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TECHNET Archives


September 1998


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Table of Contents:

(TN) need supplier-laser cutting (1 message)
1999 Pan Pacific call for papers (1 message)
74ACT573 (1 message)
: Corrective Action Limits (4 messages)
: Digital Cameras (5 messages)
: SMT Hand placing time standards... (4 messages)
: What software do you use ? (2 messages)
<No subject> (2 messages)
Acceptability of electronical assemblies (4 messages)
Acceptable PPM Defect Rate (2 messages)
Acq.Reform (1 message)
Adhesive for double sided reflow soldering (1 message)
ADMIN MESSAGE: Attention TechNet Subscribers! (1 message)
Alternative finishes (1 message)
Alternative to Electroless-Blasberg (1 message)
Alumina & AlN DBC substrates needed! (2 messages)
Anyone Using Electrovert's ELECTRA Wavesolder Machine? (2 messages)
asking of a spec' MIL-STD-105 (1 message)
ASSY: BGA FAILURES (7 messages)
Assy: Cocure conductive and nonconductive epoxies (1 message)
ASSY: Conformal Coating Forum (1 message)
ASSY: Environmental testing to verify adequacy of conformal coating. (1 message)
ASSY: recycle ESD foam packing material (3 messages)
ASSY: Surface Mounting Adhesives survey (1 message)
ASSY: [TN] Reflow Peak Temperatures (1 message)
ASSY[TN] Micro BGA Sockets... (2 messages)
attn: StevaZeva reflow (2 messages)
Autoboard 3.1 board files (1 message)
Autoclaving Flex PWBs (6 messages)
Automatic replenishment of Resist Stripper (1 message)
automatic replenishment of resist stripper. (4 messages)
AW: [TN] Adhesive for double sided reflow soldering (1 message)
AW: [TN] Country Code (1 message)
AW: [TN] Help! Plugging vias (1 message)
AW: [TN] Help! Plugging vias -Reply (1 message)
BAKING BOARDS PRIOR TO ASSY (11 messages)
Balzer Evaporater (1 message)
BGA opens at Xray (1 message)
BGA opens. (2 messages)
BGA vs QFP reliability (2 messages)
Biphenol Resins (2 messages)
blind and buried via's (3 messages)
Boardsubstrates for RIMM module (2 messages)
Bubbles from conformally coated board (11 messages)
Build-up Wiring Boards (Stereolithography?) (1 message)
Buildup Wiring Boards (5 messages)
Buried Vias (2 messages)
Burn In (2 messages)
C.O.P.S.[TN] Assy: Cocure conductive and nonconductive epoxi es (1 message)
Call for Papers (1 message)
Cancellation of MIL-S-13949H (1 message)
Carbon Printing on PCBs (1 message)
Cleanliness Experiment/Demonstration Ideas? (6 messages)
Cleanliness Experiment/Demonstration Ideas? -Reply (1 message)
Coatingthings (1 message)
Component Sourcing (2 messages)
confirmation (1 message)
Conformal Coat Masking (4 messages)
conformal coating query (1 message)
Controlled Impedance on signals (1 message)
copper thieving (5 messages)
copper thieving and X-outs (1 message)
Core punch (1 message)
Country Code (1 message)
CSP Assembly (1 message)
Current Capacity of via holes (1 message)
Current Capacity of vias (5 messages)
DES: How do we compare (1 message)
Design For Manufacturability(DFM) Strategy and rules (2 messages)
Dewetting of Surface Mount pads (2 messages)
Digital Cameras (3 messages)
DP-1500 (fwd) (2 messages)
drill files-plated/no (3 messages)
drill files-plated/non-plated holes (3 messages)
Drop off Component (3 messages)
Dummy BGAs with Resistor Chips (2 messages)
Durapol laminate suppliers (1 message)
El Paso Designer Council Meeting Reminder (1 message)
Electrical Design Clearance (1 message)
Email list (1 message)
Enroll me in Technet (1 message)
Environmental Testing ("insect resistance") (2 messages)
Environmental testing - insects (2 messages)
EPC - Wiesbaden - Updates (1 message)
EPC - Wiesbaden - Updates -Reply (1 message)
ESD (4 messages)
ESD labels (6 messages)
ESD labels..thanks (1 message)
ETHYLENE GLYCOL CLEAN-UP (2 messages)
Excess flux Kester 924FB (2 messages)
Fab note for Laminate material (2 messages)
Fab Solderability Test @ Assembly house (3 messages)
Fab/Assy: Vias under chip components (4 messages)
FAB: IPC-2221 confusion (3 messages)
Fab: Multiple surface finishes (2 messages)
FAILURE ANALYSIS LABORATORIES (4 messages)
Fastek Netlist software (1 message)
Fine Line technology (4 messages)
fine pitch BGA soldering pad size (1 message)
Fingers vs Socket & Pin on pwr supply (2 messages)
Flash point and melting point for CEM-3 and Paper Phenol laminates (2 messages)
Flex Circuit Fixtures for SMT (1 message)
Flex Materials (2 messages)
Flux Measuring Techniques (2 messages)
Flux Measuring Techniques?? (2 messages)
Flying Probe Bare Board Testers (2 messages)
Fractures (1 message)
FREE FORUM ON CONFORMAL COATING (1 message)
From HASL to Ni/Immersion Gold (1 message)
Fw: ASSY: PBGA on PCMCIA card (2 messages)
FW: Cancellation of MIL-S-13949H (1 message)
FW: [TN] ASSY: BGA FAILURES (1 message)
FW: [TN] Phosphorous In The Nickel Barrier (1 message)
FW:[TN] Cleanliness Experiment/Demonstration Ideas? (1 message)
Fwd: [CN] Haloing on PWB (1 message)
Fwd:Alodine washing off (4 messages)
g10 (2 messages)
GDSII compatible CAD software (2 messages)
GEN (4 messages)
Gen: photoablation substrate materials (1 message)
Gen: Reliability Testing in Road Salt Conditions (2 messages)
GETECK laminates (3 messages)
Gold plated connector & peelable resist? (2 messages)
GR-78-CORE (2 messages)
Greater Boston Designers Council Chapter Meeting (1 message)
Haloing on PWB (2 messages)
Harderman Fluxes (1 message)
HASL thickness readings (2 messages)
Help! Plugging vias (6 messages)
High Density Circuits (2 messages)
Hoax ? > Ericsson ? (3 messages)
Hole tolerances (1 message)
HP DesignJet 650C Problems (1 message)
IC coating (2 messages)
Incoming Inspection Equipment (3 messages)
Increase number of drill sizes (5 messages)
Info about AOI (2 messages)
Info about AOI -Reply (2 messages)
Info on J-STD-003A "Solderability Tests for Circuit Boards" (1 message)
Ink for insulation layer (1 message)
Inspection criteria for no clean assembly? (3 messages)
Insulation layer for Remote control PWB (1 message)
INTEL PLM 96 (1 message)
Ionograph / Cleanliness Requirement for Components (8 messages)
IPC 4101 L25 (2 messages)
IPC Standard for PCB Acceptance (3 messages)
IPC-L-112 Help (1 message)
IPC-S-815 (1 message)
IPC/SMTA ELECTRONICS EXPO (7 messages)
ISA card board requirements (1 message)
Job opportunities (1 message)
Justification for change from tht to smt (5 messages)
Keep Out Distance for press-fit connectors. (3 messages)
Laminate material (1 message)
Laminates, Dk, Tg and Cost (1 message)
Lamination process control (1 message)
Land Pattern Calculator (2 messages)
laser ablation material (4 messages)
laser drilling / ablation (1 message)
Micro Soldering (1 message)
Micro viewer for PWB manufacturing line (2 messages)
microannex els (1 message)
Microscopes (2 messages)
Mil-Std-2000 (2 messages)
Moisture Sensitive Components (2 messages)
MS-2000 (2 messages)
NC machines and Y2k bug (2 messages)
Network Analyzers (1 message)
New IPC Desk Ref. Manual on SM Solder Joint Eval. (2 messages)
Newbie (1 message)
News from Stickley-Vejar (2 messages)
No-Clean Process - Cleanliness Specification (2 messages)
Offer for new printing line for Single side PWB (1 message)
Open circuits from Silver Sulfide Corrosion (5 messages)
Optical Sensor (1 message)
Outgassing (2 messages)
oxygen index and test method, FR4 laminates (2 messages)
Pacific Northwest IPC DC Newsletter (1 message)
Paint Finish Protection (5 messages)
Pass/Fail Wetting Balance Criteria (2 messages)
PCB Material Change (4 messages)
PCB Material Change -Reply (2 messages)
PCB Materials (1 message)
Peelable mask in reflow oven (3 messages)
Phosphorous In The Nickel Barrier (1 message)
Planarity (2 messages)
Plasma Machine Manufacturer (3 messages)
Plugged Via Holes: BGA (1 message)
PM Software Program Replacement (1 message)
PPM Defect Rate (1 message)
Pricing Survey (1 message)
Printing ink supplier (1 message)
Process Audit Points [ HELP ] (4 messages)
Pros/Cons Moving Probe Bare Board Testers (1 message)
PTFE Etching Processes (2 messages)
PTFE Etching Processes -Reply (2 messages)
Pyralux History (2 messages)
Quad4c mark 2 placement using local fids (1 message)
Questioning UL950 (2 messages)
RE : [TN] PCB Material Change (1 message)
re Warpage @ Assembly (1 message)
Reflow of Nylon 6/6 Connector? (1 message)
Reliable crystals/oscillators packaging (1 message)
Reminder (1 message)
Replacing Mil-S-13949 (2 messages)
Reply to Posting Number 23642 (1 message)
Resist Strip (3 messages)
Reworking delaminated rigid-flex (6 messages)
Re[2]: [TN] ESD labels (1 message)
Re[2]: [TN] Fab Solderability Test @ Assembly house (1 message)
Re[2]: [TN] g10 (1 message)
Re[2]: [TN] IC coating (2 messages)
RF Screening cans (2 messages)
Routing conformal coatings (4 messages)
SCOPE DRILL OR UNIDRILL (1 message)
Scoring Issues (2 messages)
SCSI BackPlane Design Rules . . . (1 message)
Seho Wave Soldering Process Procedures (11 messages)
set technet digest (1 message)
simulation (1 message)
SM Component Standardization (2 messages)
SMD on bottomside (4 messages)
SMT - SPC fishbone chart (6 messages)
SMT - SPC fishbone chart ? (1 message)
SMT Connectors (7 messages)
SMT gull wing solder joint force test? (1 message)
Soft Solder (5 messages)
Software upgrade question (2 messages)
Solder "webbing" to Solder Mask After Wavesolder?? (2 messages)
Solder ball attachment to BGA (2 messages)
Solder Balling (1 message)
Solder Balling Spec. (2 messages)
Solder Balls (1 message)
Solder Bumping (2 messages)
Solder crack (5 messages)
Solder Fracture during Drop Test (2 messages)
solder mask (LPI) flaking (3 messages)
solder mask (LPI) flaking -Reply (1 message)
Solder Paste (2 messages)
Solder-ball (1 message)
solderability testing (5 messages)
Solderable Diode & IGBT (1 message)
Soldering BGA's with Nitrogen (2 messages)
soldering patents (5 messages)
Soldering to Gold (5 messages)
Soldering to Gold Plated Pads (6 messages)
Solderless Interconnects (1 message)
Soldermask Artwork Marking (3 messages)
Soldermask Artwork Marking -Reply (1 message)
SRT Summit 1000 Profiles? (1 message)
Stain Mark Accept or Reject? (1 message)
Standard for smt polarised component orientatio (1 message)
Standard for smt polarised component orientation (2 messages)
Stencil manufacturers (3 messages)
Storage Temp (2 messages)
Stress in SMT Components (3 messages)
Subject: Flying Probe Bare Board Testers (1 message)
Surface Finish for Flex SMT (1 message)
surface mounting header using gold plating vs tin plating (1 message)
Tape bonders (1 message)
TECHNET Confirmation (5 messages)
TechNet Digest - 24 Sep 1998 - Special issue (1 message)
TechNet: confirmation required (79A054) (2 messages)
test and packaging (2 messages)
Test Lab for Corrosive Gas Testing (5 messages)
Test Methods For Conformal Coatings (1 message)
Thermal Adhesive under SMDs (1 message)
Thermal profiling units/software (1 message)
Tin stripper waste treatment (1 message)
TNMeeting (2 messages)
Trace to pad spacing design rules (2 messages)
Trouble with downloading SMT Desk Ref. Manual Samples (1 message)
Underfill materials (3 messages)
UNIVERSAL 4785 (SANYO) CHIP-SHOOTER ERROR CODE (2 messages)
UNSUBSCRIBE (1 message)
USB Port Specs (2 messages)
Used PCB cleanimg machine wanted (1 message)
Vacuum Cabinet (1 message)
Valor Enterprise 3000 (2 messages)
Via fill (2 messages)
Vias in chip components pads? (2 messages)
Wanted: scrap assembled PCB's (1 message)
Warpage @ Assembly (2 messages)
Water soluble temporary solder mask (5 messages)
Wave solder VS Reflow on bottom side (4 messages)
What should a good C.O.C cover? (2 messages)
What to compare for HASL v/s OSP (2 messages)
Why is a respond to sender showing up on the open forum. (2 messages)
Wire Bonding (1 message)
Word Game RE Clinton (1 message)
X-ray for open joints on BGA's ? (13 messages)
X-ray for open joints on BGA's ? [BGA rel issues?] <IPC T echNet> (1 message)
X-ray for open joints on BGA's ? [CBGA columns] (1 message)
[DC] Pacific Northwest IPC DC Newsletter (1 message)
[Fab] Fracturing Summary (1 message)
[TN] Assy.: µBGA Footprints and design guidlines... (1 message)
[TN] ESD labels (2 messages)
[TN] Fab Solderability Test @ Assembly house (1 message)
[TN] g10 (1 message)
[TN] Help! Plugging vias (1 message)
[TN] IC coating (1 message)
[TN] Re[2]: [TN] Fab Solderability Test @ Assembly ho (1 message)
[TN] Seho Wave Soldering Process Procedures (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

(TN) need supplier-laser cutting

(TN) need supplier-laser cutting

Stephen R. Mikell <[log in to unmask]>

Thu, 3 Sep 1998 17:07:33 -0500

33 lines

New Thread

1999 Pan Pacific call for papers

1999 Pan Pacific call for papers

David Gonnerman <[log in to unmask]>

Tue, 8 Sep 1998 14:24:04 -0500

110 lines

New Thread

74ACT573

74ACT573

Rainer Taube <[log in to unmask]>

Wed, 16 Sep 1998 13:22:36 +0200

38 lines

New Thread

: Corrective Action Limits

: Corrective Action Limits

Kasprzak, Bill (esd) US <[log in to unmask]>

Mon, 14 Sep 1998 15:36:00 PDT

39 lines

: Corrective Action Limits

Kasprzak, Bill (esd) US <[log in to unmask]>

Fri, 18 Sep 1998 13:16:00 PDT

42 lines

Re: : Corrective Action Limits

Jerry Rosser <[log in to unmask]>

Sun, 20 Sep 1998 23:24:14 -0700

154 lines

Re: : Corrective Action Limits

Jerry Rosser <[log in to unmask]>

Sun, 20 Sep 1998 23:34:27 -0700

64 lines

New Thread

: Digital Cameras

: Digital Cameras

Kasprzak, Bill (esd) US <[log in to unmask]>

Thu, 10 Sep 1998 07:37:00 PDT

53 lines

Re: : Digital Cameras

Stephen R. Gregory <[log in to unmask]>

Thu, 10 Sep 1998 08:05:58 EDT

45 lines

Re: : Digital Cameras

Ed Holton <[log in to unmask]>

Fri, 11 Sep 1998 10:04:34 -0400

76 lines

Re: : Digital Cameras

ETS <[log in to unmask]>

Fri, 11 Sep 1998 09:12:31 -0700

108 lines

: Digital Cameras

[log in to unmask]

Mon, 14 Sep 1998 16:09:55 +0200

66 lines

New Thread

: SMT Hand placing time standards...

