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October 1998


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Table of Contents:

回覆 : [TN] CTE of FR4 and other materials in JPG format (1 message)
(fab) Specify Multilayer Build (5 messages)
(no subject) (1 message)
.004 Cores (2 messages)
0603 devices and wave flow (3 messages)
400 micron Laminate (1 message)
: Assy: Xray Utilization (9 messages)
: SMT Hand placing time standards... (1 message)
<No subject> (2 messages)
About E-Ni/E-Pd/I-Au (1 message)
About Wire Bonding (1 message)
Admin Test Message - Disregard (1 message)
Allegro RS274X Output (1 message)
another test ― disregard (1 message)
Any advice on Omikron (Immersion White Tin)? (4 messages)
AOI MARKING PENS (3 messages)
Are you looking for an SMT line? (1 message)
asking of a spec' MIL-STD-105 (1 message)
Assembly survey (3 messages)
Assy: Max Soldering Temp/Time spec. (3 messages)
ASSY: stacking 1206 chip resistors (12 messages)
ASSY: vertical integration of 1206 chip resistors (1 message)
ASSY:board marking labels for reflow (2 messages)
Attaching TC's for profiling (2 messages)
Attaching Thermocouples for Profiling (5 messages)
Autoclaving Flex PWBs (1 message)
AW: [TN] Via's under BGA's (1 message)
Backfill with dielectric control (1 message)
BGA (3 messages)
BGA Acceptable crititerial (1 message)
BGA Assembly (3 messages)
BGA Assembly pricing (1 message)
BGA on thru-hole pads (3 messages)
BGA Reflow question (3 messages)
BGA Rework (1 message)
BGA rework question (2 messages)
BGA X-ray image interpretation (1 message)
BGA: Tape & Reel vs. Trays (1 message)
Blind & Buried Via (2 messages)
Blind and Buried Via Design (1 message)
Braun? Brown? Process (4 messages)
Braun? Brown? Process Thanks! (1 message)
Burnt FR4 (2 messages)
Call For Abstracts - InterPACK® '99 (1 message)
Carbon film resistors (2 messages)
Career Advice (1 message)
Ceramic vs. Plastic Components (2 messages)
Chemicals List (2 messages)
Component Baking Guideline (3 messages)
Confomal coating adhesion (6 messages)
Confomal coating adhesion - reply (1 message)
conformal coat machines (2 messages)
Conformal Coat Masking (2 messages)
Conformal coating adhesion (1 message)
Conformal Coating Manufactures (3 messages)
Copper ductility (2 messages)
Copper ductility -Reply (2 messages)
Copper plating & Copper thickness (3 messages)
Copper Question (3 messages)
CTE of FR4 and other materials (1 message)
CTE of FR4 and other materials in JPG format (1 message)
Current Carrying Capacity of Conductors (1 message)
Cutters (8 messages)
Cyanate Ester E glass processing (1 message)
DC Current Probe (1 message)
Depanelizing boards (3 messages)
DESIGN SERVICE BUREAU USING ZUKEN VISULA (1 message)
DFM HELP (1 message)
Differential impedance (2 messages)
Digital Camera Assembly Process (1 message)
digital pwb design survey (2 messages)
Double sided BGA assembly (3 messages)
Effects of X-Ray inspection on GaAs components. (1 message)
EMI Shields (5 messages)
Environmental Stress Screening (ESS) (1 message)
ESD Smocks (2 messages)
FAB : Deburr Brushes (1 message)
Fab: Cyanide plating bath on "standby mode" (3 messages)
Fab: Multiple surface finishes (3 messages)
fab: repair inner layer trace (3 messages)
Failure of Rigid Flex (3 messages)
Flex Circuit Materials (1 message)
Flex market figures (2 messages)
FR4 thermal expansion (10 messages)
FR4 thermal expansion -Reply (1 message)
FW: ICT for bare boards (1 message)
Fw: TechNet: confirmation required (1D4C91) (1 message)
Fw: TechNet: confirmation required (75C57F) (1 message)
Fw: [TN] Ceramic vs. Plastic Components (1 message)
FW: [TN] Ionic Contamination due to No-Clean Fluxes (2 messages)
FW: [TN] Via's under BGA's (1 message)
FW: [TN] Voiding in BGA (1 message)
Galvanic action (4 messages)
geek (5 messages)
Gold Finger Critical Contact Area (1 message)
Gold removal service (3 messages)
Gull wing lead forming (3 messages)
Harman wire-bonding book (1 message)
Heat seal connectors to LCD (2 messages)
Heller 1900 (1 message)
HELP NEEDED ON OSP QUALITY ON THE THM COMPONENT SOLD (2 messages)
HELP NEEDED ON OSP QUALITY ON THE THM COMPONENT SOLDERBILITY (1 message)
Help on design rules for chip capacitors (4 messages)
Help with design and assembly of Micro BGA's TI "MicroSt ar" and Tessera uBGA style (1 message)
Help with design and assembly of Micro BGA's TI "MicroStar" and Tessera uBGA style (1 message)
Hermetic Sealing (2 messages)
Hidden Via (1 message)
High Temp Solder - the "real" world (1 message)
Hot Bar Soldering (6 messages)
Hot bar soldering flex on ceramic (4 messages)
Hot: Trace width and air gap for 1mm pitch BGA (3 messages)
ICD defect (4 messages)
ICT for bare boards (13 messages)
IMAPS/SMTA Seminar 10/22/98 @ Lucent Technologies (1 message)
Immersion Tin Process (4 messages)
In-house Specifications (2 messages)
Inserts into PWB (2 messages)
Intel uBGA Flash, Bottom Side SMT? (2 messages)
Ionic Contamination due to No-Clean Fluxes (7 messages)
IPC - A - 600 (2 messages)
IPC - A - 600 or 610? (1 message)
IPC J-Std-001 Class What reliability? (2 messages)
IPC Rework Documents (2 messages)
IPC Standards for Fiducials (3 messages)
IPC-A-610B Class II vs Class III (1 message)
IPC-R-700 (1 message)
j-std-001b (2 messages)
Japanese Solderability Specs (2 messages)
Land size (2 messages)
Laser direct imaging (3 messages)
laser drilling / ablation (1 message)
LED 7 segment displays in SMT package (3 messages)
LED failures (4 messages)
LED failures -Reply (1 message)
Longitudinal PTH cracking (2 messages)
Looking for custom vibrating tube feeder for Fuji IP2 (2 messages)
Looking for susceptibility simu. software for RFI (1 message)
Loss of chips thru wave solder (2 messages)
LPI Filled Vias (1 message)
LPI Filled Vias ? (4 messages)
LPI Filled Vias-correction (1 message)
Mail Link to SMTP Undeliverable Message (1 message)
Micro BGA (1 message)
microannex els (2 messages)
Microelectronics Market for Imaging Chemicals (1 message)
MIL S 13949 to IPC 4101 Conversion GMN versus GFT (1 message)
Military Specifications (4 messages)
MS-105 (1 message)
NAWCADLKE SPECIFICATION (2 messages)
No-Clean Solder Ball. (5 messages)
One more thing on stacked chip components. (1 message)
OSP and Loctite 7360 (1 message)
Oxide / Durabond Alternatives (6 messages)
Oxide / Durabond Alternatives -Reply (2 messages)
Oxide process controls (3 messages)
P and B content in electroless nickel (2 messages)
Partnering with CM's (1 message)
PCB ASSEMBLY COST ANALYS (2 messages)
PCB ASSEMBLY COST ANALYS (Can we put on TN?) (1 message)
PCB ASSEMBLY COST ANALYSIS (9 messages)
PCB Designers (2 messages)
PCB for fine pitch (3 messages)
Percent Phosphorous in plating solution causing excess intermetal lics in Au/Ni/Cu solder joints (1 message)
Percent Phosphorous in plating solution causing excess intermetallics in Au/Ni/Cu solder joints (1 message)
Phosphor in Electroless Nickel (1 message)
Phosphour in Elcetroless Nickel (1 message)
Phosphour in Electroless Nickel (3 messages)
Please help, if you can. (1 message)
Plugged/tented vias (4 messages)
Prepreg Thickness (1 message)
Price Quote (1 message)
Product Safety (3 messages)
Protective coating for glass (1 message)
PTH Plugging (1 message)
Pull force (1 message)
pure tin surface finish (1 message)
pure tin surface finish requirement (5 messages)
pwb design survey (2 messages)
question (2 messages)
quoting for an SMT assembly job, help! (1 message)
Reg: Dicing operations (3 messages)
Reg: Voids in Solder Bumps (1 message)
Reliability Data for Pad Repair (1 message)
Replacing Mil-S-13949 (3 messages)
Rework (2 messages)
Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS (1 message)
Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS -Reply (1 message)
Re[2]: [TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS (2 messages)
RF soldermask defined pads (2 messages)
Risu and Rasu (2 messages)
RTV (4 messages)
Sealbrite (4 messages)
Shelf Life/Storage for Bare PCB (8 messages)
SMD pull test (2 messages)
SMT Assembly on Ceramic substrate? (10 messages)
SMT Government/Industry projections (1 message)
SNEC mtg notice (1 message)
Solder alloy properties (1 message)
Solder splatter on wave solder machine (8 messages)
Solderability Problems (11 messages)
Solderability Test for SMT: Dip and Look or Wetting Bala nce? (1 message)
Solderability Test for SMT: Dip and Look or Wetting Balance? (3 messages)
Soldering Brass to Copper (3 messages)
Soldering Palladium plated leads (6 messages)
Soldering to Gold using "No Clean" flux (1 message)
Soldering to Nickel (3 messages)
Soldermask covered vias?? (3 messages)
Soldermask covered vias?? -Reply (1 message)
Something abobut Au plating (1 message)
Stacking Chip Components (1 message)
Subscribe (6 messages)
Technet @ the EXPO (2 messages)
Technology Roadmaps (2 messages)
Teflon Board Assembly (3 messages)
Temp Profiling (2 messages)
Test (3 messages)
Thermal Aging Of Solder Joints (5 messages)
This is a test. (1 message)
Through Hole Component leads & their solder land size (1 message)
Throwing Power (6 messages)
TN: Need help on sun sparc 5 front end system for MD fire9000 plotter. (1 message)
Tolerance on Collapsed height of BGA Balls (3 messages)
top side solderpaste (2 messages)
Trace Repairs (2 messages)
Transmission line and Microstrip theory (2 messages)
transparent silver coating (1 message)
Types of BGAs (5 messages)
unsubscribe users.. (1 message)
Vacuum failures (1 message)
Via's under BGA (1 message)
Via's under BGA's (4 messages)
Vias in chip components pads? (3 messages)
Vias stealing solder from BGA's pads (1 message)
Voiding in BGA (6 messages)
Wanting to Know (1 message)
Water absorption rate (2 messages)
Water Absorption Rate. (1 message)
Water soluble temporary solder mask (2 messages)
Wave Solder Process Tools (1 message)
wave solder service & support (2 messages)
Wave Soldering SMT Timing Devices (1 message)
WG: OSP & through hole components _ (1 message)
Wirebond Arc Description (JEDEC) (1 message)
Wirebonding (2 messages)
WTECH (2 messages)
Xray inspection (1 message)
[TN] Confomal coating adhesion (1 message)
[TN] Depanelizing boards (1 message)
[TN] PCB ASSEMBLY COST ANALYSIS (1 message)
[TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS (1 message)
[TN] Teflon Board Assembly (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

回覆 : [TN] CTE of FR4 and other materials in JPG format

回覆 : [TN] CTE of FR4 and other materials in JPG format

Howard Lin <[log in to unmask]>

Fri, 23 Oct 1998 11:50:58 +0800

76 lines

New Thread

(fab) Specify Multilayer Build

(fab) Specify Multilayer Build

Brian Gaynor <[log in to unmask]>

Wed, 7 Oct 1998 11:00:22 -0400

32 lines

Re: (fab) Specify Multilayer Build

Dieter Beisiegel <[log in to unmask]>

Wed, 7 Oct 1998 14:14:46 +-200

114 lines

Re: (fab) Specify Multilayer Build

Paul Gould <[log in to unmask]>

Wed, 7 Oct 1998 14:00:03 +0100

91 lines

Re: (fab) Specify Multilayer Build

Ed Cosper <[log in to unmask]>

Wed, 7 Oct 1998 08:12:48 -0500

120 lines

Re: (fab) Specify Multilayer Build

[log in to unmask]

Wed, 7 Oct 1998 13:13:51 EDT

50 lines

New Thread

(no subject)

(no subject)

Chuck Garth <[log in to unmask]>

Mon, 26 Oct 1998 10:04:16 EST

22 lines

New Thread

.004 Cores

.004 Cores

[log in to unmask]

Mon, 19 Oct 1998 15:11:57 -0500

37 lines

.004 Cores

Earl Moon <[log in to unmask]>

Tue, 20 Oct 1998 05:09:55 -0700

39 lines

New Thread

0603 devices and wave flow

0603 devices and wave flow

Richard G Smith <[log in to unmask]>

Wed, 21 Oct 1998 08:14:56 -0500

29 lines

Re: 0603 devices and wave flow

Ian Squires <[log in to unmask]>

Wed, 21 Oct 1998 16:45:40 PDT

45 lines

Re: 0603 devices and wave flow

Russ Steiner <[log in to unmask]>

Wed, 21 Oct 1998 13:24:34 -0400

58 lines

New Thread

400 micron Laminate

400 micron Laminate

Neil Atkinson <[log in to unmask]>

Fri, 9 Oct 1998 08:02:22 +0100

34 lines

New Thread

: Assy: Xray Utilization

: Assy: Xray Utilization

Stephen R. Gregory <[log in to unmask]>

Thu, 1 Oct 1998 10:54:11 EDT

52 lines

Re: : Assy: Xray Utilization

Ian Squires <[log in to unmask]>

Thu, 1 Oct 1998 16:16:43 PDT

53 lines

Re: : Assy: Xray Utilization

Stephen R. Gregory <[log in to unmask]>

Thu, 1 Oct 1998 11:42:27 EDT

48 lines

Re: : Assy: Xray Utilization

Stephen R. Gregory <[log in to unmask]>

Fri, 2 Oct 1998 02:32:19 EDT

70 lines

Re: : Assy: Xray Utilization

Evan D Jones <[log in to unmask]>

Fri, 2 Oct 1998 16:51:43 +1000

105 lines

Re: : Assy: Xray Utilization

Bev Christian <[log in to unmask]>

Fri, 2 Oct 1998 13:24:05 -0400

130 lines

Re: : Assy: Xray Utilization

No Name Available <[log in to unmask]>

Thu, 1 Oct 1998 21:25:26 EDT

29 lines

Re: : Assy: Xray Utilization

Gabriela Bogdan <[log in to unmask]>

Sun, 4 Oct 1998 16:02:14 +0200

187 lines

Re: : Assy: Xray Utilization

David D Hillman <[log in to unmask]>

Mon, 5 Oct 1998 09:12:24 -0500

110 lines

New Thread

: SMT Hand placing time standards...

