

70 lines

Re: Fingerprints

Dave Robertson <[log in to unmask]>

Tue, 1 Jun 1999 15:36:12 -0400

80 lines

Re: Fingerprints

Bryan Kerr <[log in to unmask]>

Tue, 1 Jun 1999 22:30:00 +0100

69 lines

Re: Fingerprints

Bryan Kerr <[log in to unmask]>

Tue, 1 Jun 1999 22:30:00 +0100

79 lines

Re: Fingerprints

[log in to unmask]

Sat, 5 Jun 1999 07:18:03 EDT

58 lines

Re: Fingerprints

[log in to unmask]

Sat, 5 Jun 1999 07:18:03 EDT

68 lines

New Thread

Fingerprints II

Fingerprints II

Tempea, Ioan <[log in to unmask]>

Wed, 2 Jun 1999 13:38:41 -0400

30 lines

Re: Fingerprints II

Ronald J. Leckfor <[log in to unmask]>

Wed, 2 Jun 1999 15:24:31 -0400

147 lines

Fingerprints II

Tempea, Ioan <[log in to unmask]>

Wed, 2 Jun 1999 13:38:41 -0400

41 lines

Re: Fingerprints II

Bill Davis <[log in to unmask]>

Wed, 2 Jun 1999 14:04:33 -0700

63 lines

Re: Fingerprints II

Bill Davis <[log in to unmask]>

Wed, 2 Jun 1999 14:04:33 -0700

73 lines

Re: Fingerprints II

Ronald J. Leckfor <[log in to unmask]>

Wed, 2 Jun 1999 15:24:31 -0400

158 lines

Re: Fingerprints II

Edwards, Ted A (AZ75) <[log in to unmask]>

Wed, 2 Jun 1999 15:02:53 -0700

87 lines

Re: Fingerprints II

Edwards, Ted A (AZ75) <[log in to unmask]>

Wed, 2 Jun 1999 15:02:53 -0700

97 lines

Re: Fingerprints II

Terry Munson <[log in to unmask]>

Thu, 3 Jun 1999 07:31:44 EDT

37 lines

Re: Fingerprints II

Terry Munson <[log in to unmask]>

Thu, 3 Jun 1999 07:31:44 EDT

47 lines

New Thread

flip-chip bonding

flip-chip bonding

No Name Available <[log in to unmask]>

Wed, 2 Jun 1999 08:08:19 +0000

29 lines

flip-chip bonding

No Name Available <[log in to unmask]>

Wed, 2 Jun 1999 08:08:19 +0000

40 lines

flip-chip bonding

<Gareth Jones> <[log in to unmask]>

Thu, 3 Jun 1999 11:01:29 +0000

35 lines

flip-chip bonding

<Gareth Jones> <[log in to unmask]>

Thu, 3 Jun 1999 11:01:29 +0000

46 lines

New Thread

from jpl

Re: from jpl

Chalmer, Paul <[log in to unmask]>

Fri, 11 Jun 1999 14:16:16 -0400

61 lines

Re: from jpl

Rob Watson <[log in to unmask]>

Fri, 11 Jun 1999 14:33:07 -0400

80 lines

Re: from jpl

Chalmer, Paul <[log in to unmask]>

Fri, 11 Jun 1999 14:43:57 -0400

113 lines

Re: from jpl

Chalmer, Paul <[log in to unmask]>

Fri, 11 Jun 1999 14:16:16 -0400

71 lines

Re: from jpl

Chalmer, Paul <[log in to unmask]>

Fri, 11 Jun 1999 14:43:57 -0400

123 lines

Re: from jpl

Chalmer, Paul <[log in to unmask]>

Fri, 11 Jun 1999 15:53:09 -0400

145 lines

Re: from jpl

Chalmer, Paul <[log in to unmask]>

Fri, 11 Jun 1999 15:53:09 -0400

155 lines

Re: from jpl

Rob Watson <[log in to unmask]>

Fri, 11 Jun 1999 14:33:07 -0400

90 lines

Re: from JPL

Hinners, Hans - LYPME <[log in to unmask]>

Fri, 11 Jun 1999 16:21:48 -0400

64 lines

Re: from JPL

Hinners, Hans - LYPME <[log in to unmask]>

Fri, 11 Jun 1999 16:21:48 -0400

75 lines

New Thread

Fuji IP feeders vs. Hover-Davis IP style feeders

Fuji IP feeders vs. Hover-Davis IP style feeders

Wade Oberle <[log in to unmask]>

Thu, 24 Jun 1999 11:54:00 -0500

26 lines

New Thread

FW: Castin

FW: Castin

Ryan Jennens <[log in to unmask]>

Tue, 29 Jun 1999 15:42:09 -0400

104 lines

Re: FW: Castin

Bev Christian <[log in to unmask]>

Tue, 29 Jun 1999 15:51:45 -0400

50 lines

New Thread

Fw: Subject: Please read the la

Re: Fw: Subject: Please read the la

Ian Squires <[log in to unmask]>

Wed, 9 Jun 1999 09:54:35 +0000

207 lines

Re: Fw: Subject: Please read the la

Ian Squires <[log in to unmask]>

Wed, 9 Jun 1999 09:54:35 +0000

217 lines

New Thread

Fw: Subject: Please read the last lines

Fw: Subject: Please read the last lines

Joe Cachina <[log in to unmask]>

Tue, 8 Jun 1999 15:33:36 -0400

162 lines

Re: Fw: Subject: Please read the last lines

Hinners, Hans - LYPME <[log in to unmask]>

Tue, 8 Jun 1999 15:47:23 -0400

191 lines

Re: Fw: Subject: Please read the last lines

Eric Kalgren <[log in to unmask]>

Tue, 8 Jun 1999 14:04:47 -0600

222 lines

Re: Fw: Subject: Please read the last lines

Eric Kalgren <[log in to unmask]>

Tue, 8 Jun 1999 14:04:47 -0600

233 lines

Fw: Subject: Please read the last lines

Joe Cachina <[log in to unmask]>

Tue, 8 Jun 1999 15:33:36 -0400

158 lines

Re: Fw: Subject: Please read the last lines

Hinners, Hans - LYPME <[log in to unmask]>

Tue, 8 Jun 1999 15:47:23 -0400

202 lines

Re: Fw: Subject: Please read the last lines

Matthew Lamkin <[log in to unmask]>

Wed, 9 Jun 1999 08:14:05 +0100

32 lines

Re: Fw: Subject: Please read the last lines

Matthew Lamkin <[log in to unmask]>

Wed, 9 Jun 1999 08:14:05 +0100

43 lines

New Thread

FW: Vibration Analysis [Question: PWB natural freq = ?] <IPC TN>

FW: Vibration Analysis [Question: PWB natural freq = ?] <IPC TN>

Alderete, Michael <[log in to unmask]>

Wed, 23 Jun 1999 14:53:14 -0700

102 lines

New Thread

FW: What it would be like living in Australia

FW: What it would be like living in Australia

Paul Klasek <[log in to unmask]>

Thu, 24 Jun 1999 23:23:37 -0700

117 lines

Re: FW: What it would be like living in Australia

Matthew Lamkin <[log in to unmask]>

Fri, 25 Jun 1999 08:25:31 +0100

42 lines

Re: FW: What it would be like living in Australia

Garry Beaumont <[log in to unmask]>

Fri, 25 Jun 1999 20:22:55 +1200

12 lines

New Thread

Fwd: Charges for E-mail, Fw: Please read & Pass Along

Fwd: Charges for E-mail, Fw: Please read & Pass Along

Phillip E Hinton <[log in to unmask]>

Tue, 8 Jun 1999 14:28:42 EDT

193 lines

Fwd: Charges for E-mail, Fw: Please read & Pass Along

Phillip E Hinton <[log in to unmask]>

Tue, 8 Jun 1999 14:28:42 EDT

204 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Larry Campbell <[log in to unmask]>

