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January 1999


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Table of Contents:

ÄTNÅ Dye Penetration Testing of BGA solder joints (1 message)
ÄTNÅ Materials qualification (SIR, copper mirror test,...) (1 message)
#2 White layer on PCB after wave solder (2 messages)
(no subject) (3 messages)
356 netlists (2 messages)
: Pink Ring (3 messages)
<No subject> (7 messages)
Accordian Metalized Film Capacitors (1 message)
Adapter from SSOP-20 to DIP20 (1 message)
Addendum to previous Enquiry (1 message)
Adhesive/sealant applicator (3 messages)
Analytical Labs (2 messages)
ANSI/EIA-481 (1 message)
ANSI/J-STD-004 (2 messages)
AOI INSPECTION (2 messages)
Ass'y (1 message)
Assembly Inquiry (1 message)
Assy: I CAN Rework this BGA Socket! (9 messages)
Assy: Is it possible to rework a BGA socket? (3 messages)
Assy: Source for Gold Plating Solution (8 messages)
Assy: STEVE CAN Rework this BGA Socket !!! (2 messages)
assy:AVX low inductance multila (1 message)
assy:AVX low inductance multilayer capacitors (2 messages)
Assy:Through-hole Solder Preforms... (8 messages)
Attaching heatsinks to IC's (1 message)
AW: [TN] Pips on plastic Surface Mount connectors (1 message)
Baking PCB With OSP Finish (3 messages)
Bare PWB Packaging (3 messages)
BGA and profiling (6 messages)
BGA clean checking (4 messages)
BGA Rework (2 messages)
BGA Substrate (4 messages)
BGA's with Adhesives (1 message)
BGAs on both sides of a PCB (4 messages)
BGAs on both sides of a PCB -Reply (1 message)
Bowed Boards (6 messages)
Brightness of Ni/Au plated surface (1 message)
Burn-IN (2 messages)
Call for papers (2 messages)
Centistokes to centipoise (4 messages)
Check out CCA Surface Finishes Workshop (1 message)
Circuit Board Company for Sale (1 message)
Cleaning of mis-printed boards (3 messages)
Cleaning Options per J-STD-001B (1 message)
COILS (5 messages)
Component Solderability Testing (2 messages)
Componentry Convention (1 message)
Components (2 messages)
confirm (1 message)
contact info (3 messages)
Contact Reliability > Steam Test ? (1 message)
conversion (6 messages)
Correlating QCTC specimens to Specific Tests (2 messages)
CSPs assembly for Via In Pad (1 message)
CTE of FR4 and other materials (1 message)
cu flakes in blind via holes (2 messages)
Design considerations for No-Clean processes (12 messages)
Design considerations for No-Clean processes -Reply (1 message)
Design Help (2 messages)
destaticising p/carbon . (4 messages)
Dewetting on NiAu (3 messages)
Did anyone measure Dk of PCB laminate at Ghz ? (1 message)
Does anybody know what FR4-6, FR4-4 mean? (2 messages)
Don't panic! Someone made a mistake. (2 messages)
Double side reflow (1 message)
Double Sided Surface Mount (3 messages)
double sided, mixed media boards (4 messages)
Drawing Notes for Controlled Impedance (2 messages)
Dummy BGA boards (1 message)
Dye Penetration Testing of BGA solder joints (5 messages)
Electroplated copper composition (2 messages)
Experience with No Clean Paste and No Clean Flux (3 messages)
Experience with No Clean Paste and No Clean Flux -Reply (1 message)
Fab: Panel Racks (2 messages)
FAB: Solder Filled Thermal Vias (9 messages)
fabrication process specification (1 message)
Fastek parts (1 message)
Flat Ribbon "L" and Gull Wing Lead Inspection (2 messages)
FTIR Systems (1 message)
FW: Assy: Is it possible to rework a BGA socket? (1 message)
Fw: Help for using software "awake10" (1 message)
FW: [TN] Dye Penetration Testing of BGA solder joints (1 message)
FW: [TN] MPM solder Paste dryness and cartridge dispenser (1 message)
FW: [TN] Peretti (1 message)
FW: [TN] PHOSPHORIC ACID ANODIZE (1 message)
Galvanic effects (2 messages)
Getek board (3 messages)
Gold Flash Spec for PCB? (3 messages)
Gold Immersion at Wave Solder (2 messages)
Gold Immersion at Wave Solder -Reply (1 message)
Greater Boston IPC/DC Chapter Meeting, 12-Jan (1 message)
Halogen-free base materials (1 message)
Halogen-Free Epoxy Resins (2 messages)
HAST (2 messages)
HELP with use of URALANE 7760 with SMT (1 message)
High Current PCB (4 messages)
High Temp Reflow on 63/37 Solder joints (1 message)
Hollis Future I (1 message)
Hull Cell Stress Analysis (2 messages)
IMAPS/SMTA Rocky Mountain Chapter Seminar 1/21/99 (1 message)
Immersion tin (1 message)
immersion white tin finish (13 messages)
immersion white tin finish -Reply (2 messages)
immersion white tin finish -Reply -Reply (1 message)
IN CIRCUIT TEST (5 messages)
Injection molded casing (2 messages)
IONIC Contam Specs (3 messages)
IPC 1710 (3 messages)
IPC National Conference on Flex Circuits - Call For Papers (1 message)
IPC netlists: -356 or 356A? (2 messages)
IPC SIR Specs (2 messages)
IPC SPEC CONFORMANCE TESTING (1 message)
IPC vs. JIS (1 message)
IPC's J-STD-001 Training and Certification Program (1 message)
IPC's Wave Solder training video (2 messages)
IPC-2221 and 2222 (2 messages)
IPC-AJ-820 (April 1997)Assembly and Joining Handbook (1 message)
JS100 variable capacitor (2 messages)
Kapton Etcing (1 message)
Kleenox (1 message)
Laminate suppliers (2 messages)
Laser Cutting Equipment Recommendations Sought (3 messages)
Laser depanelization (7 messages)
laser related hardware F.S. (1 message)
Laser Singulation (1 message)
Lead Free Survey (2 messages)
Leaky Hybrid Circuits during Aqueous Cleaning (4 messages)
LittleFuse Components (3 messages)
LLTC Testing for Micro-vias (3 messages)
Long Term Effects on soldered joints (3 messages)
Looking for Jared Lang (1 message)
Looking for Ray Iannuzzelli, formerly employed at Digita l Equipment Corporation (1 message)
Looking for Ray Iannuzzelli, formerly employed at Digital Equipment Corporation (1 message)
looking for specs (2 messages)
Looking for: Custom BGA and LTCC (2 messages)
LTCCs with buried caps & res (2 messages)
Manufacturing Software (3 messages)
Material Callout (4 messages)
Material Supplier (1 message)
Materials qualification (SIR, copper mirror test,...) (1 message)
Methods for Stiffening a PWB (10 messages)
Micro-strip and Controlled Impedance (7 messages)
MPM solder Paste dryness and cartridge dispenser (6 messages)
MTG: Powering Digital Boards - Distribution and Performance (1 message)
Muromoto AirTools (1 message)
NE Ohio Desigers Council Feb 3 Meeting (1 message)
Need info on reeled smd component counters (3 messages)
Need to obtain the best PWB manufacturer... (3 messages)
NEPCON / Legends of the TechNet (1 message)
NEPCON Get-Together (1 message)
NEPCON? (7 messages)
New Exam Date: Designer Certification (1 message)
Ni-Fe alloy plating solution (1 message)
Nickel-Gold problem (1 message)
No Clean Process (1 message)
NOTICE: Annual Meeting of the PNW Chapter of the IPC Designers Council (1 message)
Obsolete Varactor Diodes (4 messages)
One more thing on Double side reflow (2 messages)
Orange Rust around solder joints (3 messages)
ORC Exposure Machine (1 message)
Orietation of DIP IC for Solder Wave (5 messages)
Packages (4 messages)
Palladium underplate for Cu-Ni-Au system (2 messages)
Panasonic MV100 problems? (1 message)
Parts for Amistar CI3000 (2 messages)
PCB defect (2 messages)
PCB Design Vacancy (1 message)
pcb makers in Japan (1 message)
PCB Vendors (UC) (1 message)
PCB Warping Estimate (2 messages)
Peretti from Neopost Industrie (1 message)
PHOSPHORIC ACID ANODIZE (1 message)
Photoresist stripping chemicals (3 messages)
pinholes (8 messages)
Pips on plastic Surface Mount connectors (1 message)
Plating of laser drilled vias (8 messages)
Porous copper deposits (2 messages)
Prepreg properties (2 messages)
Programmed parts in sockets (2 messages)
Programmed parts in sockets -Reply (1 message)
pull-test to QFP and BGA (3 messages)
Pulse Plating (3 messages)
PUMICE SCRUBBER (4 messages)
punchability measurement (1 message)
PWA Routing (2 messages)
PWB Trays - Who's your source? (1 message)
PWB Warping (7 messages)
Re-heats (3 messages)
Real Time X-Ray Services (1 message)
Reel Orientation Std (3 messages)
Reliability > Steam Test ? ; & destaticising p/carbon . (3 messages)
Reliability Software (1 message)
Removal of Lead (13 messages)
remove (1 message)
Repair knife (4 messages)
Re[2]: [TN] One more thing on Double side reflow (2 messages)
RF Materials (7 messages)
RF PCB Artwork? (1 message)
Rigid PWB, ICT probe pad air gap requirements (3 messages)
Rigid-Flex Assembly (1 message)
RO recycling system problems (1 message)
RS274X format out of Cadence Allegro (2 messages)
Schlumberger ATE For Sale. (1 message)
Screen for fine pitch parts (3 messages)
search for IPC micro via guidelines (2 messages)
seeking aluminum wedge bonding advice (4 messages)
Sequential lamination / Via Damming materials (2 messages)
SERA (4 messages)
Silk-Screen registration Spec/ Pad Contamination (2 messages)
Simulation before PCB manufacturing? (4 messages)
single process initiative (SPI) 55110 to 6012 (1 message)
Single sided flex (1 message)
slot drill (3 messages)
SMT land pattern standards? (7 messages)
SMT Machine Operator Training? (2 messages)
SMT v.s. Through hole trade studies (2 messages)
Software to simulate packing drop test (1 message)
SOIC solder joint integrity (3 messages)
Solder "movement" (2 messages)
Solder Filled Thermal Vias (3 messages)
Solder fountain devices and BGA/Fine pitch repair/rework stations (3 messages)
solder fountain process (1 message)
Solder Metallurgy (3 messages)
Solder Paste Application (4 messages)
Solder Wick Specification (1 message)
Solderability Testing (3 messages)
Soldering Bar Comsumption at wave solder machine?? (2 messages)
Soldering Question (3 messages)
Soldering SMT Tantalum (CWR09) Caps (3 messages)
Source Inspection Guidelines (1 message)
Stencil Cleaner (2 messages)
Stencil Control Procedure (1 message)
Stress Testing (3 messages)
subscribe (3 messages)
SV: [TN] AOI INSPECTION (1 message)
SV: [TN] PUMICE SCRUBBER (1 message)
Tackiness Tester (1 message)
Tarnished marks on crystals (5 messages)
TechNet (1 message)
test (1 message)
Testing (1 message)
Thermal Effects (2 messages)
Thermal vias in pads (4 messages)
Thermosonic ball bonding to .... silver? (6 messages)
Thickness of electroless copper from PTH (2 messages)
TO-92 spacing (1 message)
TO-92 spacing -Reply (1 message)
Trace cutting tool manufacturer (1 message)
Transistor TO-92 Orientation (2 messages)
Two up on panel (9 messages)
Update on IPC Printed Circuits Expo (1 message)
Using Mentor Graphics? (1 message)
VDE specfications (1 message)
Vision Inspection? (6 messages)
Wanted book name. (1 message)
Wanted: 3ft black light bulbs (1 message)
Wanted: 3ft black light bulbs. (2 messages)
warpage (1 message)
Water contents in no clean flux (12 messages)
White blistering on solder mask. (4 messages)
White layer on PCB after Wave Solder (1 message)
Why won't electroless copper plate on copper (4 messages)
wire bonding on silver, con't... (1 message)
Wrong orientation on Tantalum Cap. (2 messages)
X-ray Inspection System (1 message)
X-ray service (3 messages)
your mail (1 message)
Z-control (6 messages)
Z-wire installation and/or soldering (1 message)
Zero Margin PWB Assembly Depaneling (5 messages)
[Fwd: San Diego IPC Designers C (1 message)
[Fwd: San Diego IPC Designers Council Meeting] (3 messages)
[TN] Bowed Boards (1 message)
[TN] IN CIRCUIT TEST (1 message)
[TN] One more thing on Double side reflow (1 message)
[TN] ORC Exposure Machine (1 message)
[TN] slot drill (1 message)
[TN] Solder Metallurgy (1 message)
[TN] Wrong orientation on Tantalum Cap. (1 message)
[TN] Z-control (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

ÄTNÅ Dye Penetration Testing of BGA solder joints

RE: ÄTNÅ Dye Penetration Testing of BGA solder joints

Tegehall Per-Erik <[log in to unmask]>

Thu, 14 Jan 1999 09:15:01 +0100

86 lines

New Thread

ÄTNÅ Materials qualification (SIR, copper mirror test,...)

RE: ÄTNÅ Materials qualification (SIR, copper mirror test,...)

Tegehall Per-Erik <[log in to unmask]>

Tue, 26 Jan 1999 08:54:49 +0100

76 lines

New Thread

#2 White layer on PCB after wave solder

#2 White layer on PCB after wave solder

fawnec <[log in to unmask]>

Wed, 27 Jan 1999 11:14:46 -0500

30 lines

Re: #2 White layer on PCB after wave solder

Graham Naisbitt <[log in to unmask]>

Wed, 27 Jan 1999 18:45:39 -0000

81 lines

New Thread

(no subject)

(no subject)

Jerry Hoppke <[log in to unmask]>

Thu, 14 Jan 1999 17:24:21 -0600

34 lines

(no subject)

[log in to unmask]

Fri, 15 Jan 1999 10:22:00 EST

22 lines

(no subject)

[log in to unmask]

Sat, 16 Jan 1999 13:46:25 -0600

24 lines

New Thread

356 netlists

356 netlists

Doug Jeffery <[log in to unmask]>

Sat, 23 Jan 1999 12:21:03 -0600

42 lines

Re: 356 netlists

Test Engineering <[log in to unmask]>

Mon, 25 Jan 1999 07:14:54 -0500

43 lines

New Thread

: Pink Ring

: Pink Ring

Poh Kong Hui <[log in to unmask]>

Mon, 11 Jan 1999 19:40:12 +0800

27 lines

Re: : Pink Ring

Motoyo Wajima <[log in to unmask]>

Tue, 12 Jan 1999 14:54:00 +0900

81 lines

Re: : Pink Ring

Poh Kong Hui <[log in to unmask]>

Thu, 14 Jan 1999 22:20:17 +0800

110 lines

New Thread

<No subject>

<No subject>

Freitag, David <[log in to unmask]>

Wed, 6 Jan 1999 15:21:05 -0600

26 lines

<No subject>

Wade Oberle <[log in to unmask]>

Thu, 7 Jan 1999 07:27:27 -0600

58 lines

<No subject>

David D Hillman <[log in to unmask]>

Thu, 7 Jan 1999 08:40:06 -0600

65 lines

<No subject>

Black, Paul <[log in to unmask]>

Fri, 8 Jan 1999 08:48:14 -0500

21 lines

<No subject>

N Radhakrishna <[log in to unmask]>

Wed, 20 Jan 1999 13:04:04 +0500

34 lines

<No subject>

Raul Cantero <[log in to unmask]>

Mon, 25 Jan 1999 15:03:02 -0600

90 lines

<No subject>

Jodi Eitner <[log in to unmask]>

Fri, 29 Jan 1999 11:49:51 -0700

31 lines

New Thread

Accordian Metalized Film Capacitors

Accordian Metalized Film Capacitors

Thibodeau, Chad <[log in to unmask]>

Wed, 6 Jan 1999 07:53:40 -0700

43 lines

New Thread

Adapter from SSOP-20 to DIP20

Adapter from SSOP-20 to DIP20

Alain Mathieu <[log in to unmask]>

Wed, 20 Jan 1999 19:52:28 -0800

43 lines

New Thread

Addendum to previous Enquiry

Addendum to previous Enquiry

PAT DIAMOND <[log in to unmask]>

Wed, 6 Jan 1999 10:08:34 EMT+0

31 lines

New Thread

Adhesive/sealant applicator

Adhesive/sealant applicator

Narayana Vishy-CVN002 <[log in to unmask]>

Fri, 8 Jan 1999 16:04:30 +0800

29 lines

Re: Adhesive/sealant applicator

Jeff Finger <[log in to unmask]>

Fri, 8 Jan 1999 09:35:33 -0800

50 lines

Re: Adhesive/sealant applicator

Mike Barmuta <[log in to unmask]>

Fri, 8 Jan 1999 15:31:35 PST

69 lines

New Thread

Analytical Labs

Analytical Labs

John Gulley <[log in to unmask]>

Wed, 27 Jan 1999 10:51:52 -0800

64 lines

Re: Analytical Labs

Randy Anderson <[log in to unmask]>

Wed, 27 Jan 1999 10:11:54 -0800

102 lines

New Thread

ANSI/EIA-481

Re: ANSI/EIA-481

Sauer, Steven T. <[log in to unmask]>

Thu, 7 Jan 1999 10:12:00 E

34 lines

New Thread

ANSI/J-STD-004

ANSI/J-STD-004

Patranit Waitayasuwan <[log in to unmask]>

Fri, 22 Jan 1999 13:27:42 +0700

47 lines

Re: ANSI/J-STD-004

[log in to unmask]