Re: : SMT Hand placing time standards...

Patten, James <[log in to unmask]>

Mon, 5 Oct 1998 08:16:41 -0700

60 lines

New Thread

<No subject>

<No subject>

Prawit Wadwape <[log in to unmask]>

Sat, 17 Oct 1998 23:48:24 +0700

27 lines

<No subject>

Sira Rikulsurakan <[log in to unmask]>

Sun, 18 Oct 1998 01:03:09 +0700

63 lines

New Thread

About E-Ni/E-Pd/I-Au

About E-Ni/E-Pd/I-Au

solar group <[log in to unmask]>

Mon, 26 Oct 1998 11:21:05 +0800

31 lines

New Thread

About Wire Bonding

About Wire Bonding

ccfswr <[log in to unmask]>

Wed, 14 Oct 1998 16:34:42 +0800

41 lines

New Thread

Admin Test Message - Disregard

Admin Test Message - Disregard

Hugo Scaramuzza <[log in to unmask]>

Thu, 15 Oct 1998 14:14:59 -0500

31 lines

New Thread

Allegro RS274X Output

Allegro RS274X Output

Steve Chidester <[log in to unmask]>

Tue, 27 Oct 1998 16:46:48 -0500

68 lines

New Thread

another test ― disregard

another test ― disregard

Lisa Williams <[log in to unmask]>

Thu, 15 Oct 1998 14:18:34 -0500

22 lines

New Thread

Any advice on Omikron (Immersion White Tin)?

Any advice on Omikron (Immersion White Tin)?

Brian Rusten <[log in to unmask]>

Mon, 12 Oct 1998 13:37:06 +1000

43 lines

Re: Any advice on Omikron (Immersion White Tin)?

Rick A. Scovel <[log in to unmask]>

Mon, 12 Oct 1998 10:49:18 -0700

88 lines

Re: Any advice on Omikron (Immersion White Tin)?

Gary D. Peterson <[log in to unmask]>

Mon, 12 Oct 1998 13:29:58 -0600

88 lines

Re: Any advice on Omikron (Immersion White Tin)?

Paul Wilson <[log in to unmask]>

Tue, 13 Oct 1998 06:31:24 -0400

159 lines

New Thread

AOI MARKING PENS

AOI MARKING PENS

David Valliere <[log in to unmask]>

Tue, 6 Oct 1998 17:36:30 -0400

72 lines

AOI Marking Pens

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 7 Oct 1998 06:40:00 PDT

27 lines

Re: AOI MARKING PENS

McMonagle, Michael R. <[log in to unmask]>

Wed, 7 Oct 1998 10:17:22 -0500

54 lines

New Thread

Are you looking for an SMT line?

Are you looking for an SMT line?

Bryan Alan <[log in to unmask]>

Fri, 30 Oct 1998 09:08:00 -0800

40 lines

New Thread

asking of a spec' MIL-STD-105

Re: asking of a spec' MIL-STD-105

Jim Marsico 516-595-5879 <[log in to unmask]>

Thu, 1 Oct 1998 10:43:00 -0400

23 lines

New Thread

Assembly survey

Assembly survey

Terveen, James <[log in to unmask]>

Tue, 13 Oct 1998 14:18:00 -0400

45 lines

Re: assembly survey

Ian Squires <[log in to unmask]>

Wed, 14 Oct 1998 12:14:55 PDT

368 lines

Re: Assembly survey

McMonagle, Michael R. <[log in to unmask]>

Wed, 14 Oct 1998 10:21:38 -0500

82 lines

New Thread

Assy: Max Soldering Temp/Time spec.

Assy: Max Soldering Temp/Time spec.

glenn pelkey <[log in to unmask]>

Wed, 7 Oct 1998 11:06:44 PDT

39 lines

Re: Assy: Max Soldering Temp/Time spec.

Kelly M. Schriver <[log in to unmask]>

Wed, 7 Oct 1998 16:30:32 -0500

39 lines

Re: Assy: Max Soldering Temp/Time spec.

Russ Winslow <[log in to unmask]>

Wed, 7 Oct 1998 21:03:46 -0700

96 lines

New Thread

ASSY: stacking 1206 chip resistors

ASSY: stacking 1206 chip resistors

Sherman Banks <[log in to unmask]>

Mon, 5 Oct 1998 13:54:34 -0700

37 lines

Re: ASSY: stacking 1206 chip resistors

Paul Klasek <[log in to unmask]>

Tue, 6 Oct 1998 08:49:56 +1000

101 lines

Re: ASSY: stacking 1206 chip resistors

Stephen R. Gregory <[log in to unmask]>

Mon, 5 Oct 1998 19:07:35 EDT

66 lines

Re: ASSY: stacking 1206 chip resistors

David Ratte <[log in to unmask]>

Mon, 5 Oct 1998 19:10:25 -0400

140 lines

Re: ASSY: stacking 1206 chip resistors

Crepeau, Phil <[log in to unmask]>

Mon, 5 Oct 1998 15:23:19 -0700

67 lines

Re: ASSY: stacking 1206 chip resistors

Douglas Mckean <[log in to unmask]>

Mon, 5 Oct 1998 16:24:41 -0700

51 lines

Re: ASSY: stacking 1206 chip resistors

Crepeau, Phil <[log in to unmask]>

Mon, 5 Oct 1998 17:05:56 -0700

166 lines

Re: ASSY: stacking 1206 chip resistors

Paul Klasek <[log in to unmask]>

Tue, 6 Oct 1998 11:21:04 +1000

199 lines

Re: ASSY: stacking 1206 chip resistors

McMonagle, Michael R. <[log in to unmask]>

Tue, 6 Oct 1998 09:02:32 -0500

90 lines

Re: ASSY: stacking 1206 chip resistors

Crepeau, Phil <[log in to unmask]>

Tue, 6 Oct 1998 07:31:03 -0700

43 lines

Re: ASSY: stacking 1206 chip resistors

Paul Klasek <[log in to unmask]>

Wed, 7 Oct 1998 08:15:51 +1000

89 lines

Re: ASSY: stacking 1206 chip resistors

Kevin Dale Kirmse <[log in to unmask]>

Wed, 7 Oct 1998 20:28:44 -0400

61 lines

New Thread

ASSY: vertical integration of 1206 chip resistors

Re: ASSY: vertical integration of 1206 chip resistors

Matthew Park <[log in to unmask]>

Tue, 6 Oct 1998 15:47:03 -0700

140 lines

New Thread

ASSY:board marking labels for reflow

ASSY:board marking labels for reflow

Jeff Hempton <[log in to unmask]>

Mon, 12 Oct 1998 12:02:19 -0500

34 lines

Re: ASSY:board marking labels for reflow

<Dennis Polinski> <[log in to unmask]>

Mon, 12 Oct 1998 16:40:49 -0500

99 lines

New Thread

Attaching TC's for profiling

Attaching TC's for profiling

Great Basin <[log in to unmask]>

Tue, 13 Oct 1998 07:29:35 -0700

34 lines

Re: Attaching TC's for profiling

[log in to unmask]

Tue, 13 Oct 1998 12:24:55 EDT

37 lines

New Thread

Attaching Thermocouples for Profiling

Attaching Thermocouples for Profiling

Greg Jones <[log in to unmask]>

Wed, 14 Oct 1998 09:02:47 -0700

34 lines

Re: Attaching Thermocouples for Profiling

Doug Jeffery <[log in to unmask]>

Wed, 14 Oct 1998 11:45:10 -0500

69 lines

Re: Attaching Thermocouples for Profiling

Thomas DeSmit <[log in to unmask]>

Wed, 14 Oct 1998 11:41:48 -0500

64 lines

Re: Attaching Thermocouples for Profiling

Kenny Bloomquist <[log in to unmask]>

Wed, 14 Oct 1998 09:57:08 -0700

31 lines

Re: Attaching Thermocouples for Profiling

David Whalley <[log in to unmask]>

Fri, 16 Oct 1998 08:57:53 +0100

34 lines

New Thread

Autoclaving Flex PWBs

Re: Autoclaving Flex PWBs

Andy Magee <[log in to unmask]>

Wed, 14 Oct 1998 20:45:31 -0400

63 lines

New Thread

AW: [TN] Via's under BGA's

AW: [TN] Via's under BGA's

Nüchter Wolfgang (FV/FLT) * <[log in to unmask]>

Tue, 6 Oct 1998 16:40:58 +0200

177 lines

New Thread

Backfill with dielectric control

Backfill with dielectric control

[log in to unmask]

Wed, 21 Oct 1998 14:37:44 -0500

40 lines

New Thread

BGA

BGA

Thomas C Han <[log in to unmask]>

Tue, 13 Oct 1998 12:28:40 -0700

45 lines

Re: BGA

Rod Martens <[log in to unmask]>

Tue, 13 Oct 1998 15:24:31 -0600

61 lines

Re: BGA

Iain Braddock <[log in to unmask]>

Sat, 17 Oct 1998 10:19:27 +0100

95 lines

New Thread

BGA Acceptable crititerial

BGA Acceptable crititerial

Paul Yan <[log in to unmask]>

Mon, 5 Oct 1998 10:56:13 -0700

119 lines

New Thread

BGA Assembly

BGA Assembly

Thomas C Han <[log in to unmask]>

Tue, 20 Oct 1998 16:48:00 -0700

35 lines

Re: BGA Assembly

Eden Chen <[log in to unmask]>

Wed, 21 Oct 1998 08:58:38 +0800

83 lines

Re: BGA Assembly

Rick Thompson <[log in to unmask]>

Wed, 21 Oct 1998 07:44:07 -0700

76 lines

New Thread

BGA Assembly pricing

BGA Assembly pricing

Thomas C Han <[log in to unmask]>

Tue, 20 Oct 1998 16:36:47 -0700

43 lines

New Thread

BGA on thru-hole pads

BGA on thru-hole pads

Thomas C Han <[log in to unmask]>

Tue, 13 Oct 1998 13:12:38 -0700

36 lines

Re: BGA on thru-hole pads

Chan, Marcelo <[log in to unmask]>

Tue, 13 Oct 1998 17:07:50 -0400

76 lines

Re: BGA on thru-hole pads

No Name Available <[log in to unmask]>

Wed, 14 Oct 1998 19:42:19 EDT

30 lines

New Thread

BGA Reflow question

BGA Reflow question

Scott Holthausen <[log in to unmask]>

Thu, 1 Oct 1998 09:26:16 -0400

31 lines

Re: BGA Reflow question

Stephen R. Gregory <[log in to unmask]>

Thu, 1 Oct 1998 10:23:27 EDT

65 lines

Re: BGA Reflow question

Lee, Scott <[log in to unmask]>

Thu, 1 Oct 1998 10:55:41 -0400

129 lines

New Thread

BGA Rework

BGA Rework

Thomas C Han <[log in to unmask]>

Fri, 23 Oct 1998 16:16:14 -0700

34 lines

New Thread

BGA rework question

BGA rework question

Stammely, Tim <[log in to unmask]>

Sat, 31 Oct 1998 07:29:00 -0500

41 lines

Re: BGA rework question

McMonagle, Michael R. <[log in to unmask]>

Sat, 31 Oct 1998 08:36:02 -0600

91 lines

New Thread

BGA X-ray image interpretation

BGA X-ray image interpretation

Sira Rikulsurakan <[log in to unmask]>

Sun, 11 Oct 1998 02:42:35 +0700

29 lines

New Thread

BGA: Tape & Reel vs. Trays

BGA: Tape & Reel vs. Trays

Bill Davis <[log in to unmask]>

Fri, 9 Oct 1998 08:47:04 -0700

37 lines

New Thread

Blind & Buried Via

Blind & Buried Via

Bock Ming Gai Joanne <[log in to unmask]>

Fri, 16 Oct 1998 14:29:40 +0800

33 lines

Re: Blind & Buried Via

Dr. Walter Schmidt <[log in to unmask]>

Fri, 16 Oct 1998 09:07:57 +0200

51 lines

New Thread

Blind and Buried Via Design

Blind and Buried Via Design

Bock Ming Gai Joanne <[log in to unmask]>

Fri, 2 Oct 1998 14:22:57 +0800

33 lines

New Thread

Braun? Brown? Process

Braun? Brown? Process

Dr. Warren Smith <[log in to unmask]>

Wed, 14 Oct 1998 15:23:33 -0400

38 lines

Re: Braun? Brown? Process

Jerry Cupples <[log in to unmask]>

Wed, 14 Oct 1998 15:21:56 -0500

59 lines

Re: Braun? Brown? Process

Motoyo Wajima <[log in to unmask]>

Thu, 15 Oct 1998 09:30:45 +0900

80 lines

Re: Braun? Brown? Process

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 15 Oct 1998 07:48:12 +0300

53 lines

New Thread

Braun? Brown? Process Thanks!

