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April 1999


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Table of Contents:

回覆 : [TN] Photo Definable Dielectric Suppliers (1 message)
"Lead Free", "The Great Gas-Out", and other musings.. (1 message)
.75MM PITCH BGA (1 message)
0201 component size usage (3 messages)
1999 IPC Chip Scale and BGA National Symposium (1 message)
8MM TAPE SPLICING TOOL FOR SMT CAPS&RES. (2 messages)
: New Revision of NHB5300.4(3A-2) (3 messages)
: Parylene Coating (1 message)
: Toothpick test (2 messages)
: Wave soldering CWR06 parts (2 messages)
<No subject> (6 messages)
A/B/C/D/E Technique in PCB manufacturing (1 message)
Acceptable PCB Yields... (1 message)
ADSL Technology (2 messages)
ADSL technology... (1 message)
Allowable PCA flex under/around BGAs (1 message)
Anatech box/3 parameter Weibull (5 messages)
ANSI Approval of IPC-2223 (1 message)
Application of SAW filter chips (3 messages)
Artwork storage (1 message)
Assembly process differences between HASL and nic/gold surface finishe (1 message)
Assembly process differences between HASL and nickel /go ld surface finishe (2 messages)
Assembly process differences between HASL and nickel /gold surface finishe (1 message)
Assembly process differences between HASL and nickel/gold surface finishe (1 message)
ASSEMBLY: measling around pressfit flared hardware afte r wave solder (1 message)
ASSEMBLY: measling around pressfit flared hardware after ... (1 message)
ASSEMBLY: measling around pressfit flared hardware after wave solder (1 message)
AXV DFM Guidelines recommendation - CAUTION !! (1 message)
Baking of innerlayers (2 messages)
Baking of polyimide boards (5 messages)
Bar code label applicator (3 messages)
bare boards with solder paste (7 messages)
Bench top etcher (1 message)
Best Manufacturing Practices (1 message)
BGA and micro-BGA consumption distribution (8 messages)
BGA Info. (1 message)
BGA land design (1 message)
BGA solder ball replacement options? (4 messages)
BGA solder ball replacement options? -Reply (2 messages)
BGA Via Fill (1 message)
BGA Vias (2 messages)
BGA Voiding Problem (4 messages)
Blind Via Adhesion (3 messages)
Boards sensitive to ESD (3 messages)
Bow and Twist (3 messages)
Break-in for capillary (1 message)
Broadside Coupled Differential Lines (3 messages)
Call for Papers ― IPCWorks '99 International Summit on Lead-Free Electronic Assemblies (1 message)
Can adhesive go thru reflow soldering? (5 messages)
Cascade(Seattle) Chapter Formation Meeting (1 message)
Change in current densities in a Macdermid Tin-lead bath (1 message)
Chemical Testing Service in Georgia USA? (3 messages)
Chip resistors upside down (2 messages)
Clean Room Requirement (4 messages)
Coax to P.C. board mounting (2 messages)
Cold Solder/Rough Solder/Dull solder (1 message)
Column Grid Arrays (CGA) (2 messages)
Comments and Recommendations Requested for IPC-1730 (1 message)
Comparative Tracking Index (CTI) on Circuit Board Mater ial (1 message)
Comparative Tracking Index (CTI) on Circuit Board Material (1 message)
computer upgrade (6 messages)
Conductive Adhesive (3 messages)
Conformal coat for Al wire bond (1 message)
Contactless Electrical Tester (2 messages)
Copper thickness measurement small PTH. (2 messages)
CORFIN (1 message)
Correct Spec for assembly of RF coaxial cable assemblies (1 message)
Correction to JIT Training Resources... (1 message)
Corrosion (5 messages)
Cracked Tracks in a flex PCB (3 messages)
Define goldfinger critical area (1 message)
Definition of Microvias (4 messages)
Design for manufacture (2 messages)
Different current densities in the Macdermid tin-lead ba th (1 message)
Different Paste Height (5 messages)
DIP components (2 messages)
DIP components addendum (1 message)
DO-214AB/ SMCJ (3 messages)
Double sided reflow (7 messages)
Drying of double reflow boards with BGA's (1 message)
DSA Anode (2 messages)
DSC vs. TMA (4 messages)
Electrolytic Plating (2 messages)
Electrolytic plating on isolated areas or an alternative (2 messages)
Entek question (2 messages)
Fab-Laminate Material (1 message)
File attachments (virus risk) (2 messages)
Find out viclad laminate (1 message)
Fine Pitch PADS (1 message)
Fine-pitch PADs (3 messages)
Flame Spray (2 messages)
Flash Gold?? (5 messages)
Flex stiffener (1 message)
Flex stiffener -Reply (1 message)
FW: CEM3 and surface mount (1 message)
Fw: PROCESS PROBLEM (2 messages)
Fw: [Fwd: FW: Turn On Your Lights For Littleton CO] (1 message)
FW: [TN] 8MM TAPE SPLICING TOOL FOR SMT CAPS&RES. (1 message)
FW: [TN] Can adhesive go thru reflow soldering? (1 message)
FW: [TN] DIP components (1 message)
FW: [TN] SMT Component Fall Out Rate (1 message)
Fwd: [CN] BGAs (1 message)
Gluing (1 message)
Gold drag out reclaim (4 messages)
Gold drag out reclaim - resins for... (1 message)
Gold Embrittlement (6 messages)
Gold embrittlement/Attaching Gold Plated leads to PWB's. (5 messages)
Goldfinger questions. (2 messages)
GRAINY JOINTS (5 messages)
Halides in solderpaste (1 message)
Hand Solder Pre-Heat (1 message)
Heavy wire Al-bonding on FR4 (2 messages)
Help for protective material of Thick Film (1 message)
Help for protective material of Thick Film <IPC TN> (1 message)
Hermitic Glass-to-Metal Sealing (1 message)
High precision resistors (5 messages)
Hot Air Knife (7 messages)
How thin can a two layer board be? (6 messages)
How to fill Vias? ... (4 messages)
How to get water out? (1 message)
How to Import. -Reply (1 message)
Impedance Measurements of Solder Paste (2 messages)
Insulator under a Xformer (1 message)
Intermetallic growth during thermal cycling (1 message)
Intermittent PCB Traces Due To Vibration (1 message)
ionic contamination (4 messages)
Ionic Contamination Testers (2 messages)
IPC SPECIFICATION (1 message)
IPC Standards (2 messages)
IPC-4101 ANSI Approval (1 message)
IPC/DC Greater Boston Chapter Meeting 04/21 6pm - SI (1 message)
IPCchat session announcement (1 message)
ISO Qualification (1 message)
Isolator (5 messages)
Japnese Manufacturer (3 messages)
Japnese Manufacturer -Reply (1 message)
JIT Training demo.... (4 messages)
kapton coverlay (3 messages)
kapton flex circuits (2 messages)
Kapton Flex Circuits Reliablity Assurance (1 message)
Kleenox (1 message)
Label Feeder (1 message)
Laminate, No UV Block. (2 messages)
Land Grid Array and Pad Size (1 message)
Land Pattern for 24 ld SSOP (2 messages)
Lead-Free Alloys (2 messages)
Lead-to-Hole Ratio (1 message)
Life testing of PCBAs. (2 messages)
Linux in a CIM Environment? (2 messages)
Method 2.6.22 Acoustic Microscopy (3 messages)
Michigan DC Chapter meeting (1 message)
Microetch depth measurement (5 messages)
MIL-P-55110 continuance (1 message)
Milled Finish??? (1 message)
Moisture absorption in plastic packaging (1 message)
Multilayer drilling (1 message)
New surface coating (finish) (1 message)
Ni Plating for wire bond (2 messages)
Ni/Au "black pad" problem (1 message)
Nickel Chromium Etchant (1 message)
North Penn Technologies (1 message)
North Penn Techologies (5 messages)
Optical Comparators (2 messages)
Order standard (1 message)
Oxidation on a Connector (2 messages)
Oxide reducing powder (2 messages)
Part number systems (3 messages)
Parylene coating (2 messages)
Pb in conductor-paste (2 messages)
PBGA357 (2 messages)
PC501 solder mask? (2 messages)
PCB (1 message)
PCB discoloration (2 messages)
PCB Scoreline (V cut) tolerance (7 messages)
PCI Connector P/S insufficient after Wave (3 messages)
Photo Definable Dielectric Suppliers (1 message)
Pitting (6 messages)
plating pens (4 messages)
plating thickness (2 messages)
Polyimide tape applicator. (1 message)
Popcorning (1 message)
Popcorning <IPC TN> (2 messages)
Positive & negative etchback (1 message)
Power Drivers... (4 messages)
Problem during strip dry film (6 messages)
protective films (1 message)
Prototype board for BGA's (1 message)
PWB: Kapton or similar process (1 message)
Quad 100 (2 messages)
Question from customer (7 messages)
Question from customer - Dichloromethane (1 message)
Question: Problems in BGA assembly process... (1 message)
Question: Problems in BGA assembly process... <IPC TN> (1 message)
RE(3): [TN] Black Ni/Au pads (1 message)
Re-entrant flow simulation (1 message)
Recommendations on a Versatile Microsectioning System? (3 messages)
reflow solder defect (1 message)
Reflowing ceramic boards. (2 messages)
ReGold (1 message)
Repair's Adverse Effect (5 messages)
Revision change costs (7 messages)
Rework technology inquiry (4 messages)
Salary Survey for PCB Designers (2 messages)
Samurai (4 messages)
SBU (1 message)
selecting coatings (2 messages)
Selective negative etchback on a 10 layer board (4 messages)
Sensby Conveyors (1 message)
Sensby Conveyors. (3 messages)
Sensby Conveyors. -Reply (1 message)
shadowing of SMD in wave solder (1 message)
SMT Chip Resistors (2 messages)
SMT Component Fall Out Rate (3 messages)
Sn/Ag Solder (5 messages)
SNEC April meeting notice (1 message)
SNEC mtg notice (1 message)
Solder filled vias (3 messages)
Solder Mask Adhesion (Tape test) (3 messages)
Solderability Testing (3 messages)
SOLDERING A CAP (1 message)
Soldering Book Wanted (1 message)
soldering Connector (6 messages)
Soldering Paladium-Silver-Platinum terminations (2 messages)
Soldering straddle mount connectors and other stuff... (2 messages)
Soldering to Brass (1 message)
Soldermask off-rework options (4 messages)
Something off-topic... (1 message)
Sources for Rigid/Flex circuits (2 messages)
SPC (2 messages)
Specifying DIFFERENTIAL Impedance (4 messages)
Stain in Palladium based DPS (2 messages)
Stop sending e-mail (1 message)
Subcribe (1 message)
SUBSCRIBE (2 messages)
subscribe technet (1 message)
Substrate X-OUT (1 message)
Substrates / Tooling Charges (1 message)
Switching power supply (2 messages)
test-phenom (3 messages)
Thanks! (was RE: [TN] Chemical Testing Service in Georgia USA?) (1 message)
Theda Service Bureau (1 message)
Thermocouple Attachment Methods (4 messages)
Thermocouple welders (1 message)
Thermocouples on Hard Drives (5 messages)
Tin stripper on line recycle (3 messages)
Titanium Lead Cropping Plates (1 message)
Traces (6 messages)
Type of files required for Test Fixtures. (2 messages)
URGENT !!! San Diego Update!!! (1 message)
US IRS and ODX-TAX (1 message)
Use of CAM350 (1 message)
V-Tek Tape and Reel Machines... (1 message)
Vibratory Feeders (3 messages)
VME 64X (1 message)
Wage and Salary (3 messages)
Warp and Twist (1 message)
Water (2 messages)
Wave Solder Ventilation (1 message)
weekcode (6 messages)
Wire Bond, in over in our heads (1 message)
Wire Bonding On Gold (7 messages)
[CHIPNET] Metal Polyimide Adhesion (1 message)
[TN] Black Ni/Au pads (1 message)
[TN] Blind Via Adhesion (1 message)
[TN] Electrolytic plating on isolated areas or an alt (1 message)
[TN] Specifying DIFFERENTIAL Impedance (1 message)
[TN] weekcode (1 message)

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From

Date

Size

New Thread

回覆 : [TN] Photo Definable Dielectric Suppliers

回覆 : [TN] Photo Definable Dielectric Suppliers

Howard Lin <[log in to unmask]>

Fri, 2 Apr 1999 09:36:01 +0800

92 lines

New Thread

"Lead Free", "The Great Gas-Out", and other musings..

"Lead Free", "The Great Gas-Out", and other musings..

Stephen R. Gregory <[log in to unmask]>

Fri, 30 Apr 1999 19:25:48 EDT

234 lines

New Thread

.75MM PITCH BGA

.75MM PITCH BGA

Pucket, Larry Lee <[log in to unmask]>

Tue, 27 Apr 1999 08:30:01 -0600

33 lines

New Thread

0201 component size usage

0201 component size usage

Jorge Engenharia <[log in to unmask]>

Fri, 16 Apr 1999 13:18:36 -0300

36 lines

Re: 0201 component size usage

Andy Mackie <[log in to unmask]>

Fri, 16 Apr 1999 13:03:12 -0400

89 lines

Re: 0201 component size usage

Stephen R. Gregory <[log in to unmask]>

Fri, 16 Apr 1999 14:42:50 EDT

65 lines

New Thread

1999 IPC Chip Scale and BGA National Symposium

1999 IPC Chip Scale and BGA National Symposium

Maryellen Hilderbrand <[log in to unmask]>

Mon, 19 Apr 1999 10:47:36 -0500

72 lines

New Thread

8MM TAPE SPLICING TOOL FOR SMT CAPS&RES.

8MM TAPE SPLICING TOOL FOR SMT CAPS&RES.

[log in to unmask]

Fri, 23 Apr 1999 15:41:51 EDT

33 lines

Re: 8MM TAPE SPLICING TOOL FOR SMT CAPS&RES.