: SMT Hand placing time standards...

Stephen R. Gregory <[log in to unmask]>

Fri, 25 Sep 1998 09:07:56 EDT

41 lines

Re: : SMT Hand placing time standards...

McMonagle, Michael R. <[log in to unmask]>

Fri, 25 Sep 1998 08:41:27 -0500

95 lines

Re: : SMT Hand placing time standards...

David Ratte <[log in to unmask]>

Fri, 25 Sep 1998 09:36:22 -0400

72 lines

Re: : SMT Hand placing time standards...

No Name Available <[log in to unmask]>

Fri, 25 Sep 1998 19:51:28 EDT

31 lines

New Thread

: What software do you use ?

: What software do you use ?

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 30 Sep 1998 09:47:00 PDT

88 lines

Re: : What software do you use ?

Paul Anderson <[log in to unmask]>

Wed, 30 Sep 1998 16:06:23 -0400

153 lines

New Thread

<No subject>

<No subject>

Bernard Williams <[log in to unmask]>

Tue, 8 Sep 1998 12:34:24 +1200

35 lines

<No subject>

Alderete, Michael <[log in to unmask]>

Tue, 15 Sep 1998 16:48:42 -0700

75 lines

New Thread

Acceptability of electronical assemblies

Acceptability of electronical assemblies

Ari Sairanen <[log in to unmask]>

Fri, 4 Sep 1998 11:15:48 +0200

36 lines

Re: Acceptability of electronical assemblies

Paul Wilson <[log in to unmask]>

Fri, 4 Sep 1998 06:13:23 -0400

74 lines

Re: Acceptability of electronical assemblies

Cyrus Ringle <[log in to unmask]>

Fri, 4 Sep 1998 08:51:17 -0700

113 lines

Re: Acceptability of electronical assemblies

Jack Crawford <[log in to unmask]>

Fri, 4 Sep 1998 10:48:31 -0500

77 lines

New Thread

Acceptable PPM Defect Rate

Acceptable PPM Defect Rate

Michael Forrester <[log in to unmask]>

Tue, 8 Sep 1998 16:14:57 -0400

37 lines

Re: Acceptable PPM Defect Rate

Collins, Graham <[log in to unmask]>

Wed, 9 Sep 1998 12:54:39 -0300

78 lines

New Thread

Acq.Reform

Acq.Reform

[log in to unmask]

Tue, 15 Sep 1998 14:33:00 EDT

41 lines

New Thread

Adhesive for double sided reflow soldering

Adhesive for double sided reflow soldering

d. terstegge <[log in to unmask]>

Thu, 24 Sep 1998 15:35:18 +0200

41 lines

New Thread

ADMIN MESSAGE: Attention TechNet Subscribers!

ADMIN MESSAGE: Attention TechNet Subscribers!

Hugo Scaramuzza <[log in to unmask]>

Tue, 1 Sep 1998 14:19:43 -0500

53 lines

New Thread

Alternative finishes

Alternative finishes

Paul Stolar <[log in to unmask]>

Tue, 22 Sep 1998 16:53:54 -0600

25 lines

New Thread

Alternative to Electroless-Blasberg

Alternative to Electroless-Blasberg

Edwards, Ted A (AZ75) <[log in to unmask]>

Fri, 11 Sep 1998 08:18:00 -0700

30 lines

New Thread

Alumina & AlN DBC substrates needed!

Alumina & AlN DBC substrates needed!

Sihua Wen <[log in to unmask]>

Fri, 11 Sep 1998 13:40:03 -0400

30 lines

Re: Alumina & AlN DBC substrates needed!

Roger Massey-G14195 <[log in to unmask]>

Mon, 14 Sep 1998 07:34:59 +0000

71 lines

New Thread

Anyone Using Electrovert's ELECTRA Wavesolder Machine?

Anyone Using Electrovert's ELECTRA Wavesolder Machine?

Mike Manwell <[log in to unmask]>

Thu, 17 Sep 1998 07:00:11 -0700

29 lines

Re: Anyone Using Electrovert's ELECTRA Wavesolder Machine?

McMonagle, Michael R. <[log in to unmask]>

Thu, 17 Sep 1998 11:24:55 -0500

67 lines

New Thread

asking of a spec' MIL-STD-105

asking of a spec' MIL-STD-105

Rudolph Yu <[log in to unmask]>

Wed, 30 Sep 1998 15:41:44 -0700

32 lines

New Thread

ASSY: BGA FAILURES

ASSY: BGA FAILURES

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 28 Sep 1998 08:50:00 -0400

43 lines

Re: ASSY: BGA FAILURES

Mark Austin <[log in to unmask]>

Mon, 28 Sep 1998 17:00:00 +0100

84 lines

Re: ASSY: BGA FAILURES

Nüchter Wolfgang (FV/FLT) * <[log in to unmask]>

Tue, 29 Sep 1998 10:21:18 +0200

133 lines

Re: ASSY: BGA FAILURES

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 29 Sep 1998 07:48:00 -0400

43 lines

Re: ASSY: BGA FAILURES

David D Hillman <[log in to unmask]>

Tue, 29 Sep 1998 08:59:49 -0500

92 lines

Re: ASSY: BGA FAILURES

Rod Martens <[log in to unmask]>

Tue, 29 Sep 1998 11:01:15 -0600

129 lines

Re: ASSY: BGA FAILURES

Alderete, Michael <[log in to unmask]>

Tue, 29 Sep 1998 10:43:16 -0700

71 lines

New Thread

Assy: Cocure conductive and nonconductive epoxies

Assy: Cocure conductive and nonconductive epoxies

glenn pelkey <[log in to unmask]>

Wed, 16 Sep 1998 10:09:38 PDT

48 lines

New Thread

ASSY: Conformal Coating Forum

ASSY: Conformal Coating Forum

Jack Crawford <[log in to unmask]>

Sun, 27 Sep 1998 12:11:27 -0500

81 lines

New Thread

ASSY: Environmental testing to verify adequacy of conformal coating.

ASSY: Environmental testing to verify adequacy of conformal coating.

Brent Alcorn <[log in to unmask]>

Thu, 10 Sep 1998 08:34:05 -0300

50 lines

New Thread

ASSY: recycle ESD foam packing material

ASSY: recycle ESD foam packing material

Jerry Cupples <[log in to unmask]>

Tue, 22 Sep 1998 16:10:03 -0500

40 lines

Re: ASSY: recycle ESD foam packing material

Bev Christian <[log in to unmask]>

Tue, 22 Sep 1998 20:29:37 -0400

73 lines

Re: ASSY: recycle ESD foam packing material

PELCHAT_JM <[log in to unmask]>

Wed, 23 Sep 1998 07:10:49 -0400

73 lines

New Thread

ASSY: Surface Mounting Adhesives survey

ASSY: Surface Mounting Adhesives survey

Jack Crawford <[log in to unmask]>

Sun, 27 Sep 1998 16:54:18 -0500

77 lines

New Thread

ASSY: [TN] Reflow Peak Temperatures

ASSY: [TN] Reflow Peak Temperatures

Stephen R. Gregory <[log in to unmask]>

Wed, 16 Sep 1998 16:36:26 EDT

44 lines

New Thread

ASSY[TN] Micro BGA Sockets...

ASSY[TN] Micro BGA Sockets...

Stephen R. Gregory <[log in to unmask]>

Thu, 17 Sep 1998 17:25:39 EDT

36 lines

Re: ASSY[TN] Micro BGA Sockets...

Sauer, Steven T. <[log in to unmask]>

Fri, 18 Sep 1998 08:06:00 E

74 lines

New Thread

attn: StevaZeva reflow

attn: StevaZeva reflow

[log in to unmask]

Wed, 16 Sep 1998 17:13:50 EDT

36 lines

Re: attn: StevaZeva reflow

Stephen R. Gregory <[log in to unmask]>

Wed, 16 Sep 1998 19:01:39 EDT

58 lines

New Thread

Autoboard 3.1 board files

Autoboard 3.1 board files

Papanna Manjunatha <[log in to unmask]>

Tue, 1 Sep 1998 16:35:40 IST

30 lines

New Thread

Autoclaving Flex PWBs

Autoclaving Flex PWBs

Eric Christison <[log in to unmask]>

Tue, 29 Sep 1998 12:01:25 +0100

38 lines

Re: Autoclaving Flex PWBs

Thomas DeSmit <[log in to unmask]>

Tue, 29 Sep 1998 07:19:23 -0500

83 lines

Re: Autoclaving Flex PWBs

Kelly M. Schriver <[log in to unmask]>

Tue, 29 Sep 1998 08:16:34 -0500

49 lines

Re: Autoclaving Flex PWBs

Andy Magee <[log in to unmask]>

Tue, 29 Sep 1998 14:07:35 -0400

59 lines

Re: Autoclaving Flex PWBs

Werner Engelmaier <[log in to unmask]>

Tue, 29 Sep 1998 08:21:10 EDT

36 lines

Re: Autoclaving Flex PWBs

Joseph Fjelstad <[log in to unmask]>

Tue, 29 Sep 1998 15:41:03 -0700

39 lines

New Thread

Automatic replenishment of Resist Stripper

Automatic replenishment of Resist Stripper

[log in to unmask]

Fri, 25 Sep 1998 11:03:20 -0500

180 lines

New Thread

automatic replenishment of resist stripper.

Re: automatic replenishment of resist stripper.

Lenny Kurup <[log in to unmask]>

Thu, 24 Sep 1998 16:31:12 -0400

35 lines

Re: automatic replenishment of resist stripper.

Ted Stern <[log in to unmask]>

Fri, 25 Sep 1998 09:00:54 -0700

64 lines

Re: automatic replenishment of resist stripper.

<Rudy Sedlak> <[log in to unmask]>

Thu, 24 Sep 1998 23:32:00 EDT

58 lines

Re: automatic replenishment of resist stripper.

[log in to unmask]

Thu, 24 Sep 1998 20:30:59 EDT

32 lines

New Thread

AW: [TN] Adhesive for double sided reflow soldering

AW: [TN] Adhesive for double sided reflow soldering

Giese Klaus <[log in to unmask]>

Thu, 24 Sep 1998 16:48:32 +0200

85 lines

New Thread

AW: [TN] Country Code

AW: [TN] Country Code

Nüchter Wolfgang (FV/FLT) * <[log in to unmask]>

Fri, 25 Sep 1998 14:06:27 +0200

623 lines

New Thread

AW: [TN] Help! Plugging vias

AW: [TN] Help! Plugging vias

Nüchter Wolfgang (FV/FLT) * <[log in to unmask]>

Fri, 25 Sep 1998 15:25:54 +0200

121 lines

New Thread

AW: [TN] Help! Plugging vias -Reply

AW: [TN] Help! Plugging vias -Reply

Bob Poirier <[log in to unmask]>

Mon, 28 Sep 1998 09:57:58 -0700

147 lines

New Thread

BAKING BOARDS PRIOR TO ASSY

BAKING BOARDS PRIOR TO ASSY

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 22 Sep 1998 10:30:00 -0400

35 lines

Re: BAKING BOARDS PRIOR TO ASSY

Alan Kreplick <[log in to unmask]>

Tue, 22 Sep 1998 11:15:37 -0400

42 lines

Re: BAKING BOARDS PRIOR TO ASSY

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 22 Sep 1998 11:23:00 -0400

34 lines

Re: BAKING BOARDS PRIOR TO ASSY

Derek Wynne <[log in to unmask]>

Tue, 22 Sep 1998 18:03:23 +0100

191 lines

Re: BAKING BOARDS PRIOR TO ASSY

Bev Christian <[log in to unmask]>

Tue, 22 Sep 1998 13:14:07 -0400

73 lines

Re: BAKING BOARDS PRIOR TO ASSY

Kenny Bloomquist <[log in to unmask]>

Tue, 22 Sep 1998 10:15:07 -0700

56 lines

Re: BAKING BOARDS PRIOR TO ASSY

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 22 Sep 1998 13:10:00 -0400

24 lines

Re: BAKING BOARDS PRIOR TO ASSY

Bev Christian <[log in to unmask]>

Tue, 22 Sep 1998 14:07:58 -0400

56 lines

Re: BAKING BOARDS PRIOR TO ASSY

Ed Cosper <[log in to unmask]>

Tue, 22 Sep 1998 13:19:37 -0500

110 lines

Re: BAKING BOARDS PRIOR TO ASSY

Kelly M. Schriver <[log in to unmask]>

Tue, 22 Sep 1998 14:17:13 -0500

60 lines

Re: BAKING BOARDS PRIOR TO ASSY

Jay Solderberg <[log in to unmask]>

Wed, 23 Sep 1998 08:08:48 -0600

135 lines

New Thread

Balzer Evaporater

Balzer Evaporater

Kitt <[log in to unmask]>

Thu, 3 Sep 1998 08:30:31 -0500

28 lines

New Thread

BGA opens at Xray

Re: BGA opens at Xray

Paul M. Quintin Jr <[log in to unmask]>

Tue, 15 Sep 1998 12:07:10 EDT

28 lines

New Thread

BGA opens.

BGA opens.

Paul M. Quintin Jr <[log in to unmask]>

Mon, 14 Sep 1998 05:47:52 EDT

31 lines

Re: BGA opens.

Sean Heffernan <[log in to unmask]>

Mon, 14 Sep 1998 12:43:53 -0700

72 lines

New Thread

BGA vs QFP reliability

BGA vs QFP reliability

Tan Boon Kiat <[log in to unmask]>

Sat, 19 Sep 1998 23:27:48 +0800

47 lines

Re: BGA vs QFP reliability

Maynard, Jason L (FL51) <[log in to unmask]>

Wed, 30 Sep 1998 13:25:49 -0400

82 lines

New Thread

Biphenol Resins

Biphenol Resins

Clive Ffitch <[log in to unmask]>

Wed, 9 Sep 1998 15:44:38 PST

45 lines

Re: Biphenol Resins

Crepeau, Phil <[log in to unmask]>

Thu, 10 Sep 1998 07:43:10 -0700

88 lines

New Thread

blind and buried via's

blind and buried via's

Gregg Teachout <[log in to unmask]>

Wed, 23 Sep 1998 12:31:00 PDT

27 lines

Re: blind and buried via's

<Andy Slade> <[log in to unmask]>

Thu, 24 Sep 1998 17:01:17 -0400

72 lines

Re: blind and buried via's

[log in to unmask]

Thu, 24 Sep 1998 22:05:35 -0400

45 lines

New Thread

Boardsubstrates for RIMM module

Boardsubstrates for RIMM module

Achim Neu <[log in to unmask]>

Mon, 28 Sep 1998 22:10:01 +0200

31 lines

Re: Boardsubstrates for RIMM module

Smith Russell MSM LAPO US <[log in to unmask]>

Wed, 30 Sep 1998 04:06:00 +0200

106 lines

New Thread

Bubbles from conformally coated board

Re: Bubbles from conformally coated board

Kelly M. Schriver <[log in to unmask]>

Tue, 1 Sep 1998 07:47:15 -0500

34 lines

Re: Bubbles from conformally coated board

Lepsche, Thomas (NM75) <[log in to unmask]>

Tue, 1 Sep 1998 07:31:32 -0600

63 lines

Re: Bubbles from conformally coated board

Crepeau, Phil <[log in to unmask]>

Tue, 1 Sep 1998 07:21:40 -0700

64 lines

Re: Bubbles from conformally coated board

Hemstad, Jon (MN51) <[log in to unmask]>

Tue, 1 Sep 1998 09:39:56 -0500

60 lines

Re: Bubbles from conformally coated board

ETS <[log in to unmask]>

Tue, 1 Sep 1998 09:47:01 -0700

74 lines

Re: Bubbles from conformally coated board

Vaughan, Ralph H <[log in to unmask]>

Tue, 1 Sep 1998 11:17:35 -0700

66 lines

Re: Bubbles from conformally coated board

Stephen R. Mikell <[log in to unmask]>

Tue, 1 Sep 1998 16:47:23 -0500

44 lines

Re: Bubbles from conformally coated board

Lum Wee Mei <[log in to unmask]>

Wed, 2 Sep 1998 15:20:08 +0800

65 lines

Re: Bubbles from conformally coated board

Aric parr <[log in to unmask]>

Tue, 1 Sep 1998 07:24:04 EDT

75 lines

Re: Bubbles from conformally coated board

Graham Naisbitt <[log in to unmask]>

Tue, 1 Sep 1998 15:59:41 +0100

88 lines

Re: Bubbles from conformally coated board

Graham Naisbitt <[log in to unmask]>

Wed, 2 Sep 1998 15:14:18 +0100

120 lines

New Thread

Build-up Wiring Boards (Stereolithography?)