Re: Braun? Brown? Process Thanks!

Dr. Warren Smith <[log in to unmask]>

Thu, 15 Oct 1998 06:53:07 -0400

25 lines

New Thread

Burnt FR4

Burnt FR4

Joe Wackerman <[log in to unmask]>

Wed, 21 Oct 1998 11:11:41 -0700

41 lines

Re: Burnt FR4

Werner Engelmaier <[log in to unmask]>

Thu, 22 Oct 1998 07:25:05 EDT

37 lines

New Thread

Call For Abstracts - InterPACK® '99

Call For Abstracts - InterPACK® '99

David Whalley <[log in to unmask]>

Fri, 2 Oct 1998 08:37:00 +0100

42 lines

New Thread

Carbon film resistors

Carbon film resistors

Connie Korth <[log in to unmask]>

Tue, 13 Oct 1998 09:01:10 CDT

35 lines

Re: Carbon film resistors

Dale Marcum <[log in to unmask]>

Tue, 13 Oct 1998 10:35:49 -0400

86 lines

New Thread

Career Advice

Career Advice

Tony Morales <[log in to unmask]>

Tue, 6 Oct 1998 13:53:54 -0700

38 lines

New Thread

Ceramic vs. Plastic Components

Ceramic vs. Plastic Components

Neubauer, Terri <[log in to unmask]>

Fri, 9 Oct 1998 12:30:17 -0400

42 lines

Ceramic vs. Plastic Components

Alderete, Michael <[log in to unmask]>

Mon, 12 Oct 1998 13:01:39 -0700

67 lines

New Thread

Chemicals List

Chemicals List

SannMaung SEPS ENG <[log in to unmask]>

Wed, 14 Oct 1998 10:18:12 +0800

28 lines

Re: Chemicals List

[log in to unmask]

Thu, 15 Oct 1998 11:28:57 EDT

25 lines

New Thread

Component Baking Guideline

Component Baking Guideline

Ken Patel <[log in to unmask]>

Tue, 13 Oct 1998 10:41:54 -0700

30 lines

Component Baking Guideline

Jeff Hempton <[log in to unmask]>

Wed, 14 Oct 1998 08:31:42 -0500

60 lines

Re: Component Baking Guideline

Ken Fong <[log in to unmask]>

Wed, 14 Oct 1998 15:48:55 EST

57 lines

New Thread

Confomal coating adhesion

Confomal coating adhesion

Paul Stolar <[log in to unmask]>

Mon, 12 Oct 1998 08:09:06 -0600

26 lines

Re: Confomal coating adhesion

Fred Shubert <[log in to unmask]>

Mon, 12 Oct 1998 10:54:36 -0400

55 lines

Re: Confomal coating adhesion

Bridget Piper <[log in to unmask]>

Mon, 12 Oct 1998 15:30:45 +0100

66 lines

Re: Confomal coating adhesion

Davis, Mary <[log in to unmask]>

Mon, 12 Oct 1998 09:38:32 -0700

76 lines

Re: Confomal coating adhesion

Graham Naisbitt <[log in to unmask]>

Thu, 15 Oct 1998 15:32:45 +0100

146 lines

Re: Confomal coating adhesion

Richard Haynes <[log in to unmask]>

Sun, 18 Oct 1998 23:31:47 -0400

179 lines

New Thread

Confomal coating adhesion - reply

Re: Confomal coating adhesion - reply

[log in to unmask]

Mon, 12 Oct 1998 10:00:27 EDT

36 lines

New Thread

conformal coat machines

conformal coat machines

Ed Holton <[log in to unmask]>

Thu, 29 Oct 1998 10:38:02 -0400

31 lines

Re: conformal coat machines

McMonagle, Michael R. <[log in to unmask]>

Thu, 29 Oct 1998 12:55:14 -0600

70 lines

New Thread

Conformal Coat Masking

Re: Conformal Coat Masking

James Kittel <[log in to unmask]>

Thu, 1 Oct 1998 06:20:47 -0600

82 lines

Re: Conformal Coat Masking

McMonagle, Michael R. <[log in to unmask]>

Thu, 1 Oct 1998 11:18:27 -0500

100 lines

New Thread

Conformal coating adhesion

Re: Conformal coating adhesion

James Kittel <[log in to unmask]>

Mon, 12 Oct 1998 10:04:50 -0600

91 lines

New Thread

Conformal Coating Manufactures

Conformal Coating Manufactures

Darrell Bonzo <[log in to unmask]>

Wed, 21 Oct 1998 07:20:29 -0600

27 lines

Re: Conformal Coating Manufactures

Golfer <[log in to unmask]>

Wed, 21 Oct 1998 23:10:41 +0100

61 lines

Re: Conformal Coating Manufactures

Kevin A. Bush a.k.a. "Bushman" <[log in to unmask]>

Mon, 26 Oct 1998 07:42:56 -0500

107 lines

New Thread

Copper ductility

Copper ductility

Paul Gould <[log in to unmask]>

Mon, 12 Oct 1998 10:32:06 +0100

149 lines

Re: Copper ductility

Eric Yakobson <[log in to unmask]>

Mon, 12 Oct 1998 15:58:48 -0400

213 lines

New Thread

Copper ductility -Reply

Copper ductility -Reply

Fred Johnson <[log in to unmask]>

Mon, 12 Oct 1998 14:55:59 +0100

84 lines

Re: Copper ductility -Reply

Paul Gould <[log in to unmask]>

Mon, 12 Oct 1998 20:31:01 +0100

67 lines

New Thread

Copper plating & Copper thickness

Copper plating & Copper thickness

Francis Lai <[log in to unmask]>

Sat, 31 Oct 1998 10:13:49 -0500

42 lines

Re: Copper plating & Copper thickness

mcarano <[log in to unmask]>

Sat, 31 Oct 1998 09:30:36 -0600

87 lines

Re: Copper plating & Copper thickness

Eric Yakobson <[log in to unmask]>

Sat, 31 Oct 1998 20:04:48 -0500

156 lines

New Thread

Copper Question

Copper Question

Scott Holthausen <[log in to unmask]>

Tue, 13 Oct 1998 17:36:01 -0400

28 lines

Re: Copper Question

Rick A. Scovel <[log in to unmask]>

Tue, 13 Oct 1998 16:08:06 -0700

86 lines

Re: Copper Question

Alex Neussendorfer <[log in to unmask]>

Tue, 13 Oct 1998 17:35:54 -0500

60 lines

New Thread

CTE of FR4 and other materials

CTE of FR4 and other materials

James R. Paulus <[log in to unmask]>

Wed, 21 Oct 1998 15:13:44 EDT

365 lines

New Thread

CTE of FR4 and other materials in JPG format

CTE of FR4 and other materials in JPG format

Hugo Scaramuzza <[log in to unmask]>

Thu, 22 Oct 1998 14:24:06 -0500

39 lines

New Thread

Current Carrying Capacity of Conductors

Current Carrying Capacity of Conductors

Lisa Williams <[log in to unmask]>

Fri, 9 Oct 1998 13:17:51 -0500

51 lines

New Thread

Cutters

Cutters

Ryan Jennens <[log in to unmask]>

Mon, 12 Oct 1998 12:32:01 -0400

33 lines

Re: Cutters

Scott Decker <[log in to unmask]>

Mon, 12 Oct 1998 09:59:20 -0700

73 lines

Re: Cutters

Thomas C Han <[log in to unmask]>

Mon, 12 Oct 1998 10:42:56 -0700

124 lines

Re: Cutters

Stephen R. Gregory <[log in to unmask]>

Mon, 12 Oct 1998 14:04:21 EDT

41 lines

Re: Cutters

Matthias Mansfeld <[log in to unmask]>

Mon, 12 Oct 1998 19:24:18 +0200

44 lines

Re: Cutters

McMonagle, Michael R. <[log in to unmask]>

Mon, 12 Oct 1998 13:48:49 -0500

83 lines

Re: Cutters

Paul Klasek <[log in to unmask]>

Tue, 13 Oct 1998 13:46:39 +1000

71 lines

Re: Cutters

McMonagle, Michael R. <[log in to unmask]>

Tue, 13 Oct 1998 06:53:32 -0500

77 lines

New Thread

Cyanate Ester E glass processing

Cyanate Ester E glass processing

Shadler, Jeffrey <[log in to unmask]>

Thu, 8 Oct 1998 13:40:45 -0400

38 lines

New Thread

DC Current Probe

DC Current Probe

[log in to unmask]

Wed, 7 Oct 1998 14:22:41 -0500

40 lines

New Thread

Depanelizing boards

Depanelizing boards

Lustig, Steven K.. <[log in to unmask]>

Wed, 21 Oct 1998 13:44:11 -0400

37 lines

Re: Depanelizing boards

Gary Camac <[log in to unmask]>

Wed, 21 Oct 1998 14:13:59 -0500

54 lines

Re: Depanelizing boards

Paul Klasek <[log in to unmask]>

Fri, 23 Oct 1998 08:53:52 +1000

81 lines

New Thread

DESIGN SERVICE BUREAU USING ZUKEN VISULA

DESIGN SERVICE BUREAU USING ZUKEN VISULA

David Muscat <[log in to unmask]>

Sat, 24 Oct 1998 11:11:56 +1000

55 lines

New Thread

DFM HELP

DFM HELP

Jay Bitanga <[log in to unmask]>

Sat, 31 Oct 1998 10:15:12 +0000

49 lines

New Thread

Differential impedance

Differential impedance

Erika Pacheco <[log in to unmask]>

Fri, 9 Oct 1998 23:28:59 -0400

27 lines

Re: Differential impedance

Joseph E. J. Duclos Jr. <[log in to unmask]>

Sat, 10 Oct 1998 13:14:55 -0400

54 lines

New Thread

Digital Camera Assembly Process

Digital Camera Assembly Process

Jay Bitanga <[log in to unmask]>

Fri, 30 Oct 1998 09:38:57 +0000

45 lines

New Thread

digital pwb design survey

digital pwb design survey

Vanech, Bob <[log in to unmask]>

Fri, 9 Oct 1998 06:57:32 -0700

294 lines

Re: digital pwb design survey

D'Angelo, Ken <[log in to unmask]>

Fri, 9 Oct 1998 14:57:30 -0400

275 lines

New Thread

Double sided BGA assembly

Double sided BGA assembly

TOSTEVIN_BC <[log in to unmask]>

Tue, 20 Oct 1998 16:42:03 -0400

35 lines

Re: Double sided BGA assembly

Russ Steiner <[log in to unmask]>

Wed, 21 Oct 1998 13:18:41 -0400

72 lines

Re: Double sided BGA assembly

Jean-Paul Clech <[log in to unmask]>

Wed, 21 Oct 1998 21:19:02 EDT

51 lines

New Thread

Effects of X-Ray inspection on GaAs components.

Effects of X-Ray inspection on GaAs components.

Bridget Piper <[log in to unmask]>

Mon, 12 Oct 1998 14:18:31 +0100

86 lines

New Thread

EMI Shields

EMI Shields

Lustig, Steven K.. <[log in to unmask]>

Mon, 12 Oct 1998 07:41:20 -0400

42 lines

Re: EMI Shields

McMonagle, Michael R. <[log in to unmask]>

Mon, 12 Oct 1998 07:35:13 -0500

76 lines

Re: EMI Shields

Dale Marcum <[log in to unmask]>

Mon, 12 Oct 1998 09:08:17 -0400

90 lines

Re: EMI Shields

Stuart Chessen <[log in to unmask]>

Mon, 12 Oct 1998 06:58:08 -0700

96 lines

Re: EMI Shields

Richard Haynes <[log in to unmask]>

Mon, 12 Oct 1998 16:49:06 -0400

74 lines

New Thread

Environmental Stress Screening (ESS)

Environmental Stress Screening (ESS)

[log in to unmask]

Tue, 13 Oct 1998 15:56:09 -0500

28 lines

New Thread

ESD Smocks

ESD Smocks

Kenny Bloomquist <[log in to unmask]>

Fri, 16 Oct 1998 08:37:50 -0700

43 lines

Re: ESD Smocks

Richard Haynes <[log in to unmask]>

Fri, 16 Oct 1998 13:18:47 -0400

76 lines

New Thread

FAB : Deburr Brushes

FAB : Deburr Brushes

Mark Gillan <[log in to unmask]>

Fri, 9 Oct 1998 12:10:00 +0000

31 lines

New Thread

Fab: Cyanide plating bath on "standby mode"

Fab: Cyanide plating bath on "standby mode"

glenn pelkey <[log in to unmask]>

Fri, 2 Oct 1998 13:49:37 PDT

37 lines

Re: Fab: Cyanide plating bath on "standby mode"

Mike Barmuta <[log in to unmask]>

Fri, 2 Oct 1998 15:31:18 -0700

75 lines

Re: Fab: Cyanide plating bath on "standby mode"