Jerry Cupples <[log in to unmask]>

Tue, 27 Apr 1999 11:42:56 -0500

78 lines

New Thread

: New Revision of NHB5300.4(3A-2)

: New Revision of NHB5300.4(3A-2)

Kasprzak, Bill (esd) US <[log in to unmask]>

Fri, 16 Apr 1999 09:24:00 PDT

40 lines

Re: : New Revision of NHB5300.4(3A-2)

Sherry Warner <[log in to unmask]>

Fri, 16 Apr 1999 11:22:10 -0400

74 lines

Re: : New Revision of NHB5300.4(3A-2)

Hogue, Pat (AZ76) <[log in to unmask]>

Fri, 16 Apr 1999 13:29:05 -0700

77 lines

New Thread

: Parylene Coating

: Parylene Coating

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 28 Apr 1999 08:40:00 PDT

59 lines

New Thread

: Toothpick test

: Toothpick test

Poh Kong Hui <[log in to unmask]>

Sat, 10 Apr 1999 20:16:03 +0800

27 lines

Re: : Toothpick test

Stephen R. Gregory <[log in to unmask]>

Sat, 10 Apr 1999 21:46:14 EDT

62 lines

New Thread

: Wave soldering CWR06 parts

: Wave soldering CWR06 parts

Kasprzak, Bill (esd) US <[log in to unmask]>

Sat, 17 Apr 1999 08:15:00 PDT

37 lines

Re: : Wave soldering CWR06 parts

Justin Braime <[log in to unmask]>

Mon, 19 Apr 1999 08:31:37 +1200

84 lines

New Thread

<No subject>

<No subject>

Don E Steffen <[log in to unmask]>

Mon, 5 Apr 1999 13:27:24 -0500

34 lines

<no subject>

Jeff Hempton <[log in to unmask]>

Mon, 5 Apr 1999 15:10:09 -0400

66 lines

<No subject>

Ahne Oosterhof <[log in to unmask]>

Tue, 6 Apr 1999 08:10:32 -0700

52 lines

<No subject>

Rick Vankirk <[log in to unmask]>

Wed, 7 Apr 1999 16:35:49 -0700

39 lines

<No subject>

Gary Ferrari <[log in to unmask]>

Thu, 8 Apr 1999 10:45:19 EDT

40 lines

<No subject>

Paul Tomlinson <[log in to unmask]>

Tue, 27 Apr 1999 12:13:54 -0400

37 lines

New Thread

A/B/C/D/E Technique in PCB manufacturing

A/B/C/D/E Technique in PCB manufacturing

Feng Yi,BISC PD IE(BJ) <[log in to unmask]>

Thu, 29 Apr 1999 15:34:43 +0800

94 lines

New Thread

Acceptable PCB Yields...

Acceptable PCB Yields...

Tim Knowlton <[log in to unmask]>

Mon, 12 Apr 1999 13:28:36 -0700

54 lines

New Thread

ADSL Technology

ADSL Technology

Robert E. Mesick <[log in to unmask]>

Wed, 14 Apr 1999 10:24:55 -0700

46 lines

Re: ADSL Technology

Fred Pescitelli <[log in to unmask]>

Mon, 19 Apr 1999 09:59:59 -0500

90 lines

New Thread

ADSL technology...

ADSL technology...

Stephen R. Gregory <[log in to unmask]>

Wed, 14 Apr 1999 12:23:43 EDT

176 lines

New Thread

Allowable PCA flex under/around BGAs

Allowable PCA flex under/around BGAs

Bob Bickers <[log in to unmask]>

Mon, 5 Apr 1999 17:30:11 -0700

26 lines

New Thread

Anatech box/3 parameter Weibull

Anatech box/3 parameter Weibull

Michael Becker <[log in to unmask]>

Tue, 13 Apr 1999 10:52:24 -0400

32 lines

Re: Anatech box/3 parameter Weibull

Jean-Paul Clech <[log in to unmask]>

Tue, 13 Apr 1999 11:54:30 EDT

51 lines

Re: Anatech box/3 parameter Weibull

Werner Engelmaier <[log in to unmask]>

Tue, 13 Apr 1999 23:56:05 EDT

39 lines

Re: Anatech box/3 parameter Weibull

Joe Felts <[log in to unmask]>

Thu, 15 Apr 1999 00:42:27 -0700

68 lines

Re: Anatech box/3 parameter Weibull

Werner Engelmaier <[log in to unmask]>

Thu, 15 Apr 1999 18:50:23 EDT

40 lines

New Thread

ANSI Approval of IPC-2223

ANSI Approval of IPC-2223

Christopher Jorgensen <[log in to unmask]>

Fri, 16 Apr 1999 11:52:28 -0500

36 lines

New Thread

Application of SAW filter chips

Application of SAW filter chips

Chris Flores <[log in to unmask]>

Thu, 8 Apr 1999 08:04:17 MDT

45 lines

Re: Application of SAW filter chips

[log in to unmask]

Thu, 8 Apr 1999 11:59:02 -0400

73 lines

Application of SAW filter chips

Jeff Hempton <[log in to unmask]>

Thu, 8 Apr 1999 10:18:06 -0400

74 lines

New Thread

Artwork storage

Artwork storage

Brigitte Haugk <[log in to unmask]>

Fri, 30 Apr 1999 17:31:28 -0500

24 lines

New Thread

Assembly process differences between HASL and nic/gold surface finishe

Re: Assembly process differences between HASL and nic/gold surface finishe

David D Hillman <[log in to unmask]>

Thu, 15 Apr 1999 13:13:01 -0500

74 lines

New Thread

Assembly process differences between HASL and nickel /go ld surface finishe

Re: Assembly process differences between HASL and nickel /go ld surface finishe

Gerald G. Gagnon <[log in to unmask]>

Thu, 15 Apr 1999 16:51:08 -0400

104 lines

Re: Assembly process differences between HASL and nickel /go ld surface finishe

Jim Kenny <[log in to unmask]>

Thu, 15 Apr 1999 18:27:45 -0400

31 lines

New Thread

Assembly process differences between HASL and nickel /gold surface finishe

Re: Assembly process differences between HASL and nickel /gold surface finishe

David D Hillman <[log in to unmask]>

Thu, 15 Apr 1999 07:06:14 -0500

108 lines

New Thread

Assembly process differences between HASL and nickel/gold surface finishe

Assembly process differences between HASL and nickel/gold surface finishe

Gerald G. Gagnon <[log in to unmask]>

Wed, 14 Apr 1999 10:54:47 -0400

58 lines

New Thread

ASSEMBLY: measling around pressfit flared hardware afte r wave solder

Re: ASSEMBLY: measling around pressfit flared hardware afte r wave solder

Buccieri, Rich <[log in to unmask]>

Tue, 13 Apr 1999 12:18:20 -0400

77 lines

New Thread

ASSEMBLY: measling around pressfit flared hardware after ...

Re: ASSEMBLY: measling around pressfit flared hardware after ...

Stephen R. Gregory <[log in to unmask]>

Tue, 13 Apr 1999 12:18:48 EDT

61 lines

New Thread

ASSEMBLY: measling around pressfit flared hardware after wave solder

ASSEMBLY: measling around pressfit flared hardware after wave solder

Sheila Smith <[log in to unmask]>

Tue, 13 Apr 1999 11:15:37 -0400

38 lines

New Thread

AXV DFM Guidelines recommendation - CAUTION !!

Re: AXV DFM Guidelines recommendation - CAUTION !!

Jeff Finger <[log in to unmask]>

Mon, 19 Apr 1999 10:24:04 -0700

93 lines

New Thread

Baking of innerlayers

Baking of innerlayers

Eltek Ltd. - Process Engineering <[log in to unmask]>

Mon, 5 Apr 1999 11:32:08 +0200

33 lines

Re: Baking of innerlayers

<Rudy Sedlak> <[log in to unmask]>

Mon, 5 Apr 1999 10:08:39 EDT

42 lines

New Thread

Baking of polyimide boards

Baking of polyimide boards

Mengers, William D. <[log in to unmask]>

Thu, 8 Apr 1999 16:02:24 -0400

34 lines

Re: Baking of polyimide boards

Stephen R. Gregory <[log in to unmask]>

Thu, 8 Apr 1999 16:58:18 EDT

60 lines

Re: Baking of polyimide boards

Richard MacCutcheon <[log in to unmask]>

Thu, 8 Apr 1999 15:37:03 -0600

70 lines

Re: Baking of polyimide boards

Bill Davis <[log in to unmask]>

Thu, 8 Apr 1999 15:25:22 -0700

82 lines

Re: Baking of polyimide boards

KELLY M SCHRIVER <[log in to unmask]>

Fri, 9 Apr 1999 11:27:00 -0400

43 lines

New Thread

Bar code label applicator

Bar code label applicator

Brigitte Haugk <[log in to unmask]>

Fri, 16 Apr 1999 16:09:45 -0500

23 lines

Re: Bar code label applicator

Lustig, Steven K.. <[log in to unmask]>

Mon, 19 Apr 1999 14:29:38 -0400

100 lines

Re: Bar code label applicator

Stephen R. Gregory <[log in to unmask]>

Mon, 19 Apr 1999 16:23:19 EDT

68 lines

New Thread

bare boards with solder paste

bare boards with solder paste

Lustig, Steven K.. <[log in to unmask]>

Thu, 8 Apr 1999 18:47:39 -0400

41 lines

Re: bare boards with solder paste

Guenter Grossmann <[log in to unmask]>

Fri, 9 Apr 1999 09:28:30 +0200

64 lines

Re: bare boards with solder paste

Peterson, Gary D <[log in to unmask]>

Fri, 9 Apr 1999 08:26:35 -0600

73 lines

Re: bare boards with solder paste

Luis Gallegos <[log in to unmask]>

Fri, 9 Apr 1999 11:50:54 -0500

71 lines

Re: bare boards with solder paste

Ryan Chase <[log in to unmask]>

Fri, 9 Apr 1999 13:19:19 MDT

112 lines

Re: bare boards with solder paste

Peterson, Gary D <[log in to unmask]>

Fri, 9 Apr 1999 13:42:42 -0600

150 lines

Re: bare boards with solder paste

Stephen R. Gregory <[log in to unmask]>

Fri, 9 Apr 1999 16:56:45 EDT

51 lines

New Thread

Bench top etcher

Bench top etcher

Dan Brandler <[log in to unmask]>

Tue, 20 Apr 1999 14:51:31 -0700

32 lines

New Thread

Best Manufacturing Practices

Best Manufacturing Practices

Narayana Vishy-CVN002 <[log in to unmask]>

Thu, 22 Apr 1999 14:29:49 +0800

37 lines

New Thread

BGA and micro-BGA consumption distribution

BGA and micro-BGA consumption distribution

[log in to unmask]

Thu, 8 Apr 1999 10:26:35 -0500

45 lines

Re: BGA and micro-BGA consumption distribution

[log in to unmask]

Tue, 13 Apr 1999 18:14:36 -0500

73 lines

Re: BGA and micro-BGA consumption distribution

Stephen R. Gregory <[log in to unmask]>

Tue, 13 Apr 1999 20:26:30 EDT

58 lines

Re: BGA and micro-BGA consumption distribution

Jim Kittel <[log in to unmask]>

Wed, 14 Apr 1999 06:31:20 -0600

105 lines

Re: BGA and micro-BGA consumption distribution

Albert Mok <[log in to unmask]>

Wed, 14 Apr 1999 22:55:01 +0800

120 lines

Re: BGA and micro-BGA consumption distribution

Mcmaster, Michael <[log in to unmask]>

Wed, 14 Apr 1999 08:35:00 -0700

97 lines

Re: BGA and micro-BGA consumption distribution

Kimmey, Frank <[log in to unmask]>

Wed, 14 Apr 1999 08:24:46 -0700

120 lines

BGA and micro-BGA consumption distribution

[log in to unmask]

Thu, 15 Apr 1999 15:12:39 -0500

24 lines

New Thread

BGA Info.

BGA Info.

Digest James H Moffitt <[log in to unmask]>

Wed, 14 Apr 1999 21:10:18 EDT

36 lines

New Thread

BGA land design

BGA land design

Burtt, Nigel <[log in to unmask]>

Mon, 19 Apr 1999 11:26:23 +0100

32 lines

New Thread

BGA solder ball replacement options?

BGA solder ball replacement options?

Tomaso Mordha <[log in to unmask]>

Mon, 19 Apr 1999 03:32:44 MDT

46 lines

Re: BGA solder ball replacement options?

Stephen R. Gregory <[log in to unmask]>

Mon, 19 Apr 1999 09:18:51 EDT

63 lines

Re: BGA solder ball replacement options?

Kathy Palumbo <[log in to unmask]>

Mon, 19 Apr 1999 10:12:03 -0700

81 lines

Re: BGA solder ball replacement options?