Fri, 22 Jan 1999 08:41:46 EST

33 lines

New Thread

AOI INSPECTION

AOI INSPECTION

Brigitte Haugk <[log in to unmask]>

Mon, 18 Jan 1999 13:42:22 -0600

27 lines

Re: AOI INSPECTION

Marco Biagtan <[log in to unmask]>

Tue, 19 Jan 1999 09:20:07 +0800

60 lines

New Thread

Ass'y

Ass'y

Phil Belliveau <[log in to unmask]>

Wed, 13 Jan 1999 17:01:10 -0500

30 lines

New Thread

Assembly Inquiry

Assembly Inquiry

Jay Bitanga <[log in to unmask]>

Wed, 20 Jan 1999 13:56:55 +0000

49 lines

New Thread

Assy: I CAN Rework this BGA Socket!

Assy: I CAN Rework this BGA Socket!

Stephen R. Gregory <[log in to unmask]>

Thu, 7 Jan 1999 16:41:11 EST

71 lines

Re: Assy: I CAN Rework this BGA Socket!

Tenison Stone <[log in to unmask]>

Thu, 7 Jan 1999 16:08:04 -0600

29 lines

Re: Assy: I CAN Rework this BGA Socket!

Energy Technology Systems <[log in to unmask]>

Thu, 7 Jan 1999 15:59:18 -0800

51 lines

Re: Assy: I CAN Rework this BGA Socket!

Paul Klasek <[log in to unmask]>

Fri, 8 Jan 1999 12:07:32 +1100

89 lines

Re: Assy: I CAN Rework this BGA Socket!

Tenison Stone <[log in to unmask]>

Fri, 8 Jan 1999 07:22:21 -0600

130 lines

Re: Assy: I CAN Rework this BGA Socket!

McMonagle, Michael R. <[log in to unmask]>

Fri, 8 Jan 1999 08:12:17 -0600

150 lines

Re: Assy: I CAN Rework this BGA Socket!

Stephen R. Gregory <[log in to unmask]>

Fri, 8 Jan 1999 12:52:07 EST

78 lines

Re: Assy: I CAN Rework this BGA Socket!

Mike Keel <[log in to unmask]>

Fri, 8 Jan 1999 08:53:02 -0000

128 lines

Re: Assy: I CAN Rework this BGA Socket!

Gabe Cherian <[log in to unmask]>

Mon, 11 Jan 1999 16:02:26 -0800

125 lines

New Thread

Assy: Is it possible to rework a BGA socket?

Assy: Is it possible to rework a BGA socket?

Stephen R. Gregory <[log in to unmask]>

Wed, 6 Jan 1999 19:28:56 EST

60 lines

Re: Assy: Is it possible to rework a BGA socket?

Wade Oberle <[log in to unmask]>

Thu, 7 Jan 1999 07:18:42 -0600

130 lines

Re: Assy: Is it possible to rework a BGA socket?

Jim Kittel <[log in to unmask]>

Thu, 7 Jan 1999 06:44:42 -0700

162 lines

New Thread

Assy: Source for Gold Plating Solution

Assy: Source for Gold Plating Solution

Stephen R. Gregory <[log in to unmask]>

Tue, 19 Jan 1999 13:57:23 EST

37 lines

Re: Assy: Source for Gold Plating Solution

Ryan Jennens <[log in to unmask]>

Tue, 19 Jan 1999 15:34:41 -0500

73 lines

Re: Assy: Source for Gold Plating Solution

Stephen R. Gregory <[log in to unmask]>

Tue, 19 Jan 1999 17:36:03 EST

61 lines

Re: Assy: Source for Gold Plating Solution

rob schetty <[log in to unmask]>

Tue, 19 Jan 1999 15:45:36 -0500

66 lines

Re: Assy: Source for Gold Plating Solution

Leslie O. Connally <[log in to unmask]>

Wed, 20 Jan 1999 08:48:07 -0600

76 lines

Re: Assy: Source for Gold Plating Solution

Sheila Smith <[log in to unmask]>

Wed, 20 Jan 1999 15:28:52 -0500

111 lines

Re: Assy: Source for Gold Plating Solution

David Fish <[log in to unmask]>

Wed, 20 Jan 1999 16:31:33 -0500

117 lines

Re: Assy: Source for Gold Plating Solution

McMonagle, Michael R. <[log in to unmask]>

Thu, 21 Jan 1999 10:55:28 -0600

85 lines

New Thread

Assy: STEVE CAN Rework this BGA Socket !!!

Re: Assy: STEVE CAN Rework this BGA Socket !!!

Paul Klasek <[log in to unmask]>

Fri, 8 Jan 1999 09:27:45 +1100

141 lines

Re: Assy: STEVE CAN Rework this BGA Socket !!!

Ryan Jennens <[log in to unmask]>

Thu, 7 Jan 1999 18:17:37 -0500

189 lines

New Thread

assy:AVX low inductance multila

Re: assy:AVX low inductance multila

Thomas Burek <[log in to unmask]>

Tue, 26 Jan 1999 19:54:23 -0500

94 lines

New Thread

assy:AVX low inductance multilayer capacitors

assy:AVX low inductance multilayer capacitors

Parke, Gregory <[log in to unmask]>

Tue, 26 Jan 1999 18:11:13 -0500

47 lines

Re: assy:AVX low inductance multilayer capacitors

Wade Oberle <[log in to unmask]>

Wed, 27 Jan 1999 07:04:58 -0600

90 lines

New Thread

Assy:Through-hole Solder Preforms...

Assy:Through-hole Solder Preforms...

Stephen R. Gregory <[log in to unmask]>

Tue, 12 Jan 1999 12:59:13 EST

82 lines

Re: Assy:Through-hole Solder Preforms...

John Koleszar <[log in to unmask]>

Tue, 12 Jan 1999 13:19:00 -0500

155 lines

Re: Assy:Through-hole Solder Preforms...

Angie Marques <[log in to unmask]>

Tue, 12 Jan 1999 10:50:28 -0800

161 lines

Re: Assy:Through-hole Solder Preforms...

Stephen R. Gregory <[log in to unmask]>

Tue, 12 Jan 1999 16:08:17 EST

82 lines

Re: Assy:Through-hole Solder Preforms...

David D Hillman <[log in to unmask]>

Wed, 13 Jan 1999 06:15:06 -0600

151 lines

Re: Assy:Through-hole Solder Preforms...

Rupert, Martha L. <[log in to unmask]>

Wed, 13 Jan 1999 15:22:48 -0500

32 lines

Re: Assy:Through-hole Solder Preforms...

McMonagle, Michael R. <[log in to unmask]>

Wed, 13 Jan 1999 15:10:04 -0600

82 lines

Re: Assy:Through-hole Solder Preforms...

Martin, Jesse <[log in to unmask]>

Wed, 13 Jan 1999 16:35:48 -0500

32 lines

New Thread

Attaching heatsinks to IC's

Re: Attaching heatsinks to IC's

Bill Davis <[log in to unmask]>

Mon, 4 Jan 1999 07:49:47 -0800

127 lines

New Thread

AW: [TN] Pips on plastic Surface Mount connectors

AW: [TN] Pips on plastic Surface Mount connectors

Giese Klaus <[log in to unmask]>

Thu, 14 Jan 1999 17:45:17 +0100

83 lines

New Thread

Baking PCB With OSP Finish

Baking PCB With OSP Finish

Kevin Moore-G11208 <[log in to unmask]>

Tue, 26 Jan 1999 07:59:03 -0800

30 lines

Re: Baking PCB With OSP Finish

<Joseph M. Webb> <[log in to unmask]>

Tue, 26 Jan 1999 11:04:37 -0500

33 lines

Re: Baking PCB With OSP Finish

Andy Mackie <[log in to unmask]>

Tue, 26 Jan 1999 14:03:11 -0500

67 lines

New Thread

Bare PWB Packaging

Bare PWB Packaging

Vascukynas, Brian <[log in to unmask]>

Fri, 8 Jan 1999 10:05:33 -0500

40 lines

Re: Bare PWB Packaging

KELLY M SCHRIVER <[log in to unmask]>

Fri, 8 Jan 1999 09:42:00 -0500

36 lines

Re: Bare PWB Packaging

Paul Klasek <[log in to unmask]>

Mon, 11 Jan 1999 13:14:59 +1100

74 lines

New Thread

BGA and profiling

BGA and profiling

John Chandler <[log in to unmask]>

Wed, 13 Jan 1999 15:49:32 +0100

43 lines

BGA and profiling

[log in to unmask]

Wed, 13 Jan 1999 20:44:06 -0600

34 lines

Re: BGA and profiling

Paul Klasek <[log in to unmask]>

Thu, 14 Jan 1999 14:37:13 +1100

70 lines

Re: BGA and profiling

McMonagle, Michael R. <[log in to unmask]>

Thu, 14 Jan 1999 08:36:52 -0600

97 lines

Re: BGA and profiling

[log in to unmask]

Thu, 14 Jan 1999 07:45:54 -0600

55 lines

Re: BGA and profiling

Bill Davis <[log in to unmask]>

Thu, 14 Jan 1999 07:56:42 -0800

88 lines

New Thread

BGA clean checking

BGA clean checking

John Chandler <[log in to unmask]>

Mon, 25 Jan 1999 07:46:26 +0100

29 lines

Re: BGA clean checking

Stephen R. Gregory <[log in to unmask]>

Mon, 25 Jan 1999 11:09:37 EST

53 lines

Re: BGA clean checking

Jim Kittel <[log in to unmask]>

Mon, 25 Jan 1999 10:02:07 -0700

64 lines

Re: BGA clean checking

Collins, Graham <[log in to unmask]>

Tue, 26 Jan 1999 08:26:46 -0400

76 lines

New Thread

BGA Rework

BGA Rework

Stammely, Tim <[log in to unmask]>

Mon, 18 Jan 1999 12:16:37 -0500

37 lines

BGA Rework

[log in to unmask]

Wed, 20 Jan 1999 09:15:12 -0600

47 lines

New Thread

BGA Substrate

BGA Substrate

Jay Bitanga <[log in to unmask]>

Thu, 14 Jan 1999 09:10:08 +0000

47 lines

Re: BGA Substrate

McMonagle, Michael R. <[log in to unmask]>

Thu, 14 Jan 1999 08:16:21 -0600

83 lines

Re: BGA Substrate

Bill Davis <[log in to unmask]>

Thu, 14 Jan 1999 08:05:42 -0800

95 lines

Re: BGA Substrate

[log in to unmask]

Thu, 14 Jan 1999 18:14:11 -0600

28 lines

New Thread

BGA's with Adhesives

BGA's with Adhesives

KELLY M SCHRIVER <[log in to unmask]>

Tue, 26 Jan 1999 14:26:00 -0500

41 lines

New Thread

BGAs on both sides of a PCB

BGAs on both sides of a PCB

Rod Lafond <[log in to unmask]>

Mon, 11 Jan 1999 10:58:28 -0800

34 lines

Re: BGAs on both sides of a PCB

Jean-Paul Clech <[log in to unmask]>

Mon, 11 Jan 1999 14:55:47 EST

49 lines

Re: BGAs on both sides of a PCB

Martin, Jesse <[log in to unmask]>

Mon, 11 Jan 1999 15:02:19 -0500

33 lines

Re: BGAs on both sides of a PCB

[log in to unmask]

Tue, 12 Jan 1999 14:16:39 -0600

23 lines

New Thread

BGAs on both sides of a PCB -Reply

BGAs on both sides of a PCB -Reply

Matthew Park <[log in to unmask]>

Mon, 11 Jan 1999 14:56:28 -0800

74 lines

New Thread

Bowed Boards

Bowed Boards

Ken Nevius <[log in to unmask]>

Tue, 19 Jan 1999 16:33:11 -0500

41 lines

Re: Bowed Boards

John W <[log in to unmask]>

Wed, 20 Jan 1999 21:35:38 -0500

77 lines

Re: Bowed Boards

Wade Oberle <[log in to unmask]>

Thu, 21 Jan 1999 06:55:35 -0600

81 lines

Re: Bowed Boards

Anne Ledger <[log in to unmask]>

Thu, 21 Jan 1999 08:59:40 -0500

77 lines

Re: Bowed Boards

Stephen R. Gregory <[log in to unmask]>

Thu, 21 Jan 1999 10:24:05 EST

79 lines

Re: Bowed Boards

Bryan Kerr +44 1383 822131 ext 4409 <[log in to unmask]>

Thu, 21 Jan 1999 10:12:29 +0000

39 lines

New Thread

Brightness of Ni/Au plated surface

Brightness of Ni/Au plated surface

Au Po Lam, Benny <[log in to unmask]>

Wed, 6 Jan 1999 16:45:49 +0800

32 lines

New Thread

Burn-IN

Burn-IN

Craig Patterson <[log in to unmask]>

Tue, 12 Jan 1999 10:45:00 -0500

32 lines

Re: Burn-IN

Paul Klasek <[log in to unmask]>

Wed, 13 Jan 1999 10:15:36 +1100

72 lines

New Thread

Call for papers

Call for papers

Cathy Aplin <[log in to unmask]>

Mon, 11 Jan 1999 13:53:06 -0000

100 lines

Re: Call for papers

S.L.N.MURTHY <[log in to unmask]>

Sun, 24 Jan 1999 21:22:01 +0530

181 lines

New Thread

Centistokes to centipoise

Centistokes to centipoise

tana <[log in to unmask]>

Mon, 18 Jan 1999 11:37:16 +0000

32 lines

Re: Centistokes to centipoise

David D Hillman <[log in to unmask]>

Mon, 18 Jan 1999 09:54:53 -0600

70 lines

Re: Centistokes to centipoise

Stephen R. Gregory <[log in to unmask]>

Mon, 18 Jan 1999 12:44:26 EST

75 lines

Re: Centistokes to centipoise

Fred Shubert <[log in to unmask]>

Mon, 18 Jan 1999 10:03:42 -0500

51 lines

New Thread

Check out CCA Surface Finishes Workshop

Check out CCA Surface Finishes Workshop

Dennis Maggi <[log in to unmask]>

Thu, 21 Jan 1999 03:11:57 EST

39 lines

New Thread

Circuit Board Company for Sale

Circuit Board Company for Sale

[log in to unmask]