Build-up Wiring Boards (Stereolithography?)

Dr. Warren Smith <[log in to unmask]>

Fri, 11 Sep 1998 14:19:23 -0400

33 lines

New Thread

Buildup Wiring Boards

Buildup Wiring Boards

Dr. Warren Smith <[log in to unmask]>

Thu, 10 Sep 1998 22:08:16 -0400

31 lines

Re: Buildup Wiring Boards

Stephen R. Gregory <[log in to unmask]>

Thu, 10 Sep 1998 22:53:16 EDT

38 lines

Re: Buildup Wiring Boards

David Gonnerman <[log in to unmask]>

Fri, 11 Sep 1998 10:26:15 -0500

69 lines

Re: Buildup Wiring Boards

Joe Malley <[log in to unmask]>

Fri, 11 Sep 1998 11:19:44 -0400

73 lines

Re: Buildup Wiring Boards

Smith Russell MSM LAPO US <[log in to unmask]>

Mon, 14 Sep 1998 04:27:00 +0200

167 lines

New Thread

Buried Vias

Buried Vias

Blazi, Eric - LYPMPA <[log in to unmask]>

Wed, 16 Sep 1998 11:49:26 -0400

35 lines

Re: Buried Vias

<Andy Slade> <[log in to unmask]>

Wed, 16 Sep 1998 12:49:55 -0400

94 lines

New Thread

Burn In

Burn In

Cory and Lise Steeby <[log in to unmask]>

Mon, 21 Sep 1998 05:43:26 -0500

33 lines

Re: Burn In

Werner Engelmaier <[log in to unmask]>

Mon, 21 Sep 1998 12:22:54 EDT

41 lines

New Thread

C.O.P.S.[TN] Assy: Cocure conductive and nonconductive epoxi es

Re: C.O.P.S.[TN] Assy: Cocure conductive and nonconductive epoxi es

Paul Klasek <[log in to unmask]>

Thu, 17 Sep 1998 10:15:27 +1000

121 lines

New Thread

Call for Papers

Call for Papers

Jack Crawford <[log in to unmask]>

Tue, 8 Sep 1998 10:46:18 -0500

128 lines

New Thread

Cancellation of MIL-S-13949H

Cancellation of MIL-S-13949H

Doug Sober <[log in to unmask]>

Fri, 18 Sep 1998 17:59:16 -0400

274 lines

New Thread

Carbon Printing on PCBs

Carbon Printing on PCBs

H.S.Somashekar <[log in to unmask]>

Sun, 30 Aug 1998 00:25:08 +0500

40 lines

New Thread

Cleanliness Experiment/Demonstration Ideas?

Cleanliness Experiment/Demonstration Ideas?

Stephen R. Gregory <[log in to unmask]>

Thu, 3 Sep 1998 16:38:31 EDT

60 lines

Re: Cleanliness Experiment/Demonstration Ideas?

Kelly M. Schriver <[log in to unmask]>

Thu, 3 Sep 1998 16:01:00 -0500

33 lines

Re: Cleanliness Experiment/Demonstration Ideas?

Bev Christian <[log in to unmask]>

Thu, 3 Sep 1998 16:58:34 -0400

110 lines

Re: Cleanliness Experiment/Demonstration Ideas?

Stephen R. Gregory <[log in to unmask]>

Thu, 3 Sep 1998 17:51:58 EDT

54 lines

Cleanliness Experiment/Demonstration Ideas?

Stephen R. Mikell <[log in to unmask]>

Fri, 4 Sep 1998 16:41:58 -0500

62 lines

Re: Cleanliness Experiment/Demonstration Ideas?

Graham Naisbitt <[log in to unmask]>

Fri, 4 Sep 1998 23:01:37 +0100

129 lines

New Thread

Cleanliness Experiment/Demonstration Ideas? -Reply

Cleanliness Experiment/Demonstration Ideas? -Reply

Matthew Park <[log in to unmask]>

Thu, 3 Sep 1998 15:40:30 -0700

32 lines

New Thread

Coatingthings

Coatingthings

[log in to unmask]

Wed, 2 Sep 1998 10:18:04 +0200

59 lines

New Thread

Component Sourcing

Component Sourcing

Andy Mackie <[log in to unmask]>

Fri, 11 Sep 1998 12:19:23 -0400

28 lines

Re: Component Sourcing

Martin Hart <[log in to unmask]>

Fri, 11 Sep 1998 21:30:49 -0700

67 lines

New Thread

confirmation

confirmation

Aric parr <[log in to unmask]>

Wed, 2 Sep 1998 07:36:26 EDT

33 lines

New Thread

Conformal Coat Masking

Conformal Coat Masking

James Kittel <[log in to unmask]>

Wed, 30 Sep 1998 09:53:14 -0600

21 lines

Re: Conformal Coat Masking

Buccieri, Rich <[log in to unmask]>

Wed, 30 Sep 1998 12:25:31 -0400

63 lines

Re: Conformal Coat Masking

Alan Davis <[log in to unmask]>

Wed, 30 Sep 1998 12:50:28 -0400

62 lines

Re: Conformal Coat Masking

Golfer <[log in to unmask]>

Wed, 30 Sep 1998 23:56:55 +0100

58 lines

New Thread

conformal coating query

conformal coating query

Ian Squires <[log in to unmask]>

Mon, 21 Sep 1998 10:45:01 PDT

62 lines

New Thread

Controlled Impedance on signals

Controlled Impedance on signals

Meehan, Alexis <[log in to unmask]>

Tue, 15 Sep 1998 09:12:01 -0700

37 lines

New Thread

copper thieving

copper thieving

Paul Truit <[log in to unmask]>

Fri, 18 Sep 1998 09:28:40 -0400

41 lines

Re: copper thieving

Nelson, John <[log in to unmask]>

Fri, 18 Sep 1998 12:54:41 -0400

76 lines

Re: copper thieving

Jeff Seeger <[log in to unmask]>

Fri, 18 Sep 1998 15:45:56 -0400

45 lines

Re: copper thieving

Stephen R. Gregory <[log in to unmask]>

Fri, 18 Sep 1998 16:31:17 EDT

103 lines

Re: copper thieving

Leslie O. Connally <[log in to unmask]>

Fri, 18 Sep 1998 15:25:26 -0500

101 lines

New Thread

copper thieving and X-outs

Re: copper thieving and X-outs

Nelson, John <[log in to unmask]>

Sat, 19 Sep 1998 10:47:31 -0400

73 lines

New Thread

Core punch

Core punch

Ed Cosper <[log in to unmask]>

Tue, 29 Sep 1998 15:16:20 -0500

28 lines

New Thread

Country Code

Country Code

Gu, Sam <[log in to unmask]>

Thu, 24 Sep 1998 14:30:39 -0700

30 lines

New Thread

CSP Assembly

CSP Assembly

Lim Yak Peng <[log in to unmask]>

Fri, 25 Sep 1998 13:55:54 +0800

30 lines

New Thread

Current Capacity of via holes

Current Capacity of via holes

Derek Wynne <[log in to unmask]>

Tue, 15 Sep 1998 18:24:32 +0100

148 lines

New Thread

Current Capacity of vias

Current Capacity of vias

Scott Holthausen <[log in to unmask]>

Fri, 4 Sep 1998 14:24:16 -0400

32 lines

Re: Current Capacity of vias

Ralph Hersey <[log in to unmask]>

Fri, 4 Sep 1998 13:04:45 -0700

103 lines

Re: Current Capacity of vias

Lum Wee Mei <[log in to unmask]>

Sat, 5 Sep 1998 10:55:27 +0800

83 lines

Re: Current Capacity of vias

Lum Wee Mei <[log in to unmask]>

Sat, 5 Sep 1998 12:09:34 +0800

121 lines

Re: Current Capacity of vias

Douglas L McKean <[log in to unmask]>

Fri, 4 Sep 1998 20:12:40 -0700

112 lines

New Thread

DES: How do we compare

DES: How do we compare

Alan Berni <[log in to unmask]>

Tue, 8 Sep 1998 12:39:02 -0400

47 lines

New Thread

Design For Manufacturability(DFM) Strategy and rules

Design For Manufacturability(DFM) Strategy and rules

Ken Fong <[log in to unmask]>

Thu, 24 Sep 1998 14:49:44 EST

31 lines

Design For Manufacturability(DFM) Strategy and rules

Timothy A. Estes <[log in to unmask]>

Thu, 24 Sep 1998 14:32:05 -0600

82 lines

New Thread

Dewetting of Surface Mount pads

Dewetting of Surface Mount pads

d. terstegge <[log in to unmask]>

Thu, 10 Sep 1998 11:23:57 +0200

46 lines

Re: Dewetting of Surface Mount pads

Andy Mackie <[log in to unmask]>

Thu, 10 Sep 1998 09:52:12 -0400

94 lines

New Thread

Digital Cameras

Digital Cameras

Vincent B. Kinol <[log in to unmask]>

Wed, 9 Sep 1998 10:21:01 -0000

29 lines

Re: Digital Cameras

Stephen R. Gregory <[log in to unmask]>

Wed, 9 Sep 1998 18:00:53 EDT

66 lines

Digital cameras

Phil Hersey <[log in to unmask]>

Thu, 10 Sep 1998 11:08:20 -0700

84 lines

New Thread

DP-1500 (fwd)

DP-1500 (fwd)

Afri Singh <[log in to unmask]>

Mon, 21 Sep 1998 18:11:50 -0400

28 lines

Re: DP-1500 (fwd)

Mike Barmuta <[log in to unmask]>

Tue, 22 Sep 1998 13:16:48 -0700

105 lines

New Thread

drill files-plated/no

Re: drill files-plated/no

Bob Walker <[log in to unmask]>

Fri, 25 Sep 1998 10:21:38 -0400

150 lines

Re: drill files-plated/no

John Denton <[log in to unmask]>

Fri, 25 Sep 1998 11:57:07 -0400

200 lines

Re: drill files-plated/no

Edwards, Ted A (AZ75) <[log in to unmask]>

Fri, 25 Sep 1998 12:24:00 -0700

228 lines

New Thread

drill files-plated/non-plated holes

drill files-plated/non-plated holes

Bob Walker <[log in to unmask]>

Thu, 24 Sep 1998 16:45:01 -0400

46 lines

Re: drill files-plated/non-plated holes

Mike Mikucki <[log in to unmask]>

Thu, 24 Sep 1998 17:42:28 -0400

83 lines

Re: drill files-plated/non-plated holes

Don Vischulis <[log in to unmask]>

Thu, 24 Sep 1998 19:50:42 -0500

72 lines

New Thread

Drop off Component

Drop off Component

Poh Kong Hui <[log in to unmask]>

Wed, 30 Sep 1998 06:29:31 +0800

31 lines

Re: Drop off Component

Hwang Steve-WLSH14 <[log in to unmask]>

Wed, 30 Sep 1998 13:02:03 -0500

60 lines

Re: Drop off Component

James Kittel <[log in to unmask]>

Wed, 30 Sep 1998 13:17:16 -0600

55 lines

New Thread

Dummy BGAs with Resistor Chips

Dummy BGAs with Resistor Chips

Werner Engelmaier <[log in to unmask]>

Thu, 10 Sep 1998 13:59:56 EDT

27 lines

Re: Dummy BGAs with Resistor Chips

Martin Hart <[log in to unmask]>

Sun, 13 Sep 1998 22:06:29 -0700

66 lines

New Thread

Durapol laminate suppliers

Durapol laminate suppliers

[log in to unmask]

Tue, 15 Sep 1998 17:16:11 -0500

39 lines

New Thread

El Paso Designer Council Meeting Reminder

El Paso Designer Council Meeting Reminder

Steve Collins <[log in to unmask]>

Tue, 29 Sep 1998 07:33:52 -0600

37 lines

New Thread

Electrical Design Clearance

Electrical Design Clearance

David Paluck <[log in to unmask]>

Tue, 29 Sep 1998 16:30:04 -0500

27 lines

New Thread

Email list

Email list

[log in to unmask]

Tue, 29 Sep 1998 10:31:15 -0400

32 lines

New Thread

Enroll me in Technet

Enroll me in Technet

[log in to unmask]

Wed, 23 Sep 1998 10:33:47 -0400

24 lines

New Thread

Environmental Testing ("insect resistance")

Re: Environmental Testing ("insect resistance")

Clive Ffitch <[log in to unmask]>

Wed, 9 Sep 1998 09:48:43 PST

71 lines

Re: Environmental Testing ("insect resistance")