Russ <[log in to unmask]>

Thu, 22 Apr 1999 15:12:03 -0700

92 lines

New Thread

BGA solder ball replacement options? -Reply

Re: BGA solder ball replacement options? -Reply

Nick D'Onofrio <[log in to unmask]>

Fri, 23 Apr 1999 08:39:02 -0400

120 lines

Re: BGA solder ball replacement options? -Reply

Bill Davis <[log in to unmask]>

Mon, 26 Apr 1999 10:43:59 -0700

169 lines

New Thread

BGA Via Fill

BGA Via Fill

Alan Kreplick <[log in to unmask]>

Fri, 23 Apr 1999 12:00:36 -0400

41 lines

New Thread

BGA Vias

BGA Vias

Alan Kreplick <[log in to unmask]>

Mon, 26 Apr 1999 14:43:39 -0400

46 lines

Re: BGA Vias

McMonagle, Michael R. <[log in to unmask]>

Mon, 26 Apr 1999 14:11:54 -0500

90 lines

New Thread

BGA Voiding Problem

BGA Voiding Problem

Todd Ness <[log in to unmask]>

Fri, 23 Apr 1999 15:56:06 +0000

43 lines

Re: BGA Voiding Problem

Phil Bavaro <[log in to unmask]>

Fri, 23 Apr 1999 15:04:09 -0700

91 lines

Re: BGA Voiding Problem

Gabriela Bogdan <[log in to unmask]>

Sat, 24 Apr 1999 09:17:31 +0300

135 lines

Re: BGA Voiding Problem

Jim Kittel <[log in to unmask]>

Mon, 26 Apr 1999 13:35:49 -0600

72 lines

New Thread

Blind Via Adhesion

Blind Via Adhesion

Mike Bailey <[log in to unmask]>

Thu, 22 Apr 1999 09:01:34 -0700

38 lines

Re: Blind Via Adhesion

Andy Slade <[log in to unmask]>

Fri, 23 Apr 1999 08:08:27 -0400

74 lines

Re: Blind Via Adhesion

Lourdes Mertens <[log in to unmask]>

Sun, 25 Apr 1999 05:53:39 -0700

102 lines

New Thread

Boards sensitive to ESD

Boards sensitive to ESD

West, Jim <[log in to unmask]>

Thu, 22 Apr 1999 11:27:46 -0400

36 lines

Re: Boards sensitive to ESD

McMonagle, Michael R. <[log in to unmask]>

Thu, 22 Apr 1999 11:35:59 -0500

85 lines

Re: Boards sensitive to ESD

<Charles Barker> <[log in to unmask]>

Thu, 22 Apr 1999 15:50:10 -0500

104 lines

New Thread

Bow and Twist

Bow and Twist

Richard Hamilton <[log in to unmask]>

Wed, 21 Apr 1999 12:03:26 -0700

34 lines

Re: Bow and Twist

Don Vischulis <[log in to unmask]>

Thu, 22 Apr 1999 18:42:10 -0500

49 lines

Re: Bow and Twist

Mcmaster, Michael <[log in to unmask]>

Fri, 23 Apr 1999 08:14:56 -0700

63 lines

New Thread

Break-in for capillary

Break-in for capillary

Au Po Lam, Benny <[log in to unmask]>

Fri, 9 Apr 1999 08:40:20 +0800

45 lines

New Thread

Broadside Coupled Differential Lines

Broadside Coupled Differential Lines

Michael Annand <[log in to unmask]>

Mon, 12 Apr 1999 12:28:51 -0400

27 lines

Re: Broadside Coupled Differential Lines

Dave Hoover <[log in to unmask]>

Tue, 13 Apr 1999 08:29:27 -0700

59 lines

Re: Broadside Coupled Differential Lines

Jeff Seeger <[log in to unmask]>

Wed, 14 Apr 1999 03:46:29 -0400

58 lines

New Thread

Call for Papers ― IPCWorks '99 International Summit on Lead-Free Electronic Assemblies

Call for Papers ― IPCWorks '99 International Summit on Lead-Free Electronic Assemblies

Christopher Jorgensen <[log in to unmask]>

Thu, 1 Apr 1999 12:57:57 -0600

86 lines

New Thread

Can adhesive go thru reflow soldering?

Can adhesive go thru reflow soldering?

Davis Yang <[log in to unmask]>

Wed, 7 Apr 1999 12:05:49 +0800

30 lines

Re: Can adhesive go thru reflow soldering?

Jorge Engenharia <[log in to unmask]>

Wed, 7 Apr 1999 14:59:23 -0300

67 lines

Re: Can adhesive go thru reflow soldering?

Tempea, Ioan <[log in to unmask]>

Wed, 7 Apr 1999 14:28:04 -0400

68 lines

Re: Can adhesive go thru reflow soldering?

Ryan Chase <[log in to unmask]>

Thu, 8 Apr 1999 09:37:47 MDT

117 lines

Re: Can adhesive go thru reflow soldering?

Collins, Graham <[log in to unmask]>

Thu, 8 Apr 1999 16:00:31 -0300

107 lines

New Thread

Cascade(Seattle) Chapter Formation Meeting

Cascade(Seattle) Chapter Formation Meeting

Christine Myrick <[log in to unmask]>

Thu, 29 Apr 1999 15:45:55 -0500

104 lines

New Thread

Change in current densities in a Macdermid Tin-lead bath

Re: Change in current densities in a Macdermid Tin-lead bath

Carano,Michael <[log in to unmask]>

Thu, 1 Apr 1999 15:03:32 +0100

59 lines

New Thread

Chemical Testing Service in Georgia USA?

Chemical Testing Service in Georgia USA?

Hinners, Hans - LYPME <[log in to unmask]>

Fri, 2 Apr 1999 13:34:38 -0500

41 lines

Re: Chemical Testing Service in Georgia USA?

Stephen R. Gregory <[log in to unmask]>

Fri, 2 Apr 1999 14:51:48 EST

113 lines

Re: Chemical Testing Service in Georgia USA?

<Joseph M. Webb> <[log in to unmask]>

Mon, 5 Apr 1999 11:32:52 -0400

28 lines

New Thread

Chip resistors upside down

Chip resistors upside down

SCHILDEI <[log in to unmask]>

Fri, 23 Apr 1999 12:25:29 +0001

32 lines

Re: Chip resistors upside down

[log in to unmask]

Fri, 23 Apr 1999 12:12:21 -0400

71 lines

New Thread

Clean Room Requirement

Clean Room Requirement

Phillip Ingram <[log in to unmask]>

Mon, 12 Apr 1999 17:05:48 -0400

39 lines

Re: Clean Room Requirement

KELLY M SCHRIVER <[log in to unmask]>

Mon, 12 Apr 1999 16:54:00 -0400

53 lines

Re: Clean Room Requirement

Graham Naisbitt <[log in to unmask]>

Mon, 12 Apr 1999 22:54:36 +0100

85 lines

Re: Clean Room Requirement

Wade Oberle <[log in to unmask]>

Tue, 13 Apr 1999 07:03:43 -0500

75 lines

New Thread

Coax to P.C. board mounting

Coax to P.C. board mounting

Tracy Black <[log in to unmask]>

Tue, 6 Apr 1999 08:33:23 -0700

35 lines

Re: Coax to P.C. board mounting

Beckman, Michael W <[log in to unmask]>

Tue, 6 Apr 1999 09:19:55 -0700

80 lines

New Thread

Cold Solder/Rough Solder/Dull solder

Cold Solder/Rough Solder/Dull solder

Aura Esporlas <[log in to unmask]>

Tue, 6 Apr 1999 17:00:56 +0000

32 lines

New Thread

Column Grid Arrays (CGA)

Column Grid Arrays (CGA)

Robert P. Pelletier <[log in to unmask]>

Wed, 21 Apr 1999 12:34:54 -0700

30 lines

Re: Column Grid Arrays (CGA)

Werner Engelmaier <[log in to unmask]>

Thu, 22 Apr 1999 21:25:39 EDT

46 lines

New Thread

Comments and Recommendations Requested for IPC-1730

Comments and Recommendations Requested for IPC-1730

Christopher Jorgensen <[log in to unmask]>

Tue, 6 Apr 1999 14:54:04 -0500

58 lines

New Thread

Comparative Tracking Index (CTI) on Circuit Board Mater ial

Re: Comparative Tracking Index (CTI) on Circuit Board Mater ial

Gerald G. Gagnon <[log in to unmask]>

Fri, 16 Apr 1999 11:03:50 -0400

77 lines

New Thread

Comparative Tracking Index (CTI) on Circuit Board Material

Comparative Tracking Index (CTI) on Circuit Board Material

Bay State Circuits, Inc. <[log in to unmask]>

Fri, 16 Apr 1999 09:46:52 -0400

80 lines

New Thread

computer upgrade

computer upgrade

Bay State Circuits, Inc. <[log in to unmask]>

Fri, 9 Apr 1999 09:42:38 -0400

104 lines

Re: computer upgrade

doug smith <[log in to unmask]>

Fri, 9 Apr 1999 09:06:55 -0700

63 lines

Re: computer upgrade

joyce <[log in to unmask]>

Sat, 10 Apr 1999 07:43:52 -0400

85 lines

Re: computer upgrade

金鸿 <[log in to unmask]>

Sat, 10 Apr 1999 20:05:26 +0800

149 lines

Re: computer upgrade

VanDeWal, Brian [AMSTA-AR-CCB-DD] <[log in to unmask]>

Mon, 12 Apr 1999 07:52:15 -0400

81 lines

Re: computer upgrade

<Charles Barker> <[log in to unmask]>

Mon, 12 Apr 1999 10:11:09 -0500

126 lines

New Thread

Conductive Adhesive

Conductive Adhesive

Stephen Ayotte <[log in to unmask]>

Thu, 15 Apr 1999 16:16:11 -0400

32 lines

Re: Conductive Adhesive

Lyle Wallig <[log in to unmask]>

Thu, 15 Apr 1999 20:30:40 EDT

30 lines

Re: Conductive Adhesive

[log in to unmask]

Thu, 15 Apr 1999 20:46:09 EDT

74 lines

New Thread

Conformal coat for Al wire bond

Conformal coat for Al wire bond

joyce <[log in to unmask]>

Wed, 14 Apr 1999 19:16:44 -0400

50 lines

New Thread

Contactless Electrical Tester

Contactless Electrical Tester

Sid Tryzbiak <[log in to unmask]>

Fri, 23 Apr 1999 14:48:01 -0400

65 lines

Re: Contactless Electrical Tester

Hans Rohr <[log in to unmask]>

Fri, 23 Apr 1999 20:31:22 -0400

42 lines

New Thread

Copper thickness measurement small PTH.

Copper thickness measurement small PTH.

Desroches, Charles <[log in to unmask]>

Mon, 26 Apr 1999 09:24:15 -0400

41 lines

Re: Copper thickness measurement small PTH.

Barmuta, Mike <[log in to unmask]>

Mon, 26 Apr 1999 08:36:34 -0700

83 lines

New Thread

CORFIN

CORFIN

Les Scontsas <[log in to unmask]>

Wed, 31 Mar 1999 14:00:53 EST

119 lines

New Thread

Correct Spec for assembly of RF coaxial cable assemblies

Correct Spec for assembly of RF coaxial cable assemblies

Jesse Whitfield <[log in to unmask]>

Mon, 19 Apr 1999 16:01:31 -0700

28 lines

New Thread

Correction to JIT Training Resources...

Re: Correction to JIT Training Resources...

Stephen R. Gregory <[log in to unmask]>

Wed, 14 Apr 1999 20:24:49 EDT

31 lines

New Thread

Corrosion

Corrosion

Ryan Chase <[log in to unmask]>

Wed, 14 Apr 1999 17:25:29 MDT

40 lines

Re: Corrosion

joyce <[log in to unmask]>

Wed, 14 Apr 1999 19:45:55 -0400

61 lines

Re: Corrosion

Vanderhoof, Brad <[log in to unmask]>

Wed, 14 Apr 1999 16:46:22 -0700

70 lines

Re: Corrosion

[log in to unmask]

Fri, 16 Apr 1999 19:27:18 EDT

62 lines

Re: Corrosion

Ian Boyton <[log in to unmask]>

Fri, 16 Apr 1999 10:52:32 PDT

108 lines

New Thread

Cracked Tracks in a flex PCB

Cracked Tracks in a flex PCB

Eric Christison <[log in to unmask]>

Fri, 23 Apr 1999 11:20:49 -0500

61 lines

Cracked Tracks in a flex PCB

Andy Magee <[log in to unmask]>

Fri, 23 Apr 1999 21:43:16 -0400

121 lines

Re: Cracked Tracks in a flex PCB

Werner Engelmaier <[log in to unmask]>

Fri, 23 Apr 1999 16:18:22 EDT

66 lines

New Thread

Define goldfinger critical area

Define goldfinger critical area

ryu <[log in to unmask]>

Wed, 21 Apr 1999 23:10:33 -0700

30 lines

New Thread

Definition of Microvias

Definition of Microvias

Harvey Monroe PHILLIPS <[log in to unmask]>

Tue, 6 Apr 1999 10:15:27 +0800

41 lines

Re: Definition of Microvias

Alderete, Michael <[log in to unmask]>

Tue, 6 Apr 1999 08:18:01 -0700

140 lines

Re: Definition of Microvias

Brian McDermott <[log in to unmask]>

Tue, 6 Apr 1999 15:50:04 -0400

92 lines

Re: Definition of Microvias

Christopher Jorgensen <[log in to unmask]>

Tue, 6 Apr 1999 15:15:36 -0500

130 lines

New Thread

Design for manufacture

Design for manufacture

BADA <[log in to unmask]>

Tue, 6 Apr 1999 08:07:43 +0200

33 lines

Re: Design for manufacture

Jorge Engenharia <[log in to unmask]>

Tue, 6 Apr 1999 12:23:31 -0400

85 lines

New Thread

Different current densities in the Macdermid tin-lead ba th

Re: Different current densities in the Macdermid tin-lead ba th

Smith Russell MSM LAPO US <[log in to unmask]>

Thu, 1 Apr 1999 08:44:00 +0200

83 lines

New Thread

Different Paste Height

Different Paste Height

Poh Kong Hui <[log in to unmask]>

Sun, 27 Jun 1999 03:57:18 +0800

39 lines

Re: Different Paste Height

John Chandler <[log in to unmask]>

Mon, 26 Apr 1999 07:26:33 +0200

70 lines

Re: Different Paste Height

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 26 Apr 1999 11:54:00 -0500

23 lines

Re: Different Paste Height

Jorge Engenharia <[log in to unmask]>

Mon, 26 Apr 1999 14:59:25 -0300

84 lines

Re: Different Paste Height

Larry Jindra <[log in to unmask]>

Wed, 28 Apr 1999 09:59:01 -0700

73 lines

New Thread

DIP components

DIP components

PCB Design Division <[log in to unmask]>

Sat, 3 Apr 1999 11:50:04 +0200

46 lines

Re: DIP components

[log in to unmask]