Mon, 25 Jan 1999 12:12:09 EST

29 lines

New Thread

Cleaning of mis-printed boards

Cleaning of mis-printed boards

Wade Oberle <[log in to unmask]>

Thu, 14 Jan 1999 09:07:42 -0600

37 lines

Re: Cleaning of mis-printed boards

Brad Kendall <[log in to unmask]>

Thu, 14 Jan 1999 13:33:57 -0500

92 lines

Re: Cleaning of mis-printed boards

David Muscat <[log in to unmask]>

Fri, 15 Jan 1999 08:35:34 +1100

91 lines

New Thread

Cleaning Options per J-STD-001B

Re: Cleaning Options per J-STD-001B

Jerry Rosser <[log in to unmask]>

Mon, 11 Jan 1999 22:11:42 -0700

73 lines

New Thread

COILS

COILS

Gabriela Bogdan <[log in to unmask]>

Fri, 8 Jan 1999 19:39:37 +0200

37 lines

COILS

[log in to unmask]

Fri, 8 Jan 1999 14:06:22 -0600

35 lines

Re: COILS

KK Chin <[log in to unmask]>

Fri, 8 Jan 1999 13:45:56 -0800

91 lines

COILS

[log in to unmask]

Fri, 8 Jan 1999 15:53:11 -0600

23 lines

Re: COILS

Gabriela Bogdan <[log in to unmask]>

Sat, 9 Jan 1999 02:29:10 +0200

64 lines

New Thread

Component Solderability Testing

Component Solderability Testing

Andy Mackie <[log in to unmask]>

Tue, 26 Jan 1999 15:58:50 -0500

29 lines

Re: Component Solderability Testing

Bev Christian <[log in to unmask]>

Tue, 26 Jan 1999 16:25:08 -0500

62 lines

New Thread

Componentry Convention

Componentry Convention

Paul Klasek <[log in to unmask]>

Thu, 14 Jan 1999 09:52:29 +1100

32 lines

New Thread

Components

Components

Scott B. Westheimer <[log in to unmask]>

Fri, 22 Jan 1999 10:23:06 +0800

61 lines

Re: Components

Rob Schetty <[log in to unmask]>

Fri, 22 Jan 1999 08:18:47 -0500

103 lines

New Thread

confirm

confirm

[log in to unmask]

Sat, 23 Jan 1999 17:16:54 +0100

85 lines

New Thread

contact info

contact info

Frank K. Frimpong <[log in to unmask]>

Fri, 22 Jan 1999 17:33:46 +0000

25 lines

Re: contact info

Stephen R. Gregory <[log in to unmask]>

Fri, 22 Jan 1999 12:59:08 EST

45 lines

Re: contact info

Steve Collins <[log in to unmask]>

Fri, 22 Jan 1999 11:07:20 -0700

62 lines

New Thread

Contact Reliability > Steam Test ?

Re: Contact Reliability > Steam Test ?

Paul Klasek <[log in to unmask]>

Tue, 5 Jan 1999 14:55:57 +1100

172 lines

New Thread

conversion

conversion

Todd Vorpahl <[log in to unmask]>

Thu, 14 Jan 1999 11:41:47 -0500

27 lines

Re: conversion

<Andy Slade> <[log in to unmask]>

Thu, 14 Jan 1999 13:22:16 -0500

57 lines

Re: conversion

Gang Zhao <[log in to unmask]>

Thu, 14 Jan 1999 15:40:21 -0500

56 lines

Re: conversion

Jim Douglas <[log in to unmask]>

Thu, 14 Jan 1999 21:51:33 -0000

79 lines

Re: conversion

<Rudy Sedlak> <[log in to unmask]>

Thu, 14 Jan 1999 23:02:43 EST

25 lines

Re: conversion

[log in to unmask]

Mon, 18 Jan 1999 14:59:30 EST

70 lines

New Thread

Correlating QCTC specimens to Specific Tests

Correlating QCTC specimens to Specific Tests

[log in to unmask]

Tue, 19 Jan 1999 09:57:00 -0800

42 lines

Re: Correlating QCTC specimens to Specific Tests

[log in to unmask]

Tue, 19 Jan 1999 15:12:40 EST

37 lines

New Thread

CSPs assembly for Via In Pad

CSPs assembly for Via In Pad

Parvez Patel <[log in to unmask]>

Mon, 25 Jan 1999 14:38:39 -0500

47 lines

New Thread

CTE of FR4 and other materials

Re: CTE of FR4 and other materials

Gabe Cherian <[log in to unmask]>

Thu, 14 Jan 1999 11:08:59 -0800

50 lines

New Thread

cu flakes in blind via holes

cu flakes in blind via holes

Tom Obarski x4286 <[log in to unmask]>

Thu, 28 Jan 1999 17:51:11 -0500

50 lines

Re: cu flakes in blind via holes

[log in to unmask]

Fri, 29 Jan 1999 08:35:18 EST

30 lines

New Thread

Design considerations for No-Clean processes

Design considerations for No-Clean processes

Kimmey, Frank <[log in to unmask]>

Wed, 27 Jan 1999 06:12:45 -0800

38 lines

Re: Design considerations for No-Clean processes

David D Hillman <[log in to unmask]>

Wed, 27 Jan 1999 19:55:53 -0600

86 lines

Re: Design considerations for No-Clean processes

Paul Klasek <[log in to unmask]>

Thu, 28 Jan 1999 15:14:07 +1100

80 lines

Re: Design considerations for No-Clean processes

Stephen R. Gregory <[log in to unmask]>

Thu, 28 Jan 1999 12:14:01 EST

87 lines

Re: Design considerations for No-Clean processes

Andy Mackie <[log in to unmask]>

Thu, 28 Jan 1999 12:46:03 -0500

163 lines

Re: Design considerations for No-Clean processes

Paul Klasek <[log in to unmask]>

Fri, 29 Jan 1999 12:41:21 +1100

178 lines

Re: Design considerations for No-Clean processes

Andy Mackie <[log in to unmask]>

Fri, 29 Jan 1999 09:10:39 -0500

237 lines

Re: Design considerations for No-Clean processes

Wade Oberle <[log in to unmask]>

Fri, 29 Jan 1999 09:58:59 -0600

354 lines

Re: Design considerations for No-Clean processes

Stephen R. Gregory <[log in to unmask]>

Fri, 29 Jan 1999 12:36:05 EST

114 lines

Re: Design considerations for No-Clean processes

Matthew Park <[log in to unmask]>

Fri, 29 Jan 1999 11:28:05 -0800

216 lines

Re: Design considerations for No-Clean processes

Stephen R. Gregory <[log in to unmask]>

Fri, 29 Jan 1999 16:10:04 EST

76 lines

Re: Design considerations for No-Clean processes

Paul Klasek <[log in to unmask]>

Mon, 1 Feb 1999 10:04:43 +1100

207 lines

New Thread

Design considerations for No-Clean processes -Reply

Re: Design considerations for No-Clean processes -Reply

Matthew Park <[log in to unmask]>

Thu, 28 Jan 1999 10:57:11 -0800

34 lines

New Thread

Design Help

Design Help

[log in to unmask]

Thu, 28 Jan 1999 09:31:00 -0800

35 lines

Re: Design Help

Linda Mazzitelli <[log in to unmask]>

Sat, 30 Jan 1999 20:06:02 -0200

61 lines

New Thread

destaticising p/carbon .

Re: destaticising p/carbon .

Paul Klasek <[log in to unmask]>

Wed, 6 Jan 1999 09:11:42 +1100

156 lines

Re: destaticising p/carbon .

Bev Christian <[log in to unmask]>

Wed, 6 Jan 1999 09:06:57 -0500

200 lines

Re: destaticising p/carbon .

Cash, Alan <[log in to unmask]>

Wed, 6 Jan 1999 11:11:39 -0500

198 lines

Re: destaticising p/carbon .

Paul Klasek <[log in to unmask]>

Thu, 7 Jan 1999 08:06:26 +1100

241 lines

New Thread

Dewetting on NiAu

Dewetting on NiAu

Guenter Grossmann <[log in to unmask]>

Fri, 22 Jan 1999 12:31:03 +0100

35 lines

Re: Dewetting on NiAu

Werner Engelmaier <[log in to unmask]>

Fri, 22 Jan 1999 15:45:21 EST

39 lines

Re: Dewetting on NiAu

Tynan, Cait Joy (Cait)** CTR ** <[log in to unmask]>

Mon, 25 Jan 1999 08:29:22 +1100

65 lines

New Thread

Did anyone measure Dk of PCB laminate at Ghz ?

Did anyone measure Dk of PCB laminate at Ghz ?

이민수 과장 전자 본사연구1팀 <[log in to unmask]>

Fri, 15 Jan 1999 10:52:15 +0900

44 lines

New Thread

Does anybody know what FR4-6, FR4-4 mean?

Does anybody know what FR4-6, FR4-4 mean?

이민수 과장 전자 본사연구1팀 <[log in to unmask]>

Fri, 8 Jan 1999 19:52:49 +0900

34 lines

Re: Does anybody know what FR4-6, FR4-4 mean?

Jim Francey <[log in to unmask]>

Fri, 8 Jan 1999 19:08:06 EST

28 lines

New Thread

Don't panic! Someone made a mistake.

Don't panic! Someone made a mistake.

Hugo Scaramuzza <[log in to unmask]>

Mon, 25 Jan 1999 15:01:59 -0600

58 lines

Re: Don't panic! Someone made a mistake.

Thomas E. Waznis <[log in to unmask]>

Mon, 25 Jan 1999 14:14:08 -0800

80 lines

New Thread

Double side reflow

Double side reflow

Wade Oberle <[log in to unmask]>

Mon, 18 Jan 1999 09:58:08 -0600

50 lines

New Thread

Double Sided Surface Mount

Double Sided Surface Mount

Sherry, Andrew <[log in to unmask]>

Mon, 18 Jan 1999 12:17:31 -0000

36 lines

Re: Double Sided Surface Mount

John Chandler <[log in to unmask]>

Mon, 18 Jan 1999 06:11:36 +0100

65 lines

Re: Double Sided Surface Mount

Rob Watson <[log in to unmask]>

Mon, 18 Jan 1999 15:20:17 -0500

60 lines

New Thread

double sided, mixed media boards

double sided, mixed media boards

Bryan Bloom <[log in to unmask]>

Fri, 15 Jan 1999 11:36:01 -0800

37 lines

Re: double sided, mixed media boards

Stephen R. Gregory <[log in to unmask]>

Fri, 15 Jan 1999 20:14:02 EST

97 lines

Re: double sided, mixed media boards

Finlay Buchan <[log in to unmask]>

Mon, 18 Jan 1999 00:06:53 -0000

163 lines

Re: double sided, mixed media boards

jim <[log in to unmask]>

Mon, 18 Jan 1999 07:31:40 -0600

65 lines

New Thread

Drawing Notes for Controlled Impedance

Drawing Notes for Controlled Impedance

Kimmey, Frank <[log in to unmask]>

Thu, 21 Jan 1999 07:18:59 -0800

39 lines

Re: Drawing Notes for Controlled Impedance

Jeff Seeger <[log in to unmask]>

Thu, 21 Jan 1999 12:33:18 -0500

58 lines

New Thread

Dummy BGA boards

Dummy BGA boards

glenn pelkey <[log in to unmask]>

Tue, 19 Jan 1999 08:58:15 PST

37 lines

New Thread

Dye Penetration Testing of BGA solder joints

Dye Penetration Testing of BGA solder joints

Maguire, James F <[log in to unmask]>

Wed, 13 Jan 1999 16:21:56 -0800

44 lines

Re: Dye Penetration Testing of BGA solder joints

Jeff Perkins <[log in to unmask]>

Thu, 14 Jan 1999 08:31:50 -0500

96 lines

Re: Dye Penetration Testing of BGA solder joints

Jean-Paul Clech <[log in to unmask]>

Thu, 14 Jan 1999 10:38:31 EST

50 lines

Re: Dye Penetration Testing of BGA solder joints

Bill Davis <[log in to unmask]>

Thu, 14 Jan 1999 07:58:38 -0800

93 lines

Re: Dye Penetration Testing of BGA solder joints

Maguire, James F <[log in to unmask]>

Thu, 14 Jan 1999 11:33:48 -0800

79 lines

New Thread

Electroplated copper composition

Electroplated copper composition

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 6 Jan 1999 17:43:25 +0200

30 lines

Re: Electroplated copper composition

Leslie O. Connally <[log in to unmask]>

Wed, 6 Jan 1999 11:02:26 -0600

62 lines

New Thread

Experience with No Clean Paste and No Clean Flux

Experience with No Clean Paste and No Clean Flux

Don E Steffen <[log in to unmask]>

Thu, 14 Jan 1999 12:27:55 -0500

56 lines

Re: Experience with No Clean Paste and No Clean Flux

Sauer, Steven T. <[log in to unmask]>

Thu, 14 Jan 1999 13:32:00 E

28 lines

Re: Experience with No Clean Paste and No Clean Flux

<Joseph M. Webb> <[log in to unmask]>

Thu, 14 Jan 1999 14:43:29 -0500

47 lines

New Thread

Experience with No Clean Paste and No Clean Flux -Reply

Re: Experience with No Clean Paste and No Clean Flux -Reply

Matthew Park <[log in to unmask]>

Thu, 14 Jan 1999 13:14:01 -0800

38 lines

New Thread

Fab: Panel Racks

Fab: Panel Racks

John Lennox <[log in to unmask]>

Wed, 13 Jan 1999 17:39:22 -0500

39 lines

Re: Fab: Panel Racks

Thibodeau, Chad <[log in to unmask]>

Fri, 15 Jan 1999 07:45:55 -0700

74 lines

New Thread

FAB: Solder Filled Thermal Vias

Re: FAB: Solder Filled Thermal Vias

Seth Goodman <[log in to unmask]>

Tue, 5 Jan 1999 12:42:22 -0600

65 lines

Re: FAB: Solder Filled Thermal Vias

KELLY M SCHRIVER <[log in to unmask]>

Tue, 5 Jan 1999 13:04:00 -0500

30 lines

FAB: Solder Filled Thermal Vias

Patten, James <[log in to unmask]>

Tue, 5 Jan 1999 12:01:05 -0800

98 lines

FAB: Solder Filled Thermal Vias

[log in to unmask]

Tue, 5 Jan 1999 16:22:27 -0600

31 lines

Re: FAB: Solder Filled Thermal Vias

Mitch Morey <[log in to unmask]>

Tue, 5 Jan 1999 16:06:21 -0800

41 lines

FAB: Solder Filled Thermal Vias

[log in to unmask]

Tue, 5 Jan 1999 18:35:46 -0600

24 lines

Re: FAB: Solder Filled Thermal Vias

KELLY M SCHRIVER <[log in to unmask]>

Wed, 6 Jan 1999 09:28:00 -0500

47 lines

Re: FAB: Solder Filled Thermal Vias

Leslie O. Connally <[log in to unmask]>

Wed, 6 Jan 1999 11:25:01 -0600

43 lines

Re: FAB: Solder Filled Thermal Vias

Patten, James <[log in to unmask]>

Wed, 6 Jan 1999 10:16:27 -0800

92 lines

New Thread

fabrication process specification

fabrication process specification

Chris Roberston <[log in to unmask]>

Mon, 4 Jan 1999 11:18:09 -0600

57 lines

New Thread

Fastek parts

Fastek parts

Terrie Balck <[log in to unmask]>

Mon, 18 Jan 1999 14:35:29 -0800

31 lines

New Thread

Flat Ribbon "L" and Gull Wing Lead Inspection

Flat Ribbon "L" and Gull Wing Lead Inspection

Brinson Lonnie G CNIN <[log in to unmask]>

Tue, 26 Jan 1999 08:05:09 -0500

40 lines

Re: Flat Ribbon "L" and Gull Wing Lead Inspection

Stephen R. Gregory <[log in to unmask]>

Tue, 26 Jan 1999 10:41:15 EST

59 lines

New Thread

FTIR Systems

FTIR Systems

Severson, Scott M. <[log in to unmask]>

Tue, 26 Jan 1999 10:28:49 -0600

29 lines

New Thread

FW: Assy: Is it possible to rework a BGA socket?

FW: Assy: Is it possible to rework a BGA socket?