Gabriela Bogdan <[log in to unmask]>

Fri, 11 Sep 1998 15:58:15 +0200

111 lines

New Thread

Environmental testing - insects

Environmental testing - insects

Bernard Williams <[log in to unmask]>

Fri, 11 Sep 1998 10:51:04 +1200

59 lines

Re: Environmental testing - insects

Graham Naisbitt <[log in to unmask]>

Sat, 12 Sep 1998 23:26:02 +0100

108 lines

New Thread

EPC - Wiesbaden - Updates

EPC - Wiesbaden - Updates

Roland Jaquet <[log in to unmask]>

Tue, 15 Sep 1998 11:29:59 +0200

687 lines

New Thread

EPC - Wiesbaden - Updates -Reply

EPC - Wiesbaden - Updates -Reply

Gina Wang <[log in to unmask]>

Wed, 16 Sep 1998 09:11:15 +1200

27 lines

New Thread

ESD

ESD

Ken Patel <[log in to unmask]>

Tue, 29 Sep 1998 14:13:10 -0700

31 lines

Re: ESD

Matthias Mansfeld <[log in to unmask]>

Tue, 29 Sep 1998 23:35:32 +0200

44 lines

Re: ESD

Jeremy Drake <[log in to unmask]>

Wed, 30 Sep 1998 11:49:25 +0000

81 lines

Re: ESD

Gagrani, Kishore <[log in to unmask]>

Wed, 30 Sep 1998 08:28:54 -0400

137 lines

New Thread

ESD labels

ESD labels

Ian Squires <[log in to unmask]>

Wed, 23 Sep 1998 11:14:08 PDT

50 lines

Re: ESD labels

PELCHAT_JM <[log in to unmask]>

Wed, 23 Sep 1998 07:40:35 -0400

79 lines

Re: ESD labels

Gagrani, Kishore <[log in to unmask]>

Wed, 23 Sep 1998 08:22:47 -0400

130 lines

Re: ESD labels

George Franck <[log in to unmask]>

Wed, 23 Sep 1998 08:44:15 -0400

99 lines

Re: ESD labels

Paul Klasek <[log in to unmask]>

Thu, 24 Sep 1998 08:08:42 +1000

156 lines

Re: ESD labels

George Franck <[log in to unmask]>

Thu, 24 Sep 1998 09:38:57 -0400

62 lines

New Thread

ESD labels..thanks

ESD labels..thanks

Ian Squires <[log in to unmask]>

Wed, 23 Sep 1998 14:40:56 PDT

54 lines

New Thread

ETHYLENE GLYCOL CLEAN-UP

ETHYLENE GLYCOL CLEAN-UP

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 4 Sep 1998 14:33:00 -0400

43 lines

Re: ETHYLENE GLYCOL CLEAN-UP

Paul Wilson <[log in to unmask]>

Tue, 8 Sep 1998 06:20:07 -0400

100 lines

New Thread

Excess flux Kester 924FB

Excess flux Kester 924FB

Bev Christian <[log in to unmask]>

Wed, 9 Sep 1998 16:43:19 -0400

30 lines

Re: Excess flux Kester 924FB

Stephen R. Gregory <[log in to unmask]>

Wed, 9 Sep 1998 18:05:17 EDT

34 lines

New Thread

Fab note for Laminate material

Fab note for Laminate material

Ken Patel <[log in to unmask]>

Fri, 11 Sep 1998 11:45:16 -0700

40 lines

Re: Fab note for Laminate material

Charles Barker <[log in to unmask]>

Fri, 11 Sep 1998 15:55:33 -0500

81 lines

New Thread

Fab Solderability Test @ Assembly house

Fab Solderability Test @ Assembly house

Ken Patel <[log in to unmask]>

Tue, 22 Sep 1998 10:55:25 -0700

39 lines

Re: Fab Solderability Test @ Assembly house

Bev Christian <[log in to unmask]>

Tue, 22 Sep 1998 14:11:05 -0400

72 lines

Re: Fab Solderability Test @ Assembly house

Stephen R. Gregory <[log in to unmask]>

Tue, 22 Sep 1998 16:35:58 EDT

72 lines

New Thread

Fab/Assy: Vias under chip components

Fab/Assy: Vias under chip components

glenn pelkey <[log in to unmask]>

Tue, 29 Sep 1998 13:40:37 PDT

36 lines

Re: Fab/Assy: Vias under chip components

Jay Tsai <[log in to unmask]>

Tue, 29 Sep 1998 14:49:08 -0700

63 lines

Re: Fab/Assy: Vias under chip components

Wolfe, Robert <[log in to unmask]>

Tue, 29 Sep 1998 18:08:02 -0400

65 lines

Re: Fab/Assy: Vias under chip components

Jay Tsai <[log in to unmask]>

Wed, 30 Sep 1998 16:25:53 -0700

86 lines

New Thread

FAB: IPC-2221 confusion

FAB: IPC-2221 confusion

Thomas N. Bresnan <[log in to unmask]>

Mon, 21 Sep 1998 08:36:44 -0400

37 lines

Re: FAB: IPC-2221 confusion

Kelly M. Schriver <[log in to unmask]>

Mon, 21 Sep 1998 10:29:06 -0500

42 lines

Re: FAB: IPC-2221 confusion

George Franck <[log in to unmask]>

Mon, 21 Sep 1998 13:23:56 -0400

77 lines

New Thread

Fab: Multiple surface finishes

Fab: Multiple surface finishes

glenn pelkey <[log in to unmask]>

Wed, 30 Sep 1998 10:31:54 PDT

48 lines

Fab: Multiple surface finishes

Alderete, Michael <[log in to unmask]>

Wed, 30 Sep 1998 14:44:49 -0700

72 lines

New Thread

FAILURE ANALYSIS LABORATORIES

FAILURE ANALYSIS LABORATORIES

[log in to unmask]

Tue, 1 Sep 1998 20:34:41 EDT

33 lines

Re: FAILURE ANALYSIS LABORATORIES

Paul Terranova <[log in to unmask]>

Wed, 2 Sep 1998 08:56:05 -0400

287 lines

Re: FAILURE ANALYSIS LABORATORIES

Brad Vanderhoof <[log in to unmask]>

Wed, 2 Sep 1998 10:17:00 PDT

55 lines

Re: FAILURE ANALYSIS LABORATORIES

Bill Davis <[log in to unmask]>

Wed, 2 Sep 1998 09:17:24 -0700

59 lines

New Thread

Fastek Netlist software

Fastek Netlist software

Jim Marvel <[log in to unmask]>

Mon, 14 Sep 1998 05:18:37 -0400

28 lines

New Thread

Fine Line technology

Fine Line technology

Craig McGlinchy <[log in to unmask]>

Thu, 3 Sep 1998 09:11:25 +1200

53 lines

Re: Fine Line technology

Ronald J. Rhodes <[log in to unmask]>

Thu, 3 Sep 1998 15:13:54 -0400

125 lines

Re: Fine Line technology

Phil Culpovich <[log in to unmask]>

Thu, 3 Sep 1998 06:28:50 -0700

80 lines

Fine Line technology

Craig McGlinchy <[log in to unmask]>

Wed, 16 Sep 1998 13:35:39 +1200

24 lines

New Thread

fine pitch BGA soldering pad size

fine pitch BGA soldering pad size

ginsing <[log in to unmask]>

Wed, 2 Sep 1998 21:56:28 +1200

32 lines

New Thread

Fingers vs Socket & Pin on pwr supply

Fingers vs Socket & Pin on pwr supply

Wolfe, Robert <[log in to unmask]>

Thu, 17 Sep 1998 15:52:22 -0400

34 lines

Re: Fingers vs Socket & Pin on pwr supply

Kelly M. Schriver <[log in to unmask]>

Fri, 18 Sep 1998 07:09:41 -0500

27 lines

New Thread

Flash point and melting point for CEM-3 and Paper Phenol laminates

Flash point and melting point for CEM-3 and Paper Phenol laminates

Mark Wythes <[log in to unmask]>

Fri, 18 Sep 1998 14:52:53 -0700

23 lines

Re: Flash point and melting point for CEM-3 and Paper Phenol laminates

Crepeau, Phil <[log in to unmask]>

Mon, 21 Sep 1998 07:45:46 -0700

60 lines

New Thread

Flex Circuit Fixtures for SMT

Flex Circuit Fixtures for SMT

Kent S. Asmus <[log in to unmask]>

Thu, 17 Sep 1998 23:00:59 -0700

74 lines

New Thread

Flex Materials

Flex Materials

Kelly M. Schriver <[log in to unmask]>

Tue, 15 Sep 1998 14:31:28 -0500

36 lines

Re: Flex Materials

Jerome Sallo <[log in to unmask]>

Wed, 16 Sep 1998 01:38:32 EDT

25 lines

New Thread

Flux Measuring Techniques

Flux Measuring Techniques

Hoppa, Floyd <[log in to unmask]>

Wed, 16 Sep 1998 06:34:08 -0500

37 lines

Re: Flux Measuring Techniques

Mike Manwell <[log in to unmask]>

Wed, 16 Sep 1998 07:48:12 -0700

64 lines

New Thread

Flux Measuring Techniques??

Flux Measuring Techniques??

Mike Manwell <[log in to unmask]>

Tue, 15 Sep 1998 16:04:25 -0700

26 lines

Re: Flux Measuring Techniques??

<Jason M. Smith> <[log in to unmask]>

Wed, 16 Sep 1998 07:26:27 -0400

70 lines

New Thread

Flying Probe Bare Board Testers

Flying Probe Bare Board Testers

Fred Paul <[log in to unmask]>

Tue, 22 Sep 1998 15:28:10 -0700

35 lines

Re: Flying Probe Bare Board Testers

Terry Regan <[log in to unmask]>

Tue, 22 Sep 1998 16:11:55 -0400

69 lines

New Thread

Fractures

Fractures

[log in to unmask]

Tue, 15 Sep 1998 15:54:53 EDT

47 lines

New Thread

FREE FORUM ON CONFORMAL COATING

FREE FORUM ON CONFORMAL COATING

Jack Crawford <[log in to unmask]>

Tue, 1 Sep 1998 17:49:25 -0500

101 lines

New Thread

From HASL to Ni/Immersion Gold

From HASL to Ni/Immersion Gold

Johannes Sivula <[log in to unmask]>

Tue, 15 Sep 1998 13:23:00 +0300

31 lines

New Thread

Fw: ASSY: PBGA on PCMCIA card

Fw: ASSY: PBGA on PCMCIA card

Orna and Yehuda <[log in to unmask]>

Thu, 17 Sep 1998 12:19:39 +0200

113 lines

Fw: ASSY: PBGA on PCMCIA card

Jeff Hempton <[log in to unmask]>

Thu, 17 Sep 1998 08:27:42 -0500

130 lines

New Thread

FW: Cancellation of MIL-S-13949H

FW: Cancellation of MIL-S-13949H

Alderete, Michael <[log in to unmask]>

Tue, 22 Sep 1998 10:15:48 -0700

325 lines

New Thread

FW: [TN] ASSY: BGA FAILURES

FW: [TN] ASSY: BGA FAILURES

Jeff Perkins <[log in to unmask]>

Tue, 29 Sep 1998 11:03:46 -0400

71 lines

New Thread

FW: [TN] Phosphorous In The Nickel Barrier

FW: [TN] Phosphorous In The Nickel Barrier

Jeff Perkins <[log in to unmask]>

Mon, 21 Sep 1998 18:26:48 -0400

65 lines

New Thread

FW:[TN] Cleanliness Experiment/Demonstration Ideas?

FW:[TN] Cleanliness Experiment/Demonstration Ideas?

Stephen R. Mikell <[log in to unmask]>

Thu, 3 Sep 1998 17:05:14 -0500

99 lines

New Thread

Fwd: [CN] Haloing on PWB

Fwd: [CN] Haloing on PWB

Christopher Rhodes <[log in to unmask]>

Wed, 9 Sep 1998 12:01:29 -0500

95 lines

New Thread

Fwd:Alodine washing off

Fwd:Alodine washing off

[log in to unmask]

Fri, 4 Sep 1998 13:38:43 +0000

52 lines

Re: Fwd:Alodine washing off

Jerry Cupples <[log in to unmask]>

Fri, 4 Sep 1998 14:13:57 -0500

109 lines

Re: Fwd:Alodine washing off

Richard Haynes <[log in to unmask]>

Fri, 4 Sep 1998 16:22:50 -0400

89 lines

Re: Fwd:Alodine washing off

Chris Evans <[log in to unmask]>

Mon, 7 Sep 1998 17:14:10 PST

100 lines

New Thread

g10

g10

Paul Stolar <[log in to unmask]>

Thu, 17 Sep 1998 11:20:46 -0600

25 lines

Re: g10

Chris Chapman <[log in to unmask]>

Thu, 17 Sep 1998 13:53:31 -0400

55 lines

New Thread

GDSII compatible CAD software

GDSII compatible CAD software

Ferm, Paul <[log in to unmask]>

Fri, 4 Sep 1998 06:56:00 -0700

31 lines

Re: GDSII compatible CAD software

Steve Trasatto <[log in to unmask]>

Tue, 8 Sep 1998 08:28:45 -0400

69 lines

New Thread

GEN

GEN

Robert McGarry <[log in to unmask]>

Wed, 16 Sep 1998 15:28:15 +0000

34 lines

Re: GEN

Mike Wilson <[log in to unmask]>

Thu, 17 Sep 1998 08:15:31 -0500

67 lines

Re: GEN

Buccieri, Rich <[log in to unmask]>

Thu, 17 Sep 1998 08:58:01 -0400

59 lines

Re: GEN

Paul Klasek <[log in to unmask]>

Fri, 18 Sep 1998 08:04:00 +1000

66 lines

New Thread

Gen: photoablation substrate materials

Gen: photoablation substrate materials

Paul Wilson <[log in to unmask]>

Wed, 9 Sep 1998 08:53:00 -0400

30 lines

New Thread

Gen: Reliability Testing in Road Salt Conditions

Gen: Reliability Testing in Road Salt Conditions

Paul Wilson <[log in to unmask]>

Thu, 24 Sep 1998 13:09:27 -0400

43 lines

Re: Gen: Reliability Testing in Road Salt Conditions

Kelly M. Schriver <[log in to unmask]>

Thu, 24 Sep 1998 19:07:40 -0500

37 lines

New Thread

GETECK laminates

GETECK laminates

Ed Cosper <[log in to unmask]>

Tue, 15 Sep 1998 16:47:27 -0500

29 lines

Re: GETECK laminates

Joel Fillion <[log in to unmask]>

Wed, 16 Sep 1998 08:32:20 -0700

54 lines

Re: GETECK laminates

McGlaughlin, Jeffrey A <[log in to unmask]>

Wed, 16 Sep 1998 11:55:55 -0400

54 lines

New Thread

Gold plated connector & peelable resist?

Gold plated connector & peelable resist?

Matthew Lamkin <[log in to unmask]>

Mon, 14 Sep 1998 22:39:07 +0100

102 lines

Re: Gold plated connector & peelable resist?

Paul Klasek <[log in to unmask]>

Tue, 15 Sep 1998 09:55:00 +1000

81 lines

New Thread

GR-78-CORE

GR-78-CORE

Denise Krozal <[log in to unmask]>

Wed, 9 Sep 1998 12:43:13 -0400

23 lines

Re: GR-78-CORE

Bev Christian <[log in to unmask]>

Wed, 9 Sep 1998 13:24:31 -0400

62 lines

New Thread

Greater Boston Designers Council Chapter Meeting

Greater Boston Designers Council Chapter Meeting

Jeff Seeger <[log in to unmask]>

Mon, 28 Sep 1998 06:34:21 -0400

82 lines

New Thread

Haloing on PWB

Haloing on PWB

Julie Dobbins <[log in to unmask]>

Tue, 8 Sep 1998 15:05:07 -0500

24 lines

Re: Haloing on PWB

Ralph Hersey <[log in to unmask]>

Thu, 10 Sep 1998 01:40:39 -0700

105 lines

New Thread

Harderman Fluxes

Harderman Fluxes

DAVID D RUND <[log in to unmask]>

Tue, 8 Sep 1998 17:47:57 -0700

69 lines

New Thread

HASL thickness readings

HASL thickness readings

PELCHAT_JM <[log in to unmask]>

Tue, 22 Sep 1998 07:17:13 -0400

33 lines

Re: HASL thickness readings

Mark Simmons <[log in to unmask]>

Tue, 22 Sep 1998 06:27:15 -0700

41 lines

New Thread

Help! Plugging vias

Help! Plugging vias

Chi-man Chan <[log in to unmask]>

Thu, 24 Sep 1998 19:59:19 +1000

43 lines

Re: Help! Plugging vias

Fred Shubert <[log in to unmask]>

Thu, 24 Sep 1998 10:04:39 -0400

76 lines

Re: Help! Plugging vias

Matthew Park <[log in to unmask]>

Thu, 24 Sep 1998 08:13:38 -0700

90 lines

Re: Help! Plugging vias

Martin, Jesse <[log in to unmask]>

Thu, 24 Sep 1998 12:45:52 -0400

36 lines

Re: Help! Plugging vias

Marti Tully CEO Consultant & Trainer <[log in to unmask]>

Thu, 24 Sep 1998 10:56:53 -0700

97 lines

Re: Help! Plugging vias

Erika Pacheco <[log in to unmask]>

Thu, 24 Sep 1998 19:40:39 -0400

42 lines

New Thread

High Density Circuits

High Density Circuits

Mark Simmons <[log in to unmask]>

Thu, 17 Sep 1998 07:43:49 -0700

45 lines

Re: High Density Circuits

Motoyo Wajima <[log in to unmask]>

Sat, 19 Sep 1998 11:29:58 +0900

85 lines

New Thread

Hoax ? > Ericsson ?

Hoax ? > Ericsson ?

Paul Klasek <[log in to unmask]>

Wed, 23 Sep 1998 10:29:56 +1000

50 lines

Re: Hoax ? > Ericsson ?

Douglas Mckean <[log in to unmask]>

Tue, 22 Sep 1998 18:34:43 -0700

46 lines

Re: Hoax ? > Ericsson ?