Sat, 3 Apr 1999 15:00:08 EST

54 lines

New Thread

DIP components addendum

Re: DIP components addendum

[log in to unmask]

Wed, 7 Apr 1999 14:31:31 EDT

40 lines

New Thread

DO-214AB/ SMCJ

DO-214AB/ SMCJ

Bob Pauly <[log in to unmask]>

Wed, 7 Apr 1999 12:11:58 -0500

25 lines

Re: DO-214AB/ SMCJ

Stephen R. Gregory <[log in to unmask]>

Wed, 7 Apr 1999 14:04:18 EDT

39 lines

Re: DO-214AB/ SMCJ

Bill Gilman <[log in to unmask]>

Wed, 7 Apr 1999 14:06:12 -0400

60 lines

New Thread

Double sided reflow

Double sided reflow

[log in to unmask]

Mon, 12 Apr 1999 16:26:18 GMT

33 lines

Re: Double sided reflow

Stephen R. Gregory <[log in to unmask]>

Tue, 13 Apr 1999 11:19:44 EDT

63 lines

Re: Double sided reflow

Jorge Engenharia <[log in to unmask]>

Tue, 13 Apr 1999 13:43:32 -0300

113 lines

Re: Double sided reflow

West, Jim <[log in to unmask]>

Tue, 13 Apr 1999 13:48:00 -0400

141 lines

Re: Double sided reflow

Jeff Hempton <[log in to unmask]>

Tue, 13 Apr 1999 14:23:48 -0400

155 lines

Re: Double sided reflow

Ryan Jennens <[log in to unmask]>

Tue, 13 Apr 1999 16:03:35 -0400

147 lines

Re: Double sided reflow

jim <[log in to unmask]>

Tue, 13 Apr 1999 17:36:36 -0500

155 lines

New Thread

Drying of double reflow boards with BGA's

Drying of double reflow boards with BGA's

d. terstegge <[log in to unmask]>

Mon, 12 Apr 1999 11:02:05 +0200

37 lines

New Thread

DSA Anode

DSA Anode

Albert Mok <[log in to unmask]>

Tue, 6 Apr 1999 16:18:40 +0800

26 lines

Re: DSA Anode

Jim Jablonsky <[log in to unmask]>

Tue, 6 Apr 1999 09:42:33 -0400

50 lines

New Thread

DSC vs. TMA

DSC vs. TMA

glenn pelkey <[log in to unmask]>

Tue, 20 Apr 1999 08:41:45 PDT

45 lines

Re: DSC vs. TMA

joyce <[log in to unmask]>

Tue, 20 Apr 1999 18:47:57 -0400

64 lines

Re: DSC vs. TMA

[log in to unmask]

Tue, 20 Apr 1999 19:37:59 EDT

74 lines

Re: DSC vs. TMA

Bill Davis <[log in to unmask]>

Thu, 22 Apr 1999 07:54:17 -0700

106 lines

New Thread

Electrolytic Plating

Electrolytic Plating

Craig Hillman <[log in to unmask]>

Mon, 19 Apr 1999 05:00:00 EST

30 lines

Re: Electrolytic Plating

Hogue, Pat (AZ76) <[log in to unmask]>

Mon, 19 Apr 1999 13:45:45 -0700

62 lines

New Thread

Electrolytic plating on isolated areas or an alternative

Electrolytic plating on isolated areas or an alternative

[log in to unmask]

Tue, 20 Apr 1999 15:06:49 -0500

43 lines

Re: Electrolytic plating on isolated areas or an alternative

George Gerberick <[log in to unmask]>

Tue, 20 Apr 1999 14:42:46 -0700

61 lines

New Thread

Entek question

Entek question

Michael D. Doty <[log in to unmask]>

Thu, 1 Apr 1999 18:34:42 -0500

32 lines

Re: Entek question

David Chandler <[log in to unmask]>

Wed, 7 Apr 1999 07:50:00 -0400

116 lines

New Thread

Fab-Laminate Material

Fab-Laminate Material

Edwards, Ted A (AZ75) <[log in to unmask]>

Fri, 23 Apr 1999 14:07:06 -0700

23 lines

New Thread

File attachments (virus risk)

File attachments (virus risk)

[log in to unmask]

Thu, 1 Apr 1999 14:32:41 EST

30 lines

Re: File attachments (virus risk)

joyce <[log in to unmask]>

Fri, 2 Apr 1999 18:54:29 -0500

55 lines

New Thread

Find out viclad laminate

Find out viclad laminate

Howard Lin <[log in to unmask]>

Mon, 26 Apr 1999 14:24:31 +0800

30 lines

New Thread

Fine Pitch PADS

Fine Pitch PADS

Edward Brunker <[log in to unmask]>

Thu, 15 Apr 1999 12:52:27 GMT

43 lines

New Thread

Fine-pitch PADs

Fine-pitch PADs

Roberto A. Nunes <[log in to unmask]>

Wed, 14 Apr 1999 13:36:51 -0300

89 lines

Re: Fine-pitch PADs

Hiteshew, Michael <[log in to unmask]>

Thu, 15 Apr 1999 11:26:35 -0400

63 lines

Re: Fine-pitch PADs

Seth Goodman <[log in to unmask]>

Thu, 15 Apr 1999 12:47:10 -0500

83 lines

New Thread

Flame Spray

Flame Spray

Hogue, Pat (AZ76) <[log in to unmask]>

Wed, 21 Apr 1999 16:03:50 -0700

45 lines

Re: Flame Spray

Ted Tessiert <[log in to unmask]>

Mon, 26 Apr 1999 17:56:47 -0700

80 lines

New Thread

Flash Gold??

Flash Gold??

Nick Liang <[log in to unmask]>

Tue, 27 Apr 1999 14:40:59 +0800

37 lines

Re: Flash Gold??

David McCann <[log in to unmask]>

Tue, 27 Apr 1999 06:58:27 -0700

66 lines

Re: Flash Gold??

Albert Mok <[log in to unmask]>

Wed, 28 Apr 1999 09:35:52 +0800

95 lines

Re: Flash Gold??

Art Fisher <[log in to unmask]>

Wed, 28 Apr 1999 07:48:54 -0500

135 lines

Re: Flash Gold??

Albert Mok <[log in to unmask]>

Thu, 29 Apr 1999 09:25:42 +0800

147 lines

New Thread

Flex stiffener

Flex stiffener

[log in to unmask]

Mon, 19 Apr 1999 09:03:28 -0800

28 lines

New Thread

Flex stiffener -Reply

Flex stiffener -Reply

Larry Campbell <[log in to unmask]>

Mon, 19 Apr 1999 13:05:22 -0400

30 lines

New Thread

FW: CEM3 and surface mount

FW: CEM3 and surface mount

Jon McDowell <[log in to unmask]>

Fri, 2 Apr 1999 09:02:20 -0700

228 lines

New Thread

Fw: PROCESS PROBLEM

Fw: PROCESS PROBLEM

Bay State Circuits, Inc. <[log in to unmask]>

Fri, 2 Apr 1999 13:46:03 -0500

120 lines

Re: Fw: PROCESS PROBLEM

Paul Gould <[log in to unmask]>

Mon, 5 Apr 1999 14:31:11 +0100

252 lines

New Thread

Fw: [Fwd: FW: Turn On Your Lights For Littleton CO]

Fw: [Fwd: FW: Turn On Your Lights For Littleton CO]

[log in to unmask]

Fri, 23 Apr 1999 08:09:38 -0700

109 lines

New Thread

FW: [TN] 8MM TAPE SPLICING TOOL FOR SMT CAPS&RES.

FW: [TN] 8MM TAPE SPLICING TOOL FOR SMT CAPS&RES.

Stephen Bonaccorsi <[log in to unmask]>

Mon, 26 Apr 1999 10:40:55 +0100

76 lines

New Thread

FW: [TN] Can adhesive go thru reflow soldering?

FW: [TN] Can adhesive go thru reflow soldering?

Stephen Bonaccorsi <[log in to unmask]>

Wed, 7 Apr 1999 17:52:09 +0100

71 lines

New Thread

FW: [TN] DIP components

FW: [TN] DIP components

Dhawan, Ashok <[log in to unmask]>

Mon, 5 Apr 1999 09:29:19 -0500

112 lines

New Thread

FW: [TN] SMT Component Fall Out Rate

FW: [TN] SMT Component Fall Out Rate

Stephen Bonaccorsi <[log in to unmask]>

Wed, 7 Apr 1999 18:09:46 +0100

101 lines

New Thread

Fwd: [CN] BGAs

Fwd: [CN] BGAs

Christopher Rhodes <[log in to unmask]>

Mon, 26 Apr 1999 12:28:08 -0500

113 lines

New Thread

Gluing

Gluing

Tempea, Ioan <[log in to unmask]>

Tue, 27 Apr 1999 10:18:43 -0400

35 lines

New Thread

Gold drag out reclaim

Gold drag out reclaim

Albert Mok <[log in to unmask]>

Thu, 8 Apr 1999 23:29:00 +0800

27 lines

Re: Gold drag out reclaim

Barmuta, Mike <[log in to unmask]>

Thu, 8 Apr 1999 09:52:53 -0700

76 lines

Re: Gold drag out reclaim

No Name Available <[log in to unmask]>

Thu, 8 Apr 1999 11:07:16 -0400

76 lines

Re: Gold drag out reclaim

Lenny Kurup <[log in to unmask]>

Thu, 8 Apr 1999 12:44:43 -0400

31 lines

New Thread

Gold drag out reclaim - resins for...

Re: Gold drag out reclaim - resins for...

Robert E. Mesick <[log in to unmask]>

Thu, 8 Apr 1999 16:47:01 -0700

48 lines

New Thread

Gold Embrittlement

Gold Embrittlement

Knowles, Ed <[log in to unmask]>

Mon, 5 Apr 1999 15:28:32 -0600

55 lines

Re: Gold Embrittlement

Maguire, James F <[log in to unmask]>

Tue, 6 Apr 1999 11:09:21 -0700

91 lines

Re: Gold Embrittlement

joyce <[log in to unmask]>

Tue, 6 Apr 1999 18:16:36 -0400

82 lines

Re: Gold Embrittlement

Paul Klasek <[log in to unmask]>

Wed, 7 Apr 1999 11:47:20 +1000

104 lines

Re: Gold Embrittlement

Guenter Grossmann <[log in to unmask]>

Wed, 7 Apr 1999 08:54:58 +0200

31 lines

Re: Gold Embrittlement

Werner Engelmaier <[log in to unmask]>

Wed, 7 Apr 1999 07:30:15 EDT

42 lines

New Thread

Gold embrittlement/Attaching Gold Plated leads to PWB's.

Gold embrittlement/Attaching Gold Plated leads to PWB's.

<Charles Barker> <[log in to unmask]>

Thu, 1 Apr 1999 16:25:11 -0600

41 lines

Re: Gold embrittlement/Attaching Gold Plated leads to PWB's.

KELLY M SCHRIVER <[log in to unmask]>

Mon, 5 Apr 1999 13:32:00 -0400

48 lines

Re: Gold embrittlement/Attaching Gold Plated leads to PWB's.

Paul Klasek <[log in to unmask]>

Mon, 5 Apr 1999 17:45:17 -0700

97 lines

Re: Gold embrittlement/Attaching Gold Plated leads to PWB's.

Phillip E Hinton <[log in to unmask]>

Mon, 5 Apr 1999 23:12:32 EDT

28 lines

Re: Gold embrittlement/Attaching Gold Plated leads to PWB's.

[log in to unmask]

Wed, 7 Apr 1999 20:14:33 EDT

43 lines

New Thread

Goldfinger questions.

Goldfinger questions.

ryu <[log in to unmask]>

Sun, 11 Apr 1999 22:59:27 -0700

30 lines

Re: Goldfinger questions.

Albert Mok <[log in to unmask]>

Mon, 12 Apr 1999 16:29:32 +0800

61 lines

New Thread

GRAINY JOINTS

GRAINY JOINTS

Stephen Bonaccorsi <[log in to unmask]>

Thu, 1 Apr 1999 12:34:09 +0100

48 lines

Re: GRAINY JOINTS

KELLY M SCHRIVER <[log in to unmask]>

Thu, 1 Apr 1999 08:54:00 -0500

42 lines

Re: GRAINY JOINTS

Kathy Palumbo <[log in to unmask]>

Thu, 1 Apr 1999 08:49:39 -0800

89 lines

Re: GRAINY JOINTS

David D Hillman <[log in to unmask]>

Thu, 15 Apr 1999 07:46:15 -0500

90 lines

Re: GRAINY JOINTS

[log in to unmask]

Fri, 16 Apr 1999 10:14:40 +0200

59 lines

New Thread

Halides in solderpaste

Halides in solderpaste

KK Chin <[log in to unmask]>

Thu, 1 Apr 1999 17:17:40 -0700

31 lines

New Thread

Hand Solder Pre-Heat

Hand Solder Pre-Heat

Ryan Jennens <[log in to unmask]>

Fri, 30 Apr 1999 10:26:43 -0400

101 lines

New Thread

Heavy wire Al-bonding on FR4

Heavy wire Al-bonding on FR4

[log in to unmask]

Thu, 15 Apr 1999 17:52:22 +0200

39 lines

Re: Heavy wire Al-bonding on FR4

Roger Massey-G14195 <[log in to unmask]>

Fri, 16 Apr 1999 12:17:28 +0100

108 lines

New Thread

Help for protective material of Thick Film

Help for protective material of Thick Film

Davis Yang <[log in to unmask]>

Thu, 15 Apr 1999 08:28:06 +0800

30 lines

New Thread

Help for protective material of Thick Film <IPC TN>

Re: Help for protective material of Thick Film <IPC TN>

Alderete, Michael <[log in to unmask]>

Fri, 16 Apr 1999 08:54:06 -0700

108 lines

New Thread

Hermitic Glass-to-Metal Sealing

Hermitic Glass-to-Metal Sealing

Casero, Juan <[log in to unmask]>

Thu, 8 Apr 1999 06:47:20 -0700

29 lines

New Thread

High precision resistors

High precision resistors

Stephen Ayotte <[log in to unmask]>

Wed, 14 Apr 1999 15:44:23 -0400

30 lines

Re: High precision resistors

West, Jim <[log in to unmask]>

Wed, 14 Apr 1999 16:51:57 -0400

76 lines

Re: High precision resistors

Thomas DeSmit <[log in to unmask]>

Wed, 14 Apr 1999 15:54:39 -0500

70 lines

Re: High precision resistors

Peterson, Gary D <[log in to unmask]>

Wed, 14 Apr 1999 15:05:14 -0600

56 lines

Re: High precision resistors

Yvon Hache <[log in to unmask]>

Thu, 15 Apr 1999 09:01:19 -0300

57 lines

New Thread

Hot Air Knife

Hot Air Knife

Kane, Joseph <[log in to unmask]>

Mon, 19 Apr 1999 18:24:26 -0400

47 lines

Re: Hot Air Knife

Stephen R. Gregory <[log in to unmask]>

Mon, 19 Apr 1999 23:56:36 EDT

97 lines

Re: Hot Air Knife

Eddy Nijhof <[log in to unmask]>

Tue, 20 Apr 1999 10:11:01 +0200

154 lines

Re: Hot Air Knife

Tempea, Ioan <[log in to unmask]>

Tue, 20 Apr 1999 08:28:55 -0400

81 lines

Re: Hot Air Knife

Aric Parr <[log in to unmask]>

Tue, 20 Apr 1999 07:04:24 EDT

96 lines

Hot Air Knife

Ken Kirby <[log in to unmask]>

Tue, 20 Apr 1999 10:45:35 -0500

152 lines

Re: Hot Air Knife

Jorge Engenharia <[log in to unmask]>

Tue, 20 Apr 1999 12:26:00 -0400

88 lines

New Thread

How thin can a two layer board be?