Lenny Kurup <[log in to unmask]>

Mon, 5 Oct 1998 09:20:53 -0400

62 lines

New Thread

Fab: Multiple surface finishes

Re: Fab: Multiple surface finishes

<Andy Slade> <[log in to unmask]>

Wed, 30 Sep 1998 16:24:43 -0400

89 lines

Re: Fab: Multiple surface finishes

Terry Regan <[log in to unmask]>

Wed, 30 Sep 1998 15:35:15 -0400

108 lines

Re: Fab: Multiple surface finishes

David Ratte <[log in to unmask]>

Thu, 1 Oct 1998 12:21:52 -0400

137 lines

New Thread

fab: repair inner layer trace

fab: repair inner layer trace

Causey, Patty - LYPME <[log in to unmask]>

Thu, 29 Oct 1998 07:47:34 -0500

32 lines

Re: fab: repair inner layer trace

Ed Cosper <[log in to unmask]>

Thu, 29 Oct 1998 22:43:44 -0600

119 lines

Re: fab: repair inner layer trace

Paul Gould <[log in to unmask]>

Thu, 29 Oct 1998 22:10:44 -0000

59 lines

New Thread

Failure of Rigid Flex

Failure of Rigid Flex

Edward G. Shea <[log in to unmask]>

Fri, 30 Oct 1998 16:07:00 -0800

60 lines

Re: Failure of Rigid Flex

<Rashesh Patel> <[log in to unmask]>

Sat, 31 Oct 1998 09:11:25 EST

31 lines

Re: Failure of Rigid Flex

Jerome Sallo <[log in to unmask]>

Sat, 31 Oct 1998 12:36:53 EST

25 lines

New Thread

Flex Circuit Materials

Flex Circuit Materials

Tom Lambert <[log in to unmask]>

Fri, 2 Oct 1998 11:01:09 -0700

22 lines

New Thread

Flex market figures

Flex market figures

<David Albin> <[log in to unmask]>

Fri, 30 Oct 1998 13:55:00 +0000

32 lines

Re: Flex market figures

McMonagle, Michael R. <[log in to unmask]>

Fri, 30 Oct 1998 10:46:38 -0600

69 lines

New Thread

FR4 thermal expansion

FR4 thermal expansion

MARS100 <[log in to unmask]>

Sat, 17 Oct 1998 22:34:47 -0700

26 lines

Re: FR4 thermal expansion

Nüchter Wolfgang (FV/FLT) * <[log in to unmask]>

Wed, 21 Oct 1998 16:03:03 +0200

61 lines

Re: FR4 thermal expansion

James R. Paulus <[log in to unmask]>

Wed, 21 Oct 1998 11:13:49 EDT

38 lines

Re: FR4 thermal expansion

Vaughan, Ralph H <[log in to unmask]>

Wed, 21 Oct 1998 08:53:51 -0700

74 lines

Re: FR4 thermal expansion

Eric Christison <[log in to unmask]>

Wed, 21 Oct 1998 17:00:31 +0100

38 lines

Re: FR4 thermal expansion

Fred Shubert <[log in to unmask]>

Wed, 21 Oct 1998 15:07:43 -0400

68 lines

Re: FR4 thermal expansion

Chen Fung Leng <[log in to unmask]>

Thu, 22 Oct 1998 14:12:00 -0700

104 lines

Re: FR4 thermal expansion

David Hill <[log in to unmask]>

Thu, 22 Oct 1998 09:21:10 BST

35 lines

Re: FR4 thermal expansion

Werner Engelmaier <[log in to unmask]>

Wed, 21 Oct 1998 20:20:40 EDT

46 lines

Re: FR4 thermal expansion

Gabe Cherian <[log in to unmask]>

Thu, 22 Oct 1998 13:55:32 -0700

73 lines

New Thread

FR4 thermal expansion -Reply

Re: FR4 thermal expansion -Reply

Gina Wang <[log in to unmask]>

Thu, 22 Oct 1998 09:10:37 +1200

24 lines

New Thread

FW: ICT for bare boards

FW: ICT for bare boards

Reed, Randy <[log in to unmask]>

Thu, 15 Oct 1998 16:16:45 -0700

111 lines

New Thread

Fw: TechNet: confirmation required (1D4C91)

Fw: TechNet: confirmation required (1D4C91)

Richard Haynes <[log in to unmask]>

Wed, 14 Oct 1998 23:07:28 -0400

150 lines

New Thread

Fw: TechNet: confirmation required (75C57F)

Fw: TechNet: confirmation required (75C57F)

Richard Haynes <[log in to unmask]>

Wed, 14 Oct 1998 23:06:27 -0400

308 lines

New Thread

Fw: [TN] Ceramic vs. Plastic Components

Fw: [TN] Ceramic vs. Plastic Components

Russ Winslow <[log in to unmask]>

Tue, 13 Oct 1998 09:00:16 -0700

83 lines

New Thread

FW: [TN] Ionic Contamination due to No-Clean Fluxes

Re: FW: [TN] Ionic Contamination due to No-Clean Fluxes

Douglas Pauls <[log in to unmask]>

Tue, 13 Oct 1998 14:12:52 EDT

107 lines

Re: FW: [TN] Ionic Contamination due to No-Clean Fluxes

Sohn, John E (John) <[log in to unmask]>

Thu, 15 Oct 1998 13:15:40 -0400

180 lines

New Thread

FW: [TN] Via's under BGA's

FW: [TN] Via's under BGA's

Lee, Scott <[log in to unmask]>

Tue, 6 Oct 1998 12:19:58 -0400

248 lines

New Thread

FW: [TN] Voiding in BGA

FW: [TN] Voiding in BGA

Jeff Perkins <[log in to unmask]>

Thu, 8 Oct 1998 09:54:00 -0400

56 lines

New Thread

Galvanic action

Galvanic action

Michael D. Doty <[log in to unmask]>

Tue, 20 Oct 1998 18:39:37 -0400

34 lines

Re: Galvanic action

<Rudy Sedlak> <[log in to unmask]>

Tue, 20 Oct 1998 20:32:30 EDT

36 lines

Re: Galvanic action

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 22 Oct 1998 07:40:00 +0200

71 lines

Re: Galvanic action

Roger Mouton <[log in to unmask]>

Thu, 22 Oct 1998 16:10:14 EDT

26 lines

New Thread

geek

Re: geek

[log in to unmask]

Wed, 28 Oct 1998 10:46:23 EST

57 lines

Re: geek

Ian Squires <[log in to unmask]>

Wed, 28 Oct 1998 16:24:52 PST

108 lines

Re: geek

[log in to unmask]

Wed, 28 Oct 1998 11:20:57 EST

73 lines

Re: geek

Jerry Cupples <[log in to unmask]>

Wed, 28 Oct 1998 17:46:43 -0600

99 lines

Re: geek

Mark Simmons <[log in to unmask]>

Thu, 29 Oct 1998 08:28:02 -0800

29 lines

New Thread

Gold Finger Critical Contact Area

Gold Finger Critical Contact Area

Tom Collins <[log in to unmask]>

Fri, 30 Oct 1998 12:06:26 +0000

113 lines

New Thread

Gold removal service

Gold removal service

Larry Morse <[log in to unmask]>

Mon, 26 Oct 1998 15:59:37 -0800

32 lines

Re: Gold removal service

Stephen R. Gregory <[log in to unmask]>

Mon, 26 Oct 1998 20:47:33 EST

67 lines

Re: Gold removal service

Brett Goldstein <[log in to unmask]>

Wed, 28 Oct 1998 08:52:30 +0000

51 lines

New Thread

Gull wing lead forming

Gull wing lead forming

Bruce Adams <[log in to unmask]>

Fri, 30 Oct 1998 12:41:18 -0800

27 lines

Re: Gull wing lead forming

Stephen R. Gregory <[log in to unmask]>

Fri, 30 Oct 1998 17:24:04 EST

39 lines

Re: Gull wing lead forming

David Fish <[log in to unmask]>

Fri, 30 Oct 1998 17:50:24 -0500

47 lines

New Thread

Harman wire-bonding book

Harman wire-bonding book

David Gonnerman <[log in to unmask]>

Thu, 1 Oct 1998 12:58:28 -0500

189 lines

New Thread

Heat seal connectors to LCD

Heat seal connectors to LCD

Chuck Garth <[log in to unmask]>

Mon, 26 Oct 1998 10:20:26 EST

28 lines

Re: Heat seal connectors to LCD

Jeff Hempton <[log in to unmask]>

Tue, 27 Oct 1998 13:45:10 -0500

71 lines

New Thread

Heller 1900

Heller 1900

Angie Marques <[log in to unmask]>

Fri, 9 Oct 1998 10:21:23 -0700

30 lines

New Thread

HELP NEEDED ON OSP QUALITY ON THE THM COMPONENT SOLD

Re: HELP NEEDED ON OSP QUALITY ON THE THM COMPONENT SOLD

Terry Regan <[log in to unmask]>

Thu, 8 Oct 1998 09:58:06 -0400

93 lines

Re: HELP NEEDED ON OSP QUALITY ON THE THM COMPONENT SOLD

Michael Pavlov <[log in to unmask]>

Fri, 9 Oct 1998 09:44:06 EDT

31 lines

New Thread

HELP NEEDED ON OSP QUALITY ON THE THM COMPONENT SOLDERBILITY

HELP NEEDED ON OSP QUALITY ON THE THM COMPONENT SOLDERBILITY

LAI,HAW FONG <[log in to unmask]>

Wed, 7 Oct 1998 08:41:00 PDT

53 lines

New Thread

Help on design rules for chip capacitors

Help on design rules for chip capacitors

Gabriela Bogdan <[log in to unmask]>

Tue, 6 Oct 1998 19:44:43 +0200

35 lines

Re: Help on design rules for chip capacitors

Stephen R. Gregory <[log in to unmask]>

Tue, 6 Oct 1998 18:16:10 EDT

79 lines

Re: Help on design rules for chip capacitors

Sauer, Steven T. <[log in to unmask]>

Wed, 7 Oct 1998 08:37:00 E

81 lines

Re: Help on design rules for chip capacitors

Gabriela Bogdan <[log in to unmask]>

Wed, 7 Oct 1998 17:51:01 +0200

116 lines

New Thread

Help with design and assembly of Micro BGA's TI "MicroSt ar" and Tessera uBGA style

Re: Help with design and assembly of Micro BGA's TI "MicroSt ar" and Tessera uBGA style

Stammely, Tim <[log in to unmask]>

Tue, 13 Oct 1998 14:02:51 -0400

81 lines

New Thread

Help with design and assembly of Micro BGA's TI "MicroStar" and Tessera uBGA style

Help with design and assembly of Micro BGA's TI "MicroStar" and Tessera uBGA style

Winiarski, Frank <[log in to unmask]>

Tue, 13 Oct 1998 13:30:35 -0400

45 lines

New Thread

Hermetic Sealing

Hermetic Sealing

[log in to unmask]

Tue, 6 Oct 1998 12:54:16 -0500

41 lines

Re: Hermetic Sealing

Jeremy Drake <[log in to unmask]>

Thu, 8 Oct 1998 09:20:47 +0000

59 lines

New Thread

Hidden Via

Hidden Via

Jan Satterfield <[log in to unmask]>

Mon, 26 Oct 1998 09:06:06 -0700

22 lines

New Thread

High Temp Solder - the "real" world

High Temp Solder - the "real" world

John Lusk <[log in to unmask]>

Wed, 28 Oct 1998 09:31:18 -0600

39 lines

New Thread

Hot Bar Soldering

Hot Bar Soldering

[log in to unmask]

Tue, 6 Oct 1998 09:24:34 -0500

34 lines

Re: Hot Bar Soldering

Scott Mcanall <[log in to unmask]>

Tue, 6 Oct 1998 12:52:56 EDT

26 lines

Hot Bar Soldering

[log in to unmask]

Tue, 6 Oct 1998 17:39:11 -0500

78 lines

Re: Hot Bar Soldering

Mauricio Castro <[log in to unmask]>

Wed, 7 Oct 1998 08:16:38 -0500

68 lines

Re: Hot Bar Soldering

Russ Winslow <[log in to unmask]>

Thu, 8 Oct 1998 09:51:33 -0700

46 lines

Re: Hot Bar Soldering

Iain Braddock <[log in to unmask]>

Fri, 9 Oct 1998 08:53:49 +0100

98 lines

New Thread

Hot bar soldering flex on ceramic

Hot bar soldering flex on ceramic

Matthias Mansfeld <[log in to unmask]>

Wed, 7 Oct 1998 19:10:49 +0200

52 lines

Re: Hot bar soldering flex on ceramic

Paul Stolar <[log in to unmask]>

Wed, 7 Oct 1998 16:52:41 -0600

90 lines

Re: Hot bar soldering flex on ceramic

Andy Magee <[log in to unmask]>

Thu, 8 Oct 1998 09:18:03 -0400

83 lines

Re: Hot bar soldering flex on ceramic

Andy Magee <[log in to unmask]>

Fri, 9 Oct 1998 11:45:13 -0400

35 lines

New Thread

Hot: Trace width and air gap for 1mm pitch BGA

Hot: Trace width and air gap for 1mm pitch BGA

Ken Patel <[log in to unmask]>

Tue, 27 Oct 1998 12:02:45 -0800

37 lines

Re: Hot: Trace width and air gap for 1mm pitch BGA

Russ Steiner <[log in to unmask]>

Wed, 28 Oct 1998 14:46:51 -0500

69 lines

Re: Hot: Trace width and air gap for 1mm pitch BGA

Bill Davis <[log in to unmask]>

Wed, 28 Oct 1998 14:31:33 -0800

134 lines

New Thread

ICD defect

Re: ICD defect

Howard Lin <[log in to unmask]>

Mon, 19 Oct 1998 15:20:11 +0800

27 lines

Re: ICD defect

No Name Available <[log in to unmask]>

Mon, 19 Oct 1998 09:14:54 +0100

25 lines

Re: ICD defect

[log in to unmask]

Mon, 19 Oct 1998 14:09:50 EDT

42 lines

Re: ICD defect

Russell S Gregory <[log in to unmask]>

Mon, 19 Oct 1998 15:10:25 EDT

31 lines

New Thread

ICT for bare boards

ICT for bare boards

Doug Jeffery <[log in to unmask]>

Wed, 14 Oct 1998 08:01:37 -0500

41 lines

Re: ICT for bare boards

Darrel Therriault <[log in to unmask]>

Wed, 14 Oct 1998 11:12:24 -0700

74 lines

Re: ICT for bare boards

Bev Christian <[log in to unmask]>

Wed, 14 Oct 1998 14:54:29 -0400

80 lines

Re: ICT for bare boards

Karl Sauter <[log in to unmask]>

Wed, 14 Oct 1998 11:32:29 -0700

74 lines

Re: ICT for bare boards

Gary D. Peterson <[log in to unmask]>

Wed, 14 Oct 1998 13:40:22 -0600

103 lines

Re: ICT for bare boards

[log in to unmask]