Tue, 8 Jun 1999 14:40:15 -0400

39 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Larry Campbell <[log in to unmask]>

Tue, 8 Jun 1999 14:40:15 -0400

50 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Collins, Graham <[log in to unmask]>

Tue, 8 Jun 1999 15:45:04 -0300

53 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Collins, Graham <[log in to unmask]>

Tue, 8 Jun 1999 15:45:04 -0300

63 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Beckman, Michael W <[log in to unmask]>

Tue, 8 Jun 1999 12:03:31 -0700

45 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 8 Jun 1999 13:57:00 -0500

22 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Hinners, Hans - LYPME <[log in to unmask]>

Tue, 8 Jun 1999 14:46:33 -0400

62 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

David Rist <[log in to unmask]>

Tue, 8 Jun 1999 15:12:04 EDT

44 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

James Patten <[log in to unmask]>

Tue, 8 Jun 1999 12:14:46 -0700

40 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

PAUL BROWN <[log in to unmask]>

Tue, 8 Jun 1999 15:49:40 -0400

59 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

PAUL BROWN <[log in to unmask]>

Tue, 8 Jun 1999 15:49:40 -0400

69 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

James Patten <[log in to unmask]>

Tue, 8 Jun 1999 12:14:46 -0700

50 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Hinners, Hans - LYPME <[log in to unmask]>

Tue, 8 Jun 1999 14:46:33 -0400

73 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 8 Jun 1999 13:57:00 -0500

33 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Beckman, Michael W <[log in to unmask]>

Tue, 8 Jun 1999 12:03:31 -0700

55 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

David Rist <[log in to unmask]>

Tue, 8 Jun 1999 15:12:04 EDT

54 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Bill Davis <[log in to unmask]>

Tue, 8 Jun 1999 15:42:12 -0700

95 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Bill Davis <[log in to unmask]>

Tue, 8 Jun 1999 15:42:12 -0700

105 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Matthew Lamkin <[log in to unmask]>

Wed, 9 Jun 1999 08:06:48 +0100

41 lines

Re: Fwd: Charges for E-mail, Fw: Please read & Pass Along

Matthew Lamkin <[log in to unmask]>

Wed, 9 Jun 1999 08:06:48 +0100

52 lines

New Thread

FWD: [TN] Scrap PCB's Recycled

FWD: [TN] Scrap PCB's Recycled

Hammad M Hammad <[log in to unmask]>

Thu, 3 Jun 1999 22:15:33 -0700

71 lines

FWD: [TN] Scrap PCB's Recycled

Hammad M Hammad <[log in to unmask]>

Thu, 3 Jun 1999 22:15:33 -0700

82 lines

New Thread

Gluing components

Gluing components

John Chandler <[log in to unmask]>

Wed, 9 Jun 1999 15:54:59 +0200

40 lines

Gluing components

John Chandler <[log in to unmask]>

Wed, 9 Jun 1999 15:54:59 +0200

51 lines

Re: Gluing components

Joe Wackerman <[log in to unmask]>

Wed, 9 Jun 1999 16:57:39 -0700

71 lines

Re: Gluing components

Joe Wackerman <[log in to unmask]>

Wed, 9 Jun 1999 16:57:39 -0700

81 lines

Re: Gluing components

ed hale <[log in to unmask]>

Thu, 10 Jun 1999 17:03:38 +1000

62 lines

Re: Gluing components

ed hale <[log in to unmask]>

Thu, 10 Jun 1999 17:03:38 +1000

72 lines

Re: Gluing components

Mark Austin <[log in to unmask]>

Thu, 10 Jun 1999 09:12:00 +0100

79 lines

Re: Gluing components

Ian Squires <[log in to unmask]>

Thu, 10 Jun 1999 09:09:02 +0000

106 lines

Re: Gluing components

Mark Austin <[log in to unmask]>

Thu, 10 Jun 1999 09:12:00 +0100

90 lines

Re: Gluing components

Ian Squires <[log in to unmask]>

Thu, 10 Jun 1999 09:09:02 +0000

116 lines

Re: Gluing components

Jorge Engenharia <[log in to unmask]>

Thu, 10 Jun 1999 08:34:53 -0400

81 lines

Re: Gluing components

McMonagle, Michael R. <[log in to unmask]>

Thu, 10 Jun 1999 08:15:54 -0500

90 lines

Re: Gluing components

McMonagle, Michael R. <[log in to unmask]>

Thu, 10 Jun 1999 08:15:54 -0500

100 lines

Re: Gluing components

Jorge Engenharia <[log in to unmask]>

Thu, 10 Jun 1999 08:34:53 -0400

91 lines

New Thread

Gold Plating Service's

Gold Plating Service's

James Barry <[log in to unmask]>

Wed, 2 Jun 1999 08:35:00 -0400

25 lines

Re: Gold Plating Service's

Andy Slade <[log in to unmask]>

Wed, 2 Jun 1999 12:38:03 -0400

54 lines

Re: Gold Plating Service's

David Jandzinski <[log in to unmask]>

Wed, 2 Jun 1999 11:50:02 -0700

49 lines

Gold Plating Service's

James Barry <[log in to unmask]>

Wed, 2 Jun 1999 08:35:00 -0400

36 lines

Re: Gold Plating Service's

Andy Slade <[log in to unmask]>

Wed, 2 Jun 1999 12:38:03 -0400

64 lines

Re: Gold Plating Service's

David Jandzinski <[log in to unmask]>

Wed, 2 Jun 1999 11:50:02 -0700

59 lines

New Thread

HASL Solder Height

HASL Solder Height

Dale Marcum <[log in to unmask]>

Wed, 23 Jun 1999 17:09:57 -0400

23 lines

New Thread

heat cycles allowed per joint for rework purposes

heat cycles allowed per joint for rework purposes

Martin Dooner * <[log in to unmask]>

Thu, 10 Jun 1999 15:20:15 +0100

83 lines

heat cycles allowed per joint for rework purposes

Martin Dooner * <[log in to unmask]>

Thu, 10 Jun 1999 15:20:15 +0100

94 lines

New Thread

Heat Sink Assembly

Heat Sink Assembly

Aric Anderson <[log in to unmask]>

Mon, 21 Jun 1999 14:53:55 -0500

31 lines

Re: Heat Sink Assembly

Collins, Graham <[log in to unmask]>

Tue, 22 Jun 1999 07:59:01 -0300

59 lines

Re: Heat Sink Assembly

McMonagle, Michael R. <[log in to unmask]>

Tue, 22 Jun 1999 08:42:24 -0500

53 lines

Re: Heat Sink Assembly

Moss, Thomas <[log in to unmask]>

Tue, 22 Jun 1999 07:48:22 -0700

70 lines

Re: Heat Sink Assembly

Scott Mcanall <[log in to unmask]>

Tue, 22 Jun 1999 13:28:25 EDT

14 lines

Re: Heat Sink Assembly

[log in to unmask]

Mon, 28 Jun 1999 16:07:50 +0200

71 lines

New Thread

Here's one for the UK Technetters.

Here's one for the UK Technetters.

Mark Austin <[log in to unmask]>

Mon, 14 Jun 1999 16:53:00 +0100

39 lines

Here's one for the UK Technetters.