How thin can a two layer board be?

Eric Christison <[log in to unmask]>

Thu, 22 Apr 1999 11:28:08 -0500

42 lines

Re: How thin can a two layer board be?

Kimmey, Frank <[log in to unmask]>

Thu, 22 Apr 1999 10:07:33 -0700

81 lines

Re: How thin can a two layer board be?

Don Vischulis <[log in to unmask]>

Thu, 22 Apr 1999 18:34:17 -0500

53 lines

Re: How thin can a two layer board be?

Albert Mok <[log in to unmask]>

Fri, 23 Apr 1999 10:39:51 +0800

69 lines

Re: How thin can a two layer board be?

Colin <[log in to unmask]>

Fri, 23 Apr 1999 06:05:33 -0500

105 lines

Re: How thin can a two layer board be?

Andy Slade <[log in to unmask]>

Fri, 23 Apr 1999 07:50:29 -0400

70 lines

New Thread

How to fill Vias? ...

How to fill Vias? ...

Ken Patel <[log in to unmask]>

Tue, 27 Apr 1999 16:21:35 -0700

34 lines

Re: How to fill Vias? ...

Stephen R. Gregory <[log in to unmask]>

Tue, 27 Apr 1999 19:40:15 EDT

51 lines

Re: How to fill Vias? ...

Art Fisher <[log in to unmask]>

Wed, 28 Apr 1999 07:50:38 -0500

64 lines

Re: How to fill Vias? ...

Jeff Hempton <[log in to unmask]>

Wed, 28 Apr 1999 09:35:32 -0400

89 lines

New Thread

How to get water out?

Re: How to get water out?

David D Hillman <[log in to unmask]>

Wed, 21 Apr 1999 08:14:09 -0500

104 lines

New Thread

How to Import. -Reply

How to Import. -Reply

Larry Campbell <[log in to unmask]>

Thu, 1 Apr 1999 08:12:31 -0500

32 lines

New Thread

Impedance Measurements of Solder Paste

Impedance Measurements of Solder Paste

Jim Kittel <[log in to unmask]>

Wed, 14 Apr 1999 15:02:37 -0600

28 lines

Re: Impedance Measurements of Solder Paste

David D Hillman <[log in to unmask]>

Thu, 15 Apr 1999 06:53:16 -0500

72 lines

New Thread

Insulator under a Xformer

Insulator under a Xformer

Raymond Klein <[log in to unmask]>

Wed, 28 Apr 1999 16:57:52 -0700

27 lines

New Thread

Intermetallic growth during thermal cycling

Intermetallic growth during thermal cycling

Tom Martling <[log in to unmask]>

Wed, 28 Apr 1999 12:07:02 +0000

43 lines

New Thread

Intermittent PCB Traces Due To Vibration

Intermittent PCB Traces Due To Vibration

Jeff Fries <[log in to unmask]>

Wed, 28 Apr 1999 07:13:36 -0500

108 lines

New Thread

ionic contamination

ionic contamination

Albert Mok <[log in to unmask]>

Thu, 15 Apr 1999 08:48:44 +0800

37 lines

Re: ionic contamination

David Fish <[log in to unmask]>

Wed, 14 Apr 1999 22:50:57 -0400

55 lines

Re: ionic contamination

David D Hillman <[log in to unmask]>

Thu, 15 Apr 1999 06:45:31 -0500

79 lines

Re: ionic contamination

Albert Mok <[log in to unmask]>

Fri, 16 Apr 1999 18:22:57 +0800

109 lines

New Thread

Ionic Contamination Testers

Ionic Contamination Testers

Paula R. Hoffman <[log in to unmask]>

Thu, 22 Apr 1999 10:04:04 PST

29 lines

Re: Ionic Contamination Testers

Albert Mok <[log in to unmask]>

Fri, 23 Apr 1999 10:50:07 +0800

56 lines

New Thread

IPC SPECIFICATION

IPC SPECIFICATION

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 23 Apr 1999 07:43:00 -0500

28 lines

New Thread

IPC Standards

IPC Standards

franco vezzoli <[log in to unmask]>

Fri, 16 Apr 1999 16:25:45 +0200

25 lines

Re: IPC Standards

[log in to unmask]

Mon, 19 Apr 1999 10:01:08 EDT

31 lines

New Thread

IPC-4101 ANSI Approval

IPC-4101 ANSI Approval

Christopher Jorgensen <[log in to unmask]>

Fri, 9 Apr 1999 14:09:41 -0500

41 lines

New Thread

IPC/DC Greater Boston Chapter Meeting 04/21 6pm - SI

IPC/DC Greater Boston Chapter Meeting 04/21 6pm - SI

Jeff Seeger <[log in to unmask]>

Wed, 14 Apr 1999 00:14:16 -0400

106 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Mon, 26 Apr 1999 15:42:18 -0700

46 lines

New Thread

ISO Qualification

ISO Qualification

Sid Tryzbiak <[log in to unmask]>

Mon, 26 Apr 1999 13:45:16 -0400

65 lines

New Thread

Isolator

Isolator

Yvon Hache <[log in to unmask]>

Wed, 28 Apr 1999 15:00:37 -0300

45 lines

Re: Isolator

Art Fisher <[log in to unmask]>

Wed, 28 Apr 1999 14:07:47 -0500

70 lines

Re: Isolator

Mcmaster, Michael <[log in to unmask]>

Wed, 28 Apr 1999 13:59:21 -0700

97 lines

Re: Isolator

Alderete, Michael <[log in to unmask]>

Wed, 28 Apr 1999 16:30:56 -0700

65 lines

Re: Isolator

Yvon Hache <[log in to unmask]>

Wed, 28 Apr 1999 22:31:41 -0300

96 lines

New Thread

Japnese Manufacturer

Japnese Manufacturer

Mike Khera <[log in to unmask]>

Tue, 13 Apr 1999 23:49:21 +0530

33 lines

Re: Japnese Manufacturer

Stephen R. Gregory <[log in to unmask]>

Wed, 14 Apr 1999 00:42:07 EDT

63 lines

Re: Japnese Manufacturer

Beckman, Michael W <[log in to unmask]>

Wed, 14 Apr 1999 08:03:59 -0700

63 lines

New Thread

Japnese Manufacturer -Reply

Japnese Manufacturer -Reply

TPE Engineering TechNet <[log in to unmask]>

Wed, 14 Apr 1999 06:46:24 -0700

30 lines

New Thread

JIT Training demo....

JIT Training demo....

Justin Braime <[log in to unmask]>

Thu, 15 Apr 1999 09:21:12 +1200

86 lines

Re: JIT Training demo....

Stephen R. Gregory <[log in to unmask]>

Wed, 14 Apr 1999 20:08:47 EDT

71 lines

Re: JIT Training demo....

Hinners, Hans - LYPME <[log in to unmask]>

Thu, 15 Apr 1999 08:03:34 -0400

46 lines

Re: JIT Training demo....

Stephen Schiera <[log in to unmask]>

Fri, 16 Apr 1999 08:17:04 -0700

117 lines

New Thread

kapton coverlay

kapton coverlay

Adeodato Vigano <[log in to unmask]>

Fri, 9 Apr 1999 17:47:34 -0400

86 lines

Re: Kapton Coverlay

Andy Magee <[log in to unmask]>

Sat, 10 Apr 1999 22:45:21 -0400

62 lines

Re: kapton coverlay

Chuck Brummer <[log in to unmask]>

Fri, 9 Apr 1999 15:05:59 -0700

102 lines

New Thread

kapton flex circuits

kapton flex circuits

Phil Crepeau <[log in to unmask]>

Thu, 8 Apr 1999 13:29:04 -0700

38 lines

Re: kapton flex circuits

Chuck Brummer <[log in to unmask]>

Fri, 9 Apr 1999 12:50:58 -0700

57 lines

New Thread

Kapton Flex Circuits Reliablity Assurance

Kapton Flex Circuits Reliablity Assurance

Richard E. Driscoll, Jr. <[log in to unmask]>

Wed, 21 Apr 1999 08:46:59 -0500

69 lines

New Thread

Kleenox

Re: Kleenox

Jeff Finger <[log in to unmask]>

Sat, 10 Apr 1999 21:24:43 -0700

49 lines

New Thread

Label Feeder

Re: Label Feeder

Stephen R. Gregory <[log in to unmask]>

Tue, 20 Apr 1999 13:27:18 EDT

72 lines

New Thread

Laminate, No UV Block.

Laminate, No UV Block.

Dan Brandler <[log in to unmask]>

Thu, 29 Apr 1999 17:24:28 -0700

35 lines

Re: Laminate, No UV Block.

Ralph Richart <[log in to unmask]>

Fri, 30 Apr 1999 10:55:52 -0700

60 lines

New Thread

Land Grid Array and Pad Size

Land Grid Array and Pad Size

Frank Hinojos <[log in to unmask]>

Thu, 22 Apr 1999 17:22:54 -0700

34 lines

New Thread

Land Pattern for 24 ld SSOP

Land Pattern for 24 ld SSOP

Tomaso Mordha <[log in to unmask]>

Thu, 15 Apr 1999 03:33:58 MDT

42 lines

Re: Land Pattern for 24 ld SSOP

Gary Ferrari <[log in to unmask]>

Thu, 15 Apr 1999 09:23:38 EDT

35 lines

New Thread

Lead-Free Alloys

Lead-Free Alloys

Andy Mackie <[log in to unmask]>

Thu, 8 Apr 1999 15:17:17 -0400

33 lines

Re: Lead-Free Alloys

Tracy Black <[log in to unmask]>

Thu, 8 Apr 1999 13:23:50 -0700

58 lines

New Thread

Lead-to-Hole Ratio

Lead-to-Hole Ratio

Alan Kreplick <[log in to unmask]>

Mon, 19 Apr 1999 09:13:56 -0400

36 lines

New Thread

Life testing of PCBAs.

Life testing of PCBAs.

Rod Lafond <[log in to unmask]>

Tue, 6 Apr 1999 13:59:23 -0700

31 lines

Re: Life testing of PCBAs.

Werner Engelmaier <[log in to unmask]>

Wed, 7 Apr 1999 21:31:24 EDT

33 lines

New Thread

Linux in a CIM Environment?

Linux in a CIM Environment?

Casero, Juan <[log in to unmask]>

Thu, 15 Apr 1999 08:36:08 -0700

34 lines

Re: Linux in a CIM Environment?

Scott Mcanall <[log in to unmask]>

Thu, 15 Apr 1999 13:24:06 EDT

27 lines

New Thread

Method 2.6.22 Acoustic Microscopy

Method 2.6.22 Acoustic Microscopy

glenn pelkey <[log in to unmask]>

Fri, 2 Apr 1999 09:53:18 PST

39 lines

Re: Method 2.6.22 Acoustic Microscopy

Christopher Jorgensen <[log in to unmask]>

Fri, 2 Apr 1999 12:34:21 -0600

74 lines

Re: Method 2.6.22 Acoustic Microscopy

Jack Crawford <[log in to unmask]>

Mon, 5 Apr 1999 12:06:32 -0500

71 lines

New Thread

Michigan DC Chapter meeting

Michigan DC Chapter meeting

Gary Ferrari <[log in to unmask]>

Thu, 8 Apr 1999 13:50:08 EDT

52 lines

New Thread

Microetch depth measurement

Microetch depth measurement

Albert Mok <[log in to unmask]>

Thu, 22 Apr 1999 16:40:18 +0800

43 lines

Re: Microetch depth measurement

Vaughan, Ralph H <[log in to unmask]>

Thu, 22 Apr 1999 06:00:37 -0700

81 lines

Re: Microetch depth measurement

Ronald J. Rhodes <[log in to unmask]>

Thu, 22 Apr 1999 12:53:36 -0700

84 lines

Re: Microetch depth measurement

Albert Mok <[log in to unmask]>

Fri, 23 Apr 1999 11:00:15 +0800

98 lines

Re: Microetch depth measurement

Joe Felts <[log in to unmask]>

Thu, 22 Apr 1999 21:42:48 -0700

143 lines

New Thread

MIL-P-55110 continuance

Re: MIL-P-55110 continuance

Jay Solderberg <[log in to unmask]>

Thu, 1 Apr 1999 16:45:25 -0600

135 lines

New Thread

Milled Finish???