Wed, 14 Oct 1998 16:03:28 EDT

40 lines

Re: ICT for bare boards

Leslie O. Connally <[log in to unmask]>

Wed, 14 Oct 1998 14:53:34 -0500

73 lines

Re: ICT for bare boards

Jim Axton <[log in to unmask]>

Wed, 14 Oct 1998 13:34:27 -0700

82 lines

Re: ICT for bare boards

Eric Yakobson <[log in to unmask]>

Wed, 14 Oct 1998 16:27:22 -0400

232 lines

Re: ICT for bare boards

Edwards, Ted A (AZ75) <[log in to unmask]>

Thu, 15 Oct 1998 08:57:00 -0700

118 lines

Re: ICT for bare boards

Leslie O. Connally <[log in to unmask]>

Fri, 16 Oct 1998 10:33:13 -0500

149 lines

Re: ICT for bare boards

Gerard Gavrel <[log in to unmask]>

Fri, 16 Oct 1998 16:18:20 -0400

156 lines

Re: ICT for bare boards

D. Rooke <[log in to unmask]>

Sat, 17 Oct 1998 10:24:50 -0400

134 lines

New Thread

IMAPS/SMTA Seminar 10/22/98 @ Lucent Technologies

IMAPS/SMTA Seminar 10/22/98 @ Lucent Technologies

Brian C. Hunter <[log in to unmask]>

Wed, 14 Oct 1998 11:21:23 -0600

71 lines

New Thread

Immersion Tin Process

Immersion Tin Process

Rick Thompson <[log in to unmask]>

Fri, 30 Oct 1998 13:49:42 -0800

39 lines

Re: Immersion Tin Process

[log in to unmask]

Fri, 30 Oct 1998 23:08:03 -0600

67 lines

Re: Immersion Tin Process

ECI Technology <[log in to unmask]>

Sat, 31 Oct 1998 18:31:57 EST

31 lines

Re: Immersion Tin Process

Don Vischulis <[log in to unmask]>

Fri, 30 Oct 1998 21:23:17 -0600

54 lines

New Thread

In-house Specifications

In-house Specifications

Hamilton, Richard -4454 <[log in to unmask]>

Thu, 22 Oct 1998 09:11:08 -0700

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In-house Specifications

Jeff Hempton <[log in to unmask]>

Thu, 22 Oct 1998 13:31:48 -0500

89 lines

New Thread

Inserts into PWB

Inserts into PWB

Nüchter Wolfgang (FV/FLT) * <[log in to unmask]>

Mon, 12 Oct 1998 14:09:13 +0200

38 lines

Re: Inserts into PWB

Nüchter Wolfgang (FV/FLT) * <[log in to unmask]>

Mon, 12 Oct 1998 16:08:13 +0200

95 lines

New Thread

Intel uBGA Flash, Bottom Side SMT?

Intel uBGA Flash, Bottom Side SMT?

Rick Thompson <[log in to unmask]>

Fri, 30 Oct 1998 15:03:28 -0800

45 lines

Re: Intel uBGA Flash, Bottom Side SMT?

Joseph Fjelstad <[log in to unmask]>

Fri, 30 Oct 1998 16:39:45 -0800

78 lines

New Thread

Ionic Contamination due to No-Clean Fluxes

Ionic Contamination due to No-Clean Fluxes

Ozark Circuits <[log in to unmask]>

Mon, 12 Oct 1998 10:03:33 -0500

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Re: Ionic Contamination due to No-Clean Fluxes

Edwards, Ted A (AZ75) <[log in to unmask]>

Mon, 12 Oct 1998 10:12:00 -0700

65 lines

Re: Ionic Contamination due to No-Clean Fluxes

David D Hillman <[log in to unmask]>

Mon, 12 Oct 1998 13:50:26 -0500

79 lines

Re: Ionic Contamination due to No-Clean Fluxes

[log in to unmask]

Mon, 12 Oct 1998 15:48:47 EDT

32 lines

Re: Ionic Contamination due to No-Clean Fluxes

Sauer, Steven T. <[log in to unmask]>

Tue, 13 Oct 1998 08:41:00 E

80 lines

Re: Ionic Contamination due to No-Clean Fluxes

Bev Christian <[log in to unmask]>

Wed, 14 Oct 1998 16:46:58 -0400

96 lines

Re: Ionic Contamination due to No-Clean Fluxes

Douglas Pauls <[log in to unmask]>

Wed, 21 Oct 1998 19:30:09 EDT

142 lines

New Thread

IPC - A - 600

IPC - A - 600

[log in to unmask]

Tue, 27 Oct 1998 07:53:31 -0600

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Re: IPC - A - 600

Ian Squires <[log in to unmask]>

Wed, 28 Oct 1998 10:11:29 PST

55 lines

New Thread

IPC - A - 600 or 610?

Re: IPC - A - 600 or 610?

Alan Shaw <[log in to unmask]>

Wed, 28 Oct 1998 13:59:35 -0500

64 lines

New Thread

IPC J-Std-001 Class What reliability?

IPC J-Std-001 Class What reliability?

George Franck <[log in to unmask]>

Wed, 21 Oct 1998 08:18:41 -0400

56 lines

Re: IPC J-Std-001 Class What reliability?

Werner Engelmaier <[log in to unmask]>

Wed, 21 Oct 1998 20:20:44 EDT

56 lines

New Thread

IPC Rework Documents

Re: IPC Rework Documents

Jack Crawford <[log in to unmask]>

Sat, 17 Oct 1998 14:51:57 -0500

61 lines

IPC Rework Documents

Yvon Hache <[log in to unmask]>

Tue, 20 Oct 1998 10:51:26 +0000

30 lines

New Thread

IPC Standards for Fiducials

IPC Standards for Fiducials

Randy Decker <[log in to unmask]>

Fri, 23 Oct 1998 16:05:07 -0400

30 lines

Re: IPC Standards for Fiducials

Sherman Banks <[log in to unmask]>

Fri, 23 Oct 1998 13:39:52 -0700

49 lines

Re: IPC Standards for Fiducials

Cyrus Ringle <[log in to unmask]>

Fri, 23 Oct 1998 17:54:42 -0700

88 lines

New Thread

IPC-A-610B Class II vs Class III

IPC-A-610B Class II vs Class III

Ron & Cori Green <[log in to unmask]>

Mon, 19 Oct 1998 19:18:38 -0500

32 lines

New Thread

IPC-R-700

Re: IPC-R-700

Matthias Mansfeld <[log in to unmask]>

Sat, 17 Oct 1998 23:11:40 +0200

51 lines

New Thread

j-std-001b

j-std-001b

Crepeau, Phil <[log in to unmask]>

Thu, 15 Oct 1998 16:03:08 -0700

32 lines

Re: j-std-001b

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 16 Oct 1998 08:51:00 -0400

28 lines

New Thread

Japanese Solderability Specs

Japanese Solderability Specs

Bev Christian <[log in to unmask]>

Fri, 16 Oct 1998 11:13:28 -0400

27 lines

Re: Japanese Solderability Specs

Fujikura Ltd. <[log in to unmask]>

Sat, 17 Oct 1998 10:50:26 +0900

62 lines

New Thread

Land size

Land size

WM Cheng <[log in to unmask]>

Thu, 15 Oct 1998 16:26:27 EST

26 lines

Re: Land size

TOM HYBISKE <[log in to unmask]>

Fri, 16 Oct 1998 07:41:23 +0000

60 lines

New Thread

Laser direct imaging

Laser direct imaging

danka ivanovic <[log in to unmask]>

Mon, 5 Oct 1998 17:55:24 PDT

44 lines

Re: Laser direct imaging

Marco Biagtan <[log in to unmask]>

Tue, 6 Oct 1998 20:08:03 +0700

81 lines

Re: Laser direct imaging

Roland Jaquet <[log in to unmask]>

Tue, 6 Oct 1998 15:36:31 +0200

132 lines

New Thread

laser drilling / ablation

laser drilling / ablation

Alderete, Michael <[log in to unmask]>

Mon, 5 Oct 1998 12:56:34 -0700

141 lines

New Thread

LED 7 segment displays in SMT package

LED 7 segment displays in SMT package

Landes, Jeff <[log in to unmask]>

Thu, 15 Oct 1998 13:03:00 PDT

21 lines

Re: LED 7 segment displays in SMT package

Paul Klasek <[log in to unmask]>

Fri, 16 Oct 1998 08:13:28 +1000

54 lines

Re: LED 7 segment displays in SMT package

Stephen R. Gregory <[log in to unmask]>

Thu, 15 Oct 1998 23:00:38 EDT

74 lines

New Thread

LED failures

LED failures

[log in to unmask]

Wed, 14 Oct 1998 13:36:30 -0500

44 lines

Re: LED failures

No Name Available <[log in to unmask]>

Wed, 14 Oct 1998 19:49:01 EDT

28 lines

Re: LED failures

[log in to unmask]

Thu, 15 Oct 1998 09:33:18 -0400

77 lines

Re: LED failures

Gary Camac <[log in to unmask]>

Thu, 15 Oct 1998 09:03:27 -0500

60 lines

New Thread

LED failures -Reply

LED failures -Reply

Allan Kerr <[log in to unmask]>

Wed, 14 Oct 1998 19:26:01 -0400

32 lines

New Thread

Longitudinal PTH cracking

Longitudinal PTH cracking

Chris Evans <[log in to unmask]>

Thu, 15 Oct 1998 09:55:36 PST

37 lines

Re: Longitudinal PTH cracking

Werner Engelmaier <[log in to unmask]>

Wed, 21 Oct 1998 20:20:47 EDT

59 lines

New Thread

Looking for custom vibrating tube feeder for Fuji IP2

Looking for custom vibrating tube feeder for Fuji IP2

Shin, Simon <[log in to unmask]>

Wed, 21 Oct 1998 14:23:00 -0600

36 lines

Re: Looking for custom vibrating tube feeder for Fuji IP2

Thomas C Han <[log in to unmask]>

Wed, 21 Oct 1998 16:00:04 -0700

71 lines

New Thread

Looking for susceptibility simu. software for RFI

Looking for susceptibility simu. software for RFI

Dave Artman <[log in to unmask]>

Fri, 23 Oct 1998 09:35:13 -0500

45 lines

New Thread

Loss of chips thru wave solder

Loss of chips thru wave solder

Traxler, Stan <[log in to unmask]>

Wed, 7 Oct 1998 14:16:00 PDT

48 lines

Re: Loss of chips thru wave solder

Thomas C Han <[log in to unmask]>

Thu, 8 Oct 1998 12:40:34 -0700

95 lines

New Thread

LPI Filled Vias

Re: LPI Filled Vias

TOM HYBISKE <[log in to unmask]>

Thu, 1 Oct 1998 11:37:51 +0000

42 lines

New Thread

LPI Filled Vias ?

LPI Filled Vias ?

Kelly M. Schriver <[log in to unmask]>

Thu, 1 Oct 1998 08:54:49 -0500

56 lines

Re: LPI Filled Vias ?

Ed Cosper <[log in to unmask]>

Thu, 1 Oct 1998 12:32:34 -0500

186 lines

Re: LPI Filled Vias ?

Kubes, Romeo (NM75) <[log in to unmask]>

Mon, 5 Oct 1998 08:22:50 -0600

101 lines

Re: LPI Filled Vias ?

Gary Camac <[log in to unmask]>

Mon, 5 Oct 1998 16:32:54 -0500

134 lines

New Thread

LPI Filled Vias-correction

LPI Filled Vias-correction

TOM HYBISKE <[log in to unmask]>

Thu, 1 Oct 1998 14:54:48 +0000

44 lines

New Thread

Mail Link to SMTP Undeliverable Message

Re: Mail Link to SMTP Undeliverable Message

Vanech, Bob <[log in to unmask]>

Fri, 9 Oct 1998 11:25:03 -0700

31 lines

New Thread

Micro BGA

Micro BGA

Craig McGlinchy <[log in to unmask]>

Tue, 6 Oct 1998 08:18:59 +1200

42 lines

New Thread

microannex els

microannex els

corn naik <[log in to unmask]>

Sun, 4 Oct 1998 18:20:50 -0700

35 lines

microannex els

corn naik <[log in to unmask]>

Mon, 19 Oct 1998 19:25:56 -0700

34 lines

New Thread

Microelectronics Market for Imaging Chemicals

Microelectronics Market for Imaging Chemicals

Judith Harper <[log in to unmask]>

Sun, 4 Oct 1998 19:34:17 -0400

41 lines

New Thread

MIL S 13949 to IPC 4101 Conversion GMN versus GFT

MIL S 13949 to IPC 4101 Conversion GMN versus GFT

Edwards, Ted A (AZ75) <[log in to unmask]>

Thu, 15 Oct 1998 09:57:00 -0700

25 lines

New Thread

Military Specifications

Military Specifications

Scott B. Westheimer <[log in to unmask]>

Wed, 14 Oct 1998 03:51:05 -0700

59 lines

Re: Military Specifications

McMonagle, Michael R. <[log in to unmask]>

Wed, 14 Oct 1998 10:29:05 -0500

49 lines

Re: Military Specifications

Blazi, Eric - LYPMPA <[log in to unmask]>

Wed, 14 Oct 1998 08:04:36 -0400

41 lines

Re: Military Specifications

BOB HAYNES <[log in to unmask]>

Wed, 14 Oct 1998 13:47:33 -0400

91 lines

New Thread

MS-105

MS-105

[log in to unmask]

Thu, 1 Oct 1998 10:20:27 EDT

36 lines

New Thread

NAWCADLKE SPECIFICATION

NAWCADLKE SPECIFICATION

Bridget Piper <[log in to unmask]>

Thu, 29 Oct 1998 11:34:46 -0000

77 lines

Re: NAWCADLKE SPECIFICATION

Sauer, Steven T. <[log in to unmask]>

Thu, 29 Oct 1998 08:47:00 E

40 lines

New Thread

No-Clean Solder Ball.