Raul Cantero <[log in to unmask]>

Thu, 7 Jan 1999 16:12:00 -0600

116 lines

New Thread

Fw: Help for using software "awake10"

Fw: Help for using software "awake10"

K.Chamdrabose <[log in to unmask]>

Fri, 15 Jan 1999 20:46:04 +0530

116 lines

New Thread

FW: [TN] Dye Penetration Testing of BGA solder joints

FW: [TN] Dye Penetration Testing of BGA solder joints

Jeff Perkins <[log in to unmask]>

Fri, 15 Jan 1999 08:07:28 -0500

121 lines

New Thread

FW: [TN] MPM solder Paste dryness and cartridge dispenser

FW: [TN] MPM solder Paste dryness and cartridge dispenser

Dhawan, Ashok <[log in to unmask]>

Wed, 20 Jan 1999 15:05:39 -0600

115 lines

New Thread

FW: [TN] Peretti

FW: [TN] Peretti

Paul Klasek <[log in to unmask]>

Mon, 1 Feb 1999 16:25:20 +1100

88 lines

New Thread

FW: [TN] PHOSPHORIC ACID ANODIZE

FW: [TN] PHOSPHORIC ACID ANODIZE

Sheila Smith <[log in to unmask]>

Wed, 6 Jan 1999 10:59:44 -0500

63 lines

New Thread

Galvanic effects

Galvanic effects

Nelson, John <[log in to unmask]>

Fri, 8 Jan 1999 09:51:01 -0500

36 lines

Re: Galvanic effects

Yongheng Zhu <[log in to unmask]>

Fri, 8 Jan 1999 18:24:12 -0600

68 lines

New Thread

Getek board

Getek board

Edwin Maximo <[log in to unmask]>

Thu, 7 Jan 1999 10:23:09 +0000

37 lines

Re: Getek board

Christopher Jorgensen <[log in to unmask]>

Fri, 8 Jan 1999 09:24:05 -0600

66 lines

Re: Getek board

Shaddock, David M (CRD) <[log in to unmask]>

Fri, 8 Jan 1999 15:48:21 -0500

64 lines

New Thread

Gold Flash Spec for PCB?

Gold Flash Spec for PCB?

Rick Thompson <[log in to unmask]>

Thu, 28 Jan 1999 15:48:14 -0800

79 lines

Re: Gold Flash Spec for PCB?

Paul Klasek <[log in to unmask]>

Fri, 29 Jan 1999 11:46:51 +1100

80 lines

Re: Gold Flash Spec for PCB?

David D Hillman <[log in to unmask]>

Fri, 29 Jan 1999 06:25:39 -0600

109 lines

New Thread

Gold Immersion at Wave Solder

Gold Immersion at Wave Solder

Jim Kittel <[log in to unmask]>

Tue, 19 Jan 1999 14:40:39 -0700

30 lines

Re: Gold Immersion at Wave Solder

Paul Klasek <[log in to unmask]>

Wed, 20 Jan 1999 16:01:49 +1100

77 lines

New Thread

Gold Immersion at Wave Solder -Reply

Gold Immersion at Wave Solder -Reply

TPE Engineering TechNet <[log in to unmask]>

Tue, 19 Jan 1999 13:52:07 -0800

29 lines

New Thread

Greater Boston IPC/DC Chapter Meeting, 12-Jan

Greater Boston IPC/DC Chapter Meeting, 12-Jan

Jeff Seeger <[log in to unmask]>

Wed, 6 Jan 1999 14:54:22 -0500

88 lines

New Thread

Halogen-free base materials

Halogen-free base materials

Burkhard Heck <[log in to unmask]>

Tue, 12 Jan 1999 18:23:03 +0100

46 lines

New Thread

Halogen-Free Epoxy Resins

Halogen-Free Epoxy Resins

Christopher Jorgensen <[log in to unmask]>

Wed, 6 Jan 1999 09:12:24 -0600

44 lines

Re: Halogen-Free Epoxy Resins

[log in to unmask]

Wed, 6 Jan 1999 14:19:24 EST

36 lines

New Thread

HAST

HAST

Howard Lin <[log in to unmask]>

Thu, 28 Jan 1999 14:31:20 +0800

31 lines

Re: HAST

Werner Engelmaier <[log in to unmask]>

Thu, 28 Jan 1999 11:23:15 EST

41 lines

New Thread

HELP with use of URALANE 7760 with SMT

HELP with use of URALANE 7760 with SMT

John Mastorides <[log in to unmask]>

Mon, 11 Jan 1999 10:31:14 -0500

30 lines

New Thread

High Current PCB

High Current PCB

Lum Wee Mei <[log in to unmask]>

Tue, 12 Jan 1999 15:24:38 +0800

40 lines

Re: High Current PCB

Andy Magee <[log in to unmask]>

Wed, 13 Jan 1999 22:28:57 -0500

59 lines

Re: High Current PCB

[log in to unmask]

Thu, 14 Jan 1999 07:53:12 -0600

30 lines

Re: High Current PCB

Jeff Seeger <[log in to unmask]>

Thu, 14 Jan 1999 12:38:41 -0500

76 lines

New Thread

High Temp Reflow on 63/37 Solder joints

High Temp Reflow on 63/37 Solder joints

[log in to unmask]

Thu, 28 Jan 1999 17:42:11 -0500

52 lines

New Thread

Hollis Future I

Hollis Future I

[log in to unmask]

Mon, 11 Jan 1999 10:24:52 EST

31 lines

New Thread

Hull Cell Stress Analysis

Hull Cell Stress Analysis

Schram Steve <[log in to unmask]>

Mon, 25 Jan 1999 09:44:10 -0800

26 lines

Re: Hull Cell Stress Analysis

<Rudy Sedlak> <[log in to unmask]>

Mon, 25 Jan 1999 21:22:46 EST

32 lines

New Thread

IMAPS/SMTA Rocky Mountain Chapter Seminar 1/21/99

IMAPS/SMTA Rocky Mountain Chapter Seminar 1/21/99

Hunter, Brian C <[log in to unmask]>

Fri, 15 Jan 1999 10:10:30 -0700

87 lines

New Thread

Immersion tin

Immersion tin

Gabriela Bogdan <[log in to unmask]>

Fri, 8 Jan 1999 19:22:31 +0200

27 lines

New Thread

immersion white tin finish

immersion white tin finish

Seth Goodman <[log in to unmask]>

Tue, 5 Jan 1999 16:08:32 -0600

36 lines

immersion white tin finish

[log in to unmask]

Tue, 5 Jan 1999 16:39:23 -0600

34 lines

Re: immersion white tin finish

Bob Cochran <[log in to unmask]>

Tue, 5 Jan 1999 15:09:14 -0800

68 lines

Re: immersion white tin finish

Ken Patel <[log in to unmask]>

Wed, 6 Jan 1999 09:31:16 -0800

68 lines

Re: immersion white tin finish

David D Hillman <[log in to unmask]>

Thu, 7 Jan 1999 08:49:17 -0600

73 lines

Re: immersion white tin finish

Seth Goodman <[log in to unmask]>

Thu, 7 Jan 1999 11:23:56 -0600

61 lines

Re: immersion white tin finish

KELLY M SCHRIVER <[log in to unmask]>

Thu, 7 Jan 1999 13:33:00 -0500

39 lines

Re: immersion white tin finish

Keith Larson <[log in to unmask]>

Thu, 7 Jan 1999 14:01:15 -0600

95 lines

Re: immersion white tin finish

Paul Wilson <[log in to unmask]>

Thu, 7 Jan 1999 15:35:01 -0500

111 lines

Re: immersion white tin finish

Neil Atkinson <[log in to unmask]>

Fri, 8 Jan 1999 07:51:29 -0000

34 lines

Re: immersion white tin finish

Jim Trainor <[log in to unmask]>

Fri, 8 Jan 1999 09:15:51 -0500

61 lines

immersion white tin finish

[log in to unmask]

Fri, 8 Jan 1999 09:55:54 -0600

26 lines

Re: immersion white tin finish

[log in to unmask]

Tue, 12 Jan 1999 12:02:03 EST

59 lines

New Thread

immersion white tin finish -Reply

Re: immersion white tin finish -Reply

Matthew Park <[log in to unmask]>

Wed, 6 Jan 1999 10:46:02 -0800

105 lines

Re: immersion white tin finish -Reply

Stephen R. Gregory <[log in to unmask]>

Wed, 6 Jan 1999 14:29:54 EST

42 lines

New Thread

immersion white tin finish -Reply -Reply

Re: immersion white tin finish -Reply -Reply

Matthew Park <[log in to unmask]>

Wed, 6 Jan 1999 14:06:57 -0800

85 lines

New Thread

IN CIRCUIT TEST

IN CIRCUIT TEST

Don E Steffen <[log in to unmask]>

Fri, 22 Jan 1999 14:30:04 -0500

39 lines

Re: IN CIRCUIT TEST

KELLY M SCHRIVER <[log in to unmask]>

Fri, 22 Jan 1999 15:40:00 -0500

31 lines

Re: IN CIRCUIT TEST

etgar dimaculangan <[log in to unmask]>

Sat, 23 Jan 1999 06:57:11 +0700

74 lines

Re: IN CIRCUIT TEST

garret dimaculangan <[log in to unmask]>

Sun, 24 Jan 1999 19:00:25 +0700

76 lines

Re: IN CIRCUIT TEST

John Walker <[log in to unmask]>

Mon, 25 Jan 1999 08:58:16 -0500

87 lines

New Thread

Injection molded casing

Injection molded casing

Ryan Jennens <[log in to unmask]>

Tue, 12 Jan 1999 17:15:24 -0500

38 lines

Re: Injection molded casing

KELLY M SCHRIVER <[log in to unmask]>

Tue, 12 Jan 1999 16:47:00 -0500

40 lines

New Thread

IONIC Contam Specs

IONIC Contam Specs

Jon Cruz <[log in to unmask]>

Mon, 18 Jan 1999 23:07:54 +0000

40 lines

Re: IONIC Contam Specs

Rob Watson <[log in to unmask]>

Mon, 18 Jan 1999 22:33:33 -0500

60 lines

Re: IONIC Contam Specs

Paul Gould <[log in to unmask]>

Tue, 19 Jan 1999 17:18:25 -0000

73 lines

New Thread

IPC 1710

IPC 1710

Ron Hayashi <[log in to unmask]>

Thu, 28 Jan 1999 10:13:28 -0800

24 lines

Re: IPC 1710

<Mary Smoot> <[log in to unmask]>

Thu, 28 Jan 1999 13:50:10 -0500

74 lines

Re: IPC 1710

McGlaughlin, Jeffrey A <[log in to unmask]>

Thu, 28 Jan 1999 13:54:31 -0500

54 lines

New Thread

IPC National Conference on Flex Circuits - Call For Papers

IPC National Conference on Flex Circuits - Call For Papers

MaryEllen Hilderbrand <[log in to unmask]>

Wed, 13 Jan 1999 14:48:27 -0600

300 lines

New Thread

IPC netlists: -356 or 356A?

IPC netlists: -356 or 356A?

Jeff Seeger <[log in to unmask]>

Fri, 15 Jan 1999 18:01:55 -0500

44 lines

Re: IPC netlists: -356 or 356A?

Test Engineering <[log in to unmask]>

Sat, 16 Jan 1999 11:31:12 -0500

46 lines

New Thread

IPC SIR Specs

IPC SIR Specs

Hamilton, Richard -4454 <[log in to unmask]>

Wed, 27 Jan 1999 13:10:00 -0700

38 lines

Re: IPC SIR Specs

[log in to unmask]

Thu, 28 Jan 1999 08:30:44 EST

39 lines

New Thread

IPC SPEC CONFORMANCE TESTING

IPC SPEC CONFORMANCE TESTING

[log in to unmask]

Mon, 4 Jan 1999 14:11:52 EST

43 lines

New Thread

IPC vs. JIS

IPC vs. JIS

Black, Paul <[log in to unmask]>

Fri, 8 Jan 1999 08:54:04 -0500

43 lines

New Thread

IPC's J-STD-001 Training and Certification Program

IPC's J-STD-001 Training and Certification Program

MaryEllen Hilderbrand <[log in to unmask]>

Tue, 26 Jan 1999 12:01:02 -0600

216 lines

New Thread

IPC's Wave Solder training video

IPC's Wave Solder training video

Moss, Thomas <[log in to unmask]>

Tue, 12 Jan 1999 15:10:00 -0800

36 lines

Re: IPC's Wave Solder training video

Jack Crawford <[log in to unmask]>

Wed, 13 Jan 1999 10:35:10 -0600

68 lines

New Thread

IPC-2221 and 2222

IPC-2221 and 2222

Paul Greene <[log in to unmask]>

Tue, 19 Jan 1999 11:07:37 -0500

25 lines

Re: IPC-2221 and 2222

Clifford Maddox <[log in to unmask]>

Tue, 19 Jan 1999 18:50:15 -0800

49 lines

New Thread

IPC-AJ-820 (April 1997)Assembly and Joining Handbook

IPC-AJ-820 (April 1997)Assembly and Joining Handbook

[log in to unmask]

Wed, 6 Jan 1999 14:59:29 -0800

39 lines

New Thread

JS100 variable capacitor

JS100 variable capacitor

bob smith <[log in to unmask]>

Fri, 22 Jan 1999 09:49:17 -0600

31 lines

Re: JS100 variable capacitor

Stephen R. Gregory <[log in to unmask]>

Fri, 22 Jan 1999 12:25:47 EST

72 lines

New Thread

Kapton Etcing

Kapton Etcing

Glenn Menear <[log in to unmask]>

Fri, 29 Jan 1999 10:17:27 -0700

26 lines

New Thread

Kleenox

Kleenox

Michael D. Doty <[log in to unmask]>

Tue, 19 Jan 1999 20:44:44 -0500

28 lines

New Thread

Laminate suppliers

Re: Laminate suppliers

Joe Felts <[log in to unmask]>

Thu, 7 Jan 1999 17:45:43 -0700

71 lines

Re: Laminate suppliers

Manfred Huschka <[log in to unmask]>

Fri, 8 Jan 1999 02:42:38 -0600

114 lines

New Thread

Laser Cutting Equipment Recommendations Sought

Laser Cutting Equipment Recommendations Sought

[log in to unmask]

Wed, 6 Jan 1999 04:27:41 EST

28 lines

Re: Laser Cutting Equipment Recommendations Sought

jim <[log in to unmask]>

Wed, 6 Jan 1999 08:59:20 -0600

56 lines

Re: Laser Cutting Equipment Recommendations Sought

Paul Klasek <[log in to unmask]>

Thu, 7 Jan 1999 07:30:58 +1100

60 lines

New Thread

Laser depanelization

Laser depanelization

Wade Oberle <[log in to unmask]>

Tue, 26 Jan 1999 15:51:27 -0600

34 lines

Re: Laser depanelization

Stephen R. Gregory <[log in to unmask]>

Tue, 26 Jan 1999 17:27:22 EST

61 lines

Re: Laser depanelization

John Gulley <[log in to unmask]>

Tue, 26 Jan 1999 16:06:56 -0800

84 lines

Re: Laser depanelization

Gary Camac <[log in to unmask]>

Tue, 26 Jan 1999 16:29:49 -0600

59 lines

Re: Laser depanelization

Wade Oberle <[log in to unmask]>

Wed, 27 Jan 1999 08:57:24 -0600

110 lines

Re: Laser depanelization

Ronald D. Schaeffer <[log in to unmask]>

Thu, 28 Jan 1999 12:08:57 -0500

73 lines

Re: Laser depanelization

Russ Winslow <[log in to unmask]>

Wed, 27 Jan 1999 17:59:12 -0800

97 lines

New Thread

laser related hardware F.S.

laser related hardware F.S.