Milled Finish???

Nick Liang <[log in to unmask]>

Wed, 28 Apr 1999 09:54:25 +0800

37 lines

New Thread

Moisture absorption in plastic packaging

Moisture absorption in plastic packaging

Martin, Jesse <[log in to unmask]>

Mon, 26 Apr 1999 13:40:54 -0400

35 lines

New Thread

Multilayer drilling

Multilayer drilling

Brigitte Haugk <[log in to unmask]>

Fri, 16 Apr 1999 15:53:30 -0500

25 lines

New Thread

New surface coating (finish)

Re: New surface coating (finish)

Henry Coulter <[log in to unmask]>

Wed, 21 Apr 1999 14:46:08 -0700

25 lines

New Thread

Ni Plating for wire bond

Re: Ni Plating for wire bond

Roger Massey-G14195 <[log in to unmask]>

Thu, 1 Apr 1999 10:15:12 +0100

97 lines

Re: Ni Plating for wire bond

Carano,Michael <[log in to unmask]>

Thu, 1 Apr 1999 15:11:26 +0100

85 lines

New Thread

Ni/Au "black pad" problem

Re: Ni/Au "black pad" problem

David D Hillman <[log in to unmask]>

Wed, 31 Mar 1999 18:18:06 -0600

199 lines

New Thread

Nickel Chromium Etchant

Nickel Chromium Etchant

[log in to unmask]

Mon, 5 Apr 1999 14:34:07 -0500

32 lines

New Thread

North Penn Technologies

re: North Penn Technologies

Roger F. Miller <[log in to unmask]>

Mon, 12 Apr 1999 07:32:07 -0400

48 lines

New Thread

North Penn Techologies

North Penn Techologies

Werner Engelmaier <[log in to unmask]>

Fri, 9 Apr 1999 15:13:09 EDT

28 lines

Re: North Penn Techologies

KELLY M SCHRIVER <[log in to unmask]>

Mon, 12 Apr 1999 07:49:00 -0400

32 lines

Re: North Penn Techologies

Alderete, Michael <[log in to unmask]>

Mon, 12 Apr 1999 12:23:30 -0700

126 lines

Re: North Penn Techologies

Russ <[log in to unmask]>

Mon, 12 Apr 1999 12:25:35 -0700

68 lines

Re: North Penn Techologies

Kathy Palumbo <[log in to unmask]>

Mon, 12 Apr 1999 16:37:02 -0700

98 lines

New Thread

Optical Comparators

Optical Comparators

Kimmey, Frank <[log in to unmask]>

Thu, 22 Apr 1999 12:57:14 -0700

47 lines

Optical Comparators

Jeff Hempton <[log in to unmask]>

Thu, 22 Apr 1999 15:10:20 -0400

72 lines

New Thread

Order standard

Order standard

Feng Yi,BISC PD IE(BJ) <[log in to unmask]>

Thu, 29 Apr 1999 16:41:13 +0800

85 lines

New Thread

Oxidation on a Connector

Oxidation on a Connector

Severson, Scott M. <[log in to unmask]>

Mon, 12 Apr 1999 09:02:26 -0500

85 lines

Re: Oxidation on a Connector

Roger Massey-G14195 <[log in to unmask]>

Mon, 12 Apr 1999 16:27:52 +0100

265 lines

New Thread

Oxide reducing powder

Oxide reducing powder

Tempea, Ioan <[log in to unmask]>

Thu, 1 Apr 1999 13:30:54 -0500

36 lines

Re: Oxide reducing powder

Stephen R. Gregory <[log in to unmask]>

Thu, 1 Apr 1999 17:06:51 EST

57 lines

New Thread

Part number systems

Part number systems

Dennis Ward <[log in to unmask]>

Wed, 7 Apr 1999 13:47:36 -0400

57 lines

Re: Part number systems

KK Chin <[log in to unmask]>

Wed, 7 Apr 1999 12:45:53 -0700

103 lines

Re: Part number systems

Keel, Mike <[log in to unmask]>

Wed, 7 Apr 1999 14:29:30 -0700

162 lines

New Thread

Parylene coating

Parylene coating

Collins, Graham <[log in to unmask]>

Mon, 26 Apr 1999 16:07:41 -0300

96 lines

Re: Parylene coating

Lustig, Steven K.. <[log in to unmask]>

Tue, 27 Apr 1999 12:46:29 -0500

69 lines

New Thread

Pb in conductor-paste

Pb in conductor-paste

Jos Groffils <[log in to unmask]>

Wed, 28 Apr 1999 07:56:33 +0000

45 lines

Re: Pb in conductor-paste

Rob Schetty <[log in to unmask]>

Wed, 28 Apr 1999 12:23:48 -0400

67 lines

New Thread

PBGA357

PBGA357

Burtt, Nigel <[log in to unmask]>

Thu, 8 Apr 1999 12:31:17 +0100

43 lines

Re: PBGA357

Energy Technology Systems <[log in to unmask]>

Fri, 9 Apr 1999 09:38:43 -0700

91 lines

New Thread

PC501 solder mask?

PC501 solder mask?

Howard Lin <[log in to unmask]>

Fri, 9 Apr 1999 14:15:07 +0800

29 lines

Re: PC501 solder mask?

Albert Mok <[log in to unmask]>

Fri, 9 Apr 1999 16:18:41 +0800

58 lines

New Thread

PCB

PCB

Bob Pierce <[log in to unmask]>

Wed, 28 Apr 1999 11:46:44 -0700

97 lines

New Thread

PCB discoloration

PCB discoloration

Carson Dennis D <[log in to unmask]>

Fri, 30 Apr 1999 10:06:18 -0500

35 lines

Re: PCB discoloration

doug smith <[log in to unmask]>

Fri, 30 Apr 1999 09:29:19 -0700

72 lines

New Thread

PCB Scoreline (V cut) tolerance

PCB Scoreline (V cut) tolerance

Lee PengSoon-CPL035 <[log in to unmask]>

Thu, 22 Apr 1999 07:58:52 +0800

30 lines

Re: PCB Scoreline (V cut) tolerance

Joseph E. J. Duclos Jr. <[log in to unmask]>

Wed, 21 Apr 1999 23:31:23 -0400

79 lines

Re: PCB Scoreline (V cut) tolerance

[log in to unmask]

Thu, 22 Apr 1999 08:01:12 EDT

25 lines

Re: PCB Scoreline (V cut) tolerance

Todd Vorpahl <[log in to unmask]>

Thu, 22 Apr 1999 11:27:16 -0400

135 lines

Re: PCB Scoreline (V cut) tolerance

Beckman, Michael W <[log in to unmask]>

Thu, 22 Apr 1999 08:51:48 -0700

57 lines

Re: PCB Scoreline (V cut) tolerance

Mark Simmons <[log in to unmask]>

Thu, 22 Apr 1999 09:30:13 -0700

94 lines

Re: PCB Scoreline (V cut) tolerance

Hans Rohr <[log in to unmask]>

Thu, 22 Apr 1999 21:16:41 -0400

62 lines

New Thread

PCI Connector P/S insufficient after Wave

PCI Connector P/S insufficient after Wave

Moss, Thomas <[log in to unmask]>

Mon, 5 Apr 1999 15:04:18 -0700

38 lines

Re: PCI Connector P/S insufficient after Wave

Edward Brunker <[log in to unmask]>

Tue, 6 Apr 1999 13:47:33 GMT

74 lines

Re: PCI Connector P/S insufficient after Wave

Stephen R. Gregory <[log in to unmask]>

Tue, 6 Apr 1999 10:57:49 EDT

41 lines

New Thread

Photo Definable Dielectric Suppliers

Re: Photo Definable Dielectric Suppliers

Smith Russell MSM LAPO US <[log in to unmask]>

Thu, 1 Apr 1999 08:44:00 +0200

131 lines

New Thread

Pitting

Pitting

Gwerder Lorenz <[log in to unmask]>

Sat, 3 Apr 1999 10:07:35 +0200

35 lines

Re: Pitting

Joe Felts <[log in to unmask]>

Sat, 3 Apr 1999 15:07:53 -0700

66 lines

Re: Pitting

Carano,Michael <[log in to unmask]>

Mon, 5 Apr 1999 18:16:57 +0100

67 lines

Re: Pitting

Smith Russell MSM LAPO US <[log in to unmask]>

Tue, 6 Apr 1999 04:19:00 +0200

119 lines

Re: Pitting

Albert Mok <[log in to unmask]>

Wed, 7 Apr 1999 09:46:49 +0800

79 lines

Re: Pitting

Eric Yakobson <[log in to unmask]>

Wed, 7 Apr 1999 12:12:59 -0400

98 lines

New Thread

plating pens

plating pens

Paul Peltier <[log in to unmask]>

Fri, 23 Apr 1999 02:45:16 -0400

31 lines

Re: plating pens

McMonagle, Michael R. <[log in to unmask]>

Fri, 23 Apr 1999 10:03:00 -0500

65 lines

plating pens

Remo Cirone <[log in to unmask]>

Fri, 23 Apr 1999 17:23:14 +0200

61 lines

Re: plating pens

Peter Swanson <[log in to unmask]>

Fri, 23 Apr 1999 20:15:51 GMT

38 lines

New Thread

plating thickness

plating thickness

Craig Hillman <[log in to unmask]>

Mon, 5 Apr 1999 05:00:00 EST

28 lines

Re: plating thickness

Gary Ferrari <[log in to unmask]>

Mon, 5 Apr 1999 09:49:39 EDT

37 lines

New Thread

Polyimide tape applicator.

Polyimide tape applicator.

Desroches, Charles <[log in to unmask]>

Tue, 27 Apr 1999 09:35:24 -0400

43 lines

New Thread

Popcorning

Popcorning

Andy Mackie <[log in to unmask]>

Thu, 22 Apr 1999 15:33:48 -0400

29 lines

New Thread

Popcorning <IPC TN>

Re: Popcorning <IPC TN>

Alderete, Michael <[log in to unmask]>

Fri, 23 Apr 1999 12:14:01 -0700

239 lines

Re: Popcorning <IPC TN>

Jorge Engenharia <[log in to unmask]>

Mon, 26 Apr 1999 14:20:02 -0400

179 lines

New Thread

Positive & negative etchback

Positive & negative etchback

Francis Lai <[log in to unmask]>

Thu, 29 Apr 1999 02:41:57 -0700

27 lines

New Thread

Power Drivers...

Power Drivers...

Stephen R. Gregory <[log in to unmask]>

Tue, 13 Apr 1999 10:56:50 EDT

55 lines

Re: Power Drivers...

Ryan Chase <[log in to unmask]>

Tue, 13 Apr 1999 10:56:49 MDT

111 lines

Re: Power Drivers...

<Charles Barker> <[log in to unmask]>

Tue, 13 Apr 1999 16:22:54 -0500

176 lines

Re: Power Drivers...

Stephen R. Gregory <[log in to unmask]>

Tue, 13 Apr 1999 21:20:34 EDT

51 lines

New Thread

Problem during strip dry film

Problem during strip dry film

Albert Mok <[log in to unmask]>

Sat, 10 Apr 1999 18:44:23 +0800

35 lines

Re: Problem during strip dry film

Albert Mok <[log in to unmask]>

Sat, 10 Apr 1999 20:24:33 +0800

45 lines

Re: Problem during strip dry film

Albert Mok <[log in to unmask]>

Sun, 11 Apr 1999 08:46:02 +0800

75 lines

Re: Problem during strip dry film

Nelson, John <[log in to unmask]>

Sat, 10 Apr 1999 10:27:27 -0400

58 lines

Re: Problem during strip dry film

[log in to unmask] <[log in to unmask]>

Mon, 12 Apr 1999 13:00:32 -0400

27 lines

Re: Problem during strip dry film

<Rudy Sedlak> <[log in to unmask]>

Tue, 13 Apr 1999 10:11:51 EDT

44 lines

New Thread

protective films

protective films

Marco Biagtan <[log in to unmask]>

Thu, 8 Apr 1999 15:42:18 +0800

40 lines

New Thread

Prototype board for BGA's

Prototype board for BGA's

Raymond Klein <[log in to unmask]>

Mon, 26 Apr 1999 14:03:15 -0700

30 lines

New Thread

PWB: Kapton or similar process

PWB: Kapton or similar process

Rich Everman <[log in to unmask]>

Fri, 9 Apr 1999 15:01:07 -0500

45 lines

New Thread

Quad 100

Quad 100

West, Jim <[log in to unmask]>

Wed, 14 Apr 1999 12:53:22 -0400

37 lines

Re: Quad 100

Horizon Productions/Guy Luempert <[log in to unmask]>

Thu, 15 Apr 1999 12:01:22 -0500

64 lines

New Thread

Question from customer

Question from customer

Nick Nicolaides <[log in to unmask]>

Thu, 29 Apr 1999 08:10:43 -0400

23 lines

Re: Question from customer

Smith, Ed <[log in to unmask]>

Thu, 29 Apr 1999 07:12:34 -0500

58 lines

Re: Question from customer

Thomas DeSmit <[log in to unmask]>

Thu, 29 Apr 1999 07:26:33 -0500

118 lines

Re: Question from customer

Phil Crepeau <[log in to unmask]>

Thu, 29 Apr 1999 07:17:11 -0700

53 lines

Re: Question from customer

Art Fisher <[log in to unmask]>

Thu, 29 Apr 1999 10:24:52 -0500

83 lines

Re: Question from customer

Barmuta, Mike <[log in to unmask]>

Thu, 29 Apr 1999 08:24:29 -0700

69 lines

Re: Question from customer

Bill Davis <[log in to unmask]>

Thu, 29 Apr 1999 10:12:29 -0700

67 lines

New Thread

Question from customer - Dichloromethane

Re: Question from customer - Dichloromethane

Martin Farrell 4419 <[log in to unmask]>

Thu, 29 Apr 1999 14:03:36 +0000

28 lines

New Thread

Question: Problems in BGA assembly process...