Mark Austin <[log in to unmask]>

Mon, 14 Jun 1999 16:53:00 +0100

50 lines

New Thread

hi-density capacitors

hi-density capacitors

Jim Mathis <[log in to unmask]>

Wed, 2 Jun 1999 16:43:56 EDT

32 lines

hi-density capacitors

Jim Mathis <[log in to unmask]>

Wed, 2 Jun 1999 16:43:56 EDT

42 lines

Re: hi-density capacitors

Beckman, Michael W <[log in to unmask]>

Wed, 2 Jun 1999 15:02:50 -0700

73 lines

Re: hi-density capacitors

Beckman, Michael W <[log in to unmask]>

Wed, 2 Jun 1999 15:02:50 -0700

83 lines

New Thread

High Precision Drill Press

High Precision Drill Press

Aric Anderson <[log in to unmask]>

Fri, 25 Jun 1999 09:36:34 -0500

25 lines

Re: High Precision Drill Press

Keith Larson <[log in to unmask]>

Fri, 25 Jun 1999 12:44:18 -0500

103 lines

Re: High Precision Drill Press

McMonagle, Michael R. <[log in to unmask]>

Fri, 25 Jun 1999 14:28:36 -0500

55 lines

Re: High Precision Drill Press

Ahne Oosterhof <[log in to unmask]>

Fri, 25 Jun 1999 17:49:54 -0700

44 lines

New Thread

High temperature IC precision contacts

High temperature IC precision contacts

Matthias Mansfeld <[log in to unmask]>

Sat, 19 Jun 1999 00:58:39 +0200

29 lines

New Thread

Hoax, Virus and Urban Myths websites (was RE: [TN] Fwd: Charges f or E-mail, Fw: Please read & Pass Along)

Hoax, Virus and Urban Myths websites (was RE: [TN] Fwd: Charges f or E-mail, Fw: Please read & Pass Along)

Hinners, Hans - LYPME <[log in to unmask]>

Tue, 8 Jun 1999 15:56:44 -0400

127 lines

New Thread

ICT Test Pads on PWB

ICT Test Pads on PWB

KK Chin <[log in to unmask]>

Tue, 29 Jun 1999 10:24:15 -0700

27 lines

Re: ICT Test Pads on PWB

Robert D. Green <[log in to unmask]>

Tue, 29 Jun 1999 16:16:47 -0400

69 lines

New Thread

Imersion Silver

Imersion Silver

CharlesC <[log in to unmask]>

Mon, 7 Jun 1999 08:33:26 -0500

35 lines

Imersion Silver

CharlesC <[log in to unmask]>

Mon, 7 Jun 1999 08:33:26 -0500

46 lines

Re: Imersion Silver

Paul Brown <[log in to unmask]>

Mon, 7 Jun 1999 21:33:55 +0100

67 lines

Re: Imersion Silver

Paul Brown <[log in to unmask]>

Mon, 7 Jun 1999 21:33:55 +0100

77 lines

Re: Imersion Silver

Kathy Palumbo <[log in to unmask]>

Mon, 7 Jun 1999 16:35:25 -0700

110 lines

Re: Imersion Silver

Kathy Palumbo <[log in to unmask]>

Mon, 7 Jun 1999 16:35:25 -0700

120 lines

New Thread

Immersion Gold Fabrication Processes / Specifications

Immersion Gold Fabrication Processes / Specifications

David Schaefer <[log in to unmask]>

Thu, 27 May 1999 13:49:11 -0400

45 lines

Immersion Gold Fabrication Processes / Specifications

David Schaefer <[log in to unmask]>

Thu, 27 May 1999 13:49:11 -0400

56 lines

Re: Immersion Gold Fabrication Processes / Specifications

doug smith <[log in to unmask]>

Wed, 2 Jun 1999 09:36:12 -0700

104 lines

Re: Immersion Gold Fabrication Processes / Specifications

Mcmaster, Michael <[log in to unmask]>

Wed, 2 Jun 1999 13:26:15 -0700

91 lines

Re: Immersion Gold Fabrication Processes / Specifications

doug smith <[log in to unmask]>

Wed, 2 Jun 1999 09:36:12 -0700

115 lines

Re: Immersion Gold Fabrication Processes / Specifications

Mcmaster, Michael <[log in to unmask]>

Wed, 2 Jun 1999 13:26:15 -0700

101 lines

New Thread

Immersion Silver

Re: Immersion Silver

Paul Klasek <[log in to unmask]>

Mon, 7 Jun 1999 16:56:07 -0700

147 lines

Re: Immersion Silver

Paul Klasek <[log in to unmask]>

Mon, 7 Jun 1999 16:56:07 -0700

158 lines

Re: Immersion Silver

Neil Atkinson <[log in to unmask]>

Tue, 8 Jun 1999 08:06:47 +0100

39 lines

Re: Immersion Silver

Neil Atkinson <[log in to unmask]>

Tue, 8 Jun 1999 08:06:47 +0100

50 lines

Re: Immersion Silver

Vandendolder, Ron <[log in to unmask]>

Tue, 8 Jun 1999 09:12:46 -0400

78 lines

Re: Immersion Silver

Vandendolder, Ron <[log in to unmask]>

Tue, 8 Jun 1999 09:12:46 -0400

88 lines

New Thread

Immersion Silver [HASL Alternatives] <IPC TN>

Re: Immersion Silver [HASL Alternatives] <IPC TN>

Alderete, Michael <[log in to unmask]>

Tue, 8 Jun 1999 07:38:22 -0700

254 lines

Re: Immersion Silver [HASL Alternatives] <IPC TN>

Alderete, Michael <[log in to unmask]>

Tue, 8 Jun 1999 07:38:22 -0700

265 lines

Re: Immersion Silver [HASL Alternatives] <IPC TN>

Bob Cochran <[log in to unmask]>

Tue, 8 Jun 1999 08:34:04 -0700

273 lines

Re: Immersion Silver [HASL Alternatives] <IPC TN>

Bob Cochran <[log in to unmask]>

Tue, 8 Jun 1999 08:34:04 -0700

283 lines

Re: Immersion Silver [HASL Alternatives] <IPC TN>

Paul Klasek <[log in to unmask]>

Wed, 9 Jun 1999 09:53:55 +1000

192 lines

Re: Immersion Silver [HASL Alternatives] <IPC TN>

Paul Klasek <[log in to unmask]>

Wed, 9 Jun 1999 09:53:55 +1000

202 lines

Re: Immersion Silver [HASL Alternatives] <IPC TN>

joyce <[log in to unmask]>

Tue, 8 Jun 1999 20:53:40 -0400

215 lines

Re: Immersion Silver [HASL Alternatives] <IPC TN>

joyce <[log in to unmask]>

Tue, 8 Jun 1999 20:53:40 -0400

225 lines

New Thread

Info on Fuji CP-3 placement machine

Info on Fuji CP-3 placement machine

West, Jim <[log in to unmask]>

Tue, 8 Jun 1999 10:58:43 -0400

52 lines

Info on Fuji CP-3 placement machine

West, Jim <[log in to unmask]>

Tue, 8 Jun 1999 10:58:43 -0400

63 lines

Re: Info on Fuji CP-3 placement machine

Tempea, Ioan <[log in to unmask]>

Tue, 8 Jun 1999 11:52:43 -0400

106 lines

Re: Info on Fuji CP-3 placement machine

Tempea, Ioan <[log in to unmask]>

Tue, 8 Jun 1999 11:52:43 -0400

116 lines

New Thread

INTERCONNECT 38999

INTERCONNECT 38999

Neil Snow <[log in to unmask]>

Fri, 4 Jun 1999 12:24:25 +0100

46 lines

INTERCONNECT 38999

Neil Snow <[log in to unmask]>

Fri, 4 Jun 1999 12:24:25 +0100

56 lines

Re: INTERCONNECT 38999

DEEPAK KURIYAN <[log in to unmask]>

Sun, 6 Jun 1999 09:08:55 +0530

69 lines

Re: INTERCONNECT 38999

DEEPAK KURIYAN <[log in to unmask]>

Sun, 6 Jun 1999 09:08:55 +0530

79 lines

New Thread

Ionic contamination after pumice

Ionic contamination after pumice

Chris Wall <[log in to unmask]>

Fri, 4 Jun 1999 06:16:32 -0400

29 lines

Ionic contamination after pumice

Chris Wall <[log in to unmask]>

Fri, 4 Jun 1999 06:16:32 -0400

40 lines

Re: Ionic contamination after pumice

<Rudy Sedlak> <[log in to unmask]>

Fri, 4 Jun 1999 10:13:01 EDT

44 lines

Re: Ionic contamination after pumice

<Rudy Sedlak> <[log in to unmask]>

Fri, 4 Jun 1999 10:13:01 EDT

54 lines

Re: Ionic contamination after pumice

[log in to unmask]