Curt Graber <[log in to unmask]>

Fri, 1 Jan 1999 01:19:46 -0000

164 lines

New Thread

Laser Singulation

Laser Singulation

Wade Oberle <[log in to unmask]>

Wed, 27 Jan 1999 07:42:07 -0600

38 lines

New Thread

Lead Free Survey

Lead Free Survey

Bob Willis <[log in to unmask]>

Wed, 13 Jan 1999 13:58:47 -0000

154 lines

Re: Lead Free Survey

<Joseph M. Webb> <[log in to unmask]>

Wed, 13 Jan 1999 11:18:02 -0500

153 lines

New Thread

Leaky Hybrid Circuits during Aqueous Cleaning

Leaky Hybrid Circuits during Aqueous Cleaning

Michael Forrester <[log in to unmask]>

Tue, 12 Jan 1999 09:38:36 -0500

51 lines

Leaky Hybrid Circuits during Aqueous Cleaning

[log in to unmask]

Tue, 12 Jan 1999 13:24:45 -0600

31 lines

Leaky Hybrid Circuits during Aqueous Cleaning

[log in to unmask]

Wed, 13 Jan 1999 09:17:23 +0100

114 lines

Re: Leaky Hybrid Circuits during Aqueous Cleaning

[log in to unmask]

Tue, 12 Jan 1999 15:09:46 EST

41 lines

New Thread

LittleFuse Components

LittleFuse Components

Wade Oberle <[log in to unmask]>

Fri, 15 Jan 1999 15:29:44 -0600

39 lines

LittleFuse Components

[log in to unmask]

Fri, 15 Jan 1999 16:44:04 -0600

32 lines

Re: LittleFuse Components

David D Hillman <[log in to unmask]>

Mon, 18 Jan 1999 09:31:42 -0600

78 lines

New Thread

LLTC Testing for Micro-vias

LLTC Testing for Micro-vias

Regis Froats <[log in to unmask]>

Mon, 11 Jan 1999 08:46:53 -0800

30 lines

Re: LLTC Testing for Micro-vias

Alderete, Michael <[log in to unmask]>

Mon, 11 Jan 1999 15:54:13 -0800

61 lines

Re: LLTC Testing for Micro-vias

Smith Russell MSM LAPO US <[log in to unmask]>

Tue, 12 Jan 1999 04:22:00 +0100

151 lines

New Thread

Long Term Effects on soldered joints

Long Term Effects on soldered joints

PAT DIAMOND <[log in to unmask]>

Wed, 6 Jan 1999 09:43:18 EMT+0

45 lines

Long Term Effects on soldered joints

[log in to unmask]

Wed, 6 Jan 1999 08:46:08 -0600

35 lines

Re: Long Term Effects on soldered joints

Thibodeau, Chad <[log in to unmask]>

Wed, 6 Jan 1999 08:12:36 -0700

46 lines

New Thread

Looking for Jared Lang

Looking for Jared Lang

Hamilton, Richard -4454 <[log in to unmask]>

Thu, 21 Jan 1999 14:55:54 -0700

29 lines

New Thread

Looking for Ray Iannuzzelli, formerly employed at Digita l Equipment Corporation

Re: Looking for Ray Iannuzzelli, formerly employed at Digita l Equipment Corporation

Gerald G. Gagnon <[log in to unmask]>

Mon, 18 Jan 1999 08:35:12 -0500

78 lines

New Thread

Looking for Ray Iannuzzelli, formerly employed at Digital Equipment Corporation

Looking for Ray Iannuzzelli, formerly employed at Digital Equipment Corporation

Andrew J. Scholand <[log in to unmask]>

Fri, 8 Jan 1999 15:44:03 -0500

36 lines

New Thread

looking for specs

looking for specs

Todd Vorpahl <[log in to unmask]>

Thu, 7 Jan 1999 13:19:09 -0500

36 lines

Re: looking for specs

KELLY M SCHRIVER <[log in to unmask]>

Thu, 7 Jan 1999 15:14:00 -0500

44 lines

New Thread

Looking for: Custom BGA and LTCC

Looking for: Custom BGA and LTCC

[log in to unmask]

Tue, 12 Jan 1999 15:09:56 EST

28 lines

Re: Looking for: Custom BGA and LTCC

Thibodeau, Chad <[log in to unmask]>

Thu, 14 Jan 1999 07:23:17 -0700

63 lines

New Thread

LTCCs with buried caps & res

LTCCs with buried caps & res

Kuan Kuan Ng <[log in to unmask]>

Thu, 21 Jan 1999 18:43:59 +0800

42 lines

LTCCs with buried caps & res

[log in to unmask]

Fri, 22 Jan 1999 10:18:48 +0100

74 lines

New Thread

Manufacturing Software

Manufacturing Software

Rick Thompson <[log in to unmask]>

Thu, 21 Jan 1999 15:15:22 -0800

81 lines

Re: Manufacturing Software

Tenison Stone <[log in to unmask]>

Tue, 26 Jan 1999 10:31:43 -0600

105 lines

Re: Manufacturing Software

Dale Marcum <[log in to unmask]>

Tue, 26 Jan 1999 11:54:50 -0500

114 lines

New Thread

Material Callout

Material Callout

Larry Campbell <[log in to unmask]>

Wed, 6 Jan 1999 16:58:47 -0500

31 lines

Re: Material Callout

KELLY M SCHRIVER <[log in to unmask]>

Thu, 7 Jan 1999 07:42:00 -0500

33 lines

Re: Material Callout

Vaughan, Ralph H <[log in to unmask]>

Thu, 7 Jan 1999 05:35:31 -0800

69 lines

Re: Material Callout

Tom Kropski <[log in to unmask]>

Thu, 7 Jan 1999 07:48:28 -0500

34 lines

New Thread

Material Supplier

Material Supplier

Duckworth, Randy - LYPME <[log in to unmask]>

Mon, 11 Jan 1999 07:53:22 -0500

38 lines

New Thread

Materials qualification (SIR, copper mirror test,...)

Materials qualification (SIR, copper mirror test,...)

SCHILDEI <[log in to unmask]>

Fri, 22 Jan 1999 15:08:17 +0200

37 lines

New Thread

Methods for Stiffening a PWB

Methods for Stiffening a PWB

[log in to unmask]

Tue, 5 Jan 1999 07:44:55 +0000

44 lines

Re: Methods for Stiffening a PWB

David Jandzinski <[log in to unmask]>

Tue, 5 Jan 1999 08:17:49 -0700

81 lines

Re: Methods for Stiffening a PWB

[log in to unmask]

Tue, 5 Jan 1999 09:50:32 +0000

38 lines

Re: Methods for Stiffening a PWB

jim <[log in to unmask]>

Tue, 5 Jan 1999 10:34:38 -0600

67 lines

Re: Methods for Stiffening a PWB

Leslie O. Connally <[log in to unmask]>

Tue, 5 Jan 1999 10:41:03 -0600

69 lines

Re: Methods for Stiffening a PWB

KELLY M SCHRIVER <[log in to unmask]>

Tue, 5 Jan 1999 10:47:00 -0500

47 lines

Methods for Stiffening a PWB

[log in to unmask]

Tue, 5 Jan 1999 14:05:11 -0600

45 lines

Re: Methods for Stiffening a PWB

Leslie O. Connally <[log in to unmask]>

Tue, 5 Jan 1999 15:31:37 -0600

102 lines

Methods for Stiffening a PWB

[log in to unmask]

Tue, 5 Jan 1999 16:05:26 -0600

42 lines

Re: Methods for Stiffening a PWB

Andy Magee <[log in to unmask]>

Fri, 8 Jan 1999 20:59:52 -0500

43 lines

New Thread

Micro-strip and Controlled Impedance

Micro-strip and Controlled Impedance

Kimmey, Frank <[log in to unmask]>

Fri, 8 Jan 1999 10:25:33 -0800

44 lines

Micro-strip and Controlled Impedance

[log in to unmask]

Fri, 8 Jan 1999 13:36:11 -0600

43 lines

Re: Micro-strip and Controlled Impedance

<Andy Slade> <[log in to unmask]>

Fri, 8 Jan 1999 14:22:44 -0500

83 lines

Re: Micro-strip and Controlled Impedance

Gary Ferrari <[log in to unmask]>

Fri, 8 Jan 1999 18:02:02 EST

37 lines

Re: Micro-strip and Controlled Impedance

Jeff Seeger <[log in to unmask]>

Fri, 8 Jan 1999 19:13:55 -0500

64 lines

Re: Micro-strip and Controlled Impedance

[log in to unmask]

Fri, 8 Jan 1999 18:37:31 -0600

37 lines

Re: Micro-strip and Controlled Impedance

[log in to unmask]

Fri, 8 Jan 1999 19:53:30 -0600

80 lines

New Thread

MPM solder Paste dryness and cartridge dispenser

MPM solder Paste dryness and cartridge dispenser

[log in to unmask]

Tue, 19 Jan 1999 09:46:12 -0700

62 lines

Re: MPM solder Paste dryness and cartridge dispenser

Wade Oberle <[log in to unmask]>

Tue, 19 Jan 1999 11:47:47 -0600

106 lines

Re: MPM solder Paste dryness and cartridge dispenser

John Chandler <[log in to unmask]>

Tue, 19 Jan 1999 10:10:22 +0100

79 lines

MPM solder Paste dryness and cartridge dispenser

Jeff Hempton <[log in to unmask]>

Tue, 19 Jan 1999 13:24:55 -0500

77 lines

MPM solder Paste dryness and cartridge dispenser

Jeff Hempton <[log in to unmask]>

Tue, 19 Jan 1999 13:19:30 -0500

94 lines

Re: MPM solder Paste dryness and cartridge dispenser

Matthew Park <[log in to unmask]>

Tue, 19 Jan 1999 14:13:49 -0800

98 lines

New Thread

MTG: Powering Digital Boards - Distribution and Performance

MTG: Powering Digital Boards - Distribution and Performance

Jeff Seeger <[log in to unmask]>

Fri, 29 Jan 1999 04:44:56 -0500

103 lines

New Thread

Muromoto AirTools

Muromoto AirTools

Lik-Jen Wu <[log in to unmask]>

Tue, 26 Jan 1999 11:33:52 -0500

28 lines

New Thread

NE Ohio Desigers Council Feb 3 Meeting

NE Ohio Desigers Council Feb 3 Meeting

Dave Artman <[log in to unmask]>

Fri, 29 Jan 1999 15:47:26 -0500

60 lines

New Thread

Need info on reeled smd component counters

Need info on reeled smd component counters

Raul Cantero <[log in to unmask]>

Fri, 29 Jan 1999 13:06:45 -0600

35 lines

Re: Need info on reeled smd component counters

Lustig, Steven K.. <[log in to unmask]>

Fri, 29 Jan 1999 14:28:41 -0500

74 lines

Re: Need info on reeled smd component counters

Stephen R. Gregory <[log in to unmask]>

Fri, 29 Jan 1999 14:33:21 EST

54 lines

New Thread

Need to obtain the best PWB manufacturer...

Need to obtain the best PWB manufacturer...

William Keeton <[log in to unmask]>

Wed, 20 Jan 1999 08:35:19 -0600

32 lines

Re: Need to obtain the best PWB manufacturer...

Robert D. Green <[log in to unmask]>

Wed, 20 Jan 1999 10:02:49 -0500

56 lines

Re: Need to obtain the best PWB manufacturer...

Paul Gould <[log in to unmask]>

Wed, 20 Jan 1999 20:00:35 -0000

58 lines

New Thread

NEPCON / Legends of the TechNet

NEPCON / Legends of the TechNet

Matthias Mansfeld <[log in to unmask]>

Thu, 28 Jan 1999 04:10:39 +0100

41 lines

New Thread

NEPCON Get-Together

NEPCON Get-Together

McMonagle, Michael R. <[log in to unmask]>

Wed, 27 Jan 1999 08:07:18 -0600

36 lines

New Thread

NEPCON?

NEPCON?

McMonagle, Michael R. <[log in to unmask]>

Tue, 26 Jan 1999 09:53:37 -0600

35 lines

Re: NEPCON?

Hamilton, Richard -4454 <[log in to unmask]>

Tue, 26 Jan 1999 09:36:51 -0700

42 lines

NEPCON?

Jeff Hempton <[log in to unmask]>

Tue, 26 Jan 1999 11:23:01 -0500

69 lines

Re: NEPCON?

Robert D. Green <[log in to unmask]>

Tue, 26 Jan 1999 13:48:52 -0500

85 lines

Re: NEPCON?

[log in to unmask]

Tue, 26 Jan 1999 15:12:49 EST

23 lines

Re: Nepcon?

[log in to unmask]

Tue, 26 Jan 1999 15:43:13 -0600

30 lines

Re: NEPCON?

Jack Crawford <[log in to unmask]>

Tue, 26 Jan 1999 22:37:03 -0600

69 lines

New Thread

New Exam Date: Designer Certification

New Exam Date: Designer Certification

MaryEllen Hilderbrand <[log in to unmask]>

Mon, 11 Jan 1999 11:22:00 -0600

64 lines

New Thread

Ni-Fe alloy plating solution

Ni-Fe alloy plating solution

nishath yasmeen <[log in to unmask]>

Wed, 20 Jan 1999 11:19:34 -0600

27 lines

New Thread

Nickel-Gold problem

Nickel-Gold problem

Orna and Yehuda <[log in to unmask]>

Thu, 7 Jan 1999 10:49:08 +0200

133 lines

New Thread

No Clean Process

No Clean Process

Don E Steffen <[log in to unmask]>

Fri, 29 Jan 1999 06:23:33 -0500

72 lines

New Thread

NOTICE: Annual Meeting of the PNW Chapter of the IPC Designers Council

NOTICE: Annual Meeting of the PNW Chapter of the IPC Designers Council

Jim Yohe <[log in to unmask]>

Tue, 5 Jan 1999 22:17:02 -0800

53 lines

New Thread

Obsolete Varactor Diodes

Obsolete Varactor Diodes

Thibodeau, Chad <[log in to unmask]>

Thu, 14 Jan 1999 14:39:42 -0700

37 lines

Re: Obsolete Varactor Diodes

Sauer, Steven T. <[log in to unmask]>

Fri, 15 Jan 1999 12:36:00 E

27 lines

Re: Obsolete Varactor Diodes

Richard Martin <[log in to unmask]>

Fri, 15 Jan 1999 09:06:58 -0000

74 lines

Re: Obsolete Varactor Diodes

Nicholas Kane <[log in to unmask]>

Wed, 27 Jan 1999 12:11:19 +1100

70 lines

New Thread

One more thing on Double side reflow

One more thing on Double side reflow

Wade Oberle <[log in to unmask]>

Mon, 18 Jan 1999 09:18:25 -0600

34 lines

Re: One more thing on Double side reflow

Finlay Buchan <[log in to unmask]>

Tue, 19 Jan 1999 12:06:13 -0000

99 lines

New Thread

Orange Rust around solder joints

Orange Rust around solder joints

Paul Wareham <[log in to unmask]>

Fri, 15 Jan 1999 17:00:29 -0400

84 lines

Re: Orange Rust around solder joints

David D Hillman <[log in to unmask]>

Mon, 18 Jan 1999 10:13:03 -0600

112 lines

Re: Orange Rust around solder joints

SEM Lab, Inc. <[log in to unmask]>

Mon, 18 Jan 1999 11:04:13 -0600

77 lines

New Thread

ORC Exposure Machine

Re: ORC Exposure Machine

Joseph V Curcio <[log in to unmask]>

Fri, 29 Jan 1999 06:41:16 -0800

43 lines

New Thread

Orietation of DIP IC for Solder Wave

Orietation of DIP IC for Solder Wave

Tom Braswell <[log in to unmask]>

Mon, 11 Jan 1999 16:32:43 -0500

49 lines

Re: Orietation of DIP IC for Solder Wave

Gary Camac <[log in to unmask]>

Mon, 11 Jan 1999 15:52:21 -0600

69 lines

Re: Orietation of DIP IC for Solder Wave

Angie Marques <[log in to unmask]>

Mon, 11 Jan 1999 14:27:14 -0800

74 lines

Re: Orietation of DIP IC for Solder Wave

<Charles Barker> <[log in to unmask]>

Mon, 11 Jan 1999 16:38:20 -0600

102 lines

Re: Orietation of DIP IC for Solder Wave

Mark Ross <[log in to unmask]>

Mon, 11 Jan 1999 23:03:52 -0500

92 lines

New Thread

Packages

Packages

Victor Romeo <[log in to unmask]>

Sat, 2 Jan 1999 12:29:35 +0000

30 lines

Re: Packages

Bill Davis <[log in to unmask]>

Mon, 4 Jan 1999 07:42:32 -0800

56 lines

Re: Packages

Jeremy Drake <[log in to unmask]>

Mon, 4 Jan 1999 09:12:44 +0000

68 lines

Re: Packages

Ian Squires <[log in to unmask]>

Mon, 4 Jan 1999 09:41:06 PST

64 lines

New Thread

Palladium underplate for Cu-Ni-Au system

Palladium underplate for Cu-Ni-Au system

Au Po Lam, Benny <[log in to unmask]>

Fri, 29 Jan 1999 15:13:50 +0800

37 lines

Re: Palladium underplate for Cu-Ni-Au system

Eric Yakobson <[log in to unmask]>

Fri, 29 Jan 1999 13:56:39 -0500

77 lines

New Thread

Panasonic MV100 problems?