Question: Problems in BGA assembly process...

[log in to unmask]

Wed, 7 Apr 1999 11:03:27 +0800

39 lines

New Thread

Question: Problems in BGA assembly process... <IPC TN>

Re: Question: Problems in BGA assembly process... <IPC TN>

Alderete, Michael <[log in to unmask]>

Wed, 7 Apr 1999 06:37:50 -0700

127 lines

New Thread

RE(3): [TN] Black Ni/Au pads

Re: RE(3): [TN] Black Ni/Au pads

Phillip E Hinton <[log in to unmask]>

Fri, 2 Apr 1999 12:54:17 EST

39 lines

New Thread

Re-entrant flow simulation

Re-entrant flow simulation

Feodor Gurvits <[log in to unmask]>

Tue, 27 Apr 1999 23:59:42 +0200

71 lines

New Thread

Recommendations on a Versatile Microsectioning System?

Recommendations on a Versatile Microsectioning System?

Hinners, Hans - LYPME <[log in to unmask]>

Fri, 30 Apr 1999 08:18:29 -0400

48 lines

Re: Recommendations on a Versatile Microsectioning System?

[log in to unmask]

Fri, 30 Apr 1999 13:59:48 EDT

36 lines

Re: Recommendations on a Versatile Microsectioning System?

Maguire, James F <[log in to unmask]>

Fri, 30 Apr 1999 10:58:05 -0700

85 lines

New Thread

reflow solder defect

reflow solder defect

Lustig, Steven K.. <[log in to unmask]>

Thu, 29 Apr 1999 16:38:16 -0500

48 lines

New Thread

Reflowing ceramic boards.

Reflowing ceramic boards.

<Charles Barker> <[log in to unmask]>

Tue, 20 Apr 1999 21:09:49 -0500

33 lines

Re: Reflowing ceramic boards.

Wade Oberle <[log in to unmask]>

Wed, 21 Apr 1999 07:57:24 -0500

74 lines

New Thread

ReGold

ReGold

Digest James H Moffitt <[log in to unmask]>

Tue, 6 Apr 1999 17:46:24 EDT

34 lines

New Thread

Repair's Adverse Effect

Repair's Adverse Effect

Paul Klasek <[log in to unmask]>

Thu, 8 Apr 1999 09:47:35 +1000

47 lines

Re: Repair's Adverse Effect

Werner Engelmaier <[log in to unmask]>

Wed, 7 Apr 1999 22:18:15 EDT

36 lines

Re: Repair's Adverse Effect

Stephen R. Gregory <[log in to unmask]>

Thu, 8 Apr 1999 14:36:43 EDT

123 lines

Re: Repair's Adverse Effect

Paul Klasek <[log in to unmask]>

Wed, 7 Apr 1999 22:02:45 -0700

93 lines

Repair's Adverse Effect

Paul Klasek <[log in to unmask]>

Sun, 18 Apr 1999 16:43:00 -0700

50 lines

New Thread

Revision change costs

Revision change costs

[log in to unmask]

Thu, 29 Apr 1999 16:33:36 -0800

26 lines

Re: Revision change costs

Sandra Davis <[log in to unmask]>

Thu, 29 Apr 1999 17:13:06 -0700

66 lines

Re: Revision change costs

Albert Mok <[log in to unmask]>

Fri, 30 Apr 1999 09:21:01 +0800

66 lines

Re: Revision change costs

KK Chin <[log in to unmask]>

Thu, 29 Apr 1999 19:20:10 -0700

85 lines

Re: Revision change costs

Matthew Lamkin <[log in to unmask]>

Fri, 30 Apr 1999 11:16:47 +0100

121 lines

Re: Revision change costs

Art Fisher <[log in to unmask]>

Fri, 30 Apr 1999 07:47:28 -0500

63 lines

Re: Revision change costs

Wolfe, Robert <[log in to unmask]>

Fri, 30 Apr 1999 11:31:27 -0400

94 lines

New Thread

Rework technology inquiry

Rework technology inquiry

Doug Shawver <[log in to unmask]>

Mon, 26 Apr 1999 16:57:27 -0400

32 lines

Re: Rework technology inquiry

Stephen R. Gregory <[log in to unmask]>

Tue, 27 Apr 1999 16:43:51 EDT

81 lines

Re: Rework technology inquiry

Fred S. Shubert <[log in to unmask]>

Tue, 27 Apr 1999 17:13:42 -0400

58 lines

Re: Rework technology inquiry

Vertefeuille, Russ (AZ77) <[log in to unmask]>

Tue, 27 Apr 1999 11:47:32 -0700

63 lines

New Thread

Salary Survey for PCB Designers

Salary Survey for PCB Designers

Brian Gaynor <[log in to unmask]>

Tue, 13 Apr 1999 09:58:37 +0100

25 lines

Re: Salary Survey for PCB Designers

Gary Ferrari <[log in to unmask]>

Tue, 13 Apr 1999 10:23:24 EDT

34 lines

New Thread

Samurai

Samurai

Tom Colton <[log in to unmask]>

Wed, 7 Apr 1999 09:44:18 -0400

41 lines

Re: Samurai

Tom Colton <[log in to unmask]>

Wed, 7 Apr 1999 15:32:53 -0400

83 lines

Re: Samurai

Terry Zhu <[log in to unmask]>

Wed, 7 Apr 1999 20:00:38 +0100

40 lines

Re: Samurai

Chuck Brummer <[log in to unmask]>

Wed, 7 Apr 1999 08:23:52 -0700

64 lines

New Thread

SBU

SBU

franco vezzoli <[log in to unmask]>

Thu, 29 Apr 1999 07:54:10 +0200

28 lines

New Thread

selecting coatings

selecting coatings

Lustig, Steven K.. <[log in to unmask]>

Thu, 8 Apr 1999 18:44:43 -0400

40 lines

Re: selecting coatings

Graham Naisbitt <[log in to unmask]>

Sun, 11 Apr 1999 15:50:43 +0100

87 lines

New Thread

Selective negative etchback on a 10 layer board

Selective negative etchback on a 10 layer board

Hinners, Hans - LYPME <[log in to unmask]>

Tue, 20 Apr 1999 14:15:40 -0400

58 lines

Re: Selective negative etchback on a 10 layer board

Fred Johnson <[log in to unmask]>

Wed, 21 Apr 1999 15:42:27 +0100

100 lines

Re: Selective negative etchback on a 10 layer board

Joe Dickson <[log in to unmask]>

Wed, 21 Apr 1999 10:32:32 PST

95 lines

Re: Selective negative etchback on a 10 layer board

Hinners, Hans - LYPME <[log in to unmask]>

Fri, 23 Apr 1999 17:03:43 -0400

65 lines

New Thread

Sensby Conveyors

Re: Sensby Conveyors

[log in to unmask]

Thu, 8 Apr 1999 14:34:49 -0500

42 lines

New Thread

Sensby Conveyors.

Sensby Conveyors.

Mark Austin <[log in to unmask]>

Thu, 8 Apr 1999 15:06:00 +0100

43 lines

Re: Sensby Conveyors.

Ken Morrison <[log in to unmask]>

Thu, 8 Apr 1999 14:03:19 -0400

77 lines

Re: Sensby Conveyors.

Daniel Woon <[log in to unmask]>

Fri, 9 Apr 1999 09:34:25 +0800

80 lines

New Thread

Sensby Conveyors. -Reply

Sensby Conveyors. -Reply

Chris Murphy <[log in to unmask]>

Fri, 9 Apr 1999 08:04:53 +1200

28 lines

New Thread

shadowing of SMD in wave solder

Re: shadowing of SMD in wave solder

Steve R Mikell <[log in to unmask]>

Thu, 1 Apr 1999 11:04:00 -0600

64 lines

New Thread

SMT Chip Resistors

SMT Chip Resistors

Kent S. Asmus <[log in to unmask]>

Sat, 17 Apr 1999 11:44:43 -0700

42 lines

Re: SMT Chip Resistors

David D Hillman <[log in to unmask]>

Tue, 20 Apr 1999 22:51:22 -0500

84 lines

New Thread

SMT Component Fall Out Rate

SMT Component Fall Out Rate

Access Control <[log in to unmask]>

Tue, 6 Apr 1999 11:19:22 PDT

32 lines

Re: SMT Component Fall Out Rate

Ashok Tiwari <[log in to unmask]>

Tue, 6 Apr 1999 17:11:42 -0700

63 lines

Re: SMT Component Fall Out Rate

Stephen R. Gregory <[log in to unmask]>

Wed, 7 Apr 1999 10:47:09 EDT

62 lines

New Thread

Sn/Ag Solder

Sn/Ag Solder

Bill Gilman <[log in to unmask]>

Tue, 13 Apr 1999 10:53:25 -0400

76 lines

Re: Sn/Ag Solder

VanDeWal, Brian [AMSTA-AR-CCB-DD] <[log in to unmask]>

Tue, 13 Apr 1999 11:15:07 -0400

34 lines

Re: Sn/Ag Solder

Guenter Grossmann <[log in to unmask]>

Wed, 14 Apr 1999 08:54:03 +0200

51 lines

Re: Sn/Ag Solder

Guenter Grossmann <[log in to unmask]>

Wed, 14 Apr 1999 10:25:49 +0200

46 lines

Re: Sn/Ag Solder

[log in to unmask]

Fri, 16 Apr 1999 19:27:15 EDT

59 lines

New Thread

SNEC April meeting notice

SNEC April meeting notice

Gary Ferrari <[log in to unmask]>

Fri, 9 Apr 1999 16:52:40 EDT

64 lines

New Thread

SNEC mtg notice

SNEC mtg notice

Gary Ferrari <[log in to unmask]>

Mon, 12 Apr 1999 12:14:25 EDT

63 lines

New Thread

Solder filled vias

Solder filled vias

Nick Nicolaides <[log in to unmask]>

Mon, 5 Apr 1999 17:16:20 -0400

30 lines

Solder filled vias

Jeff Hempton <[log in to unmask]>

Mon, 5 Apr 1999 16:57:38 -0500

62 lines

Re: Solder filled vias

Werner Engelmaier <[log in to unmask]>

Mon, 5 Apr 1999 17:57:41 EDT

39 lines

New Thread

Solder Mask Adhesion (Tape test)

Solder Mask Adhesion (Tape test)

Babis Papadias <[log in to unmask]>

Wed, 14 Apr 1999 10:49:07 +0300

35 lines

Re: Solder Mask Adhesion (Tape test)

Albert Mok <[log in to unmask]>

Wed, 14 Apr 1999 19:03:37 +0800

65 lines

Re: Solder Mask Adhesion (Tape test)

KK Chin <[log in to unmask]>

Wed, 14 Apr 1999 09:17:54 -0700

76 lines

New Thread

Solderability Testing

Solderability Testing

David D Hillman <[log in to unmask]>

Wed, 7 Apr 1999 12:14:30 -0500

41 lines

Re: Solderability Testing

Gabriela Bogdan <[log in to unmask]>

Thu, 8 Apr 1999 03:35:39 +0300

77 lines

Re: Solderability Testing

joyce <[log in to unmask]>

Wed, 14 Apr 1999 18:42:27 -0400

64 lines

New Thread

SOLDERING A CAP

SOLDERING A CAP

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 26 Apr 1999 07:29:00 -0500

35 lines

New Thread

Soldering Book Wanted

Soldering Book Wanted

Bob Willis <[log in to unmask]>

Thu, 22 Apr 1999 15:04:43 +0100

47 lines

New Thread

soldering Connector

soldering Connector

Wade Oberle <[log in to unmask]>

Wed, 7 Apr 1999 15:18:11 -0500

38 lines

Re: soldering Connector

Rupert, Martha L. <[log in to unmask]>

Thu, 8 Apr 1999 08:28:46 -0400

84 lines

Re: soldering Connector

McMonagle, Michael R. <[log in to unmask]>

Thu, 8 Apr 1999 08:44:20 -0500

82 lines

Re: soldering Connector

Werner Engelmaier <[log in to unmask]>

Thu, 8 Apr 1999 13:38:58 EDT

39 lines

Re: soldering Connector

Energy Technology Systems <[log in to unmask]>

Fri, 9 Apr 1999 09:38:40 -0700

66 lines

Re: soldering Connector

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 12 Apr 1999 08:19:00 -0500

27 lines

New Thread

Soldering Paladium-Silver-Platinum terminations

Re: Soldering Paladium-Silver-Platinum terminations

Guenter Grossmann <[log in to unmask]>

Thu, 1 Apr 1999 09:14:02 +0200

46 lines

Re: Soldering Paladium-Silver-Platinum terminations

[log in to unmask]

Wed, 31 Mar 1999 17:44:31 EST

58 lines

New Thread

Soldering straddle mount connectors and other stuff...

Re: Soldering straddle mount connectors and other stuff...

Stephen R. Gregory <[log in to unmask]>

Thu, 8 Apr 1999 12:47:35 EDT

88 lines

Re: Soldering straddle mount connectors and other stuff...

Stephen R. Gregory <[log in to unmask]>

Fri, 9 Apr 1999 13:52:03 EDT

64 lines

New Thread

Soldering to Brass

Soldering to Brass

Severson, Scott M. <[log in to unmask]>

Wed, 28 Apr 1999 07:29:19 -0500

45 lines

New Thread

Soldermask off-rework options

Soldermask off-rework options

glenn pelkey <[log in to unmask]>

Wed, 14 Apr 1999 17:29:16 PDT

47 lines

Re: Soldermask off-rework options

[log in to unmask]

Thu, 15 Apr 1999 08:30:00 -0600

90 lines

Re: Soldermask off-rework options

Roger Deakin <[log in to unmask]>

Thu, 15 Apr 1999 13:07:46 +0100

112 lines

Re: Soldermask off-rework options

Anil Kher <[log in to unmask]>

Thu, 29 Apr 1999 14:54:36 +0530

141 lines

New Thread

Something off-topic...