No-Clean Solder Ball.

Sira Rikulsurakan <[log in to unmask]>

Thu, 15 Oct 1998 03:52:42 +0700

36 lines

No-Clean Solder Ball.

Sira Rikulsurakan <[log in to unmask]>

Thu, 15 Oct 1998 04:07:37 +0700

33 lines

Re: No-Clean Solder Ball.

Golfer <[log in to unmask]>

Wed, 14 Oct 1998 23:56:53 +0100

78 lines

Re: No-Clean Solder Ball.

Brad Kendall <[log in to unmask]>

Thu, 15 Oct 1998 08:44:03 -0400

78 lines

Re: No-Clean Solder Ball.

Vincent B. Kinol <[log in to unmask]>

Wed, 21 Oct 1998 12:07:24 -0000

60 lines

New Thread

One more thing on stacked chip components.

One more thing on stacked chip components.

Frank Hinojos <[log in to unmask]>

Mon, 12 Oct 1998 09:10:46 -0700

37 lines

New Thread

OSP and Loctite 7360

OSP and Loctite 7360

[log in to unmask]

Fri, 30 Oct 1998 13:34:23 -0600

31 lines

New Thread

Oxide / Durabond Alternatives

Oxide / Durabond Alternatives

J M <[log in to unmask]>

Thu, 8 Oct 1998 11:24:47 PDT

28 lines

Re: Oxide / Durabond Alternatives

David D Sullivan <[log in to unmask]>

Fri, 9 Oct 1998 05:15:42 -0500

71 lines

Re: Oxide / Durabond Alternatives

Ed Cosper <[log in to unmask]>

Fri, 9 Oct 1998 11:52:39 -0500

96 lines

Oxide / Durabond Alternatives

thomas peters <[log in to unmask]>

Mon, 12 Oct 1998 14:20:06 PDT

41 lines

Oxide / Durabond Alternatives

Craig Bishop <[log in to unmask]>

Wed, 14 Oct 1998 16:06:19 -0400

232 lines

Re: Oxide / Durabond Alternatives

Kelly M. Schriver <[log in to unmask]>

Thu, 15 Oct 1998 08:35:17 -0500

37 lines

New Thread

Oxide / Durabond Alternatives -Reply

Oxide / Durabond Alternatives -Reply

Fred Johnson <[log in to unmask]>

Mon, 12 Oct 1998 14:16:08 +0100

60 lines

Re: Oxide / Durabond Alternatives -Reply

Roger Mouton <[log in to unmask]>

Mon, 12 Oct 1998 11:40:19 EDT

25 lines

New Thread

Oxide process controls

Oxide process controls

[log in to unmask]

Wed, 28 Oct 1998 13:08:44 EST

40 lines

Re: Oxide process controls

Richard Haynes <[log in to unmask]>

Wed, 28 Oct 1998 16:14:35 -0500

72 lines

Re: Oxide process controls

Leslie O. Connally <[log in to unmask]>

Fri, 30 Oct 1998 08:26:05 -0500

75 lines

New Thread

P and B content in electroless nickel

Re: P and B content in electroless nickel

Richard Haynes <[log in to unmask]>

Fri, 23 Oct 1998 23:18:31 -0400

128 lines

Re: P and B content in electroless nickel

Richard Haynes <[log in to unmask]>

Fri, 23 Oct 1998 23:32:28 -0400

110 lines

New Thread

Partnering with CM's

Partnering with CM's

Rod Martens <[log in to unmask]>

Mon, 5 Oct 1998 12:54:11 -0600

64 lines

New Thread

PCB ASSEMBLY COST ANALYS

Re: PCB ASSEMBLY COST ANALYS

Moss, Thomas <[log in to unmask]>

Tue, 27 Oct 1998 10:20:00 -0800

75 lines

Re: PCB ASSEMBLY COST ANALYS

Brett Goldstein <[log in to unmask]>

Wed, 28 Oct 1998 08:52:30 +0000

87 lines

New Thread

PCB ASSEMBLY COST ANALYS (Can we put on TN?)

PCB ASSEMBLY COST ANALYS (Can we put on TN?)

PELCHAT_JM <[log in to unmask]>

Tue, 27 Oct 1998 15:31:04 -0500

101 lines

New Thread

PCB ASSEMBLY COST ANALYSIS

PCB ASSEMBLY COST ANALYSIS

Dave Hamilton <[log in to unmask]>

Thu, 22 Oct 1998 08:50:54 -0500

51 lines

Re: PCB ASSEMBLY COST ANALYSIS

[log in to unmask]

Thu, 22 Oct 1998 20:00:00 EDT

31 lines

Re: PCB ASSEMBLY COST ANALYSIS

Barry Bates <[log in to unmask]>

Fri, 23 Oct 1998 09:01:18 +0100

76 lines

Re: PCB ASSEMBLY COST ANALYSIS

Debbie Kenney <[log in to unmask]>

Fri, 23 Oct 1998 09:28:26 -0700

99 lines

Re: PCB ASSEMBLY COST ANALYSIS

Thomas C Han <[log in to unmask]>

Fri, 23 Oct 1998 09:56:32 -0700

63 lines

PCB ASSEMBLY COST ANALYSIS

David Muscat <[log in to unmask]>

Sat, 24 Oct 1998 08:38:25 +1000

90 lines

Re: PCB ASSEMBLY COST ANALYSIS

Khaled H. Fouad <[log in to unmask]>

Sat, 24 Oct 1998 00:12:04 +0200

38 lines

Re: PCB ASSEMBLY COST ANALYSIS

Joseph Lam <[log in to unmask]>

Mon, 26 Oct 1998 11:48:59 +1100

31 lines

Re: PCB ASSEMBLY COST ANALYSIS

Craig McGlinchy <[log in to unmask]>

Tue, 27 Oct 1998 09:13:49 +1200

30 lines

New Thread

PCB Designers

PCB Designers

Scott Holthausen <[log in to unmask]>

Thu, 15 Oct 1998 10:00:01 -0400

31 lines

Re: PCB Designers

Mike Keel <[log in to unmask]>

Thu, 15 Oct 1998 08:54:04 -0700

146 lines

New Thread

PCB for fine pitch

PCB for fine pitch

No Name Available <[log in to unmask]>

Thu, 22 Oct 1998 16:00:16 EDT

36 lines

Re: PCB for fine pitch

Ed Cosper <[log in to unmask]>

Thu, 22 Oct 1998 16:56:32 -0500

134 lines

Re: PCB for fine pitch

Smith,Bob (I/A) <[log in to unmask]>

Fri, 23 Oct 1998 06:02:54 -0400

74 lines

New Thread

Percent Phosphorous in plating solution causing excess intermetal lics in Au/Ni/Cu solder joints

Percent Phosphorous in plating solution causing excess intermetal lics in Au/Ni/Cu solder joints

Earl Moon <[log in to unmask]>

Thu, 22 Oct 1998 05:42:39 -0700

40 lines

New Thread

Percent Phosphorous in plating solution causing excess intermetallics in Au/Ni/Cu solder joints

Re: Percent Phosphorous in plating solution causing excess intermetallics in Au/Ni/Cu solder joints

David D Hillman <[log in to unmask]>

Fri, 23 Oct 1998 05:35:45 -0500

90 lines

New Thread

Phosphor in Electroless Nickel

Re: Phosphor in Electroless Nickel

Gerard O'Brien <[log in to unmask]>

Wed, 21 Oct 1998 08:41:44 -0400

72 lines

New Thread

Phosphour in Elcetroless Nickel

Phosphour in Elcetroless Nickel

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 15 Oct 1998 07:48:15 +0300

37 lines

New Thread

Phosphour in Electroless Nickel

Phosphour in Electroless Nickel

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 21 Oct 1998 07:50:12 +0200

41 lines

Re: Phosphour in Electroless Nickel

Leslie O. Connally <[log in to unmask]>

Wed, 21 Oct 1998 08:14:02 -0500

76 lines

Re: Phosphour in Electroless Nickel

Chris Evans <[log in to unmask]>

Mon, 26 Oct 1998 12:21:23 PST

75 lines

New Thread

Please help, if you can.

Please help, if you can.

HeldDiedrich <[log in to unmask]>

Tue, 27 Oct 1998 10:12:08 -0500

84 lines

New Thread

Plugged/tented vias

Plugged/tented vias

Chan, Marcelo <[log in to unmask]>

Thu, 22 Oct 1998 14:33:11 -0400

34 lines

Re: Plugged/tented vias

Tim Snodgrass <[log in to unmask]>

Thu, 22 Oct 1998 15:11:52 -0700

60 lines

Re: Plugged/tented vias

Chan, Marcelo <[log in to unmask]>

Fri, 23 Oct 1998 07:40:42 -0400

89 lines

Re: Plugged/tented vias

Russ Steiner <[log in to unmask]>

Fri, 23 Oct 1998 07:54:44 -0400

74 lines

New Thread

Prepreg Thickness

Prepreg Thickness

[log in to unmask]

Mon, 19 Oct 1998 15:05:54 -0500

30 lines

New Thread

Price Quote

Price Quote

Mark Waloszek <[log in to unmask]>

Wed, 14 Oct 1998 13:43:28 -0400

31 lines

New Thread

Product Safety

Product Safety

Hamilton, Richard -4454 <[log in to unmask]>

Fri, 2 Oct 1998 10:12:17 -0700

40 lines

Re: Product Safety

Douglas Mckean <[log in to unmask]>

Fri, 2 Oct 1998 11:28:24 -0700

76 lines

Re: Product Safety

mark ross <[log in to unmask]>

Fri, 2 Oct 1998 15:25:08 -0400

65 lines

New Thread

Protective coating for glass

Protective coating for glass

Ron Videen <[log in to unmask]>

Wed, 7 Oct 1998 11:30:26 -0500

46 lines

New Thread

PTH Plugging

PTH Plugging

Mengers, William D. <[log in to unmask]>

Mon, 5 Oct 1998 15:18:17 -0400

34 lines

New Thread

Pull force

Pull force

[log in to unmask]

Fri, 16 Oct 1998 08:15:33 EDT

29 lines

New Thread

pure tin surface finish

Re: pure tin surface finish

Signorelli, Paul <[log in to unmask]>

Wed, 21 Oct 1998 07:52:59 -0600

63 lines

New Thread

pure tin surface finish requirement

pure tin surface finish requirement

Howard Lin <[log in to unmask]>

Wed, 21 Oct 1998 13:08:08 +0800

32 lines

Re: pure tin surface finish requirement

<Rudy Sedlak> <[log in to unmask]>

Wed, 21 Oct 1998 02:07:54 EDT

39 lines

Re: pure tin surface finish requirement

[log in to unmask]

Fri, 23 Oct 1998 12:21:03 EDT

45 lines

Re: pure tin surface finish requirement

Paul Wilson <[log in to unmask]>

Mon, 26 Oct 1998 06:22:52 -0500

116 lines

Re: pure tin surface finish requirement

Rick A. Scovel <[log in to unmask]>

Fri, 23 Oct 1998 20:04:19 -0700

96 lines

New Thread

pwb design survey

pwb design survey

Vanech, Bob <[log in to unmask]>

Wed, 14 Oct 1998 07:38:07 -0700

216 lines

Re: pwb design survey

D'Angelo, Ken <[log in to unmask]>

Thu, 15 Oct 1998 07:36:14 -0400

243 lines

New Thread

question

question

[log in to unmask]

Fri, 9 Oct 1998 11:41:55 -0400

43 lines

Re: question

Hurst, Joe <[log in to unmask]>

Fri, 9 Oct 1998 12:33:31 -0400

76 lines

New Thread

quoting for an SMT assembly job, help!

quoting for an SMT assembly job, help!