Bob Carhart <[log in to unmask]>

Wed, 23 Sep 1998 06:21:39 -0500

84 lines

New Thread

Hole tolerances

Hole tolerances

Matthew Sanders <[log in to unmask]>

Tue, 29 Sep 1998 15:50:15 -0700

36 lines

New Thread

HP DesignJet 650C Problems

HP DesignJet 650C Problems

KC5LOS <[log in to unmask]>

Sun, 20 Sep 1998 11:03:45 -0500

45 lines

New Thread

IC coating

IC coating

Justin Braime <[log in to unmask]>

Tue, 8 Sep 1998 11:01:33 +1200

40 lines

Re: IC coating

Russ <[log in to unmask]>

Tue, 8 Sep 1998 00:26:22 -0700

65 lines

New Thread

Incoming Inspection Equipment

Incoming Inspection Equipment

[log in to unmask]

Tue, 22 Sep 1998 17:00:31 -0500

50 lines

Re: Incoming Inspection Equipment

McMonagle, Michael R. <[log in to unmask]>

Tue, 22 Sep 1998 17:45:00 -0500

94 lines

Re: Incoming Inspection Equipment

Paul Klasek <[log in to unmask]>

Wed, 23 Sep 1998 09:50:26 +1000

97 lines

New Thread

Increase number of drill sizes

Increase number of drill sizes

Stuart Chessen <[log in to unmask]>

Sat, 26 Sep 1998 06:51:54 -0700

30 lines

Re: Increase number of drill sizes

Mike Mikucki <[log in to unmask]>

Sat, 26 Sep 1998 13:01:52 -0400

65 lines

Re: Increase number of drill sizes

Matthew Lamkin <[log in to unmask]>

Sat, 26 Sep 1998 23:40:47 +0100

83 lines

Re: Increase number of drill sizes

Steve Underwood <[log in to unmask]>

Fri, 25 Sep 1998 14:18:32 -0400

73 lines

Re: Increase number of drill sizes

Paul Giovannetti <[log in to unmask]>

Sun, 27 Sep 1998 04:18:05 -0700

76 lines

New Thread

Info about AOI

Info about AOI

[log in to unmask]

Fri, 4 Sep 1998 13:18:54 -0400

35 lines

Re: Info about AOI

Ed Cosper <[log in to unmask]>

Tue, 8 Sep 1998 15:07:35 -0500

128 lines

New Thread

Info about AOI -Reply

Re: Info about AOI -Reply

Cal Brunsting <[log in to unmask]>

Thu, 10 Sep 1998 09:49:38 -0700

31 lines

Re: Info about AOI -Reply

Ed Cosper <[log in to unmask]>

Thu, 10 Sep 1998 18:16:54 -0500

137 lines

New Thread

Info on J-STD-003A "Solderability Tests for Circuit Boards"

Info on J-STD-003A "Solderability Tests for Circuit Boards"

Jack Crawford <[log in to unmask]>

Mon, 14 Sep 1998 21:32:58 -0500

72 lines

New Thread

Ink for insulation layer

Ink for insulation layer

BPL-PCB, Doddaballapur <[log in to unmask]>

Mon, 7 Sep 1998 18:09:21 +0500

37 lines

New Thread

Inspection criteria for no clean assembly?

Inspection criteria for no clean assembly?

Rudolph Yu <[log in to unmask]>

Tue, 1 Sep 1998 12:56:25 -0700

33 lines

Re: Inspection criteria for no clean assembly?

Bev Christian <[log in to unmask]>

Wed, 2 Sep 1998 08:03:28 -0400

80 lines

Re: Inspection criteria for no clean assembly?

Russ Winslow <[log in to unmask]>

Wed, 2 Sep 1998 11:16:18 -0700

75 lines

New Thread

Insulation layer for Remote control PWB

Insulation layer for Remote control PWB

BPL-PCB, Doddaballapur <[log in to unmask]>

Thu, 10 Sep 1998 12:34:22 +0500

37 lines

New Thread

INTEL PLM 96

INTEL PLM 96

Richard W. Boerdner <[log in to unmask]>

Fri, 18 Sep 1998 09:30:23 -0400

24 lines

New Thread

Ionograph / Cleanliness Requirement for Components

Ionograph / Cleanliness Requirement for Components

Russ Winslow <[log in to unmask]>

Wed, 2 Sep 1998 11:31:58 -0700

25 lines

Re: Ionograph / Cleanliness Requirement for Components

Bev Christian <[log in to unmask]>

Thu, 3 Sep 1998 07:21:23 -0400

56 lines

Re: Ionograph / Cleanliness Requirement for Components

Russ Winslow <[log in to unmask]>

Thu, 3 Sep 1998 17:47:31 -0700

81 lines

Re: Ionograph / Cleanliness Requirement for Components

Bev Christian <[log in to unmask]>

Thu, 3 Sep 1998 22:37:17 -0400

109 lines

Re: Ionograph / Cleanliness Requirement for Components

David Fish <[log in to unmask]>

Thu, 3 Sep 1998 22:07:06 -0400

94 lines

Re: Ionograph / Cleanliness Requirement for Components

Russ Winslow <[log in to unmask]>

Fri, 4 Sep 1998 19:29:51 -0700

34 lines

Re: Ionograph / Cleanliness Requirement for Components

David Fish <[log in to unmask]>

Fri, 4 Sep 1998 18:31:32 -0400

84 lines

Re: Ionograph / Cleanliness Requirement for Components

Bev Christian <[log in to unmask]>

Mon, 7 Sep 1998 20:34:36 -0400

130 lines

New Thread

IPC 4101 L25

IPC 4101 L25

Ed Cosper <[log in to unmask]>

Thu, 17 Sep 1998 17:35:03 -0500

26 lines

Re: IPC 4101 L25

Ian McMillan <[log in to unmask]>

Fri, 18 Sep 1998 08:11:19 +0000

56 lines

New Thread

IPC Standard for PCB Acceptance

IPC Standard for PCB Acceptance

Thibodeau, Chad <[log in to unmask]>

Thu, 24 Sep 1998 11:58:26 -0700

32 lines

Re: IPC Standard for PCB Acceptance

Rick A. Scovel <[log in to unmask]>

Thu, 24 Sep 1998 12:29:27 -0700

68 lines

Re: IPC Standard for PCB Acceptance

Ralph Hersey <[log in to unmask]>

Thu, 24 Sep 1998 12:37:41 -0700

62 lines

New Thread

IPC-L-112 Help

IPC-L-112 Help

Don Vischulis <[log in to unmask]>

Wed, 2 Sep 1998 13:17:57 +500

30 lines

New Thread

IPC-S-815

IPC-S-815

Peter Haswell <[log in to unmask]>

Mon, 14 Sep 1998 05:00:00 EST

45 lines

New Thread

IPC/SMTA ELECTRONICS EXPO

IPC/SMTA ELECTRONICS EXPO

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 28 Sep 1998 12:36:00 -0400

26 lines

Re: IPC/SMTA ELECTRONICS EXPO

Jack Crawford <[log in to unmask]>

Mon, 28 Sep 1998 17:55:08 -0500

53 lines

Re: IPC/SMTA ELECTRONICS EXPO

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 29 Sep 1998 07:56:00 -0400

24 lines

Re: IPC/SMTA ELECTRONICS EXPO

Bev Christian <[log in to unmask]>

Tue, 29 Sep 1998 09:45:44 -0400

57 lines

Re: IPC/SMTA ELECTRONICS EXPO

Werner Engelmaier <[log in to unmask]>

Tue, 29 Sep 1998 08:12:05 EDT

29 lines

Re: IPC/SMTA ELECTRONICS EXPO

Golfer <[log in to unmask]>

Wed, 30 Sep 1998 08:32:04 +0100

57 lines

Re: IPC/SMTA ELECTRONICS EXPO

Golfer <[log in to unmask]>

Wed, 30 Sep 1998 08:44:37 +0100

93 lines

New Thread

ISA card board requirements

ISA card board requirements

<Jim Cook> <[log in to unmask]>

Thu, 24 Sep 1998 00:38:55 EDT

23 lines

New Thread

Job opportunities

Job opportunities

Mario Irigoyen <[log in to unmask]>

Tue, 15 Sep 1998 16:14:36 -0500

43 lines

New Thread

Justification for change from tht to smt

Re: Justification for change from tht to smt

Tony & Wendy Smythe <[log in to unmask]>

Mon, 28 Sep 1998 05:54:49 -0500

31 lines

Re: Justification for change from tht to smt

Jerry Cupples <[log in to unmask]>

Mon, 28 Sep 1998 11:29:31 -0500

86 lines

Re: Justification for change from tht to smt

Mark Austin <[log in to unmask]>

Mon, 28 Sep 1998 16:53:00 +0100

85 lines

Re: Justification for change from tht to smt

Hamilton, Richard -4454 <[log in to unmask]>

Mon, 28 Sep 1998 08:43:04 -0700

83 lines

Re: Justification for change from tht to smt

Tony & Wendy Smythe <[log in to unmask]>

Tue, 29 Sep 1998 03:46:37 -0500

30 lines

New Thread

Keep Out Distance for press-fit connectors.

Keep Out Distance for press-fit connectors.

Ken Patel <[log in to unmask]>

Mon, 28 Sep 1998 18:16:20 -0700

36 lines

Re: Keep Out Distance for press-fit connectors.

Valquirio N. Carvalho <[log in to unmask]>

Mon, 28 Sep 1998 21:52:13 -0400

82 lines

Re: Keep Out Distance for press-fit connectors.

Rupert, Martha L. <[log in to unmask]>

Tue, 29 Sep 1998 07:24:55 -0400

79 lines

New Thread

Laminate material

Laminate material

Ken Patel <[log in to unmask]>

Thu, 24 Sep 1998 13:56:40 -0700

40 lines

New Thread

Laminates, Dk, Tg and Cost

Laminates, Dk, Tg and Cost

[log in to unmask]

Tue, 15 Sep 1998 10:59:14 -0500

44 lines

New Thread

Lamination process control

Re: Lamination process control

Matthew Sanders <[log in to unmask]>

Wed, 9 Sep 1998 08:56:40 -0700

64 lines

New Thread

Land Pattern Calculator

Land Pattern Calculator

Justin Braime <[log in to unmask]>

Mon, 21 Sep 1998 12:59:23 +1200

39 lines

Re: Land Pattern Calculator

Stephen R. Gregory <[log in to unmask]>

Mon, 21 Sep 1998 07:28:15 EDT

48 lines

New Thread

laser ablation material

laser ablation material

Howard Lin <[log in to unmask]>

Wed, 9 Sep 1998 16:15:45 +0800

28 lines

Re: laser ablation material

Colin <[log in to unmask]>

Wed, 9 Sep 1998 04:26:43 -0500

57 lines

Re: laser ablation material

Colin <[log in to unmask]>

Wed, 9 Sep 1998 04:26:56 -0500

65 lines

Re: laser ablation material

[log in to unmask]

Wed, 9 Sep 1998 21:04:34 EDT

52 lines

New Thread

laser drilling / ablation

laser drilling / ablation

Roland Jaquet <[log in to unmask]>

Sat, 26 Sep 1998 11:03:11 +0200

99 lines

New Thread

Micro Soldering

Micro Soldering

Laskowsky, John <[log in to unmask]>

Wed, 23 Sep 1998 19:03:23 -0500

36 lines

New Thread

Micro viewer for PWB manufacturing line

Micro viewer for PWB manufacturing line

BPL-PCB, Doddaballapur <[log in to unmask]>

Wed, 16 Sep 1998 10:18:43 +0500

33 lines

Re: Micro viewer for PWB manufacturing line

Alex Neussendorfer <[log in to unmask]>

Wed, 16 Sep 1998 14:35:04 -0500

61 lines

New Thread

microannex els

microannex els

corn naik <[log in to unmask]>

Mon, 28 Sep 1998 22:32:14 -0700

30 lines

New Thread

Microscopes

Microscopes

No Name Available <[log in to unmask]>

Thu, 17 Sep 1998 00:31:42 EDT

28 lines

Re: Microscopes

Thomas A. Fuller <[log in to unmask]>

Thu, 17 Sep 1998 07:01:46 -0500

28 lines

New Thread

Mil-Std-2000

Mil-Std-2000

<Dennis Fink> <[log in to unmask]>

Fri, 11 Sep 1998 03:12:59 CDT

35 lines

Re: Mil-Std-2000

PELCHAT_JM <[log in to unmask]>

Fri, 11 Sep 1998 09:41:44 -0400

71 lines

New Thread

Moisture Sensitive Components

Moisture Sensitive Components

Neal W Driscoll <[log in to unmask]>

Wed, 23 Sep 1998 11:01:54 -0400

39 lines

Re: Moisture Sensitive Components

Yves Trudell <[log in to unmask]>

Wed, 23 Sep 1998 15:13:30 -0400

114 lines

New Thread

MS-2000

Re: MS-2000

[log in to unmask]

Sat, 12 Sep 1998 11:06:29 EDT

57 lines

Re: MS-2000

Jeff Hempton <[log in to unmask]>

Mon, 14 Sep 1998 08:10:35 -0500

81 lines

New Thread

NC machines and Y2k bug

NC machines and Y2k bug

Modular Components National, Inc. <[log in to unmask]>

Tue, 15 Sep 1998 10:17:39 -0400

30 lines

NC machines and Y2k bug

Keith Birchfield <[log in to unmask]>

Tue, 15 Sep 1998 16:07:20 -0400

54 lines

New Thread

Network Analyzers

Network Analyzers

Daniel Neuman <[log in to unmask]>

Tue, 29 Sep 1998 10:51:12 -0700

38 lines

New Thread

New IPC Desk Ref. Manual on SM Solder Joint Eval.

New IPC Desk Ref. Manual on SM Solder Joint Eval.

Steve Donaldson <[log in to unmask]>

Wed, 2 Sep 1998 09:02:13 -0600

858 lines

Re: New IPC Desk Ref. Manual on SM Solder Joint Eval.