Fri, 4 Jun 1999 12:41:12 EDT

36 lines

Re: Ionic contamination after pumice

[log in to unmask]

Fri, 4 Jun 1999 12:41:12 EDT

46 lines

Re: Ionic contamination after pumice

Terry Munson <[log in to unmask]>

Fri, 4 Jun 1999 14:03:02 EDT

33 lines

Re: Ionic contamination after pumice

Terry Munson <[log in to unmask]>

Fri, 4 Jun 1999 14:03:02 EDT

43 lines

Re: Ionic contamination after pumice

[log in to unmask]

Fri, 4 Jun 1999 17:41:18 EDT

28 lines

Re: Ionic contamination after pumice

[log in to unmask]

Fri, 4 Jun 1999 17:41:18 EDT

38 lines

New Thread

IPC Announces Lead-Free Alternative Electronic Forum

IPC Announces Lead-Free Alternative Electronic Forum

Christopher Jorgensen <[log in to unmask]>

Fri, 18 Jun 1999 12:17:29 -0500

71 lines

New Thread

IPC E-Mail Forum Update

IPC E-Mail Forum Update

Christopher Jorgensen <[log in to unmask]>

Fri, 25 Jun 1999 16:24:18 -0500

34 lines

New Thread

IPC Membership

IPC Membership

"Glenn Pelkey"@[log in to unmask]

Mon, 7 Jun 1999 10:12:36 PDT

35 lines

Re: IPC Membership

Kuczynski Michael <[log in to unmask]>

Mon, 7 Jun 1999 13:44:40 -0400

44 lines

Re: IPC Membership

Kuczynski Michael <[log in to unmask]>

Mon, 7 Jun 1999 13:44:40 -0400

54 lines

Re: IPC Membership

Goldman, Patricia J. <[log in to unmask]>

Mon, 7 Jun 1999 15:04:33 -0400

95 lines

Re: IPC Membership

Goldman, Patricia J. <[log in to unmask]>

Mon, 7 Jun 1999 15:04:33 -0400

105 lines

New Thread

IPC Standards

IPC Standards

Derick Hammond <[log in to unmask]>

Wed, 2 Jun 1999 12:04:18 +0000

48 lines

IPC Standards

Derick Hammond <[log in to unmask]>

Wed, 2 Jun 1999 12:04:18 +0000

59 lines

Re: IPC Standards

No Name Available <[log in to unmask]>

Tue, 1 Jun 1999 21:25:47 EDT

23 lines

Re: IPC Standards

No Name Available <[log in to unmask]>

Tue, 1 Jun 1999 21:25:47 EDT

33 lines

Re: IPC Standards

Jack Crawford <[log in to unmask]>

Wed, 2 Jun 1999 09:24:47 -0500

85 lines

Re: IPC Standards

Jack Crawford <[log in to unmask]>

Wed, 2 Jun 1999 09:24:47 -0500

95 lines

New Thread

IPC Standards updates

Re: IPC Standards updates

Jack Crawford <[log in to unmask]>

Wed, 9 Jun 1999 13:27:48 -0500

41 lines

Re: IPC Standards updates

Jack Crawford <[log in to unmask]>

Wed, 9 Jun 1999 13:27:48 -0500

51 lines

New Thread

IPC-2221 Conductor Spacing - More Questions

Re: IPC-2221 Conductor Spacing - More Questions

KK Chin <[log in to unmask]>

Mon, 21 Jun 1999 09:56:51 -0700

66 lines

Re: IPC-2221 Conductor Spacing - More Questions

Graham Naisbitt <[log in to unmask]>

Thu, 24 Jun 1999 15:45:11 +0100

110 lines

New Thread

IPC-2221 Table 6.1 Conductor Spacing

IPC-2221 Table 6.1 Conductor Spacing

Craig Hillman <[log in to unmask]>

Fri, 18 Jun 1999 05:00:00 EST

32 lines

New Thread

IPC-4101/24 vs IPC-4101/25

IPC-4101/24 vs IPC-4101/25

Kathy Palumbo <[log in to unmask]>

Fri, 11 Jun 1999 09:05:25 -0700

32 lines

IPC-4101/24 vs IPC-4101/25

Kathy Palumbo <[log in to unmask]>

Fri, 11 Jun 1999 09:05:25 -0700

43 lines

New Thread

IPC-610A versus IPC-610B

IPC-610A versus IPC-610B

Thomas J. Gulley <[log in to unmask]>

Mon, 28 Jun 1999 13:16:20 -0500

22 lines

New Thread

IPC-A610B Solder Requirements For Heat Sink/Ground Pane PTHs

IPC-A610B Solder Requirements For Heat Sink/Ground Pane PTHs

Mike Meanor <[log in to unmask]>

Wed, 9 Jun 1999 13:24:26 -0700

77 lines

IPC-A610B Solder Requirements For Heat Sink/Ground Pane PTHs

Mike Meanor <[log in to unmask]>

Wed, 9 Jun 1999 13:24:26 -0700

88 lines

Re: IPC-A610B Solder Requirements For Heat Sink/Ground Pane PTHs

Jack Crawford <[log in to unmask]>

Wed, 9 Jun 1999 17:22:49 -0500

304 lines

Re: IPC-A610B Solder Requirements For Heat Sink/Ground Pane PTHs

Jack Crawford <[log in to unmask]>

Wed, 9 Jun 1999 17:22:49 -0500

314 lines

New Thread

IPC-SM-785 Failure Definition

IPC-SM-785 Failure Definition

David D Hillman <[log in to unmask]>

Wed, 9 Jun 1999 11:29:46 -0500

37 lines

IPC-SM-785 Failure Definition

David D Hillman <[log in to unmask]>

Wed, 9 Jun 1999 11:29:46 -0500

48 lines

Re: IPC-SM-785 Failure Definition

Werner Engelmaier <[log in to unmask]>

Wed, 9 Jun 1999 23:33:33 EDT

65 lines

Re: IPC-SM-785 Failure Definition

Werner Engelmaier <[log in to unmask]>

Wed, 9 Jun 1999 23:33:33 EDT

75 lines

New Thread

IPCWorks '99 Registration

IPCWorks '99 Registration

Christopher Jorgensen <[log in to unmask]>

Mon, 14 Jun 1999 16:11:51 -0500

42 lines

IPCWorks '99 Registration

Christopher Jorgensen <[log in to unmask]>

Mon, 14 Jun 1999 16:11:51 -0500

52 lines

New Thread

ITRI's Equipment Survey Release Date?

ITRI's Equipment Survey Release Date?

Hinners, Hans - LYPME <[log in to unmask]>

Wed, 9 Jun 1999 18:27:50 -0400

35 lines

ITRI's Equipment Survey Release Date?