Bryan Bloom <[log in to unmask]>

Fri, 2 Oct 1998 16:05:07 -0700

102 lines

New Thread

Reg: Dicing operations

Reg: Dicing operations

Manish <[log in to unmask]>

Mon, 19 Oct 1998 15:52:46 -0400

52 lines

Re: Reg: Dicing operations

Jeremy Drake <[log in to unmask]>

Tue, 20 Oct 1998 08:26:48 +0000

129 lines

Re: Reg: Dicing operations

Mauro Nardini <[log in to unmask]>

Tue, 20 Oct 1998 10:24:31 -0700

123 lines

New Thread

Reg: Voids in Solder Bumps

Reg: Voids in Solder Bumps

Manish <[log in to unmask]>

Tue, 20 Oct 1998 09:57:02 -0400

37 lines

New Thread

Reliability Data for Pad Repair

Reliability Data for Pad Repair

Bev Christian <[log in to unmask]>

Wed, 14 Oct 1998 09:21:13 -0400

30 lines

New Thread

Replacing Mil-S-13949

Re: Replacing Mil-S-13949

George Franck <[log in to unmask]>

Thu, 1 Oct 1998 08:28:17 -0400

94 lines

Re: Replacing Mil-S-13949

Christopher Jorgensen <[log in to unmask]>

Thu, 1 Oct 1998 08:28:10 -0500

53 lines

Re: Replacing Mil-S-13949

Tom Kropski <[log in to unmask]>

Thu, 1 Oct 1998 07:54:23 -0400

31 lines

New Thread

Rework

Rework

Darrel Therriault <[log in to unmask]>

Thu, 22 Oct 1998 11:00:39 -0700

39 lines

Re: Rework

Sira Rikulsurakan <[log in to unmask]>

Fri, 23 Oct 1998 13:16:57 +0700

64 lines

New Thread

Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS

Re: Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS

Bridget Piper <[log in to unmask]>

Mon, 26 Oct 1998 10:37:46 -0000

199 lines

New Thread

Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS -Reply

Re: Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS -Reply

TPE Engineering TechNet <[log in to unmask]>

Mon, 26 Oct 1998 09:48:10 -0700

22 lines

New Thread

Re[2]: [TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS

Re: Re[2]: [TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS

Florencio Eiranova <[log in to unmask]>

Tue, 27 Oct 1998 07:17:29 -0800

280 lines

Re: Re[2]: [TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS

Gus Morvillo <[log in to unmask]>

Tue, 27 Oct 1998 11:08:58 -0500

242 lines

New Thread

RF soldermask defined pads

RF soldermask defined pads

Matthew Sanders <[log in to unmask]>

Fri, 9 Oct 1998 17:22:22 -0700

38 lines

Re: RF soldermask defined pads

Mike Joyner <[log in to unmask]>

Mon, 12 Oct 1998 07:50:44 -0400

84 lines

New Thread

Risu and Rasu

Risu and Rasu

Dr. Warren Smith <[log in to unmask]>

Sat, 10 Oct 1998 19:33:14 -0400

35 lines

Re: Risu and Rasu

Fujikura Ltd. <[log in to unmask]>

Mon, 12 Oct 1998 16:44:16 +0900

58 lines

New Thread

RTV

RTV

Ken Patel <[log in to unmask]>

Wed, 14 Oct 1998 11:42:14 -0700

30 lines

Re: RTV

Crepeau, Phil <[log in to unmask]>

Wed, 14 Oct 1998 12:54:14 -0700

62 lines

Re: RTV

KK Chin <[log in to unmask]>

Wed, 14 Oct 1998 13:14:08 -0700

35 lines

Re: RTV

David Fish <[log in to unmask]>

Wed, 14 Oct 1998 20:36:33 -0400

76 lines

New Thread

Sealbrite

Sealbrite

Chris Williams <[log in to unmask]>

Wed, 7 Oct 1998 14:08:51 -0400

28 lines

Re: Sealbrite

Mike Barmuta <[log in to unmask]>

Thu, 8 Oct 1998 07:58:05 -0700

70 lines

Re: Sealbrite

mark ross <[log in to unmask]>

Thu, 8 Oct 1998 14:08:17 -0400

90 lines

Re: Sealbrite

Eric Yakobson <[log in to unmask]>

Thu, 8 Oct 1998 19:49:05 -0400

143 lines

New Thread

Shelf Life/Storage for Bare PCB

Shelf Life/Storage for Bare PCB

Andrew G Kettlewell <[log in to unmask]>

Mon, 19 Oct 1998 07:49:05 -0500

35 lines

Re: Shelf Life/Storage for Bare PCB

<Mary Smoot> <[log in to unmask]>

Tue, 20 Oct 1998 09:29:20 -0400

82 lines

Re: Shelf Life/Storage for Bare PCB

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 21 Oct 1998 13:12:00 -0400

24 lines

Re: Shelf Life/Storage for Bare PCB

Paul Klasek <[log in to unmask]>

Thu, 22 Oct 1998 08:30:16 +1000

63 lines

Re: Shelf Life/Storage for Bare PCB

Carl Levoguer <[log in to unmask]>

Thu, 22 Oct 1998 09:41:54 +0100

107 lines

Re: Shelf Life/Storage for Bare PCB

Jim Marsico 516-595-5879 <[log in to unmask]>

Thu, 22 Oct 1998 07:44:00 -0400

24 lines

Re: Shelf Life/Storage for Bare PCB

James Kittel <[log in to unmask]>

Thu, 22 Oct 1998 06:45:25 -0600

133 lines

Re: Shelf Life/Storage for Bare PCB

Paul Klasek <[log in to unmask]>

Fri, 23 Oct 1998 08:35:14 +1000

158 lines

New Thread

SMD pull test

SMD pull test

Joe Smith <[log in to unmask]>

Sat, 17 Oct 1998 16:36:06 +0100

35 lines

SMD pull test

Joe Smith <[log in to unmask]>

Sun, 25 Oct 1998 15:20:13 +0100

37 lines

New Thread

SMT Assembly on Ceramic substrate?

SMT Assembly on Ceramic substrate?

Rick Thompson <[log in to unmask]>

Tue, 27 Oct 1998 09:07:16 -0800

40 lines

SMT Assembly on Ceramic substrate?

Jeff Hempton <[log in to unmask]>

Tue, 27 Oct 1998 13:55:24 -0500

81 lines

Re: SMT Assembly on Ceramic substrate?

Roger Massey-G14195 <[log in to unmask]>

Wed, 28 Oct 1998 14:41:31 +0000

88 lines

Re: SMT Assembly on Ceramic substrate?

Jeff Hempton <[log in to unmask]>

Wed, 28 Oct 1998 10:34:40 -0500

119 lines

Re: SMT Assembly on Ceramic substrate?

Peroutka, Gregg W. <[log in to unmask]>

Wed, 28 Oct 1998 12:19:41 -0600

150 lines

Re: SMT Assembly on Ceramic substrate?

Enza Hill <[log in to unmask]>

Wed, 28 Oct 1998 15:07:33 -0600

72 lines

Re: SMT Assembly on Ceramic substrate?

Werner Engelmaier <[log in to unmask]>

Wed, 28 Oct 1998 07:17:01 EST

32 lines

Re: SMT Assembly on Ceramic substrate?

David Ratte <[log in to unmask]>

Thu, 29 Oct 1998 08:25:57 -0500

82 lines

Re: SMT Assembly on Ceramic substrate?

David Ratte <[log in to unmask]>

Fri, 30 Oct 1998 10:46:20 -0500

69 lines

Re: SMT Assembly on Ceramic substrate?

David Fish <[log in to unmask]>

Fri, 30 Oct 1998 10:07:46 -0500

30 lines

New Thread

SMT Government/Industry projections

SMT Government/Industry projections

Blakley Peggi J CNIN <[log in to unmask]>

Mon, 19 Oct 1998 08:20:10 -0500

24 lines

New Thread

SNEC mtg notice

SNEC mtg notice

[log in to unmask]

Fri, 9 Oct 1998 16:24:04 EDT

59 lines

New Thread

Solder alloy properties

Solder alloy properties

David Whalley <[log in to unmask]>

Thu, 1 Oct 1998 13:36:48 +0100

51 lines

New Thread

Solder splatter on wave solder machine

Solder splatter on wave solder machine

Thomas C Han <[log in to unmask]>

Wed, 21 Oct 1998 11:43:19 -0700

39 lines

Re: Solder splatter on wave solder machine

Alan Kreplick <[log in to unmask]>

Wed, 21 Oct 1998 16:14:29 -0400

34 lines

Re: Solder splatter on wave solder machine

Rick Thompson <[log in to unmask]>

Wed, 21 Oct 1998 13:56:33 -0700

82 lines

Re: Solder splatter on wave solder machine

Moss, Thomas <[log in to unmask]>

Wed, 21 Oct 1998 14:51:00 -0700

73 lines

Re: Solder splatter on wave solder machine

Grawburg, Bruce (AZ75) <[log in to unmask]>

Wed, 21 Oct 1998 16:56:23 -0700

73 lines

Re: Solder splatter on wave solder machine

<Jason M. Smith> <[log in to unmask]>

Thu, 22 Oct 1998 06:18:50 -0400

29 lines

Re: Solder splatter on wave solder machine

Jim Marsico 516-595-5879 <[log in to unmask]>

Thu, 22 Oct 1998 10:01:00 -0400

24 lines

Re: Solder splatter on wave solder machine

Gary Camac <[log in to unmask]>

Thu, 22 Oct 1998 12:46:06 -0500

68 lines

New Thread

Solderability Problems

Solderability Problems

Neil Atkinson <[log in to unmask]>

Thu, 1 Oct 1998 08:00:51 +0100

52 lines

Re: Solderability Problems

No Name Available <[log in to unmask]>

Thu, 1 Oct 1998 06:31:35 EDT

37 lines

Re: Solderability Problems

Neil Atkinson <[log in to unmask]>

Thu, 1 Oct 1998 12:15:34 +0100

63 lines

Re: Solderability Problems

David D Hillman <[log in to unmask]>

Thu, 1 Oct 1998 08:07:34 -0500

117 lines

Re: Solderability Problems

Werner Engelmaier <[log in to unmask]>

Thu, 1 Oct 1998 11:07:28 EDT

41 lines

Re: Solderability Problems

Gabe Cherian <[log in to unmask]>

Thu, 1 Oct 1998 15:04:18 -0700

154 lines

Re: Solderability Problems

David D Hillman <[log in to unmask]>

Fri, 2 Oct 1998 06:26:28 -0500

85 lines

Solderability Problems

Jeff Hempton <[log in to unmask]>

Fri, 2 Oct 1998 07:51:31 -0500

81 lines

Re: Solderability Problems

Lenny Kurup <[log in to unmask]>

Fri, 2 Oct 1998 12:42:01 -0400

76 lines

Re: Solderability Problems

Werner Engelmaier <[log in to unmask]>

Fri, 2 Oct 1998 12:21:19 EDT

53 lines

Re: Solderability Problems

Werner Engelmaier <[log in to unmask]>

Fri, 2 Oct 1998 13:22:57 EDT

63 lines

New Thread

Solderability Test for SMT: Dip and Look or Wetting Bala nce?

Re: Solderability Test for SMT: Dip and Look or Wetting Bala nce?

Bev Christian <[log in to unmask]>

Wed, 21 Oct 1998 08:40:00 -0400

92 lines

New Thread

Solderability Test for SMT: Dip and Look or Wetting Balance?

Solderability Test for SMT: Dip and Look or Wetting Balance?

Tumibay, Aleli <[log in to unmask]>

Tue, 20 Oct 1998 19:59:13 -0400

43 lines

Re: Solderability Test for SMT: Dip and Look or Wetting Balance?

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 22 Oct 1998 07:40:04 +0200

74 lines

Re: Solderability Test for SMT: Dip and Look or Wetting Balance?

David D Hillman <[log in to unmask]>

Fri, 23 Oct 1998 05:24:09 -0500

95 lines

New Thread

Soldering Brass to Copper

Soldering Brass to Copper

Alan Kreplick <[log in to unmask]>

Tue, 13 Oct 1998 08:03:56 -0400

59 lines

Re: Soldering Brass to Copper

Paul Terranova <[log in to unmask]>

Tue, 13 Oct 1998 09:42:52 -0400

164 lines

Re: Soldering Brass to Copper

David D Hillman <[log in to unmask]>

Tue, 13 Oct 1998 08:49:47 -0500

114 lines

New Thread

Soldering Palladium plated leads

Soldering Palladium plated leads

Rick Thompson <[log in to unmask]>

Fri, 2 Oct 1998 07:39:12 -0700

49 lines

Re: Soldering Palladium plated leads

Bev Christian <[log in to unmask]>

Fri, 2 Oct 1998 13:36:11 -0400

88 lines

Re: Soldering Palladium plated leads

Stephen R. Gregory <[log in to unmask]>

Fri, 2 Oct 1998 14:34:30 EDT

79 lines

Re: Soldering Palladium plated leads

James Kittel <[log in to unmask]>

Mon, 5 Oct 1998 06:41:09 -0600

70 lines

Re: Soldering Palladium plated leads

David D Hillman <[log in to unmask]>

Mon, 5 Oct 1998 09:18:33 -0500

91 lines

Re: Soldering Palladium plated leads

Iain Braddock <[log in to unmask]>

Mon, 5 Oct 1998 16:32:36 +0100

113 lines

New Thread

Soldering to Gold using "No Clean" flux

Soldering to Gold using "No Clean" flux

PAT DIAMOND <[log in to unmask]>

Thu, 15 Oct 1998 09:37:12 EMT+0

46 lines

New Thread

Soldering to Nickel

Soldering to Nickel

No Name Available <[log in to unmask]>

Thu, 8 Oct 1998 17:29:10 EDT

32 lines

Re: Soldering to Nickel

Tresillian Rowe <[log in to unmask]>

Fri, 9 Oct 1998 08:26:15 +0000

29 lines

Re: Soldering to Nickel

David D Hillman <[log in to unmask]>

Thu, 8 Oct 1998 17:36:18 -0500

80 lines

New Thread

Soldermask covered vias??

Soldermask covered vias??

Stammely, Tim <[log in to unmask]>

Thu, 8 Oct 1998 17:28:12 -0400

31 lines

Re: Soldermask covered vias??

Marta Hilton <[log in to unmask]>

Fri, 9 Oct 1998 09:23:12 -0400

98 lines

Re: Soldermask covered vias??