Cash, Alan <[log in to unmask]>

Wed, 2 Sep 1998 17:24:10 -0400

51 lines

New Thread

Newbie

Newbie

Paul M. Quintin Jr <[log in to unmask]>

Thu, 10 Sep 1998 11:11:08 EDT

33 lines

New Thread

News from Stickley-Vejar

Re: News from Stickley-Vejar

Stephen R. Gregory <[log in to unmask]>

Mon, 28 Sep 1998 16:24:32 EDT

31 lines

Re: News from Stickley-Vejar

Werner Engelmaier <[log in to unmask]>

Tue, 29 Sep 1998 08:12:08 EDT

38 lines

New Thread

No-Clean Process - Cleanliness Specification

No-Clean Process - Cleanliness Specification

<Mary Smoot> <[log in to unmask]>

Fri, 18 Sep 1998 15:56:35 -0400

36 lines

Re: No-Clean Process - Cleanliness Specification

Graham Naisbitt <[log in to unmask]>

Sat, 19 Sep 1998 17:26:26 +0100

101 lines

New Thread

Offer for new printing line for Single side PWB

Offer for new printing line for Single side PWB

BPL-PCB, Doddaballapur <[log in to unmask]>

Sun, 6 Sep 1998 21:57:18 +0500

71 lines

New Thread

Open circuits from Silver Sulfide Corrosion

Open circuits from Silver Sulfide Corrosion

David Weber <[log in to unmask]>

Wed, 23 Sep 1998 21:08:02 -0400

41 lines

Re: Open circuits from Silver Sulfide Corrosion

Paul Stolar <[log in to unmask]>

Thu, 24 Sep 1998 08:35:17 -0600

78 lines

Open circuits from Silver Sulfide Corrosion

[log in to unmask]

Thu, 24 Sep 1998 16:06:44 +0200

79 lines

Re: Open circuits from Silver Sulfide Corrosion

Werner Engelmaier <[log in to unmask]>

Thu, 24 Sep 1998 08:15:07 EDT

37 lines

Re: Open circuits from Silver Sulfide Corrosion

Mark Austin <[log in to unmask]>

Thu, 24 Sep 1998 16:48:00 +0100

87 lines

New Thread

Optical Sensor

Optical Sensor

Mauricio Castro <[log in to unmask]>

Fri, 11 Sep 1998 08:33:04 -0500

41 lines

New Thread

Outgassing

Outgassing

[log in to unmask]

Tue, 8 Sep 1998 16:07:11 +0000

31 lines

Re: Outgassing

Kelly M. Schriver <[log in to unmask]>

Tue, 8 Sep 1998 11:07:16 -0500

31 lines

New Thread

oxygen index and test method, FR4 laminates

oxygen index and test method, FR4 laminates

th_yeo <[log in to unmask]>

Wed, 16 Sep 1998 07:39:01 +0800

31 lines

Re: oxygen index and test method, FR4 laminates

Delsen Testing Laboratories <[log in to unmask]>

Wed, 16 Sep 1998 07:17:03 -0700

66 lines

New Thread

Pacific Northwest IPC DC Newsletter

Pacific Northwest IPC DC Newsletter

Jim Yohe <[log in to unmask]>

Sun, 27 Sep 1998 18:47:41 -0700

62 lines

New Thread

Paint Finish Protection

Paint Finish Protection

Kane, Joseph <[log in to unmask]>

Wed, 9 Sep 1998 17:08:14 -0400

31 lines

Re: Paint Finish Protection

Bev Christian <[log in to unmask]>

Thu, 10 Sep 1998 07:52:16 -0400

65 lines

Re: Paint Finish Protection

Kitt <[log in to unmask]>

Thu, 10 Sep 1998 09:33:09 -0500

31 lines

Re: Paint Finish Protection

Kane, Joseph <[log in to unmask]>

Thu, 10 Sep 1998 10:47:01 -0400

95 lines

Re: Paint Finish Protection

Eric Christison <[log in to unmask]>

Mon, 14 Sep 1998 13:44:39 +0100

59 lines

New Thread

Pass/Fail Wetting Balance Criteria

Pass/Fail Wetting Balance Criteria

Bev Christian <[log in to unmask]>

Thu, 24 Sep 1998 15:28:17 -0400

29 lines

Re: Pass/Fail Wetting Balance Criteria

Scott M. Severson <[log in to unmask]>

Thu, 24 Sep 1998 15:54:00 -0600

73 lines

New Thread

PCB Material Change

PCB Material Change

Kathy Palumbo <[log in to unmask]>

Wed, 2 Sep 1998 10:13:11 -0700

38 lines

Re: PCB Material Change

Jerome Sallo <[log in to unmask]>

Wed, 2 Sep 1998 14:02:25 EDT

27 lines

Re: PCB Material Change

Joe Malley <[log in to unmask]>

Wed, 2 Sep 1998 14:43:31 -0400

35 lines

Re: PCB Material Change

Ray Honorio <[log in to unmask]>

Sat, 12 Sep 1998 07:20:54 +0800

83 lines

New Thread

PCB Material Change -Reply

PCB Material Change -Reply

Matthew Park <[log in to unmask]>

Wed, 2 Sep 1998 11:19:10 -0700

80 lines

Re: PCB Material Change -Reply

Greg Finlay <[log in to unmask]>

Wed, 2 Sep 1998 15:01:39 -0400

113 lines

New Thread

PCB Materials

PCB Materials

Simon Butte <[log in to unmask]>

Fri, 25 Sep 1998 13:04:51 -0700

33 lines

New Thread

Peelable mask in reflow oven

Peelable mask in reflow oven

Lon Weffers <[log in to unmask]>

Tue, 1 Sep 1998 16:38:52 +0200

63 lines

Peelable mask in reflow oven

Lon Weffers <[log in to unmask]>

Tue, 1 Sep 1998 16:40:03 +0200

75 lines

Re: Peelable mask in reflow oven

Brad Vanderhoof <[log in to unmask]>

Wed, 2 Sep 1998 10:29:26 PDT

45 lines

New Thread

Phosphorous In The Nickel Barrier

Phosphorous In The Nickel Barrier

Ron Hollandsworth <[log in to unmask]>

Mon, 21 Sep 1998 11:38:21 -0500

43 lines

New Thread

Planarity

Planarity

Paul Stolar <[log in to unmask]>

Mon, 21 Sep 1998 15:44:15 -0600

32 lines

Re: Planarity

Russ Winslow <[log in to unmask]>

Mon, 21 Sep 1998 19:48:27 -0700

52 lines

New Thread

Plasma Machine Manufacturer

Plasma Machine Manufacturer

tgyee <[log in to unmask]>

Fri, 18 Sep 1998 09:18:39 PST

43 lines

Re: Plasma Machine Manufacturer

Manfred Huschka <[log in to unmask]>

Fri, 18 Sep 1998 05:55:53 -0500

96 lines

Re: Plasma Machine Manufacturer

Lenny Kurup <[log in to unmask]>

Fri, 18 Sep 1998 14:07:45 -0400

67 lines

New Thread

Plugged Via Holes: BGA

Plugged Via Holes: BGA

Carl Ray <[log in to unmask]>

Fri, 18 Sep 1998 21:16:46 -0500

37 lines

New Thread

PM Software Program Replacement

PM Software Program Replacement

Phil Dam <[log in to unmask]>

Thu, 24 Sep 1998 10:35:23 EDT

23 lines

New Thread

PPM Defect Rate

Re: PPM Defect Rate

[log in to unmask]

Wed, 9 Sep 1998 11:38:36 EDT

39 lines

New Thread

Pricing Survey

Pricing Survey

VaradaRaj.K <[log in to unmask]>

Fri, 11 Sep 1998 15:19:23 +0530

31 lines

New Thread

Printing ink supplier

Printing ink supplier

BPL-PCB, Doddaballapur <[log in to unmask]>

Sat, 19 Sep 1998 23:55:48 +0500

29 lines

New Thread

Process Audit Points [ HELP ]

Process Audit Points [ HELP ]

ryu <[log in to unmask]>

Sat, 12 Sep 1998 08:51:51 -0700

34 lines

Re: Process Audit Points [ HELP ]

No Name Available <[log in to unmask]>

Sat, 12 Sep 1998 19:19:55 EDT

36 lines

Re: Process Audit Points [ HELP ]

Paul Stolar <[log in to unmask]>

Mon, 14 Sep 1998 08:22:22 -0600

66 lines

Re: Process Audit Points [ HELP ]

Iain Braddock <[log in to unmask]>

Mon, 14 Sep 1998 09:07:51 +0100

74 lines

New Thread

Pros/Cons Moving Probe Bare Board Testers

Pros/Cons Moving Probe Bare Board Testers

Fred Paul <[log in to unmask]>

Thu, 24 Sep 1998 10:19:34 -0700

76 lines

New Thread

PTFE Etching Processes

PTFE Etching Processes

tgyee <[log in to unmask]>

Thu, 24 Sep 1998 18:03:37 PST

37 lines

Re: PTFE Etching Processes

Edwards, Ted A (AZ75) <[log in to unmask]>

Thu, 24 Sep 1998 07:18:00 -0700

63 lines

New Thread

PTFE Etching Processes -Reply

PTFE Etching Processes -Reply

Fred Johnson <[log in to unmask]>

Thu, 24 Sep 1998 16:21:11 +0100

69 lines

Re: PTFE Etching Processes -Reply

Lyle Wallig <[log in to unmask]>

Thu, 24 Sep 1998 17:05:04 EDT

29 lines

New Thread

Pyralux History

Pyralux History

Stephen Ayotte <[log in to unmask]>

Mon, 14 Sep 1998 13:36:41 -0400

31 lines

Pyralux History

Andy Magee <[log in to unmask]>

Tue, 15 Sep 1998 12:04:15 -0400

37 lines

New Thread

Quad4c mark 2 placement using local fids

Quad4c mark 2 placement using local fids

David Simmons <[log in to unmask]>

Mon, 28 Sep 1998 12:29:42 +1200

89 lines

New Thread

Questioning UL950

Questioning UL950

[log in to unmask]

Fri, 18 Sep 1998 17:57:27 -0500

33 lines

Re: Questioning UL950

Douglas Mckean <[log in to unmask]>

Mon, 21 Sep 1998 13:29:18 -0700

37 lines

New Thread

RE : [TN] PCB Material Change

RE : [TN] PCB Material Change

Howard Lin <[log in to unmask]>

Thu, 3 Sep 1998 01:47:49 +0800

76 lines

New Thread

re Warpage @ Assembly

re Warpage @ Assembly

Alderete, Michael <[log in to unmask]>

Thu, 17 Sep 1998 09:12:43 -0700

76 lines

New Thread

Reflow of Nylon 6/6 Connector?

Re: Reflow of Nylon 6/6 Connector?

David Whalley <[log in to unmask]>

Tue, 1 Sep 1998 10:48:36 +0100

48 lines

New Thread

Reliable crystals/oscillators packaging

Reliable crystals/oscillators packaging

Ken Patel <[log in to unmask]>

Thu, 10 Sep 1998 16:33:00 -0700

33 lines

New Thread

Reminder

Reminder

Jim Yohe <[log in to unmask]>

Wed, 9 Sep 1998 21:16:40 -0700

54 lines

New Thread

Replacing Mil-S-13949

Replacing Mil-S-13949

Sheila Smith <[log in to unmask]>

Wed, 30 Sep 1998 14:28:06 -0400

41 lines

Re: Replacing Mil-S-13949

Christopher Jorgensen <[log in to unmask]>

Wed, 30 Sep 1998 14:23:10 -0500

88 lines

New Thread

Reply to Posting Number 23642

Reply to Posting Number 23642

Yinyan Wang <[log in to unmask]>

Thu, 3 Sep 1998 16:55:51 -0400

33 lines

New Thread

Resist Strip

Resist Strip

[log in to unmask]

Fri, 25 Sep 1998 18:53:29 EDT

32 lines

Re: Resist Strip

<Rudy Sedlak> <[log in to unmask]>

Fri, 25 Sep 1998 22:58:36 EDT

51 lines

Re: Resist Strip

Ted Stern <[log in to unmask]>

Mon, 28 Sep 1998 09:24:19 -0700

78 lines

New Thread

Reworking delaminated rigid-flex

Reworking delaminated rigid-flex

Matthew Sanders <[log in to unmask]>

Tue, 8 Sep 1998 17:06:13 -0700

33 lines

Re: Reworking delaminated rigid-flex

Andy Magee <[log in to unmask]>

Wed, 9 Sep 1998 22:05:20 -0400

72 lines

Reworking delaminated rigid-flex

Earl Moon <[log in to unmask]>

Mon, 14 Sep 1998 06:42:17 -0700

41 lines

Re: Reworking delaminated rigid-flex

Andy Magee <[log in to unmask]>

Mon, 14 Sep 1998 11:40:50 -0400

82 lines

Re: Reworking delaminated rigid-flex

Dan Brandler <[log in to unmask]>

Mon, 14 Sep 1998 09:43:09 -0700

31 lines

Reworking delaminated rigid-flex

Earl Moon <[log in to unmask]>

Tue, 15 Sep 1998 05:23:21 -0700

31 lines

New Thread

Re[2]: [TN] ESD labels

Re: Re[2]: [TN] ESD labels

Ian Squires <[log in to unmask]>

Thu, 24 Sep 1998 12:11:01 PDT

44 lines

New Thread

Re[2]: [TN] Fab Solderability Test @ Assembly house

Re: Re[2]: [TN] Fab Solderability Test @ Assembly house

Stephen R. Gregory <[log in to unmask]>

Wed, 23 Sep 1998 11:49:50 EDT

67 lines

New Thread

Re[2]: [TN] g10

Re: Re[2]: [TN] g10

Chris Chapman <[log in to unmask]>

Thu, 17 Sep 1998 16:09:36 -0400

128 lines

New Thread

Re[2]: [TN] IC coating

Re: Re[2]: [TN] IC coating

Ian Squires <[log in to unmask]>

Tue, 8 Sep 1998 16:45:44 PDT

45 lines

Re: Re[2]: [TN] IC coating

Russ Winslow <[log in to unmask]>

Tue, 8 Sep 1998 10:04:30 -0700

136 lines

New Thread

RF Screening cans

Re: RF Screening cans

Noel Cherowbrier <[log in to unmask]>

Tue, 29 Sep 1998 15:35:09 GMT

49 lines

Re: RF Screening cans

Eric Christison <[log in to unmask]>

Tue, 29 Sep 1998 15:53:10 +0100

55 lines

New Thread

Routing conformal coatings

Routing conformal coatings

Graham Naisbitt <[log in to unmask]>

Fri, 11 Sep 1998 16:11:46 +0100

119 lines

Re: Routing conformal coatings

Vaughan, Ralph H <[log in to unmask]>

Mon, 14 Sep 1998 04:24:12 -0700

73 lines

Re: Routing conformal coatings

Collins, Graham <[log in to unmask]>

Mon, 14 Sep 1998 08:57:30 -0300

88 lines

Re: Routing conformal coatings

Fred Shubert <[log in to unmask]>

Mon, 14 Sep 1998 09:19:38 -0400

167 lines

New Thread

SCOPE DRILL OR UNIDRILL

SCOPE DRILL OR UNIDRILL

Modular Components National, Inc. <[log in to unmask]>

Wed, 23 Sep 1998 09:58:16 -0400

36 lines

New Thread

Scoring Issues

Scoring Issues

Steve Kingdon <[log in to unmask]>

Mon, 14 Sep 1998 11:03:32 +1200

60 lines

Re: Scoring Issues

Mark Simmons <[log in to unmask]>

Mon, 14 Sep 1998 05:42:36 -0700

48 lines

New Thread

SCSI BackPlane Design Rules . . .

SCSI BackPlane Design Rules . . .

Graham Heggie <[log in to unmask]>

Mon, 14 Sep 1998 22:12:59 +0100

38 lines

New Thread

Seho Wave Soldering Process Procedures

Seho Wave Soldering Process Procedures

Earl Moon <[log in to unmask]>

Fri, 18 Sep 1998 09:05:57 -0700

32 lines

Re: Seho Wave Soldering Process Procedures

Hamilton, Richard -4454 <[log in to unmask]>

Fri, 18 Sep 1998 09:53:54 -0700

65 lines

Re: Seho Wave Soldering Process Procedures

Stephen R. Gregory <[log in to unmask]>

Fri, 18 Sep 1998 14:34:36 EDT

90 lines

Re: Seho Wave Soldering Process Procedures

Matthew Park <[log in to unmask]>

Fri, 18 Sep 1998 13:02:53 -0700

192 lines

Re: Seho Wave Soldering Process Procedures

[log in to unmask]

Fri, 18 Sep 1998 17:22:26 -0500

54 lines

Re: Seho Wave Soldering Process Procedures

Paul Klasek <[log in to unmask]>

Sat, 19 Sep 1998 09:17:47 +1000

238 lines

Re: Seho Wave Soldering Process Procedures

Justin Braime <[log in to unmask]>

Sat, 19 Sep 1998 11:10:47 +1200

74 lines

Seho Wave Soldering Process Procedures

[log in to unmask]

Sat, 19 Sep 1998 10:40:47 -0500

52 lines

Re: Seho Wave Soldering Process Procedures

Paul Klasek <[log in to unmask]>

Sun, 20 Sep 1998 13:25:45 +1000

119 lines

Re: Seho Wave Soldering Process Procedures

Mcmaster, Michael <[log in to unmask]>

Sun, 20 Sep 1998 17:10:32 -0700

26 lines

Re: Seho Wave Soldering Process Procedures

Matthew Park <[log in to unmask]>

Mon, 21 Sep 1998 09:10:43 PDT

114 lines

New Thread

set technet digest

set technet digest

Robert E. Mesick <[log in to unmask]>

Wed, 2 Sep 1998 05:37:24 +0000

24 lines

New Thread

simulation

simulation

Marc O. Bituagan <[log in to unmask]>

Wed, 2 Sep 1998 17:50:51 +0000

34 lines

New Thread

SM Component Standardization

SM Component Standardization

Hamilton, Richard -4454 <[log in to unmask]>

Mon, 21 Sep 1998 11:47:20 -0700

48 lines

Re: SM Component Standardization

Wolfe, Robert <[log in to unmask]>

Tue, 22 Sep 1998 10:05:46 -0400

91 lines

New Thread

SMD on bottomside

SMD on bottomside

Hamilton, Richard -4454 <[log in to unmask]>

Tue, 1 Sep 1998 13:42:38 -0700

40 lines

Re: SMD on bottomside

Charles Barker <[log in to unmask]>

Tue, 1 Sep 1998 17:23:20 -0500

80 lines

Re: SMD on bottomside

Hamilton, Richard -4454 <[log in to unmask]>

Tue, 1 Sep 1998 15:36:02 -0700

133 lines

Re: SMD on bottomside

Aric parr <[log in to unmask]>

Wed, 2 Sep 1998 07:19:09 EDT

78 lines

New Thread

SMT - SPC fishbone chart

SMT - SPC fishbone chart

No Name Available <[log in to unmask]>

Tue, 15 Sep 1998 23:49:20 EDT

280 lines

Re: SMT - SPC fishbone chart

Rudolph Yu <[log in to unmask]>

Wed, 16 Sep 1998 08:42:45 -0700

40 lines

Re: SMT - SPC fishbone chart

Ruben Irizarry <[log in to unmask]>

Wed, 16 Sep 1998 14:09:25 -0300

25 lines

Re: SMT - SPC fishbone chart

Ian Squires <[log in to unmask]>

Thu, 17 Sep 1998 15:58:56 PDT

306 lines

Re: SMT - SPC fishbone chart

No Name Available <[log in to unmask]>

Thu, 17 Sep 1998 00:27:48 EDT

282 lines

Re: SMT - SPC fishbone chart

Bridget Piper <[log in to unmask]>

Fri, 18 Sep 1998 12:19:46 +0100

49 lines

New Thread

SMT - SPC fishbone chart ?