Hinners, Hans - LYPME <[log in to unmask]>

Wed, 9 Jun 1999 18:27:50 -0400

46 lines

New Thread

J-STD-001

J-STD-001

[log in to unmask]

Mon, 28 Jun 1999 11:27:07 -0700

17 lines

New Thread

just wondering

just wondering

Paul Peltier <[log in to unmask]>

Thu, 24 Jun 1999 13:32:59 -0400

39 lines

New Thread

large component tape & reel

large component tape & reel

Phil Hersey <[log in to unmask]>

Thu, 24 Jun 1999 16:40:56 -0700

21 lines

Re: large component tape & reel

Paul Klasek <[log in to unmask]>

Thu, 24 Jun 1999 17:55:09 -0700

55 lines

New Thread

Lead Frames

Lead Frames

Scott B. Westheimer <[log in to unmask]>

Tue, 22 Jun 1999 16:12:40 +0800

55 lines

Re: Lead Frames

<Rudy Sedlak> <[log in to unmask]>

Tue, 22 Jun 1999 05:08:45 EDT

29 lines

New Thread

Lead free

Lead free

Rick Ishibashi <[log in to unmask]>

Tue, 8 Jun 1999 08:41:57 PDT

28 lines

Lead free

Rick Ishibashi <[log in to unmask]>

Tue, 8 Jun 1999 08:41:57 PDT

39 lines

New Thread

Lead solderability

Lead solderability

Kathy Stillings <[log in to unmask]>

Tue, 15 Jun 1999 11:49:10 -0400

34 lines

Lead solderability

Kathy Stillings <[log in to unmask]>

Tue, 15 Jun 1999 11:49:10 -0400

45 lines

Re: Lead solderability

David D Hillman <[log in to unmask]>

Tue, 15 Jun 1999 13:34:12 -0500

93 lines

Re: Lead solderability

David D Hillman <[log in to unmask]>

Tue, 15 Jun 1999 13:34:12 -0500

103 lines

Re: Lead solderability

Cash, Alan <[log in to unmask]>

Tue, 15 Jun 1999 12:40:24 -0700

74 lines

Re: Lead solderability

Cash, Alan <[log in to unmask]>

Tue, 15 Jun 1999 12:40:24 -0700

84 lines

New Thread

Legend Inks

Legend Inks

Jacob Mozel <[log in to unmask]>

Sat, 19 Jun 1999 23:03:46 +0300

20 lines

New Thread

Lo Behold-Voids!!!!!!!!!

Re: Lo Behold-Voids!!!!!!!!!

Werner Engelmaier <[log in to unmask]>

Wed, 9 Jun 1999 23:33:36 EDT

54 lines

Re: Lo Behold-Voids!!!!!!!!!

Werner Engelmaier <[log in to unmask]>

Wed, 9 Jun 1999 23:33:36 EDT

64 lines

Re: Lo Behold-Voids!!!!!!!!!

Werner Engelmaier <[log in to unmask]>

Thu, 10 Jun 1999 15:03:37 EDT

41 lines

Re: Lo Behold-Voids!!!!!!!!!

Werner Engelmaier <[log in to unmask]>

Thu, 10 Jun 1999 15:03:37 EDT

51 lines

New Thread

Looking for the resistive spec for flux on the finished ...

Re: Looking for the resistive spec for flux on the finished ...

Doug Pauls <[log in to unmask]>

Wed, 16 Jun 1999 09:01:22 EDT

80 lines

Re: Looking for the resistive spec for flux on the finished ...

Doug Pauls <[log in to unmask]>

Wed, 16 Jun 1999 09:01:22 EDT

90 lines

Re: Looking for the resistive spec for flux on the finished ...

[log in to unmask]

Wed, 16 Jun 1999 10:16:42 EDT

34 lines

Re: Looking for the resistive spec for flux on the finished ...

[log in to unmask]

Wed, 16 Jun 1999 10:16:42 EDT

44 lines

New Thread

Looking for the resistive spec for flux on the finished assembly board

Looking for the resistive spec for flux on the finished assembly board

[log in to unmask]

Tue, 15 Jun 1999 22:26:25 -0500

36 lines

Looking for the resistive spec for flux on the finished assembly board

[log in to unmask]

Tue, 15 Jun 1999 22:26:25 -0500

46 lines

Looking for the resistive spec for flux on the finished assembly board

Graham Naisbitt <[log in to unmask]>

Mon, 21 Jun 1999 13:11:32 +0100

104 lines

New Thread

Looking for training / class in the Silicon Valley

Looking for training / class in the Silicon Valley

Yu, Rudolph <[log in to unmask]>

Wed, 9 Jun 1999 16:51:00 -0700

64 lines

Looking for training / class in the Silicon Valley

Yu, Rudolph <[log in to unmask]>

Wed, 9 Jun 1999 16:51:00 -0700

75 lines

Re: Looking for training / class in the Silicon Valley

Alderete, Michael <[log in to unmask]>

Thu, 10 Jun 1999 05:51:42 -0700

64 lines

Re: Looking for training / class in the Silicon Valley

Alderete, Michael <[log in to unmask]>

Thu, 10 Jun 1999 05:51:42 -0700

75 lines

New Thread

LPISM

LPISM

Narayana Vishy-CVN002 <[log in to unmask]>

Fri, 4 Jun 1999 11:58:36 +0800

32 lines

LPISM

Narayana Vishy-CVN002 <[log in to unmask]>

Fri, 4 Jun 1999 11:58:36 +0800

43 lines

LPISM

Narayana Vishy-CVN002 <[log in to unmask]>

Fri, 4 Jun 1999 12:01:58 +0800

33 lines

LPISM

Narayana Vishy-CVN002 <[log in to unmask]>

Fri, 4 Jun 1999 12:01:58 +0800

44 lines

Re: LPISM

Meigs, Jonathan <[log in to unmask]>

Fri, 4 Jun 1999 05:20:16 -0700

79 lines

Re: LPISM

Meigs, Jonathan <[log in to unmask]>

Fri, 4 Jun 1999 05:20:16 -0700

89 lines

Re: LPISM

[log in to unmask]

Fri, 4 Jun 1999 12:31:11 EDT

45 lines

Re: LPISM

[log in to unmask]

Fri, 4 Jun 1999 12:31:11 EDT

55 lines

New Thread

Macdermid 9241 copper plating bath

Macdermid 9241 copper plating bath

Francis Lai <[log in to unmask]>

Fri, 4 Jun 1999 17:58:44 -0700

28 lines

Macdermid 9241 copper plating bath

Francis Lai <[log in to unmask]>

Fri, 4 Jun 1999 17:58:44 -0700

39 lines

Re: Macdermid 9241 copper plating bath

Dennis Fritz <[log in to unmask]>

Sat, 5 Jun 1999 00:08:36 EDT

55 lines

Re: Macdermid 9241 copper plating bath

Dennis Fritz <[log in to unmask]>

Sat, 5 Jun 1999 00:08:36 EDT

65 lines

Re: Macdermid 9241 copper plating bath

Don Vischulis <[log in to unmask]>

Sat, 5 Jun 1999 12:33:55 -0500

64 lines

Re: Macdermid 9241 copper plating bath

Don Vischulis <[log in to unmask]>

Sat, 5 Jun 1999 12:33:55 -0500

75 lines

New Thread

Magic solder?

Magic solder?

John Harris <[log in to unmask]>

Fri, 11 Jun 1999 09:30:50 +1000

34 lines

Magic solder?

John Harris <[log in to unmask]>

Fri, 11 Jun 1999 09:30:50 +1000

45 lines

Re: Magic solder?

Peter Swanson <[log in to unmask]>

Fri, 11 Jun 1999 08:43:50 GMT

53 lines

Re: Magic solder?

Peter Swanson <[log in to unmask]>

Fri, 11 Jun 1999 08:43:50 GMT

64 lines

Re: Magic solder?

Cash, Alan <[log in to unmask]>

Fri, 11 Jun 1999 09:22:07 -0400

65 lines

Re: Magic solder?

Cash, Alan <[log in to unmask]>

Fri, 11 Jun 1999 09:22:07 -0400

75 lines

Re: Magic solder?

Kenneth Kirby <[log in to unmask]>

Fri, 11 Jun 1999 08:07:31 -0500

130 lines

Re: Magic solder?