Ed Cosper <[log in to unmask]>

Fri, 9 Oct 1998 11:51:10 -0500

127 lines

New Thread

Soldermask covered vias?? -Reply

Soldermask covered vias?? -Reply

Glenn Britton <[log in to unmask]>

Thu, 8 Oct 1998 15:11:36 -0700

27 lines

New Thread

Something abobut Au plating

Something abobut Au plating

Yongheng Zhu <[log in to unmask]>

Fri, 2 Oct 1998 12:28:46 -0500

44 lines

New Thread

Stacking Chip Components

Stacking Chip Components

Frank Hinojos <[log in to unmask]>

Wed, 7 Oct 1998 17:29:25 -0700

27 lines

New Thread

Subscribe

Subscribe

Judith Harper <[log in to unmask]>

Sat, 3 Oct 1998 22:10:37 -0400

22 lines

subscribe

Florencio Eiranova <[log in to unmask]>

Wed, 7 Oct 1998 10:46:19 -0700

22 lines

subscribe

Rafael Delis <[log in to unmask]>

Thu, 8 Oct 1998 08:26:00 -0700

59 lines

Subscribe

Test Engineering <[log in to unmask]>

Mon, 19 Oct 1998 14:46:26 -0400

26 lines

subscribe

Saverio Alberti <[log in to unmask]>

Mon, 26 Oct 1998 20:55:30 +0100

29 lines

Subscribe

Patten, James <[log in to unmask]>

Fri, 30 Oct 1998 08:10:22 -0800

83 lines

New Thread

Technet @ the EXPO

Technet @ the EXPO

Scott M. Severson <[log in to unmask]>

Thu, 15 Oct 1998 15:50:00 -0500

29 lines

Re: Technet @ the EXPO

Jack Crawford <[log in to unmask]>

Thu, 15 Oct 1998 22:18:09 -0500

70 lines

New Thread

Technology Roadmaps

Technology Roadmaps

Thibodeau, Chad <[log in to unmask]>

Mon, 5 Oct 1998 10:24:34 -0700

35 lines

Re: Technology Roadmaps

Kubes, Romeo (NM75) <[log in to unmask]>

Mon, 5 Oct 1998 12:58:20 -0600

70 lines

New Thread

Teflon Board Assembly

Teflon Board Assembly

[log in to unmask]

Fri, 16 Oct 1998 21:49:13 EDT

30 lines

Re: Teflon Board Assembly

Sauer, Steven T. <[log in to unmask]>

Tue, 20 Oct 1998 08:27:00 E

59 lines

Re: Teflon Board Assembly

Manfred Huschka <[log in to unmask]>

Tue, 20 Oct 1998 16:44:11 -0500

72 lines

New Thread

Temp Profiling

Temp Profiling

Thomas C Han <[log in to unmask]>

Thu, 29 Oct 1998 14:13:19 -0800

40 lines

Re: Temp Profiling

Sauer, Steven T. <[log in to unmask]>

Fri, 30 Oct 1998 07:20:00 E

49 lines

New Thread

Test

Test

Motoyo Wajima <[log in to unmask]>

Tue, 13 Oct 1998 09:03:42 +0900

31 lines

test

Dale Marcum <[log in to unmask]>

Wed, 14 Oct 1998 12:55:59 -0400

22 lines

TEST

DAN BELDOWICZ <[log in to unmask]>

Wed, 14 Oct 1998 16:06:54 -0400

23 lines

New Thread

Thermal Aging Of Solder Joints

Thermal Aging Of Solder Joints

Malli, Reggie <[log in to unmask]>

Tue, 20 Oct 1998 13:43:43 -0700

44 lines

Re: Thermal Aging Of Solder Joints

Rupert, Martha L. <[log in to unmask]>

Wed, 21 Oct 1998 13:11:23 -0400

86 lines

Re: Thermal Aging Of Solder Joints

Werner Engelmaier <[log in to unmask]>

Wed, 21 Oct 1998 07:45:08 EDT

34 lines

Re: Thermal Aging Of Solder Joints

Brett Goldstein <[log in to unmask]>

Wed, 21 Oct 1998 15:38:44 +0000

92 lines

Re: Thermal Aging Of Solder Joints

Gary Camac <[log in to unmask]>

Wed, 21 Oct 1998 14:08:24 -0500

109 lines

New Thread

This is a test.

This is a test.

Fred Shubert <[log in to unmask]>

Mon, 5 Oct 1998 10:51:59 -0400

20 lines

New Thread

Through Hole Component leads & their solder land size

Through Hole Component leads & their solder land size

Ken Fong <[log in to unmask]>

Thu, 15 Oct 1998 17:41:11 EST

27 lines

New Thread

Throwing Power

Throwing Power

Jacob Ransborg <[log in to unmask]>

Tue, 6 Oct 1998 01:31:44 +0100

30 lines

Re: Throwing Power

Yongheng Zhu <[log in to unmask]>

Mon, 5 Oct 1998 20:09:01 -0500

65 lines

Re: Throwing Power

Roger Mouton <[log in to unmask]>

Mon, 5 Oct 1998 22:16:48 EDT

39 lines

Re: Throwing Power

Paul Anderson <[log in to unmask]>

Tue, 6 Oct 1998 10:35:26 -0400

68 lines

Re: Throwing Power

Eric Yakobson <[log in to unmask]>

Tue, 6 Oct 1998 16:43:03 -0400

109 lines

Re: Throwing Power

Robert E. Mesick <[log in to unmask]>

Tue, 6 Oct 1998 11:19:48 -0700

55 lines

New Thread

TN: Need help on sun sparc 5 front end system for MD fire9000 plotter.

TN: Need help on sun sparc 5 front end system for MD fire9000 plotter.

Ed Cosper <[log in to unmask]>

Tue, 20 Oct 1998 16:18:12 -0500

33 lines

New Thread

Tolerance on Collapsed height of BGA Balls

Tolerance on Collapsed height of BGA Balls

Eric Christison <[log in to unmask]>

Tue, 13 Oct 1998 15:55:16 +0100

37 lines

Re: Tolerance on Collapsed height of BGA Balls

Kubes, Romeo (NM75) <[log in to unmask]>

Tue, 13 Oct 1998 09:55:36 -0600

80 lines

Re: Tolerance on Collapsed height of BGA Balls

Chan, Marcelo <[log in to unmask]>

Tue, 13 Oct 1998 11:56:00 -0400

70 lines

New Thread

top side solderpaste

top side solderpaste

Todd Vorpahl <[log in to unmask]>

Thu, 29 Oct 1998 13:02:21 -0500

32 lines

Re: top side solderpaste

Russ Steiner <[log in to unmask]>

Thu, 29 Oct 1998 16:31:10 -0500

74 lines

New Thread

Trace Repairs

Trace Repairs

Doug Jeffery <[log in to unmask]>

Tue, 13 Oct 1998 12:37:44 -0500

31 lines

Re: Trace Repairs

No Name Available <[log in to unmask]>

Wed, 14 Oct 1998 19:39:50 EDT

27 lines

New Thread

Transmission line and Microstrip theory

Transmission line and Microstrip theory

Ben Castle <[log in to unmask]>

Wed, 21 Oct 1998 16:17:45 +1200

29 lines

Re: Transmission line and Microstrip theory

No Name Available <[log in to unmask]>

Wed, 21 Oct 1998 12:46:38 -0700

30 lines

New Thread

transparent silver coating

transparent silver coating

Saverio Alberti <[log in to unmask]>

Mon, 26 Oct 1998 21:43:36 +0100

34 lines

New Thread

Types of BGAs

Types of BGAs

Edwin Maximo <[log in to unmask]>

Fri, 2 Oct 1998 10:07:14 +0000

38 lines

Re: Types of BGAs

Michaud, James (STP) <[log in to unmask]>

Fri, 2 Oct 1998 09:00:40 -0500

75 lines

Re: Types of BGAs

Russ Winslow <[log in to unmask]>

Fri, 2 Oct 1998 11:35:13 -0700

86 lines

Re: Types of BGAs

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 2 Oct 1998 13:57:00 -0400

39 lines

Re: Types of BGAs

Russ Winslow <[log in to unmask]>

Wed, 7 Oct 1998 10:06:40 -0700

111 lines

New Thread

unsubscribe users..

unsubscribe users..

Malone, Barb <[log in to unmask]>

Wed, 28 Oct 1998 09:17:01 -0600

41 lines

New Thread

Vacuum failures

Vacuum failures

Fred Pescitelli <[log in to unmask]>

Tue, 6 Oct 1998 10:58:14 +0000

32 lines

New Thread

Via's under BGA

Via's under BGA

Kuczynski Michael <[log in to unmask]>

Mon, 5 Oct 1998 11:26:25 -0400

37 lines

New Thread

Via's under BGA's

Via's under BGA's

Bridget Piper <[log in to unmask]>

Mon, 5 Oct 1998 15:12:09 +0100

92 lines

Re: Via's under BGA's

Thibodeau, Chad <[log in to unmask]>

Mon, 5 Oct 1998 10:41:54 -0700

49 lines

Re: Via's under BGA's

Kubes, Romeo (NM75) <[log in to unmask]>

Mon, 5 Oct 1998 13:03:17 -0600

86 lines

Re: Via's under BGA's

Lee, Scott <[log in to unmask]>

Mon, 5 Oct 1998 15:31:02 -0400

140 lines

New Thread

Vias in chip components pads?

Re: Vias in chip components pads?

Iain Braddock <[log in to unmask]>

Thu, 1 Oct 1998 09:11:05 +0100

106 lines

Re: Vias in chip components pads?

Lum Wee Mei <[log in to unmask]>

Fri, 2 Oct 1998 10:31:13 +0800

57 lines

Re: Vias in chip components pads?

Kelly M. Schriver <[log in to unmask]>

Fri, 2 Oct 1998 08:22:39 -0500

42 lines

New Thread

Vias stealing solder from BGA's pads

Vias stealing solder from BGA's pads

Stammely, Tim <[log in to unmask]>

Thu, 22 Oct 1998 09:37:55 -0400

41 lines

New Thread

Voiding in BGA

Voiding in BGA

Florencio Eiranova <[log in to unmask]>

Wed, 7 Oct 1998 13:38:56 -0700

26 lines

Re: Voiding in BGA

Rod Martens <[log in to unmask]>

Wed, 7 Oct 1998 15:47:50 -0600

65 lines

Re: Voiding in BGA

Bill Davis <[log in to unmask]>

Wed, 7 Oct 1998 16:02:35 -0700

86 lines

Re: Voiding in BGA

James Kittel <[log in to unmask]>

Thu, 8 Oct 1998 06:56:07 -0600

112 lines

Re: Voiding in BGA

Stephen R. Gregory <[log in to unmask]>

Thu, 8 Oct 1998 10:14:43 EDT

38 lines

Re: Voiding in BGA

James Kittel <[log in to unmask]>

Thu, 8 Oct 1998 08:46:27 -0600

67 lines

New Thread

Wanting to Know

Wanting to Know

[log in to unmask]

Sun, 11 Oct 1998 02:04:58 EDT

29 lines

New Thread

Water absorption rate

Water absorption rate

Yuan Li <[log in to unmask]>

Thu, 1 Oct 1998 15:43:11 -0700

23 lines

Re: Water absorption rate

Andy Magee <[log in to unmask]>

Fri, 2 Oct 1998 09:41:24 -0400

63 lines

New Thread

Water Absorption Rate.

Re: Water Absorption Rate.

Carl Levoguer <[log in to unmask]>

Fri, 2 Oct 1998 09:35:32 +0100

55 lines

New Thread

Water soluble temporary solder mask

Re: Water soluble temporary solder mask

Karalekas, Charles <[log in to unmask]>

Mon, 5 Oct 1998 15:17:46 -0400

55 lines

Re: Water soluble temporary solder mask

Ian McMillan <[log in to unmask]>

Mon, 5 Oct 1998 13:00:52 +0000

85 lines

New Thread

Wave Solder Process Tools

Wave Solder Process Tools

Kenny Bloomquist <[log in to unmask]>

Wed, 7 Oct 1998 06:57:29 -0700

50 lines

New Thread

wave solder service & support

wave solder service & support

David Paluck <[log in to unmask]>

Tue, 27 Oct 1998 11:28:29 -0600

29 lines

Re: wave solder service & support

Craig Baker <[log in to unmask]>

Tue, 27 Oct 1998 16:55:40 -0700

62 lines

New Thread

Wave Soldering SMT Timing Devices

Wave Soldering SMT Timing Devices

mark ross <[log in to unmask]>

Wed, 7 Oct 1998 10:22:43 -0400

36 lines

New Thread

WG: OSP & through hole components _

WG: OSP & through hole components _

Nüchter Wolfgang (FV/FLT) * <[log in to unmask]>

Tue, 13 Oct 1998 14:42:43 +0200

41 lines

New Thread

Wirebond Arc Description (JEDEC)

Wirebond Arc Description (JEDEC)

Steve DB <[log in to unmask]>

Sat, 17 Oct 1998 20:53:09 -0700

35 lines

New Thread

Wirebonding

Wirebonding

Don Vischulis <[log in to unmask]>

Wed, 28 Oct 1998 12:55:38 +600

28 lines

Re: Wirebonding

R. Srinivasan <[log in to unmask]>

Thu, 29 Oct 1998 21:27:52 +0800

66 lines

New Thread

WTECH

WTECH

[log in to unmask]

Thu, 22 Oct 1998 13:25:57 -0500

25 lines

Re: WTECH

Ted Stern <[log in to unmask]>

Thu, 22 Oct 1998 14:07:29 -0700

53 lines

New Thread

Xray inspection

Xray inspection

Paul M. Quintin Jr <[log in to unmask]>

Thu, 1 Oct 1998 11:39:48 EDT

39 lines

New Thread

[TN] Confomal coating adhesion

Re[2]: [TN] Confomal coating adhesion

Paul Stolar <[log in to unmask]>

Mon, 12 Oct 1998 09:43:19 -0600

86 lines

New Thread

[TN] Depanelizing boards

Re[2]: [TN] Depanelizing boards

Mauricio Castro <[log in to unmask]>

Fri, 23 Oct 1998 08:08:47 -0500

111 lines

New Thread

[TN] PCB ASSEMBLY COST ANALYSIS

Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS

Mauricio Castro <[log in to unmask]>

Fri, 23 Oct 1998 12:08:20 -0500

129 lines

New Thread

[TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS

Re[2]: [TN] Re[2]: [TN] PCB ASSEMBLY COST ANALYSIS

[log in to unmask]

Mon, 26 Oct 1998 09:24:57 -0500

226 lines

New Thread

[TN] Teflon Board Assembly

Re[2]: [TN] Teflon Board Assembly

<Andy Slade> <[log in to unmask]>

Tue, 20 Oct 1998 11:05:07 -0400

99 lines

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