Panasonic MV100 problems?

Jeff Hempton <[log in to unmask]>

Mon, 4 Jan 1999 09:05:25 -0500

72 lines

New Thread

Parts for Amistar CI3000

Parts for Amistar CI3000

Wade Oberle <[log in to unmask]>

Thu, 28 Jan 1999 15:30:51 -0600

36 lines

Re: Parts for Amistar CI3000

Matthew Park <[log in to unmask]>

Thu, 28 Jan 1999 13:51:50 -0800

70 lines

New Thread

PCB defect

PCB defect

<Ashok Tiwari> <[log in to unmask]>

Tue, 26 Jan 1999 15:34:02 -0800

28 lines

Re: PCB defect

[log in to unmask]

Wed, 27 Jan 1999 08:20:07 EST

29 lines

New Thread

PCB Design Vacancy

PCB Design Vacancy

Gene Holmes <[log in to unmask]>

Tue, 5 Jan 1999 11:53:09 +0000

30 lines

New Thread

pcb makers in Japan

pcb makers in Japan

William E. Johnson <[log in to unmask]>

Wed, 6 Jan 1999 17:40:10 -0800

25 lines

New Thread

PCB Vendors (UC)

PCB Vendors (UC)

Lum Wee Mei <[log in to unmask]>

Wed, 27 Jan 1999 16:20:28 +0800

33 lines

New Thread

PCB Warping Estimate

PCB Warping Estimate

Andy Magee <[log in to unmask]>

Sat, 9 Jan 1999 09:28:15 -0500

49 lines

Re: PCB Warping Estimate

Andy Magee <[log in to unmask]>

Mon, 11 Jan 1999 22:13:11 -0500

65 lines

New Thread

Peretti from Neopost Industrie

Peretti from Neopost Industrie

ELECTRONIQUE <[log in to unmask]>

Fri, 29 Jan 1999 13:46:49 +-100

38 lines

New Thread

PHOSPHORIC ACID ANODIZE

PHOSPHORIC ACID ANODIZE

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 6 Jan 1999 08:22:00 -0500

29 lines

New Thread

Photoresist stripping chemicals

Photoresist stripping chemicals

Thornton White <[log in to unmask]>

Tue, 26 Jan 1999 12:28:01 +1300

28 lines

Re: Photoresist stripping chemicals

<Rudy Sedlak> <[log in to unmask]>

Mon, 25 Jan 1999 21:18:23 EST

27 lines

Re: Photoresist stripping chemicals

Eltek Ltd. - Process Engineering <[log in to unmask]>

Tue, 26 Jan 1999 07:31:16 +0200

62 lines

New Thread

pinholes

pinholes

annie laberge <[log in to unmask]>

Wed, 6 Jan 1999 09:29:29 -0500

43 lines

Re: pinholes

jim <[log in to unmask]>

Wed, 6 Jan 1999 09:02:22 -0600

71 lines

pinholes

[log in to unmask]

Wed, 6 Jan 1999 09:25:05 -0600

43 lines

Re: pinholes

annie laberge <[log in to unmask]>

Wed, 6 Jan 1999 13:30:58 -0500

97 lines

Re: pinholes

Jerry Hoppke <[log in to unmask]>

Wed, 6 Jan 1999 13:09:15 -0600

115 lines

pinholes

[log in to unmask]

Wed, 6 Jan 1999 13:29:59 -0600

42 lines

Re: pinholes

KELLY M SCHRIVER <[log in to unmask]>

Wed, 6 Jan 1999 13:15:00 -0500

45 lines

Re: pinholes

David D Hillman <[log in to unmask]>

Wed, 6 Jan 1999 17:05:46 -0600

87 lines

New Thread

Pips on plastic Surface Mount connectors

Pips on plastic Surface Mount connectors

Edward Brunker <[log in to unmask]>

Wed, 13 Jan 1999 08:37:56 GMT

33 lines

New Thread

Plating of laser drilled vias

Re: Plating of laser drilled vias

[log in to unmask]

Fri, 1 Jan 1999 02:28:32 EST

30 lines

Plating of laser drilled vias

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 6 Jan 1999 07:46:58 +0200

37 lines

Re: Plating of laser drilled vias

Nelson, John <[log in to unmask]>

Wed, 6 Jan 1999 07:59:15 -0500

62 lines

Re: Plating of laser drilled vias

<Rudy Sedlak> <[log in to unmask]>

Wed, 6 Jan 1999 08:59:54 EST

35 lines

Re: Plating of laser drilled vias

Leslie O. Connally <[log in to unmask]>

Wed, 6 Jan 1999 09:05:43 -0600

81 lines

Re: Plating of laser drilled vias

[log in to unmask]

Wed, 6 Jan 1999 11:23:14 EST

28 lines

Re: Plating of laser drilled vias

[log in to unmask]

Wed, 6 Jan 1999 11:19:48 EST

27 lines

Re: Plating of laser drilled vias

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 7 Jan 1999 14:41:37 +0200

59 lines

New Thread

Porous copper deposits

Porous copper deposits

nishath yasmeen <[log in to unmask]>

Tue, 5 Jan 1999 14:57:32 -0600

29 lines

Re: Porous copper deposits

Meigs, Jonathan <[log in to unmask]>

Wed, 6 Jan 1999 06:25:33 -0700

68 lines

New Thread

Prepreg properties

Prepreg properties

MEIR NOGA <[log in to unmask]>

Sun, 17 Jan 1999 08:45:29 +0200

37 lines

Prepreg properties

[log in to unmask]

Sun, 17 Jan 1999 07:13:49 -0600

46 lines

New Thread

Programmed parts in sockets

Programmed parts in sockets

Raul Cantero <[log in to unmask]>

Thu, 7 Jan 1999 16:46:27 -0600

32 lines

Re: Programmed parts in sockets

Evan D Jones <[log in to unmask]>

Fri, 8 Jan 1999 11:54:09 +1000

101 lines

New Thread

Programmed parts in sockets -Reply

Programmed parts in sockets -Reply

Matthew Park <[log in to unmask]>

Thu, 7 Jan 1999 15:06:27 -0800

68 lines

New Thread

pull-test to QFP and BGA

pull-test to QFP and BGA

Jos Alejandro Becerra Chiu <[log in to unmask]>

Fri, 22 Jan 1999 14:04:18 -0600

37 lines

Re: pull-test to QFP and BGA

Jos Alejandro Becerra Chiu <[log in to unmask]>

Fri, 22 Jan 1999 15:24:07 -0600

37 lines

Re: pull-test to QFP and BGA

Werner Engelmaier <[log in to unmask]>

Fri, 22 Jan 1999 15:52:36 EST

43 lines

New Thread

Pulse Plating

Pulse Plating

[log in to unmask]

Tue, 26 Jan 1999 15:21:41 EST

27 lines

Re: Pulse Plating

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 27 Jan 1999 10:08:55 +0200

61 lines

Re: Pulse Plating

[log in to unmask]

Thu, 28 Jan 1999 01:06:43 EST

23 lines

New Thread

PUMICE SCRUBBER

PUMICE SCRUBBER

Modular Components National, Inc. <[log in to unmask]>

Mon, 11 Jan 1999 09:40:50 -0500

44 lines

Re: PUMICE SCRUBBER

Roland Jaquet <[log in to unmask]>

Tue, 12 Jan 1999 12:54:10 +0100

136 lines

Re: PUMICE SCRUBBER

Nelson, John <[log in to unmask]>

Tue, 12 Jan 1999 07:56:35 -0500

31 lines

Re: PUMICE SCRUBBER

Smith Russell MSM LAPO US <[log in to unmask]>

Tue, 12 Jan 1999 18:12:00 +0100

126 lines

New Thread

punchability measurement

punchability measurement

th_yeo <[log in to unmask]>

Fri, 8 Jan 1999 08:21:51 +0800

55 lines

New Thread

PWA Routing

PWA Routing

Darrel Therriault <[log in to unmask]>

Thu, 28 Jan 1999 13:25:38 -0800

41 lines

Re: PWA Routing

<Mary Smoot> <[log in to unmask]>

Fri, 29 Jan 1999 07:55:08 -0500

83 lines

New Thread

PWB Trays - Who's your source?

PWB Trays - Who's your source?

Hinners, Hans - LYPME <[log in to unmask]>

Wed, 13 Jan 1999 15:42:07 -0500

44 lines

New Thread

PWB Warping

PWB Warping

Vascukynas, Brian <[log in to unmask]>

Fri, 8 Jan 1999 16:03:56 -0500

49 lines

PWB Warping

[log in to unmask]

Fri, 8 Jan 1999 16:00:41 -0600

33 lines

Re: PWB Warping

KELLY M SCHRIVER <[log in to unmask]>

Fri, 8 Jan 1999 16:19:00 -0500

53 lines

Re: PWB Warping

jim <[log in to unmask]>

Mon, 11 Jan 1999 08:14:41 -0600

77 lines

Re: PWB Warping

Joseph Lam <[log in to unmask]>

Tue, 12 Jan 1999 09:03:34 +1100

116 lines

Re: PWB Warping

Energy Technology Systems <[log in to unmask]>

Mon, 11 Jan 1999 16:46:22 -0800

162 lines

Re: PWB Warping

<Mary Smoot> <[log in to unmask]>

Tue, 12 Jan 1999 10:25:04 -0500

165 lines

New Thread

Re-heats

Re-heats

Kenny Bloomquist <[log in to unmask]>

Tue, 19 Jan 1999 06:28:15 -0800

36 lines

Re-heats

[log in to unmask]

Wed, 20 Jan 1999 07:11:14 -0600

29 lines

Re: Re-heats

[log in to unmask]

Wed, 20 Jan 1999 09:02:20 EST

35 lines

New Thread

Real Time X-Ray Services

Real Time X-Ray Services

accu-suzannef <[log in to unmask]>

Tue, 12 Jan 1999 12:29:26 -0800

136 lines

New Thread

Reel Orientation Std

Reel Orientation Std

[log in to unmask]

Thu, 21 Jan 1999 09:08:00 -0800

27 lines

Re: Reel Orientation Std

Lisa Putnam <[log in to unmask]>

Thu, 21 Jan 1999 14:45:04 -0800

56 lines

Re: Reel Orientation Std

Evan D Jones <[log in to unmask]>

Fri, 22 Jan 1999 10:17:24 +1000

70 lines

New Thread

Reliability > Steam Test ? ; & destaticising p/carbon .

Reliability > Steam Test ? ; & destaticising p/carbon .

Paul Klasek <[log in to unmask]>

Tue, 5 Jan 1999 09:05:15 +1100

65 lines

Re: Reliability > Steam Test ? ; & destaticising p/carbon .

Stephen R. Gregory <[log in to unmask]>

Mon, 4 Jan 1999 21:20:54 EST

97 lines

Re: Reliability > Steam Test ? ; & destaticising p/carbon .

Bev Christian <[log in to unmask]>

Tue, 5 Jan 1999 08:21:28 -0500

119 lines

New Thread

Reliability Software

Reliability Software

Relex <[log in to unmask]>

Fri, 8 Jan 1999 09:23:31 -0800

75 lines

New Thread

Removal of Lead

Removal of Lead

Don E Steffen <[log in to unmask]>

Fri, 29 Jan 1999 06:00:10 -0500

38 lines

Re: Removal of Lead

James, Chris <[log in to unmask]>

Fri, 29 Jan 1999 11:57:52 -0000

76 lines

Re: Removal of Lead

David D Hillman <[log in to unmask]>

Fri, 29 Jan 1999 06:08:29 -0600

76 lines

Re: Removal of Lead

Circuit Connect <[log in to unmask]>

Fri, 29 Jan 1999 08:41:54 -0500

114 lines

Re: Removal of Lead

David Whalley <[log in to unmask]>

Fri, 29 Jan 1999 15:49:43 +0000

58 lines

Re: Removal of Lead

Circuit Connect <[log in to unmask]>

Thu, 28 Jan 1999 12:31:01 -0500

92 lines

Re: Removal of Lead

Stephen R. Gregory <[log in to unmask]>

Fri, 29 Jan 1999 21:04:27 EST

74 lines

Re: Removal of Lead

Circuit Connect <[log in to unmask]>

Fri, 29 Jan 1999 10:08:38 -0500

164 lines

Re: Removal of Lead

Gary Camac <[log in to unmask]>

Fri, 29 Jan 1999 16:57:16 -0600

84 lines

Re: Removal of Lead

Circuit Connect <[log in to unmask]>

Fri, 29 Jan 1999 12:27:16 -0500

78 lines

Re: Removal of Lead

Werner Engelmaier <[log in to unmask]>

Fri, 29 Jan 1999 14:49:47 EST

35 lines

Re: Removal of Lead

Circuit Connect <[log in to unmask]>

Fri, 29 Jan 1999 10:26:21 -0500

227 lines

Re: Removal of Lead

Paul Klasek <[log in to unmask]>

Mon, 1 Feb 1999 11:50:54 +1100

162 lines

New Thread

remove

remove

James Campo <[log in to unmask]>

Fri, 8 Jan 1999 19:32:04 -0500

25 lines

New Thread

Repair knife

Repair knife

Paul Gould <[log in to unmask]>

Wed, 6 Jan 1999 16:00:56 -0000

40 lines

Re: Repair knife

George Toman <[log in to unmask]>

Thu, 7 Jan 1999 08:42:33 -0500

55 lines

Re: Repair knife

James, Chris <[log in to unmask]>

Thu, 7 Jan 1999 14:32:21 -0000

93 lines

Re: Repair knife

Eltek Ltd. - Process Engineering <[log in to unmask]>

Sun, 10 Jan 1999 11:08:49 +0200

65 lines

New Thread

Re[2]: [TN] One more thing on Double side reflow

Re: Re[2]: [TN] One more thing on Double side reflow

Finlay Buchan <[log in to unmask]>

Wed, 20 Jan 1999 12:43:05 -0000

216 lines

Re: Re[2]: [TN] One more thing on Double side reflow

jim <[log in to unmask]>

Wed, 20 Jan 1999 10:22:13 -0600

176 lines

New Thread

RF Materials

RF Materials

KELLY M SCHRIVER <[log in to unmask]>

Thu, 28 Jan 1999 16:14:00 -0500

31 lines

Re: RF Materials

Matthew Park <[log in to unmask]>

Thu, 28 Jan 1999 15:02:11 -0800

69 lines

Re: RF Materials

Keith Larson <[log in to unmask]>

Thu, 28 Jan 1999 17:06:48 -0600

149 lines

RF Materials

[log in to unmask]

Thu, 28 Jan 1999 17:11:24 -0600

35 lines

Re: RF Materials

Manfred Huschka <[log in to unmask]>

Fri, 29 Jan 1999 03:22:04 -0600

82 lines

Re: RF Materials

Yvon Hache <[log in to unmask]>

Fri, 29 Jan 1999 09:44:27 -0400

40 lines

Re: RF Materials

Manfred Huschka <[log in to unmask]>

Sat, 30 Jan 1999 06:16:08 -0600

100 lines

New Thread

RF PCB Artwork?

RF PCB Artwork?