Kenneth Kirby <[log in to unmask]>

Fri, 11 Jun 1999 08:07:31 -0500

141 lines

Re: Magic solder?

Jerry Cupples <[log in to unmask]>

Fri, 11 Jun 1999 10:09:50 -0500

63 lines

Re: Magic solder?

Jerry Cupples <[log in to unmask]>

Fri, 11 Jun 1999 10:09:50 -0500

73 lines

New Thread

Manual inspection related stuff

Manual inspection related stuff

Narayana Vishy-CVN002 <[log in to unmask]>

Thu, 10 Jun 1999 17:33:54 +0800

33 lines

Manual inspection related stuff

Narayana Vishy-CVN002 <[log in to unmask]>

Thu, 10 Jun 1999 17:33:54 +0800

44 lines

Re: Manual inspection related stuff

Werner Engelmaier <[log in to unmask]>

Thu, 10 Jun 1999 10:52:42 EDT

40 lines

Re: Manual inspection related stuff

Werner Engelmaier <[log in to unmask]>

Thu, 10 Jun 1999 10:52:42 EDT

50 lines

New Thread

Manufacturing process

Manufacturing process

Jorge Engenharia <[log in to unmask]>

Mon, 14 Jun 1999 09:28:46 -0400

42 lines

Manufacturing process

Jorge Engenharia <[log in to unmask]>

Mon, 14 Jun 1999 09:28:46 -0400

53 lines

Re: Manufacturing process

Kenneth Kirby <[log in to unmask]>

Mon, 14 Jun 1999 10:16:37 -0500

154 lines

Re: Manufacturing process

Kenneth Kirby <[log in to unmask]>

Mon, 14 Jun 1999 10:16:37 -0500

165 lines

Re: Manufacturing process

Sunil Gupta <[log in to unmask]>

Wed, 16 Jun 1999 13:59:30 +0530

29 lines

Re: Manufacturing process

Sunil Gupta <[log in to unmask]>

Wed, 16 Jun 1999 13:59:30 +0530

39 lines

New Thread

Marking bad boards?

Marking bad boards?

Matthew Lamkin <[log in to unmask]>

Wed, 9 Jun 1999 09:18:24 +0100

55 lines

Marking bad boards?

Matthew Lamkin <[log in to unmask]>

Wed, 9 Jun 1999 09:18:24 +0100

66 lines

Re: Marking bad boards?

Ryan Jennens <[log in to unmask]>

Wed, 9 Jun 1999 10:08:23 -0400

92 lines

Re: Marking bad boards?

Ryan Jennens <[log in to unmask]>

Wed, 9 Jun 1999 10:08:23 -0400

102 lines

Re: Marking bad boards?

Jack Olson <[log in to unmask]>

Wed, 9 Jun 1999 08:49:17 -0700

51 lines

Re: Marking bad boards?

Jack Olson <[log in to unmask]>

Wed, 9 Jun 1999 08:49:17 -0700

61 lines

Re: Marking bad boards?

Vanderhoof, Brad <[log in to unmask]>

Wed, 9 Jun 1999 09:17:54 -0700

80 lines

Re: Marking bad boards?

Vanderhoof, Brad <[log in to unmask]>

Wed, 9 Jun 1999 09:17:54 -0700

90 lines

Re: Marking bad boards?

Ian Boyton <[log in to unmask]>

Thu, 10 Jun 1999 01:51:59 PDT

119 lines

Re: Marking bad boards?

Ian Boyton <[log in to unmask]>

Thu, 10 Jun 1999 01:51:59 PDT

130 lines

New Thread

Marking Sleeves

Marking Sleeves

Hooper Doug <[log in to unmask]>

Tue, 22 Jun 1999 08:04:00 -0400

23 lines

Re: Marking Sleeves

McMonagle, Michael R. <[log in to unmask]>

Tue, 22 Jun 1999 08:36:21 -0500

46 lines

Re: Marking Sleeves

Thorup, John <[log in to unmask]>

Tue, 22 Jun 1999 06:55:16 -0700

39 lines

Re: Marking Sleeves

Timothy Reeves <[log in to unmask]>

Tue, 22 Jun 1999 09:28:33 -0700

38 lines

New Thread

MELF SCHOTTKY DIODES

MELF SCHOTTKY DIODES

Tom Lambert <[log in to unmask]>

Thu, 3 Jun 1999 12:09:42 -0700

28 lines

MELF SCHOTTKY DIODES

Tom Lambert <[log in to unmask]>

Thu, 3 Jun 1999 12:09:42 -0700

39 lines

MELF SCHOTTKY DIODES

Paul Signorelli <[log in to unmask]>

Mon, 7 Jun 1999 14:20:00 -0500

22 lines

MELF SCHOTTKY DIODES

Paul Signorelli <[log in to unmask]>

Mon, 7 Jun 1999 14:20:00 -0500

33 lines

New Thread

metal clad laminate

metal clad laminate

[log in to unmask]

Wed, 9 Jun 1999 22:24:30 -0700

22 lines

metal clad laminate

[log in to unmask]

Wed, 9 Jun 1999 22:24:30 -0700

33 lines

New Thread

METAL CLAD LAMINATE.

METAL CLAD LAMINATE.

Celebit Bandung <[log in to unmask]>

Wed, 9 Jun 1999 17:59:36 +0700

57 lines

METAL CLAD LAMINATE.

Celebit Bandung <[log in to unmask]>

Wed, 9 Jun 1999 17:59:36 +0700

68 lines

Re: METAL CLAD LAMINATE.

[log in to unmask]

Wed, 9 Jun 1999 10:30:23 EDT

23 lines

Re: METAL CLAD LAMINATE.

[log in to unmask]

Wed, 9 Jun 1999 10:30:23 EDT

33 lines

New Thread

missing marking on components

Re: missing marking on components

Roger Deakin <[log in to unmask]>

Wed, 9 Jun 1999 11:24:31 +0100

43 lines

Re: missing marking on components

Roger Deakin <[log in to unmask]>

Wed, 9 Jun 1999 11:24:31 +0100

54 lines

New Thread

Mod Wires in Circuit Board Assemblies

Mod Wires in Circuit Board Assemblies

Aric Anderson <[log in to unmask]>

Mon, 14 Jun 1999 14:54:50 -0500

37 lines

Mod Wires in Circuit Board Assemblies

Aric Anderson <[log in to unmask]>

Mon, 14 Jun 1999 14:54:50 -0500

48 lines

Re: Mod Wires in Circuit Board Assemblies

Thorup, John <[log in to unmask]>

Mon, 14 Jun 1999 13:16:12 -0700

62 lines

Re: Mod Wires in Circuit Board Assemblies

Thorup, John <[log in to unmask]>

Mon, 14 Jun 1999 13:16:12 -0700

73 lines

Re: Mod Wires in Circuit Board Assemblies

Phil Crepeau <[log in to unmask]>

Mon, 14 Jun 1999 13:22:09 -0700

64 lines

Re: Mod Wires in Circuit Board Assemblies

Phil Crepeau <[log in to unmask]>

Mon, 14 Jun 1999 13:22:09 -0700

74 lines

Re: Mod Wires in Circuit Board Assemblies

KELLY M SCHRIVER <[log in to unmask]>

Mon, 14 Jun 1999 15:40:00 -0400

55 lines

Re: Mod Wires in Circuit Board Assemblies

KELLY M SCHRIVER <[log in to unmask]>

Mon, 14 Jun 1999 15:40:00 -0400

65 lines

Re: Mod Wires in Circuit Board Assemblies

Stephen R. Gregory <[log in to unmask]>

Mon, 14 Jun 1999 16:57:24 EDT

77 lines

Re: Mod Wires in Circuit Board Assemblies

Stephen R. Gregory <[log in to unmask]>

Mon, 14 Jun 1999 16:57:24 EDT

87 lines

New Thread

negative force

negative force

PAUL BROWN <[log in to unmask]>

Tue, 15 Jun 1999 15:42:17 -0400

34 lines

negative force

PAUL BROWN <[log in to unmask]>

Tue, 15 Jun 1999 15:42:17 -0400

45 lines

Re: negative force

David D Hillman <[log in to unmask]>

Tue, 15 Jun 1999 18:20:13 -0500

89 lines

Re: negative force

David D Hillman <[log in to unmask]>

Tue, 15 Jun 1999 18:20:13 -0500

99 lines

New Thread

NEODC Meeting Reminder

NEODC Meeting Reminder

Dave Artman <[log in to unmask]>

Mon, 14 Jun 1999 14:12:21 -0500

86 lines

NEODC Meeting Reminder

Dave Artman <[log in to unmask]>

Mon, 14 Jun 1999 14:12:21 -0500

96 lines

New Thread

New IPC Video Workshop on "Microvias & High Density Interconnects"