SMT - SPC fishbone chart ?

Matthew Lamkin <[log in to unmask]>

Sun, 20 Sep 1998 15:16:18 +0100

52 lines

New Thread

SMT Connectors

SMT Connectors

Giese Klaus <[log in to unmask]>

Fri, 25 Sep 1998 17:34:39 +0200

35 lines

Re: SMT Connectors

Jorg Richstein <[log in to unmask]>

Fri, 25 Sep 1998 17:48:08 +0200

36 lines

SMT Connectors

Thibodeau, Chad <[log in to unmask]>

Fri, 25 Sep 1998 08:48:28 -0700

32 lines

Re: SMT Connectors

Scott Holthausen <[log in to unmask]>

Fri, 25 Sep 1998 11:51:20 -0400

59 lines

Re: SMT Connectors

Matthias Mansfeld <[log in to unmask]>

Fri, 25 Sep 1998 17:59:16 +0200

48 lines

Re: SMT Connectors

<Mary Smoot> <[log in to unmask]>

Fri, 25 Sep 1998 13:41:34 -0400

84 lines

SMT Connectors

Jeff Hempton <[log in to unmask]>

Fri, 25 Sep 1998 11:20:33 -0500

97 lines

New Thread

SMT gull wing solder joint force test?

Re: SMT gull wing solder joint force test?

Werner Engelmaier <[log in to unmask]>

Tue, 1 Sep 1998 11:06:40 EDT

51 lines

New Thread

Soft Solder

Soft Solder

ADC <[log in to unmask]>

Fri, 11 Sep 1998 09:39:07 -0400

29 lines

Re: Soft Solder

Stephen R. Gregory <[log in to unmask]>

Fri, 11 Sep 1998 16:15:55 EDT

61 lines

Re: Soft Solder

Werner Engelmaier <[log in to unmask]>

Fri, 11 Sep 1998 16:36:40 EDT

38 lines

Re: Soft Solder

Matthew Park <[log in to unmask]>

Fri, 11 Sep 1998 14:12:49 PDT

88 lines

Re: Soft Solder

<Jason M. Smith> <[log in to unmask]>

Mon, 14 Sep 1998 08:23:50 -0400

31 lines

New Thread

Software upgrade question

Software upgrade question

O'connor,Patrick <[log in to unmask]>

Wed, 23 Sep 1998 08:11:04 -0400

42 lines

Re: Software upgrade question

David Ratte <[log in to unmask]>

Thu, 24 Sep 1998 09:47:11 -0400

91 lines

New Thread

Solder "webbing" to Solder Mask After Wavesolder??

Solder "webbing" to Solder Mask After Wavesolder??

Mike Manwell <[log in to unmask]>

Thu, 17 Sep 1998 09:26:50 -0700

28 lines

Re: Solder "webbing" to Solder Mask After Wavesolder??

Leslie O. Connally <[log in to unmask]>

Thu, 17 Sep 1998 13:23:49 -0500

56 lines

New Thread

Solder ball attachment to BGA

Solder ball attachment to BGA

shigeoka <[log in to unmask]>

Tue, 29 Sep 1998 13:56:08 +0900

35 lines

Re: Solder ball attachment to BGA

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 29 Sep 1998 08:00:00 -0400

49 lines

New Thread

Solder Balling

Solder Balling

Ruben Irizarry <[log in to unmask]>

Tue, 1 Sep 1998 13:42:02 -0300

25 lines

New Thread

Solder Balling Spec.

Solder Balling Spec.

Ryan Jennens <[log in to unmask]>

Thu, 3 Sep 1998 11:36:53 -0400

30 lines

Re: Solder Balling Spec.

PELCHAT_JM <[log in to unmask]>

Thu, 3 Sep 1998 13:22:33 -0400

54 lines

New Thread

Solder Balls

Solder Balls

Denise Nguyen <[log in to unmask]>

Thu, 24 Sep 1998 15:49:27 -0700

30 lines

New Thread

Solder Bumping

Solder Bumping

Craig McGlinchy <[log in to unmask]>

Wed, 2 Sep 1998 08:55:09 +1200

26 lines

Re: Solder Bumping

Russ Winslow <[log in to unmask]>

Tue, 1 Sep 1998 15:54:14 -0700

54 lines

New Thread

Solder crack

Solder crack

afng <[log in to unmask]>

Tue, 18 Aug 1998 03:11:28 +0800

39 lines

Re: Solder crack

Ryan Jennens <[log in to unmask]>

Thu, 3 Sep 1998 11:40:54 -0400

60 lines

Re: Solder crack

Kwong Chin <[log in to unmask]>

Thu, 3 Sep 1998 09:30:53 -0400

108 lines

Re: Solder crack

Stephen R. Mikell <[log in to unmask]>

Thu, 3 Sep 1998 11:18:58 -0500

38 lines

Re: Solder crack

Werner Engelmaier <[log in to unmask]>

Thu, 3 Sep 1998 11:54:48 EDT

47 lines

New Thread

Solder Fracture during Drop Test

Solder Fracture during Drop Test

Ken Patel <[log in to unmask]>

Mon, 14 Sep 1998 15:21:11 -0700

34 lines

Re: Solder Fracture during Drop Test

Werner Engelmaier <[log in to unmask]>

Mon, 14 Sep 1998 21:01:04 EDT

41 lines

New Thread

solder mask (LPI) flaking

solder mask (LPI) flaking

Jeff Hempton <[log in to unmask]>

Wed, 30 Sep 1998 11:40:32 -0500

37 lines

Re: solder mask (LPI) flaking

Fred Shubert <[log in to unmask]>

Wed, 30 Sep 1998 14:47:12 -0400

86 lines

Re: Solder Mask (LPI) Flaking

Jay Solderberg <[log in to unmask]>

Wed, 30 Sep 1998 14:32:44 -0600

129 lines

New Thread

solder mask (LPI) flaking -Reply

solder mask (LPI) flaking -Reply

bob metcalf <[log in to unmask]>

Wed, 30 Sep 1998 16:16:54 -0700

71 lines

New Thread

Solder Paste

Solder Paste

Stephen Ayotte <[log in to unmask]>

Wed, 23 Sep 1998 09:11:17 -0400

32 lines

Re: Solder Paste

McMonagle, Michael R. <[log in to unmask]>

Wed, 23 Sep 1998 12:55:21 -0500

81 lines

New Thread

Solder-ball

Re: Solder-ball

Jeff Hempton <[log in to unmask]>

Wed, 9 Sep 1998 15:18:52 -0500

150 lines

New Thread

solderability testing

solderability testing

Ed Cosper <[log in to unmask]>

Thu, 10 Sep 1998 16:03:18 -0500

43 lines

Re: solderability testing

David D Hillman <[log in to unmask]>

Thu, 10 Sep 1998 19:32:47 -0500

115 lines

Re: solderability testing

Vaughan, Ralph H <[log in to unmask]>

Fri, 11 Sep 1998 04:37:25 -0700

76 lines

Re: solderability testing

Scott M. Severson <[log in to unmask]>

Fri, 11 Sep 1998 08:11:00 -0600

67 lines

Re: solderability testing

Gabriela Bogdan <[log in to unmask]>

Fri, 11 Sep 1998 16:25:49 +0200

72 lines

New Thread

Solderable Diode & IGBT

Solderable Diode & IGBT

Sihua Wen <[log in to unmask]>

Fri, 11 Sep 1998 10:20:25 -0400

36 lines

New Thread

Soldering BGA's with Nitrogen

Soldering BGA's with Nitrogen

Simonson, Tom (MN51) <[log in to unmask]>

Tue, 22 Sep 1998 10:10:43 -0500

32 lines

Re: Soldering BGA's with Nitrogen

[log in to unmask]

Tue, 22 Sep 1998 15:29:41 EDT

37 lines

New Thread

soldering patents

soldering patents

Ed Holton <[log in to unmask]>

Wed, 9 Sep 1998 08:32:35 -0400

92 lines

Re: soldering patents

Ryan Jennens <[log in to unmask]>

Fri, 11 Sep 1998 12:44:02 -0400

118 lines

Re: soldering patents

Stephen R. Gregory <[log in to unmask]>

Fri, 11 Sep 1998 12:20:55 EDT

38 lines

Re: soldering patents

Ryan Chase <[log in to unmask]>

Fri, 11 Sep 1998 12:13:51 MDT

156 lines

Re: Soldering Patents

Jack Crawford <[log in to unmask]>

Mon, 14 Sep 1998 20:14:33 -0500

175 lines

New Thread

Soldering to Gold

Re: Soldering to Gold

[log in to unmask]

Tue, 8 Sep 1998 19:47:14 EDT

43 lines

Re: Soldering to Gold

Lenny Kurup <[log in to unmask]>

Wed, 9 Sep 1998 09:19:46 -0400

35 lines

Re: Soldering to Gold

[log in to unmask]

Wed, 9 Sep 1998 15:37:47 EDT

47 lines

Re: Soldering to Gold

Phillip E. Hinton <[log in to unmask]>

Thu, 10 Sep 1998 01:16:12 EDT

32 lines

Re: Soldering to Gold

[log in to unmask]

Thu, 10 Sep 1998 10:13:17 EDT

34 lines

New Thread

Soldering to Gold Plated Pads

Soldering to Gold Plated Pads

Jan Satterfield <[log in to unmask]>

Tue, 8 Sep 1998 11:03:32 -0600

39 lines

Re: Soldering to Gold Plated Pads

David D Hillman <[log in to unmask]>

Wed, 9 Sep 1998 09:46:34 -0500

101 lines

Re: Soldering to Gold Plated Pads

Phillip E. Hinton <[log in to unmask]>

Wed, 9 Sep 1998 15:02:07 EDT

31 lines

Re: Soldering to Gold Plated Pads

David Gonnerman <[log in to unmask]>

Thu, 10 Sep 1998 12:03:29 -0500

77 lines

Re: Soldering to Gold Plated Pads

Werner Engelmaier <[log in to unmask]>

Wed, 9 Sep 1998 22:07:23 EDT

54 lines

Re: Soldering to Gold Plated Pads

Paul Klasek <[log in to unmask]>

Fri, 11 Sep 1998 16:12:17 +1000

129 lines

New Thread

Solderless Interconnects

Solderless Interconnects

[log in to unmask]

Mon, 21 Sep 1998 16:19:37 PST

27 lines

New Thread

Soldermask Artwork Marking

Soldermask Artwork Marking

John Lennox <[log in to unmask]>

Tue, 1 Sep 1998 17:05:37 -0400

47 lines

Re: Soldermask Artwork Marking

Nelson, John <[log in to unmask]>

Wed, 2 Sep 1998 08:04:36 -0400

73 lines

Re: Soldermask Artwork Marking

Glynn Shaw <[log in to unmask]>

Tue, 1 Sep 1998 15:25:18 -0700

70 lines

New Thread

Soldermask Artwork Marking -Reply

Soldermask Artwork Marking -Reply

bob metcalf <[log in to unmask]>

Wed, 2 Sep 1998 10:47:59 -0700

96 lines

New Thread

SRT Summit 1000 Profiles?

SRT Summit 1000 Profiles?

Rick Thompson <[log in to unmask]>

Thu, 10 Sep 1998 09:45:51 -0700

40 lines

New Thread

Stain Mark Accept or Reject?

Stain Mark Accept or Reject?

Rudolph Yu <[log in to unmask]>

Tue, 1 Sep 1998 15:33:39 -0700

26 lines

New Thread

Standard for smt polarised component orientatio

Re: Standard for smt polarised component orientatio

Matthias Mansfeld <[log in to unmask]>

Mon, 21 Sep 1998 20:51:32 +0200

42 lines

New Thread

Standard for smt polarised component orientation

Standard for smt polarised component orientation

Paul Arklay <[log in to unmask]>

Mon, 21 Sep 1998 15:04:45 +1000

41 lines

Standard for smt polarised component orientation

Jeff Hempton <[log in to unmask]>

Mon, 21 Sep 1998 08:11:33 -0500

67 lines

New Thread

Stencil manufacturers

Stencil manufacturers

Thomas C Han <[log in to unmask]>

Tue, 15 Sep 1998 09:00:25 -0700

33 lines

Re: Stencil manufacturers

Angie Marques <[log in to unmask]>

Tue, 15 Sep 1998 13:00:59 -0700

70 lines

Re: Stencil manufacturers

Stephen R. Gregory <[log in to unmask]>

Tue, 15 Sep 1998 16:26:18 EDT

69 lines

New Thread

Storage Temp

Storage Temp

Darrel Therriault <[log in to unmask]>

Tue, 29 Sep 1998 11:31:30 -0700

37 lines

Re: Storage Temp

Jorg Richstein <[log in to unmask]>

Tue, 29 Sep 1998 22:13:29 +0200

32 lines

New Thread

Stress in SMT Components

Stress in SMT Components

Mike Lang <[log in to unmask]>

Fri, 11 Sep 1998 13:56:32 -0400

38 lines

Re: Stress in SMT Components

Michaud, James (STP) <[log in to unmask]>

Fri, 11 Sep 1998 15:40:19 -0500

63 lines

Stress in SMT Components

Earl Moon <[log in to unmask]>

Mon, 14 Sep 1998 06:27:48 -0700

36 lines

New Thread

Subject: Flying Probe Bare Board Testers

Subject: Flying Probe Bare Board Testers

Alderete, Michael <[log in to unmask]>

Wed, 23 Sep 1998 06:08:37 -0700

79 lines

New Thread

Surface Finish for Flex SMT

Surface Finish for Flex SMT

Kent S. Asmus <[log in to unmask]>

Fri, 11 Sep 1998 22:16:35 -0700

144 lines

New Thread

surface mounting header using gold plating vs tin plating

surface mounting header using gold plating vs tin plating

Ken Fong <[log in to unmask]>

Wed, 23 Sep 1998 12:15:19 EST

92 lines

New Thread

Tape bonders

Tape bonders

Roger Massey-G14195 <[log in to unmask]>

Mon, 14 Sep 1998 16:02:10 +0000

28 lines

New Thread

TECHNET Confirmation

Re: TECHNET Confirmation

Werner Engelmaier <[log in to unmask]>

Sun, 6 Sep 1998 13:26:41 EDT

28 lines

Re: TECHNET Confirmation

No Name Available <[log in to unmask]>

Mon, 7 Sep 1998 15:45:43 EDT

31 lines

Re: TECHNET Confirmation

Hamilton, Richard -4454 <[log in to unmask]>

Tue, 8 Sep 1998 08:32:04 -0700

68 lines

Re: TECHNET Confirmation

ETS <[log in to unmask]>

Tue, 8 Sep 1998 11:07:39 -0700

60 lines

Re: TECHNET Confirmation

Thomas E. Waznis <[log in to unmask]>

Tue, 8 Sep 1998 15:42:56 -0800

51 lines

New Thread

TechNet Digest - 24 Sep 1998 - Special issue

Re: TechNet Digest - 24 Sep 1998 - Special issue

Jay Solderberg <[log in to unmask]>

Fri, 25 Sep 1998 07:00:21 -0600

74 lines

New Thread

TechNet: confirmation required (79A054)