In-myung Song <[log in to unmask]>

Tue, 12 Jan 1999 09:21:02 +0900

31 lines

New Thread

Rigid PWB, ICT probe pad air gap requirements

Rigid PWB, ICT probe pad air gap requirements

Doug Shawver <[log in to unmask]>

Tue, 19 Jan 1999 14:51:06 -0500

61 lines

Re: Rigid PWB, ICT probe pad air gap requirements

Jeff Seeger <[log in to unmask]>

Tue, 19 Jan 1999 16:31:21 -0500

73 lines

Re: Rigid PWB, ICT probe pad air gap requirements

Robert D. Green <[log in to unmask]>

Wed, 20 Jan 1999 08:39:59 -0500

111 lines

New Thread

Rigid-Flex Assembly

Rigid-Flex Assembly

Charles Barker <[log in to unmask]>

Fri, 8 Jan 1999 11:25:47 -0600

38 lines

New Thread

RO recycling system problems

Re: RO recycling system problems

Robert E. Mesick <[log in to unmask]>

Wed, 20 Jan 1999 14:30:42 -0800

66 lines

New Thread

RS274X format out of Cadence Allegro

RS274X format out of Cadence Allegro

Ken Patel <[log in to unmask]>

Mon, 18 Jan 1999 11:26:40 -0800

34 lines

RS274X format out of Cadence Allegro

Thomas Martin <[log in to unmask]>

Mon, 18 Jan 1999 16:52:37 -0500

36 lines

New Thread

Schlumberger ATE For Sale.

Schlumberger ATE For Sale.

Keith Bridgen <[log in to unmask]>

Mon, 25 Jan 1999 09:06:51 +1100

44 lines

New Thread

Screen for fine pitch parts

Screen for fine pitch parts

Thomas Burek <[log in to unmask]>

Fri, 8 Jan 1999 15:31:58 -0500

35 lines

Re: Screen for fine pitch parts

Gary Camac <[log in to unmask]>

Sat, 9 Jan 1999 10:17:35 -0600

44 lines

Re: Screen for fine pitch parts

<Charles Barker> <[log in to unmask]>

Mon, 11 Jan 1999 16:48:06 -0600

61 lines

New Thread

search for IPC micro via guidelines

search for IPC micro via guidelines

[log in to unmask]

Fri, 8 Jan 1999 12:35:00 -0800

30 lines

Re: search for IPC micro via guidelines

Timothy A. Estes <[log in to unmask]>

Fri, 8 Jan 1999 15:06:19 -0700

66 lines

New Thread

seeking aluminum wedge bonding advice

seeking aluminum wedge bonding advice

Phil Hersey <[log in to unmask]>

Wed, 27 Jan 1999 16:28:21 -0800

33 lines

seeking aluminum wedge bonding advice

[log in to unmask]

Thu, 28 Jan 1999 08:30:18 +0100

85 lines

Re: seeking aluminum wedge bonding advice

Jeremy Drake <[log in to unmask]>

Thu, 28 Jan 1999 08:59:09 +0000

91 lines

Re: seeking aluminum wedge bonding advice

Phil Hersey <[log in to unmask]>

Fri, 29 Jan 1999 13:42:47 -0800

130 lines

New Thread

Sequential lamination / Via Damming materials

Sequential lamination / Via Damming materials

Thomas Colombo <[log in to unmask]>

Thu, 21 Jan 1999 10:31:36 PST

26 lines

Re: Sequential lamination / Via Damming materials

Howard Lin <[log in to unmask]>

Fri, 22 Jan 1999 17:09:53 +0800

52 lines

New Thread

SERA

SERA

Wade Oberle <[log in to unmask]>

Tue, 19 Jan 1999 11:53:59 -0600

32 lines

Re: SERA

David D Hillman <[log in to unmask]>

Tue, 19 Jan 1999 12:29:56 -0600

73 lines

Re: SERA

Bev Christian <[log in to unmask]>

Tue, 19 Jan 1999 15:02:20 -0500

62 lines

Re: SERA

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 20 Jan 1999 07:46:37 +0200

62 lines

New Thread

Silk-Screen registration Spec/ Pad Contamination

Silk-Screen registration Spec/ Pad Contamination

fawnec <[log in to unmask]>

Mon, 11 Jan 1999 12:49:08 -0500

33 lines

Re: Silk-Screen registration Spec/ Pad Contamination

Jerome Schwartz x5474 <[log in to unmask]>

Mon, 11 Jan 1999 12:50:43 -0500

75 lines

New Thread

Simulation before PCB manufacturing?

Simulation before PCB manufacturing?

In-myung Song <[log in to unmask]>

Mon, 4 Jan 1999 10:49:02 +0900

33 lines

Re: Simulation before PCB manufacturing?

Mark Ross <[log in to unmask]>

Mon, 4 Jan 1999 18:56:15 -0500

52 lines

Re: Simulation before PCB manufacturing?

David Muscat <[log in to unmask]>

Tue, 5 Jan 1999 15:47:37 +1100

172 lines

Re: Simulation before PCB manufacturing?

Short Joe <[log in to unmask]>

Mon, 11 Jan 1999 09:49:18 -0000

94 lines

New Thread

single process initiative (SPI) 55110 to 6012

single process initiative (SPI) 55110 to 6012

Ron Payne <[log in to unmask]>

Tue, 5 Jan 1999 17:19:38 -0800

27 lines

New Thread

Single sided flex

Single sided flex

Severson, Scott M. <[log in to unmask]>

Tue, 26 Jan 1999 10:32:37 -0600

30 lines

New Thread

slot drill

slot drill

Ken Brown <[log in to unmask]>

Thu, 21 Jan 1999 08:23:44 -0500

38 lines

Re: slot drill

Leslie O. Connally <[log in to unmask]>

Fri, 22 Jan 1999 08:28:11 -0600

64 lines

Re: slot drill

Wilmer, Craig <[log in to unmask]>

Fri, 22 Jan 1999 10:04:52 -0600

99 lines

New Thread

SMT land pattern standards?

SMT land pattern standards?

Matthew Lamkin <[log in to unmask]>

Thu, 21 Jan 1999 08:07:12 -0000

63 lines

Re: SMT land pattern standards?

Hiteshew, Michael <[log in to unmask]>

Thu, 21 Jan 1999 09:13:35 -0600

108 lines

Re: SMT land pattern standards?

Gary Ferrari <[log in to unmask]>

Thu, 21 Jan 1999 10:58:13 EST

37 lines

Re: SMT land pattern standards?

Wilmer, Craig <[log in to unmask]>

Thu, 21 Jan 1999 11:08:16 -0600

74 lines

SMT land pattern standards?

Jeff Hempton <[log in to unmask]>

Thu, 21 Jan 1999 11:53:57 -0500

111 lines

Re: SMT land pattern standards?

Hamilton, Richard -4454 <[log in to unmask]>

Thu, 21 Jan 1999 11:20:26 -0700

105 lines

Re: SMT land pattern standards?

Matthias Mansfeld <[log in to unmask]>

Thu, 21 Jan 1999 20:32:06 +0100

54 lines

New Thread

SMT Machine Operator Training?

SMT Machine Operator Training?

Rick Thompson <[log in to unmask]>

Thu, 7 Jan 1999 14:30:54 -0800

44 lines

Re: SMT Machine Operator Training?

Vanderhoof, Brad <[log in to unmask]>

Thu, 7 Jan 1999 19:55:58 -0800

87 lines

New Thread

SMT v.s. Through hole trade studies

SMT v.s. Through hole trade studies

[log in to unmask]

Mon, 4 Jan 1999 15:10:08 -0600

30 lines

SMT v.s. Through Hole trade studies

Greg Sherwood <[log in to unmask]>

Tue, 5 Jan 1999 05:37:01 PST

34 lines

New Thread

Software to simulate packing drop test

Software to simulate packing drop test

Ken Fong <[log in to unmask]>

Tue, 5 Jan 1999 11:03:56 +0800

33 lines

New Thread

SOIC solder joint integrity

SOIC solder joint integrity

Jerry Hoppke <[log in to unmask]>

Mon, 4 Jan 1999 14:17:30 -0600

31 lines

Re: SOIC solder joint integrity

Guenter Grossmann <[log in to unmask]>

Wed, 6 Jan 1999 17:10:44 +0100

44 lines

Re: SOIC solder joint integrity

Bev Christian <[log in to unmask]>

Fri, 8 Jan 1999 08:42:48 -0500

78 lines

New Thread

Solder "movement"

Solder "movement"

PAT DIAMOND <[log in to unmask]>

Wed, 13 Jan 1999 08:21:41 EMT+0

32 lines

Re: Solder "movement"

Phil Hinton <[log in to unmask]>

Wed, 13 Jan 1999 14:27:16 EST

32 lines

New Thread

Solder Filled Thermal Vias

Solder Filled Thermal Vias

[log in to unmask]

Tue, 5 Jan 1999 13:44:04 -0600

42 lines

Solder Filled Thermal Vias

[log in to unmask]

Wed, 6 Jan 1999 13:43:41 -0600

40 lines

Re: Solder Filled Thermal Vias

KELLY M SCHRIVER <[log in to unmask]>

Wed, 6 Jan 1999 14:42:00 -0500

35 lines

New Thread

Solder fountain devices and BGA/Fine pitch repair/rework stations

Solder fountain devices and BGA/Fine pitch repair/rework stations

[log in to unmask]

Thu, 21 Jan 1999 08:33:53 -0600

44 lines

Re: Solder fountain devices and BGA/Fine pitch repair/rework stations

Wade Oberle <[log in to unmask]>

Thu, 21 Jan 1999 08:59:04 -0600

95 lines

Re: Solder fountain devices and BGA/Fine pitch repair/rework stations

Rick Thompson <[log in to unmask]>

Thu, 21 Jan 1999 08:39:15 -0800

121 lines

New Thread

solder fountain process

Re: solder fountain process

Iain Braddock <[log in to unmask]>

Tue, 5 Jan 1999 16:12:41 +0000

80 lines

New Thread

Solder Metallurgy

Solder Metallurgy

Roger Massey-G14195 <[log in to unmask]>

Fri, 8 Jan 1999 11:50:17 +0000

34 lines

Re: Solder Metallurgy

David D Hillman <[log in to unmask]>

Fri, 8 Jan 1999 06:57:42 -0600

78 lines

Re: Solder Metallurgy

Jan F. Merstrand <[log in to unmask]>

Fri, 8 Jan 1999 14:29:08 +0100

60 lines

New Thread

Solder Paste Application

Solder Paste Application

Hamilton, Richard -4454 <[log in to unmask]>

Mon, 4 Jan 1999 10:16:41 -0700

34 lines

Re: Solder Paste Application

Wade Oberle <[log in to unmask]>

Mon, 4 Jan 1999 16:04:13 -0600

79 lines

Re: Solder Paste Application

Stephen R. Gregory <[log in to unmask]>

Mon, 4 Jan 1999 17:25:25 EST

96 lines

Re: Solder Paste Application

ajay agarwal <[log in to unmask]>

Mon, 4 Jan 1999 14:43:54 PST

111 lines

New Thread

Solder Wick Specification

Solder Wick Specification

[log in to unmask]

Fri, 15 Jan 1999 10:57:31 EST

29 lines

New Thread

Solderability Testing

Solderability Testing

Wade Oberle <[log in to unmask]>

Fri, 15 Jan 1999 15:22:29 -0600

46 lines

Re: Solderability Testing

Scott Mcanall <[log in to unmask]>

Fri, 15 Jan 1999 18:47:12 EST

57 lines

Re: Solderability Testing

David D Hillman <[log in to unmask]>

Fri, 15 Jan 1999 17:35:08 -0600

146 lines

New Thread

Soldering Bar Comsumption at wave solder machine??

Soldering Bar Comsumption at wave solder machine??

Ruben Irizarry <[log in to unmask]>

Tue, 19 Jan 1999 17:29:46 -0300

30 lines

Re: Soldering Bar Comsumption at wave solder machine??

Stephen R. Gregory <[log in to unmask]>

Tue, 19 Jan 1999 20:08:09 EST

79 lines

New Thread

Soldering Question

Soldering Question

Joshua Forrester <[log in to unmask]>

Mon, 11 Jan 1999 15:00:59 -0600

31 lines

Re: Soldering Question

[log in to unmask]

Fri, 15 Jan 1999 19:52:03 EST

63 lines

Re: Soldering Question

David D Hillman <[log in to unmask]>

Mon, 18 Jan 1999 17:34:44 -0600

81 lines

New Thread

Soldering SMT Tantalum (CWR09) Caps

Soldering SMT Tantalum (CWR09) Caps

John Mastorides <[log in to unmask]>

Wed, 6 Jan 1999 09:02:48 -0500

41 lines

Re: Soldering SMT Tantalum (CWR09) Caps

Fawn Industries, Elm City Plant <[log in to unmask]>

Wed, 6 Jan 1999 11:43:41 -0500

83 lines

Re: Soldering SMT Tantalum (CWR09) Caps

Fawn Industries, Elm City Plant <[log in to unmask]>

Wed, 6 Jan 1999 11:49:09 -0500

77 lines

New Thread

Source Inspection Guidelines

Re: Source Inspection Guidelines

[log in to unmask]

Mon, 4 Jan 1999 13:59:11 EST

59 lines

New Thread

Stencil Cleaner

Stencil Cleaner

Krief Chaim-BCK001 <[log in to unmask]>

Tue, 12 Jan 1999 14:10:27 +0200

49 lines

Re: Stencil Cleaner

Vanderhoof, Brad <[log in to unmask]>

Tue, 12 Jan 1999 09:37:54 -0800

71 lines

New Thread

Stencil Control Procedure

Stencil Control Procedure

[log in to unmask]

Tue, 12 Jan 1999 00:20:49 +0800

63 lines

New Thread

Stress Testing

Stress Testing

Schram Steve <[log in to unmask]>

Tue, 26 Jan 1999 06:18:57 -0800

58 lines

Re: Stress Testing

Eric Yakobson <[log in to unmask]>

Tue, 26 Jan 1999 12:35:42 -0500

102 lines

Re: Stress Testing

Yu-Shan Han <[log in to unmask]>

Fri, 29 Jan 1999 22:47:48 -0800

114 lines

New Thread

subscribe

subscribe

Vicki Manfredi-P23629 <[log in to unmask]>

Mon, 4 Jan 1999 13:28:00 -0700

24 lines

SUBSCRIBE

Jodi Eitner <[log in to unmask]>

Tue, 19 Jan 1999 11:23:22 -0700

25 lines

subscribe

Parke, Gregory <[log in to unmask]>

Tue, 26 Jan 1999 17:48:28 -0500

32 lines

New Thread

SV: [TN] AOI INSPECTION

SV: [TN] AOI INSPECTION

Jan Thuesen <[log in to unmask]>

Tue, 19 Jan 1999 13:15:57 +0100

216 lines

New Thread

SV: [TN] PUMICE SCRUBBER

SV: [TN] PUMICE SCRUBBER

Jan Thuesen <[log in to unmask]>

Tue, 12 Jan 1999 09:04:13 +0100

256 lines

New Thread

Tackiness Tester

Tackiness Tester

[log in to unmask]

Fri, 29 Jan 1999 10:03:37 -0700

33 lines

New Thread

Tarnished marks on crystals

Tarnished marks on crystals

Paul Wareham <[log in to unmask]>

Thu, 21 Jan 1999 21:50:51 -0400

68 lines

Re: Tarnished marks on crystals

David Fish <[log in to unmask]>

Thu, 21 Jan 1999 21:30:59 -0500

35 lines

Re: Tarnished marks on crystals

Neil Roche <[log in to unmask]>

Fri, 22 Jan 1999 14:35:21 +0000

99 lines

Re: Tarnished marks on crystals

Jerry Cupples <[log in to unmask]>

Mon, 25 Jan 1999 12:14:32 -0600

63 lines

Re: Tarnished marks on crystals

Bill Davis <[log in to unmask]>

Mon, 25 Jan 1999 11:50:40 -0800

115 lines

New Thread

TechNet

TechNet

Hamilton, Richard -4454 <[log in to unmask]>

Tue, 12 Jan 1999 16:28:28 -0700

30 lines

New Thread

test

test

Jason Gretton <[log in to unmask]>

Fri, 15 Jan 1999 15:59:00 -0800

28 lines

New Thread

Testing

Testing

Scott B. Westheimer <[log in to unmask]>

Fri, 29 Jan 1999 09:57:44 +0800

50 lines

New Thread

Thermal Effects

Thermal Effects

Thom Anderson <[log in to unmask]>

Tue, 19 Jan 1999 08:32:36 -0800

24 lines

Thermal Effects

[log in to unmask]

Wed, 20 Jan 1999 07:25:30 -0600

37 lines

New Thread

Thermal vias in pads

Thermal vias in pads

May William D CNIN <[log in to unmask]>

Mon, 11 Jan 1999 15:32:21 -0500

44 lines

Thermal vias in pads

[log in to unmask]

Tue, 12 Jan 1999 13:35:15 -0600

38 lines

Thermal vias in pads

[log in to unmask]

Tue, 12 Jan 1999 13:42:53 -0600

27 lines

Re: Thermal vias in pads

KELLY M SCHRIVER <[log in to unmask]>

Tue, 12 Jan 1999 15:04:00 -0500

58 lines

New Thread

Thermosonic ball bonding to .... silver?