New IPC Video Workshop on "Microvias & High Density Interconnects"

Swede Donaldson <[log in to unmask]>

Tue, 22 Jun 1999 12:53:24 EDT

43 lines

New Thread

New IPC Video Workshop on Peter Turney's ABC & ABM Book

New IPC Video Workshop on Peter Turney's ABC & ABM Book

Swede Donaldson <[log in to unmask]>

Tue, 22 Jun 1999 12:56:24 EDT

37 lines

New Thread

New IPC Workshop video on "Surface Mount Problem Solving"

New IPC Workshop video on "Surface Mount Problem Solving"

Swede Donaldson <[log in to unmask]>

Tue, 22 Jun 1999 12:46:04 EDT

36 lines

New Thread

New IPC Workshop Video on "Zero Defect Soldering"

New IPC Workshop Video on "Zero Defect Soldering"

Swede Donaldson <[log in to unmask]>

Tue, 22 Jun 1999 12:48:59 EDT

45 lines

New Thread

Ni. Plating

Ni. Plating

Henry Kruckeberg <[log in to unmask]>

Thu, 10 Jun 1999 09:29:14 -0700

25 lines

Ni. Plating

Henry Kruckeberg <[log in to unmask]>

Thu, 10 Jun 1999 09:29:14 -0700

36 lines

Re: Ni. Plating

Richard Haynes <[log in to unmask]>

Fri, 11 Jun 1999 16:47:19 -0400

60 lines

Re: Ni. Plating

Richard Haynes <[log in to unmask]>

Fri, 11 Jun 1999 16:47:19 -0400

70 lines

New Thread

No clean flux evaluation

Re: No clean flux evaluation

Jon Moore <[log in to unmask]>

Sat, 12 Jun 1999 19:39:41 EDT

43 lines

Re: No clean flux evaluation

Jon Moore <[log in to unmask]>

Sat, 12 Jun 1999 19:39:41 EDT

53 lines

New Thread

None

None

Alan Kreplick <[log in to unmask]>

Fri, 18 Jun 1999 13:39:05 -0400

10 lines

Re: None

Thorup, John <[log in to unmask]>

Fri, 18 Jun 1999 12:45:10 -0700

19 lines

None

Alan Kreplick <[log in to unmask]>

Wed, 23 Jun 1999 10:07:22 -0400

10 lines

New Thread

Not read: Epoxy

Not read: Epoxy

Timothy A. Estes <[log in to unmask]>

Mon, 14 Jun 1999 09:22:19 -0600

45 lines

Not read: Epoxy

Timothy A. Estes <[log in to unmask]>

Mon, 14 Jun 1999 09:22:19 -0600

56 lines

New Thread

Organic Solderability Preservative!

Organic Solderability Preservative!

Paul Tomlinson <[log in to unmask]>

Thu, 3 Jun 1999 08:42:58 -0400

43 lines

Organic Solderability Preservative!

Paul Tomlinson <[log in to unmask]>

Thu, 3 Jun 1999 08:42:58 -0400

54 lines

New Thread

Organic Soldereability Preservative.

Organic Soldereability Preservative.

Paul Tomlinson <[log in to unmask]>

Thu, 3 Jun 1999 07:57:34 -0400

37 lines

Organic Soldereability Preservative.

Paul Tomlinson <[log in to unmask]>

Thu, 3 Jun 1999 07:57:34 -0400

48 lines

Re: Organic Soldereability Preservative.

Beckman, Michael W <[log in to unmask]>

Thu, 3 Jun 1999 07:39:46 -0700

70 lines

Re: Organic Soldereability Preservative.

Beckman, Michael W <[log in to unmask]>

Thu, 3 Jun 1999 07:39:46 -0700

80 lines

Re: Organic Soldereability Preservative.

Hammad M Hammad <[log in to unmask]>

Thu, 3 Jun 1999 22:15:33 -0700

87 lines

Re: Organic Soldereability Preservative.

Hammad M Hammad <[log in to unmask]>

Thu, 3 Jun 1999 22:15:33 -0700

98 lines

New Thread

OSP Process!

OSP Process!

Paul Tomlinson <[log in to unmask]>

Tue, 8 Jun 1999 09:53:08 -0400

40 lines

OSP Process!

Paul Tomlinson <[log in to unmask]>

Tue, 8 Jun 1999 09:53:08 -0400

51 lines

New Thread

other surface finishes

other surface finishes

PAUL BROWN <[log in to unmask]>

Fri, 11 Jun 1999 09:08:40 -0400

33 lines

other surface finishes

PAUL BROWN <[log in to unmask]>

Fri, 11 Jun 1999 09:08:40 -0400

44 lines

New Thread

Outside test service

Outside test service

Ed Cosper <[log in to unmask]>

Wed, 2 Jun 1999 08:33:58 -0400

63 lines

Outside test service

Ed Cosper <[log in to unmask]>

Wed, 2 Jun 1999 08:33:58 -0400

74 lines

Re: Outside test service

Andy Slade <[log in to unmask]>

Wed, 2 Jun 1999 10:34:14 -0400

69 lines

Re: Outside test service

Andy Slade <[log in to unmask]>

Wed, 2 Jun 1999 10:34:14 -0400

69 lines

Re: Outside test service

Robert D. Green <[log in to unmask]>

Wed, 2 Jun 1999 10:42:31 -0400

76 lines

Re: Outside test service

Beckman, Michael W <[log in to unmask]>

Wed, 2 Jun 1999 08:11:08 -0700

66 lines

Re: Outside test service

Ted Wiktorowicz <[log in to unmask]>

Wed, 2 Jun 1999 11:53:29 -0400

44 lines

Re: Outside test service

Andy Slade <[log in to unmask]>

Wed, 2 Jun 1999 10:34:14 -0400

79 lines

Re: Outside test service

Andy Slade <[log in to unmask]>

Wed, 2 Jun 1999 10:34:14 -0400

79 lines

Re: Outside test service

Robert D. Green <[log in to unmask]>

Wed, 2 Jun 1999 10:42:31 -0400

86 lines

Re: Outside test service

Beckman, Michael W <[log in to unmask]>

Wed, 2 Jun 1999 08:11:08 -0700

76 lines

Re: Outside test service

Ted Wiktorowicz <[log in to unmask]>

Wed, 2 Jun 1999 11:53:29 -0400

54 lines

New Thread

Pad Discoloration???

Pad Discoloration???

Nick Liang <[log in to unmask]>

Fri, 4 Jun 1999 11:17:56 +0800

34 lines

Pad Discoloration???

Nick Liang <[log in to unmask]>

Fri, 4 Jun 1999 11:17:56 +0800

45 lines

Re: Pad Discoloration???

Andy Slade <[log in to unmask]>

Fri, 4 Jun 1999 08:13:57 -0400

72 lines

Re: Pad Discoloration???