Re: TechNet: confirmation required (79A054)

Ron Hollandsworth <[log in to unmask]>

Mon, 14 Sep 1998 08:06:25 -0500

82 lines

Re: TechNet: confirmation required (79A054)

Werner Engelmaier <[log in to unmask]>

Mon, 14 Sep 1998 21:01:06 EDT

23 lines

New Thread

test and packaging

test and packaging

<Jason M. Smith> <[log in to unmask]>

Fri, 25 Sep 1998 11:07:18 -0400

30 lines

Re: test and packaging

Paul Klasek <[log in to unmask]>

Sun, 27 Sep 1998 16:26:25 +1000

99 lines

New Thread

Test Lab for Corrosive Gas Testing

Test Lab for Corrosive Gas Testing

J. Adrian Riley <[log in to unmask]>

Wed, 23 Sep 1998 09:43:12 -0400

26 lines

Re: Test Lab for Corrosive Gas Testing

Paul Terranova <[log in to unmask]>

Wed, 23 Sep 1998 10:07:24 -0400

122 lines

Re: Test Lab for Corrosive Gas Testing

Mike Barmuta <[log in to unmask]>

Wed, 23 Sep 1998 07:46:47 -0700

63 lines

Re: Test Lab for Corrosive Gas Testing

David Gonnerman <[log in to unmask]>

Wed, 23 Sep 1998 16:13:32 -0500

118 lines

Re: Test Lab for Corrosive Gas Testing

Alderete, Michael <[log in to unmask]>

Wed, 23 Sep 1998 14:17:07 -0700

92 lines

New Thread

Test Methods For Conformal Coatings

Test Methods For Conformal Coatings

Carl Levoguer <[log in to unmask]>

Wed, 2 Sep 1998 17:00:11 +0100

47 lines

New Thread

Thermal Adhesive under SMDs

Thermal Adhesive under SMDs

Kelly M. Schriver <[log in to unmask]>

Tue, 15 Sep 1998 15:04:35 -0500

45 lines

New Thread

Thermal profiling units/software

Thermal profiling units/software

Charles Barker <[log in to unmask]>

Thu, 10 Sep 1998 16:12:38 -0500

27 lines

New Thread

Tin stripper waste treatment

Tin stripper waste treatment

N Radhakrishna <[log in to unmask]>

Mon, 31 Aug 1998 17:28:27 +0500

39 lines

New Thread

TNMeeting

TNMeeting

[log in to unmask]

Tue, 29 Sep 1998 16:49:21 EDT

26 lines

Re: TNMeeting

Jack Crawford <[log in to unmask]>

Tue, 29 Sep 1998 18:03:01 -0500

46 lines

New Thread

Trace to pad spacing design rules

Trace to pad spacing design rules

Matthew Sanders <[log in to unmask]>

Wed, 9 Sep 1998 19:10:44 -0700

40 lines

Re: Trace to pad spacing design rules

mark ross <[log in to unmask]>

Thu, 10 Sep 1998 09:08:47 -0400

67 lines

New Thread

Trouble with downloading SMT Desk Ref. Manual Samples

Trouble with downloading SMT Desk Ref. Manual Samples

Steve Donaldson <[log in to unmask]>

Thu, 3 Sep 1998 09:25:08 -0600

75 lines

New Thread

Underfill materials

Underfill materials

Xingsheng Liu <[log in to unmask]>

Wed, 9 Sep 1998 17:39:27 -0700

36 lines

Re: Underfill materials

Fred Shubert <[log in to unmask]>

Fri, 11 Sep 1998 08:43:16 -0400

139 lines

Re: Underfill materials

Fred Shubert <[log in to unmask]>

Fri, 11 Sep 1998 17:16:55 -0400

141 lines

New Thread

UNIVERSAL 4785 (SANYO) CHIP-SHOOTER ERROR CODE

UNIVERSAL 4785 (SANYO) CHIP-SHOOTER ERROR CODE

Lolmaugh, Scott (AZ15) <[log in to unmask]>

Mon, 14 Sep 1998 15:03:42 -0400

89 lines

Re: UNIVERSAL 4785 (SANYO) CHIP-SHOOTER ERROR CODE

ETS <[log in to unmask]>

Mon, 14 Sep 1998 14:42:00 -0700

59 lines

New Thread

UNSUBSCRIBE

UNSUBSCRIBE

Thomas E Noll <[log in to unmask]>

Fri, 11 Sep 1998 11:57:57 -0400

23 lines

New Thread

USB Port Specs

USB Port Specs

David Palance <[log in to unmask]>

Wed, 30 Sep 1998 08:12:11 -0400

33 lines

Re: USB Port Specs

Cyrus Ringle <[log in to unmask]>

Wed, 30 Sep 1998 13:26:24 -0700

90 lines

New Thread

Used PCB cleanimg machine wanted

Used PCB cleanimg machine wanted

M. Betournay <[log in to unmask]>

Sat, 5 Sep 1998 08:53:11 -0400

33 lines

New Thread

Vacuum Cabinet

Vacuum Cabinet

F J <[log in to unmask]>

Mon, 28 Sep 1998 17:27:15 CDT

30 lines

New Thread

Valor Enterprise 3000

Valor Enterprise 3000

Michael Forrester <[log in to unmask]>

Tue, 8 Sep 1998 16:20:36 -0400

31 lines

Re: Valor Enterprise 3000

Weiner Mickey <[log in to unmask]>

Wed, 9 Sep 1998 16:16:38 +0200

68 lines

New Thread

Via fill

Via fill

Frank K. Frimpong <[log in to unmask]>

Tue, 8 Sep 1998 16:39:26 +0000

22 lines

via fill

William Anderson <[log in to unmask]>

Fri, 25 Sep 1998 08:27:51 -0500

39 lines

New Thread

Vias in chip components pads?

Vias in chip components pads?

Scott Holthausen <[log in to unmask]>

Wed, 30 Sep 1998 15:32:09 -0400

64 lines

Re: Vias in chip components pads?

Kelly M. Schriver <[log in to unmask]>

Wed, 30 Sep 1998 15:02:36 -0500

30 lines

New Thread

Wanted: scrap assembled PCB's

Wanted: scrap assembled PCB's

ETS <[log in to unmask]>

Wed, 16 Sep 1998 16:08:01 -0700

38 lines

New Thread

Warpage @ Assembly

Warpage @ Assembly

Robert Jordan <[log in to unmask]>

Wed, 16 Sep 1998 17:02:37 -0700

49 lines

Re: Warpage @ Assembly

Andrew J. Scholand <[log in to unmask]>

Thu, 24 Sep 1998 22:24:59 -0400

66 lines

New Thread

Water soluble temporary solder mask

Water soluble temporary solder mask

Karalekas, Charles <[log in to unmask]>

Fri, 11 Sep 1998 09:56:14 -0400

40 lines

Re: Water soluble temporary solder mask

Jim Jablonsky <[log in to unmask]>

Fri, 11 Sep 1998 19:11:41 -0400

67 lines

Re: Water soluble temporary solder mask

Graham Naisbitt <[log in to unmask]>

Sat, 12 Sep 1998 23:19:46 +0100

93 lines

Re: Water soluble temporary solder mask

[log in to unmask]

Mon, 14 Sep 1998 09:59:00 -0500

30 lines

Re: Water soluble temporary solder mask

David Fish <[log in to unmask]>

Mon, 14 Sep 1998 20:54:59 -0400

47 lines

New Thread

Wave solder VS Reflow on bottom side

Wave solder VS Reflow on bottom side

Thomas C Han <[log in to unmask]>

Tue, 22 Sep 1998 18:09:10 -0700

51 lines

Wave solder VS Reflow on bottom side

Jeff Hempton <[log in to unmask]>

Wed, 23 Sep 1998 12:18:14 -0500

91 lines

Re: Wave solder VS Reflow on bottom side

Stephen R. Gregory <[log in to unmask]>

Wed, 23 Sep 1998 17:58:03 EDT

93 lines

Re: Wave solder VS Reflow on bottom side

Andrew G Kettlewell <[log in to unmask]>

Thu, 24 Sep 1998 07:43:08 -0500

89 lines

New Thread

What should a good C.O.C cover?

What should a good C.O.C cover?

Tasos Toutountzian <[log in to unmask]>

Wed, 30 Sep 1998 20:36:44 +0300

107 lines

What should a good C.O.C cover?

Tasos Toutountzian <[log in to unmask]>

Wed, 30 Sep 1998 20:34:28 +0300

105 lines

New Thread

What to compare for HASL v/s OSP

What to compare for HASL v/s OSP

Ken Patel <[log in to unmask]>

Wed, 2 Sep 1998 10:39:55 -0700

33 lines

Re: What to compare for HASL v/s OSP

Vaughan, Ralph H <[log in to unmask]>

Thu, 3 Sep 1998 06:15:03 -0700

65 lines

New Thread

Why is a respond to sender showing up on the open forum.

Why is a respond to sender showing up on the open forum.

Ed Cosper <[log in to unmask]>

Fri, 11 Sep 1998 08:34:06 -0500

31 lines

Re: Why is a respond to sender showing up on the open forum.

Jack Crawford <[log in to unmask]>

Fri, 11 Sep 1998 11:11:24 -0500

55 lines

New Thread

Wire Bonding

Wire Bonding

Roger Massey-G14195 <[log in to unmask]>

Fri, 11 Sep 1998 09:05:51 +0000

25 lines

New Thread

Word Game RE Clinton

Word Game RE Clinton

Fred Paul <[log in to unmask]>

Fri, 11 Sep 1998 16:01:58 -0700

22 lines

New Thread

X-ray for open joints on BGA's ?

X-ray for open joints on BGA's ?

d. terstegge <[log in to unmask]>

Mon, 14 Sep 1998 09:24:32 +0200

46 lines

Re: X-ray for open joints on BGA's ?

Gregory S Bartlett <[log in to unmask]>

Mon, 14 Sep 1998 11:30:26 -0400

69 lines

Re: X-ray for open joints on BGA's ?

Ed Holton <[log in to unmask]>

Tue, 15 Sep 1998 10:10:23 -0400

98 lines

Re: X-ray for open joints on BGA's ?

Chan, Marcelo <[log in to unmask]>

Tue, 15 Sep 1998 10:25:27 -0400

142 lines

Re: X-ray for open joints on BGA's ?

Stephen R. Gregory <[log in to unmask]>

Tue, 15 Sep 1998 10:48:04 EDT

45 lines

Re: X-ray for open joints on BGA's ?

Gregory S Bartlett <[log in to unmask]>

Tue, 15 Sep 1998 11:47:06 -0400

97 lines

Re: X-ray for open joints on BGA's ?

Werner Engelmaier <[log in to unmask]>

Tue, 15 Sep 1998 12:42:28 EDT

41 lines

Re: X-ray for open joints on BGA's ?

Stephen R. Gregory <[log in to unmask]>

Tue, 15 Sep 1998 18:50:43 EDT

55 lines

Re: X-ray for open joints on BGA's ?

Chan, Marcelo <[log in to unmask]>

Wed, 16 Sep 1998 07:55:15 -0400

83 lines

Re: X-ray for open joints on BGA's ?

Michaud, James (STP) <[log in to unmask]>

Wed, 16 Sep 1998 08:30:40 -0500

142 lines

Re: X-ray for open joints on BGA's ?

Werner Engelmaier <[log in to unmask]>

Wed, 16 Sep 1998 23:01:11 EDT

39 lines

Re: X-ray for open joints on BGA's ?

Werner Engelmaier <[log in to unmask]>

Wed, 16 Sep 1998 23:01:14 EDT

70 lines

Re: X-ray for open joints on BGA's ?

Tan Boon Kiat <[log in to unmask]>

Sun, 20 Sep 1998 00:04:27 +0800

33 lines

New Thread

X-ray for open joints on BGA's ? [BGA rel issues?] <IPC T echNet>

Re: X-ray for open joints on BGA's ? [BGA rel issues?] <IPC T echNet>

Alderete, Michael <[log in to unmask]>

Tue, 22 Sep 1998 11:03:49 -0700

101 lines

New Thread

X-ray for open joints on BGA's ? [CBGA columns]

Re: X-ray for open joints on BGA's ? [CBGA columns]

Alderete, Michael <[log in to unmask]>

Tue, 15 Sep 1998 10:08:56 -0700

56 lines

New Thread

[DC] Pacific Northwest IPC DC Newsletter

Re: [DC] Pacific Northwest IPC DC Newsletter

Jim Yohe <[log in to unmask]>

Mon, 28 Sep 1998 17:04:23 -0700

65 lines

New Thread

[Fab] Fracturing Summary

[Fab] Fracturing Summary

George Franck <[log in to unmask]>

Wed, 2 Sep 1998 09:26:09 -0400

74 lines

New Thread

[TN] Assy.: µBGA Footprints and design guidlines...

[TN] Assy.: µBGA Footprints and design guidlines...

Stephen R. Gregory <[log in to unmask]>

Wed, 9 Sep 1998 22:02:39 EDT

69 lines

New Thread

[TN] ESD labels

Re[2]: [TN] ESD labels

PELCHAT_JM <[log in to unmask]>

Thu, 24 Sep 1998 07:01:13 -0400

180 lines

Re[2]: [TN] ESD labels

PELCHAT_JM <[log in to unmask]>

Thu, 24 Sep 1998 12:11:15 -0400

73 lines

New Thread

[TN] Fab Solderability Test @ Assembly house

Re[2]: [TN] Fab Solderability Test @ Assembly house

PELCHAT_JM <[log in to unmask]>

Wed, 23 Sep 1998 07:06:09 -0400

111 lines

New Thread

[TN] g10

Re[2]: [TN] g10

Paul Stolar <[log in to unmask]>

Thu, 17 Sep 1998 15:09:02 -0600

88 lines

New Thread

[TN] Help! Plugging vias

Re[2]: [TN] Help! Plugging vias

Mike Mikucki <[log in to unmask]>

Thu, 24 Sep 1998 12:01:09 -0400

132 lines

New Thread

[TN] IC coating

Re[2]: [TN] IC coating

PELCHAT_JM <[log in to unmask]>

Tue, 8 Sep 1998 07:05:57 -0400

93 lines

New Thread

[TN] Re[2]: [TN] Fab Solderability Test @ Assembly ho

Re[2]: [TN] Re[2]: [TN] Fab Solderability Test @ Assembly ho

PELCHAT_JM <[log in to unmask]>

Wed, 23 Sep 1998 14:59:41 -0400

98 lines

New Thread

[TN] Seho Wave Soldering Process Procedures

Re[2]: [TN] Seho Wave Soldering Process Procedures

fgolisan <[log in to unmask]>

Fri, 18 Sep 1998 14:19:41 PST

232 lines

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