Something off-topic...

Stephen R. Gregory <[log in to unmask]>

Wed, 14 Apr 1999 20:58:20 EDT

91 lines

New Thread

Sources for Rigid/Flex circuits

Sources for Rigid/Flex circuits

<Charles Barker> <[log in to unmask]>

Thu, 22 Apr 1999 14:28:21 -0500

40 lines

Re: Sources for Rigid/Flex circuits

McMonagle, Michael R. <[log in to unmask]>

Thu, 22 Apr 1999 15:15:17 -0500

78 lines

New Thread

SPC

SPC

Tempea, Ioan <[log in to unmask]>

Tue, 27 Apr 1999 08:19:48 -0400

33 lines

Re: SPC

Rob Watson <[log in to unmask]>

Tue, 27 Apr 1999 09:37:47 -0400

62 lines

New Thread

Specifying DIFFERENTIAL Impedance

Re: Specifying DIFFERENTIAL Impedance

Jack Olson <[log in to unmask]>

Thu, 8 Apr 1999 09:16:58 -0700

98 lines

Re: Specifying DIFFERENTIAL Impedance

Joe Dickson <[log in to unmask]>

Thu, 8 Apr 1999 09:43:36 PST

131 lines

Re: Specifying DIFFERENTIAL Impedance

Peterson, Gary D <[log in to unmask]>

Thu, 8 Apr 1999 10:43:51 -0600

134 lines

Re: Specifying DIFFERENTIAL Impedance

Mcmaster, Michael <[log in to unmask]>

Thu, 8 Apr 1999 14:31:59 -0700

169 lines

New Thread

Stain in Palladium based DPS

Stain in Palladium based DPS

franco vezzoli <[log in to unmask]>

Fri, 30 Apr 1999 07:42:07 +0200

38 lines

Re: Stain in Palladium based DPS

Albert Mok <[log in to unmask]>

Fri, 30 Apr 1999 15:54:03 +0800

73 lines

New Thread

Stop sending e-mail

Stop sending e-mail

Ronney M. Lo <[log in to unmask]>

Wed, 7 Apr 1999 07:42:50 -0600

27 lines

New Thread

Subcribe

Subcribe

[log in to unmask]

Mon, 26 Apr 1999 10:40:35 EDT

26 lines

New Thread

SUBSCRIBE

SUBSCRIBE

Phil Hennigan - Jacksonville <[log in to unmask]>

Wed, 21 Apr 1999 08:22:09 -0400

26 lines

subscribe

John Price <[log in to unmask]>

Wed, 28 Apr 1999 10:20:39 +0000

52 lines

New Thread

subscribe technet

subscribe technet

Keel, Mike <[log in to unmask]>

Tue, 27 Apr 1999 08:48:50 -0700

21 lines

New Thread

Substrate X-OUT

Substrate X-OUT

Wentworth <[log in to unmask]>

Thu, 22 Apr 1999 22:21:48 +0800

38 lines

New Thread

Substrates / Tooling Charges

Substrates / Tooling Charges

Wentworth <[log in to unmask]>

Sat, 10 Apr 1999 21:38:25 +0800

33 lines

New Thread

Switching power supply

Switching power supply

Albert Mok <[log in to unmask]>

Tue, 27 Apr 1999 15:58:59 +0800

25 lines

Re: Switching power supply

<Joseph M. Webb> <[log in to unmask]>

Tue, 27 Apr 1999 07:56:36 -0400

27 lines

New Thread

test-phenom

test-phenom

Robert McGarry <[log in to unmask]>

Tue, 6 Apr 1999 12:39:22 -0400

44 lines

Re: test-phenom

Mcmaster, Michael <[log in to unmask]>

Tue, 6 Apr 1999 10:43:16 -0700

110 lines

Re: test-phenom

Phil Crepeau <[log in to unmask]>

Tue, 6 Apr 1999 10:52:56 -0700

74 lines

New Thread

Thanks! (was RE: [TN] Chemical Testing Service in Georgia USA?)

Thanks! (was RE: [TN] Chemical Testing Service in Georgia USA?)

Hinners, Hans - LYPME <[log in to unmask]>

Wed, 7 Apr 1999 13:34:04 -0400

45 lines

New Thread

Theda Service Bureau

Theda Service Bureau

<James Schey> <[log in to unmask]>

Tue, 20 Apr 1999 17:32:26 -0400

36 lines

New Thread

Thermocouple Attachment Methods

Thermocouple Attachment Methods

McMonagle, Michael R. <[log in to unmask]>

Fri, 16 Apr 1999 10:42:45 -0500

81 lines

Re: Thermocouple Attachment Methods

Greg Jones <[log in to unmask]>

Thu, 22 Apr 1999 08:38:58 -0700

121 lines

Re: Thermocouple Attachment Methods

David Whalley <[log in to unmask]>

Fri, 23 Apr 1999 09:54:12 +0100

82 lines

Re: Thermocouple Attachment Methods

Phil Bavaro <[log in to unmask]>

Fri, 23 Apr 1999 12:13:55 -0700

83 lines

New Thread

Thermocouple welders

Thermocouple welders

<Charles Barker> <[log in to unmask]>

Fri, 23 Apr 1999 15:45:48 -0500

27 lines

New Thread

Thermocouples on Hard Drives

Thermocouples on Hard Drives

Sandra Davis <[log in to unmask]>

Thu, 15 Apr 1999 17:44:42 -0700

48 lines

Re: Thermocouples on Hard Drives

joyce <[log in to unmask]>

Fri, 16 Apr 1999 06:16:36 -0400

66 lines

Re: Thermocouples on Hard Drives

Bruce Adams <[log in to unmask]>

Fri, 16 Apr 1999 04:43:30 -0700

87 lines

Re: Thermocouples on Hard Drives

Sandra Davis <[log in to unmask]>

Fri, 16 Apr 1999 14:55:13 -0700

42 lines

Re: Thermocouples on Hard Drives

Smith Russell MSM LAPO US <[log in to unmask]>

Tue, 20 Apr 1999 03:14:00 +0200

142 lines

New Thread

Tin stripper on line recycle

Tin stripper on line recycle

Albert Mok <[log in to unmask]>

Sat, 17 Apr 1999 18:00:12 +0800

35 lines

Re: Tin stripper on line recycle

<Rudy Sedlak> <[log in to unmask]>

Sun, 18 Apr 1999 10:22:04 EDT

53 lines

Re: Tin stripper on line recycle

David Whalley <[log in to unmask]>

Mon, 19 Apr 1999 11:55:22 +0100

62 lines

New Thread

Titanium Lead Cropping Plates

Titanium Lead Cropping Plates

Mark Austin <[log in to unmask]>

Thu, 29 Apr 1999 08:51:00 +0100

42 lines

New Thread

Traces

Traces

Art Fisher <[log in to unmask]>

Tue, 27 Apr 1999 14:08:39 -0500

24 lines

Re: Traces

Bryan Kerr <[log in to unmask]>

Tue, 27 Apr 1999 20:47:10 +0100

55 lines

Re: Traces

[log in to unmask]

Tue, 27 Apr 1999 16:25:56 EDT

28 lines

Re: Traces

Art Fisher <[log in to unmask]>

Tue, 27 Apr 1999 17:00:24 -0500

54 lines

Re: Traces

Edwards, Ted A (AZ75) <[log in to unmask]>

Tue, 27 Apr 1999 15:34:47 -0700

81 lines

Re: Traces

Werner Engelmaier <[log in to unmask]>

Tue, 27 Apr 1999 16:32:46 EDT

36 lines

New Thread

Type of files required for Test Fixtures.

Type of files required for Test Fixtures.

Ken Patel <[log in to unmask]>

Mon, 12 Apr 1999 15:32:39 -0700

29 lines

Re: Type of files required for Test Fixtures.

Robert D. Green <[log in to unmask]>

Wed, 14 Apr 1999 08:59:30 -0400

84 lines

New Thread

URGENT !!! San Diego Update!!!

URGENT !!! San Diego Update!!!

Raymond Aguilar <[log in to unmask]>

Wed, 7 Apr 1999 20:43:47 -0700

159 lines

New Thread

US IRS and ODX-TAX

US IRS and ODX-TAX

Fujikura Ltd. <[log in to unmask]>

Thu, 1 Apr 1999 14:32:37 +0900

31 lines

New Thread

Use of CAM350

Use of CAM350

Matthew Lamkin <[log in to unmask]>

Thu, 1 Apr 1999 09:09:10 +0100

65 lines

New Thread

V-Tek Tape and Reel Machines...

V-Tek Tape and Reel Machines...

Stephen R. Gregory <[log in to unmask]>

Thu, 22 Apr 1999 14:01:02 EDT

72 lines

New Thread

Vibratory Feeders

Vibratory Feeders

Tempea, Ioan <[log in to unmask]>

Fri, 23 Apr 1999 11:55:39 -0400

31 lines

Re: Vibratory Feeders

McMonagle, Michael R. <[log in to unmask]>

Fri, 23 Apr 1999 11:15:39 -0500

66 lines

Re: Vibratory Feeders

Phillip E Hinton <[log in to unmask]>

Fri, 23 Apr 1999 18:11:49 EDT

28 lines

New Thread

VME 64X

VME 64X

Robert Vanech <[log in to unmask]>

Wed, 14 Apr 1999 15:11:54 +0000

27 lines

New Thread

Wage and Salary

Wage and Salary

[log in to unmask]

Wed, 7 Apr 1999 09:59:52 EDT

34 lines

Re: Wage and Salary

Kenny Bloomquist <[log in to unmask]>

Wed, 7 Apr 1999 08:56:40 -0700

29 lines

Re: Wage and Salary

Jerry Cupples <[log in to unmask]>

Wed, 7 Apr 1999 11:37:31 -0500

58 lines

New Thread

Warp and Twist

Warp and Twist

Richard Hamilton <[log in to unmask]>

Thu, 1 Apr 1999 12:45:03 -0700

54 lines

New Thread

Water

Water

franco vezzoli <[log in to unmask]>

Tue, 20 Apr 1999 18:03:48 +0200

33 lines

Re: Water

Ted Stern <[log in to unmask]>

Tue, 20 Apr 1999 12:44:18 -0700

52 lines

New Thread

Wave Solder Ventilation

Wave Solder Ventilation

Alan Kreplick <[log in to unmask]>

Thu, 1 Apr 1999 13:30:16 -0500

41 lines

New Thread

weekcode

weekcode

Albert Mok <[log in to unmask]>

Tue, 6 Apr 1999 14:31:13 +0800

32 lines

Re: weekcode

Albert Mok <[log in to unmask]>

Tue, 6 Apr 1999 21:18:31 +0800

75 lines

Re: weekcode

Mcmaster, Michael <[log in to unmask]>

Tue, 6 Apr 1999 08:44:04 -0700

122 lines

Re: weekcode

Richard Hamilton <[log in to unmask]>

Tue, 6 Apr 1999 08:50:18 -0700

148 lines

Re: weekcode

Tracy Black <[log in to unmask]>

Tue, 6 Apr 1999 11:39:32 -0700

167 lines

Re: weekcode

Ahne Oosterhof <[log in to unmask]>

Tue, 6 Apr 1999 11:58:43 -0700

136 lines

New Thread

Wire Bond, in over in our heads

Re: Wire Bond, in over in our heads

[log in to unmask]

Wed, 7 Apr 1999 12:51:49 +0200

144 lines

New Thread

Wire Bonding On Gold

Wire Bonding On Gold

Chuck Garth <[log in to unmask]>

Tue, 20 Apr 1999 06:29:01 EDT

28 lines

Re: Wire Bonding On Gold

David D Hillman <[log in to unmask]>

Tue, 20 Apr 1999 23:57:04 -0500

73 lines

Re: Wire Bonding On Gold

joyce <[log in to unmask]>

Wed, 21 Apr 1999 05:33:58 -0400

63 lines

Re: Wire Bonding On Gold

[log in to unmask]

Wed, 21 Apr 1999 11:45:15 +0200

109 lines

Re: Wire Bonding On Gold

Andy Slade <[log in to unmask]>

Wed, 21 Apr 1999 08:06:59 -0400

66 lines

Re: Wire Bonding On Gold

David Jandzinski <[log in to unmask]>

Wed, 21 Apr 1999 07:55:59 -0700

143 lines

Re: Wire Bonding On Gold

joyce <[log in to unmask]>

Wed, 21 Apr 1999 19:19:13 -0400

210 lines

New Thread

[CHIPNET] Metal Polyimide Adhesion

Re: [CHIPNET] Metal Polyimide Adhesion

Alderete, Michael <[log in to unmask]>

Tue, 20 Apr 1999 08:04:12 -0700

90 lines

New Thread

[TN] Black Ni/Au pads

RE(3): [TN] Black Ni/Au pads

Paul Wilson <[log in to unmask]>

Thu, 1 Apr 1999 11:11:08 -0500

83 lines

New Thread

[TN] Blind Via Adhesion

Re[2]: [TN] Blind Via Adhesion

Andy Slade <[log in to unmask]>

Mon, 26 Apr 1999 07:34:35 -0400

124 lines

New Thread

[TN] Electrolytic plating on isolated areas or an alt

Re[2]: [TN] Electrolytic plating on isolated areas or an alt

Andy Slade <[log in to unmask]>

Wed, 21 Apr 1999 07:37:55 -0400

95 lines

New Thread

[TN] Specifying DIFFERENTIAL Impedance

Re[2]: [TN] Specifying DIFFERENTIAL Impedance

Andy Slade <[log in to unmask]>

Thu, 8 Apr 1999 13:22:37 -0400

144 lines

New Thread

[TN] weekcode

Re[2]: [TN] weekcode

Thomas N. Bresnan <[log in to unmask]>

Tue, 6 Apr 1999 11:20:44 -0400

101 lines

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