Andy Slade <[log in to unmask]>

Fri, 4 Jun 1999 08:13:57 -0400

82 lines

New Thread

Pad/Via size for 144 pin CSP (.8mm pitch)

Pad/Via size for 144 pin CSP (.8mm pitch)

Ken Patel <[log in to unmask]>

Fri, 4 Jun 1999 17:29:59 -0700

30 lines

Pad/Via size for 144 pin CSP (.8mm pitch)

Ken Patel <[log in to unmask]>

Fri, 4 Jun 1999 17:29:59 -0700

41 lines

Re: Pad/Via size for 144 pin CSP (.8mm pitch)

Eric Kalgren <[log in to unmask]>

Mon, 7 Jun 1999 12:56:43 -0600

49 lines

Re: Pad/Via size for 144 pin CSP (.8mm pitch)

Eric Kalgren <[log in to unmask]>

Mon, 7 Jun 1999 12:56:43 -0600

60 lines

New Thread

PBGA reliability modeling

Re: PBGA reliability modeling

LI YUAN <[log in to unmask]>

Tue, 1 Jun 1999 11:48:35 -0600

65 lines

Re: PBGA reliability modeling

LI YUAN <[log in to unmask]>

Tue, 1 Jun 1999 11:48:35 -0600

75 lines

New Thread

PCB design verification hardtool

PCB design verification hardtool

Ken Fong <[log in to unmask]>

Thu, 10 Jun 1999 17:08:04 GMT

39 lines

PCB design verification hardtool

Ken Fong <[log in to unmask]>

Thu, 10 Jun 1999 17:08:04 GMT

49 lines

New Thread

PCB Outlines needed

PCB Outlines needed

Richard Moffat <[log in to unmask]>

Mon, 28 Jun 1999 13:44:10 +1200

20 lines

Re: PCB Outlines needed

John Laur <[log in to unmask]>

Mon, 28 Jun 1999 07:48:24 -0500

57 lines

New Thread

Photoimageable dielectric layer

Photoimageable dielectric layer

Cheah Li Kang <[log in to unmask]>

Thu, 24 Jun 1999 09:15:55 +0800

17 lines

Re: Photoimageable dielectric layer

James Barry <[log in to unmask]>

Thu, 24 Jun 1999 07:37:45 -0400

29 lines

New Thread

plateable epoxy

plateable epoxy

[log in to unmask]

Mon, 21 Jun 1999 08:45:02 -0700

11 lines

Re: plateable epoxy

Barmuta, Mike <[log in to unmask]>

Mon, 21 Jun 1999 13:39:02 -0700

37 lines

Re: plateable epoxy

Anil Kher <[log in to unmask]>

Tue, 22 Jun 1999 09:17:17 +0530

78 lines

New Thread

Plated Through-Hole

Re: Plated Through-Hole

Jon Moore <[log in to unmask]>

Sat, 12 Jun 1999 19:39:42 EDT

32 lines

Re: Plated Through-Hole

Jon Moore <[log in to unmask]>

Sat, 12 Jun 1999 19:39:42 EDT

42 lines

New Thread

PP Bend Mark??

PP Bend Mark??

Nick Liang <[log in to unmask]>

Wed, 30 Jun 1999 10:47:48 +0800

14 lines

Re: PP Bend Mark??

Jeff Seeger <[log in to unmask]>

Tue, 29 Jun 1999 23:00:01 -0400

26 lines

New Thread

Press-fit Connector Assembly

Press-fit Connector Assembly

Alvin Leong <[log in to unmask]>

Sat, 19 Jun 1999 18:38:02 +0800

25 lines

Re: Press-fit Connector Assembly

Francisco Brice $B!" (Jo / Molex de M $B#Y (Jico <[log in to unmask]>

Mon, 21 Jun 1999 10:52:38 -0500

57 lines

Re: Press-fit Connector Assembly

No Name Available <[log in to unmask]>

Wed, 23 Jun 1999 23:55:42 EDT

19 lines

New Thread

Press-fit Connector Assembly -Reply

Press-fit Connector Assembly -Reply

Garry Beaumont <[log in to unmask]>

Mon, 21 Jun 1999 14:19:45 +1200

46 lines

New Thread

press-fit connector assembly, force gage

Re: press-fit connector assembly, force gage

[log in to unmask]

Wed, 30 Jun 1999 09:50:34 EDT

25 lines

New Thread

Process and Material Combination

Process and Material Combination

Wanner Bernhard <[log in to unmask]>

Tue, 22 Jun 1999 22:00:11 +0200

105 lines

New Thread

Protel vs PADS....views?

Protel vs PADS....views?

Richard Patrick <[log in to unmask]>

Tue, 1 Jun 1999 14:52:49 +0100

40 lines

Protel vs PADS....views?

Richard Patrick <[log in to unmask]>

Tue, 1 Jun 1999 14:52:49 +0100

51 lines

Re: Protel vs PADS....views?

Brent Alcorn <[log in to unmask]>

Tue, 1 Jun 1999 14:20:33 -0300

70 lines

Re: Protel vs PADS....views?

Brent Alcorn <[log in to unmask]>

Tue, 1 Jun 1999 14:20:33 -0300

80 lines

Re: Protel vs PADS....views?

Matthew Lamkin <[log in to unmask]>

Wed, 2 Jun 1999 09:47:55 +0100

93 lines

Re: Protel vs PADS....views?

Matthew Lamkin <[log in to unmask]>

Wed, 2 Jun 1999 09:47:55 +0100

104 lines

New Thread

PTH copper thickness issues

Re: PTH copper thickness issues

Werner Engelmaier <[log in to unmask]>

Sat, 26 Jun 1999 08:18:00 EDT

26 lines

New Thread

PTH Plating Thickness

PTH Plating Thickness

[log in to unmask]

Thu, 10 Jun 1999 09:21:40 -0500

30 lines

PTH Plating Thickness

[log in to unmask]

Thu, 10 Jun 1999 09:21:40 -0500

41 lines

Re: PTH Plating Thickness

John J Walker <[log in to unmask]>

Thu, 10 Jun 1999 10:21:32 -0400

47 lines

Re: PTH Plating Thickness

John J Walker <[log in to unmask]>

Thu, 10 Jun 1999 10:21:32 -0400

57 lines

Re: PTH Plating Thickness

[log in to unmask]

Thu, 10 Jun 1999 10:55:21 EDT

29 lines

Re: PTH Plating Thickness

Werner Engelmaier <[log in to unmask]>

Thu, 10 Jun 1999 10:52:46 EDT

44 lines

Re: PTH Plating Thickness

[log in to unmask]

Thu, 10 Jun 1999 10:55:21 EDT

39 lines

Re: PTH Plating Thickness

Werner Engelmaier <[log in to unmask]>

Thu, 10 Jun 1999 10:52:46 EDT

54 lines

Re: PTH Plating Thickness

Michael D. Doty <[log in to unmask]>

Thu, 10 Jun 1999 15:28:30 -0400

58 lines

Re: PTH Plating Thickness

Michael D. Doty <[log in to unmask]>

Thu, 10 Jun 1999 15:28:30 -0400

68 lines

Re: PTH Plating Thickness

Michael Lester <[log in to unmask]>

Thu, 10 Jun 1999 18:41:36 EDT

25 lines

Re: PTH Plating Thickness

Michael Lester <[log in to unmask]>

Thu, 10 Jun 1999 18:41:36 EDT

35 lines

New Thread

PTH Problem

PTH Problem

Francis Lai <[log in to unmask]>

Fri, 4 Jun 1999 17:56:22 -0700

31 lines

PTH Problem

Francis Lai <[log in to unmask]>

Fri, 4 Jun 1999 17:56:22 -0700

42 lines

Re: PTH Problem

Dennis Fritz <[log in to unmask]>

Fri, 4 Jun 1999 23:53:46 EDT

72 lines