Thermosonic ball bonding to .... silver?

Phil Hersey <[log in to unmask]>

Wed, 27 Jan 1999 17:13:01 -0800

31 lines

Thermosonic ball bonding to .... silver?

[log in to unmask]

Thu, 28 Jan 1999 08:10:50 +0100

29 lines

Re: Thermosonic ball bonding to .... silver?

Rob Schetty <[log in to unmask]>

Thu, 28 Jan 1999 01:39:11 -0500

65 lines

Re: Thermosonic ball bonding to .... silver?

[log in to unmask]

Thu, 28 Jan 1999 17:36:49 -0600

39 lines

Re: Thermosonic ball bonding to .... silver?

Circuit Connect <[log in to unmask]>

Thu, 28 Jan 1999 11:34:15 -0500

114 lines

Re: Thermosonic ball bonding to .... silver?

Rob Schetty <[log in to unmask]>

Fri, 29 Jan 1999 13:17:59 -0500

272 lines

New Thread

Thickness of electroless copper from PTH

Thickness of electroless copper from PTH

Francis Lai <[log in to unmask]>

Tue, 12 Jan 1999 20:55:05 -0500

41 lines

Re: Thickness of electroless copper from PTH

Leslie O. Connally <[log in to unmask]>

Wed, 13 Jan 1999 08:13:51 -0600

79 lines

New Thread

TO-92 spacing

TO-92 spacing

Fawn Industries, Elm City Plant <[log in to unmask]>

Wed, 6 Jan 1999 13:42:31 -0500

43 lines

New Thread

TO-92 spacing -Reply

TO-92 spacing -Reply

Matthew Park <[log in to unmask]>

Wed, 6 Jan 1999 11:19:23 -0800

93 lines

New Thread

Trace cutting tool manufacturer

Trace cutting tool manufacturer

Ken Patel <[log in to unmask]>

Thu, 14 Jan 1999 17:19:31 -0800

30 lines

New Thread

Transistor TO-92 Orientation

Transistor TO-92 Orientation

Tom Braswell <[log in to unmask]>

Mon, 11 Jan 1999 17:53:20 -0500

59 lines

Re: Transistor TO-92 Orientation

Mark Ross <[log in to unmask]>

Mon, 11 Jan 1999 23:07:51 -0500

116 lines

New Thread

Two up on panel

Two up on panel

Dennis Ward <[log in to unmask]>

Tue, 5 Jan 1999 11:05:34 -0500

41 lines

Re: Two up on panel

Sauer, Steven T. <[log in to unmask]>

Tue, 5 Jan 1999 12:56:00 E

41 lines

Re: Two up on panel

Anne Ledger <[log in to unmask]>

Tue, 5 Jan 1999 13:28:25 -0500

75 lines

Re: Two up on panel

Seth Goodman <[log in to unmask]>

Tue, 5 Jan 1999 12:56:12 -0600

110 lines

Re: Two up on panel

Jerry Cupples <[log in to unmask]>

Tue, 5 Jan 1999 13:00:57 -0600

49 lines

Re: Two up on panel

John Walker <[log in to unmask]>

Tue, 5 Jan 1999 10:25:43 -0500

92 lines

Re: Two up on panel

Marti Tully <[log in to unmask]>

Tue, 5 Jan 1999 12:47:45 -0700

156 lines

Re: Two up on panel

Bob Cochran <[log in to unmask]>

Tue, 5 Jan 1999 10:35:00 -0800

62 lines

Re: Two up on panel

Erika Pacheco <[log in to unmask]>

Thu, 7 Jan 1999 22:21:25 -0500

66 lines

New Thread

Update on IPC Printed Circuits Expo

Update on IPC Printed Circuits Expo

Jack Crawford <[log in to unmask]>

Thu, 28 Jan 1999 14:55:52 -0600

72 lines

New Thread

Using Mentor Graphics?

Using Mentor Graphics?

In-myung Song <[log in to unmask]>

Wed, 6 Jan 1999 16:05:54 +0900

35 lines

New Thread

VDE specfications

VDE specfications

Thomas Burek <[log in to unmask]>

Fri, 15 Jan 1999 12:26:02 -0500

34 lines

New Thread

Vision Inspection?

Vision Inspection?

Brian Ottosen <[log in to unmask]>

Mon, 25 Jan 1999 09:59:01 -0700

29 lines

Re: Vision Inspection?

LAI,HAW FONG <[log in to unmask]>

Tue, 26 Jan 1999 08:35:00 +0800

216 lines

Re: Vision Inspection?

Shane Fitzpatrick <[log in to unmask]>

Tue, 26 Jan 1999 13:51:47 +0000

31 lines

Re: Vision Inspection?

Wade Oberle <[log in to unmask]>

Mon, 25 Jan 1999 15:38:17 -0600

67 lines

Re: Vision Inspection?

Jerry Cupples <[log in to unmask]>

Tue, 26 Jan 1999 09:17:52 -0600

65 lines

Re: Vision Inspection?

John Gulley <[log in to unmask]>

Wed, 27 Jan 1999 10:44:34 -0800

96 lines

New Thread

Wanted book name.

Wanted book name.

In-myung Song <[log in to unmask]>

Mon, 11 Jan 1999 10:28:50 +0900

28 lines

New Thread

Wanted: 3ft black light bulbs

Wanted: 3ft black light bulbs

Kuczynski Michael <[log in to unmask]>

Thu, 14 Jan 1999 08:42:16 -0500

34 lines

New Thread

Wanted: 3ft black light bulbs.

Wanted: 3ft black light bulbs.

Chris_Smith <[log in to unmask]>

Wed, 13 Jan 1999 15:48:41 -0600

33 lines

Re: Wanted: 3ft black light bulbs.

Ranno, Laurie <[log in to unmask]>

Thu, 14 Jan 1999 09:14:13 -0500

74 lines

New Thread

warpage

warpage

Brigitte Haugk <[log in to unmask]>

Fri, 8 Jan 1999 15:39:08 -0600

26 lines

New Thread

Water contents in no clean flux

Water contents in no clean flux

[log in to unmask]

Wed, 6 Jan 1999 01:10:53 +0800

30 lines

Re: Water contents in no clean flux

Evan D Jones <[log in to unmask]>

Wed, 6 Jan 1999 14:16:50 +1000

77 lines

Water contents in no clean flux

[log in to unmask]

Wed, 6 Jan 1999 03:32:44 -0600

39 lines

Re: Water contents in no clean flux

<Mary Smoot> <[log in to unmask]>

Wed, 6 Jan 1999 08:07:24 -0500

121 lines

Re: Water contents in no clean flux

Ryan Jennens <[log in to unmask]>

Wed, 6 Jan 1999 09:28:34 -0500

96 lines

Re: Water contents in no clean flux

Bev Christian <[log in to unmask]>

Wed, 6 Jan 1999 09:35:02 -0500

90 lines

Water contents in no clean flux

[log in to unmask]

Wed, 6 Jan 1999 08:34:27 -0600

30 lines

Re: Water contents in no clean flux

McMonagle, Michael R. <[log in to unmask]>

Wed, 6 Jan 1999 09:24:53 -0600

84 lines

Re: Water contents in no clean flux

<Jason M. Smith> <[log in to unmask]>

Wed, 6 Jan 1999 10:21:43 -0500

41 lines

Water contents in no clean flux

[log in to unmask]

Wed, 6 Jan 1999 09:01:46 -0600

38 lines

Re: Water contents in no clean flux

Ryan Jennens <[log in to unmask]>

Wed, 6 Jan 1999 11:22:25 -0500

90 lines

Re: Water contents in no clean flux

Karen Tellefsen <[log in to unmask]>

Wed, 6 Jan 1999 02:44:41 -0800

39 lines

New Thread

White blistering on solder mask.

White blistering on solder mask.

Paul Wareham <[log in to unmask]>

Fri, 15 Jan 1999 17:04:48 -0400

81 lines

Re: White blistering on solder mask.

Chetan Shah <[log in to unmask]>

Fri, 15 Jan 1999 18:33:48 PST

61 lines

Re: White blistering on solder mask.

Afri Singh <[log in to unmask]>

Sat, 16 Jan 1999 10:30:10 -0500

35 lines

Re: White blistering on solder mask.

[log in to unmask] <[log in to unmask]>

Sat, 16 Jan 1999 18:23:06 -0800

28 lines

New Thread

White layer on PCB after Wave Solder

White layer on PCB after Wave Solder

fawnec <[log in to unmask]>

Wed, 27 Jan 1999 11:06:08 -0500

58 lines

New Thread

Why won't electroless copper plate on copper

Why won't electroless copper plate on copper

Francis Lai <[log in to unmask]>

Fri, 15 Jan 1999 20:22:49 -0500

35 lines

Why won't electroless copper plate on copper

[log in to unmask]

Sat, 16 Jan 1999 08:22:44 -0600

29 lines

Re: Why won't electroless copper plate on copper

<Joseph M. Webb> <[log in to unmask]>

Mon, 18 Jan 1999 08:32:24 -0500

30 lines

Re: Why won't electroless copper plate on copper

Leslie O. Connally <[log in to unmask]>

Mon, 18 Jan 1999 10:35:10 -0600

88 lines

New Thread

wire bonding on silver, con't...

wire bonding on silver, con't...

Phil Hersey <[log in to unmask]>

Fri, 29 Jan 1999 12:03:15 -0800

124 lines

New Thread

Wrong orientation on Tantalum Cap.

Wrong orientation on Tantalum Cap.

Poh Kong Hui <[log in to unmask]>

Thu, 14 Jan 1999 22:40:08 +0800

27 lines

Re: Wrong orientation on Tantalum Cap.

Jeff Finger <[log in to unmask]>

Wed, 20 Jan 1999 10:18:51 -0800

64 lines

New Thread

X-ray Inspection System

X-ray Inspection System

Daniel Woon <[log in to unmask]>

Thu, 21 Jan 1999 16:12:55 +0800

45 lines

New Thread

X-ray service

X-ray service

Thomas C Han <[log in to unmask]>

Mon, 11 Jan 1999 15:45:54 -0800

26 lines

Re: X-ray service

Harry Wachob <[log in to unmask]>

Mon, 11 Jan 1999 16:51:30 -0800

53 lines

Re: X-ray service

Stephen R. Gregory <[log in to unmask]>

Mon, 11 Jan 1999 20:42:13 EST

47 lines

New Thread

your mail

Re: your mail

Lenny Kurup <[log in to unmask]>

Thu, 21 Jan 1999 10:03:18 -0500

56 lines

New Thread

Z-control

Z-control

David Curtis <[log in to unmask]>

Wed, 6 Jan 1999 11:31:19 -0500

33 lines

Re: Z-control

Leslie O. Connally <[log in to unmask]>

Wed, 6 Jan 1999 10:54:24 -0600

60 lines

Re: Z-control

Erika Pacheco <[log in to unmask]>

Thu, 7 Jan 1999 22:41:07 -0500

61 lines

Re: Z-control

David Curtis <[log in to unmask]>

Fri, 8 Jan 1999 11:43:40 -0500

40 lines

Z-control

[log in to unmask]

Fri, 8 Jan 1999 14:11:34 -0600

24 lines

Re: Z-control

Andy Burkhardt <[log in to unmask]>

Fri, 8 Jan 1999 17:29:04 +0000

90 lines

New Thread

Z-wire installation and/or soldering

Z-wire installation and/or soldering

Dow Withers <[log in to unmask]>

Mon, 18 Jan 1999 15:22:41 -0800

25 lines

New Thread

Zero Margin PWB Assembly Depaneling

Zero Margin PWB Assembly Depaneling

KK Chin <[log in to unmask]>

Wed, 6 Jan 1999 12:22:49 -0800

39 lines

Re: Zero Margin PWB Assembly Depaneling

Vanderhoof, Brad <[log in to unmask]>

Wed, 6 Jan 1999 14:05:53 -0800

67 lines

Re: Zero Margin PWB Assembly Depaneling

Paul Klasek <[log in to unmask]>

Thu, 7 Jan 1999 11:36:30 +1100

114 lines

Re: Zero Margin PWB Assembly Depaneling

jim <[log in to unmask]>

Thu, 7 Jan 1999 09:28:23 -0600

68 lines

Re: Zero Margin PWB Assembly Depaneling

Jeff Finger <[log in to unmask]>

Thu, 7 Jan 1999 12:52:57 -0800

81 lines

New Thread

[Fwd: San Diego IPC Designers C

Re: [Fwd: San Diego IPC Designers C

Thomas Burek <[log in to unmask]>

Tue, 26 Jan 1999 19:04:47 -0500

161 lines

New Thread

[Fwd: San Diego IPC Designers Council Meeting]

[Fwd: San Diego IPC Designers Council Meeting]

Raymond Aguilar <[log in to unmask]>

Thu, 21 Jan 1999 09:33:56 -0800

109 lines

Re: [Fwd: San Diego IPC Designers Council Meeting]

Sonia Singh <[log in to unmask]>

Thu, 21 Jan 1999 11:04:13 -0800

148 lines

Re: [Fwd: San Diego IPC Designers Council Meeting]

Raymond Aguilar <[log in to unmask]>

Thu, 21 Jan 1999 22:54:11 -0800

149 lines

New Thread

[TN] Bowed Boards

Re[2]: [TN] Bowed Boards

Ken Nevius <[log in to unmask]>

Thu, 21 Jan 1999 14:13:43 -0500

132 lines

New Thread

[TN] IN CIRCUIT TEST

Re[2]: [TN] IN CIRCUIT TEST

Michael D. Doty <[log in to unmask]>

Mon, 25 Jan 1999 18:52:55 -0500

102 lines

New Thread

[TN] One more thing on Double side reflow

Re[2]: [TN] One more thing on Double side reflow

Edward Brunker <[log in to unmask]>

Tue, 19 Jan 1999 15:55:26 GMT

135 lines

New Thread

[TN] ORC Exposure Machine

Re[2]: [TN] ORC Exposure Machine

No Name Available <[log in to unmask]>

Fri, 29 Jan 1999 14:53:34 -0500

79 lines

New Thread

[TN] slot drill

Re[2]: [TN] slot drill

Mike Mikucki <[log in to unmask]>

Wed, 27 Jan 1999 14:47:56 -0500

131 lines

New Thread

[TN] Solder Metallurgy

Re[2]: [TN] Solder Metallurgy

Roger Massey-G14195 <[log in to unmask]>

Fri, 8 Jan 1999 14:09:31 +0000

139 lines

New Thread

[TN] Wrong orientation on Tantalum Cap.

Re[2]: [TN] Wrong orientation on Tantalum Cap.

Robert D. Green <[log in to unmask]>

Thu, 21 Jan 1999 08:05:23 -0500

100 lines

New Thread

[TN] Z-control

Re[2]: [TN] Z-control

<Andy Slade> <[log in to unmask]>

Fri, 8 Jan 1999 13:59:11 -0500

83 lines

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