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July 1998


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Table of Contents:

회신: [TN] Au/Ni/Cu PROBLEM (1 message)
회신: [TN] OMEGA-PLY (1 message)
"Standard" fabrication allowance (1 message)
(TN) Polyimide SeeThru Stencil (1 message)
: Assy : Solder on Gold finger (3 messages)
: Component Solderability (2 messages)
: Dropout IC. (1 message)
<No subject> (3 messages)
<None> (1 message)
a plea from a researcher (1 message)
A word about Spam. (1 message)
Acceptability criteria for innerlayer interconnect (2 messages)
Acid and oil recycling (2 messages)
Acid SnPb Conditioner w/vapr phase Reflow (2 messages)
Acid SnPb Conditioner w/vapr phase Reflow -Reply (2 messages)
Acid stoper in developing (5 messages)
adara press (1 message)
Admin Notice: Commenting on Standards (1 message)
ADMIN REPLY-PLEASE DO NOT OPEN THIS LINK: [TN] hdd (1 message)
Al vs. Au wire (1 message)
Alternate Solder Paste Supplier (1 message)
ALUMINUM WEDGE BONDING?? (1 message)
An aqueous cleaning question (4 messages)
Analysis (4 messages)
Analysis labs (2 messages)
Anyone knows of an agressive resist developin equipment (2 messages)
AOI of DST-foil (4 messages)
Apology for trip plans posting (1 message)
ass'y: Torque on FR-4 (1 message)
assembly (1 message)
Assembly process for plastic parts (2 messages)
Assembly unusual part? (2 messages)
Assembly/Surface Finishes (1 message)
ASSY: BGA sanity check (5 messages)
Assy: cause-effect diagram (20 messages)
Assy: cause-effect diagram -Reply (1 message)
ASSY: Duroid Material (3 messages)
assy: flip chip (5 messages)
ASSY: Gold Finger Configurations (2 messages)
ASSY: In-Line Inspection and SPC (1 message)
ASSY: RTV Repair to PWAs (2 messages)
ASSY: Thermally/Electrically Conductive Epoxy (4 messages)
ASSY:In-Line Inspec (1 message)
ASSY:Reliability, SMT (2 messages)
Attempted rework of Oxidized HASL boards (1 message)
Attn. Users of DEK ProFlow system (4 messages)
Attn: Change of screen name (1 message)
Au/Ni/Cu PROBLEM (7 messages)
Automated COF Assembly (1 message)
Automotive Standard Thermal Application Spec. (2 messages)
Available Plating Options (1 message)
BAAN system (1 message)
Base Materials (3 messages)
Base Materials - more.... (1 message)
batch reflow ovens (3 messages)
BGA - X-ray (1 message)
BGA Ball Attachment Process (9 messages)
BGA reballing equipment (2 messages)
BGA soldering on Immersion Nickel Gold PCB (2 messages)
Black Epoxy (4 messages)
Black Oxide Filtration (4 messages)
Black Oxide Filtration -Reply (1 message)
Bond strength pins (2 messages)
Boron Electroless Nickel (1 message)
Bull**** (2 messages)
Bull****:: ADMIN RESPONSE (2 messages)
Buried Capacitance (2 messages)
Buried Capacitance? (2 messages)
C.O.P.S. software from Camalot (Speedline). (7 messages)
C.O.P.S. Software problems (2 messages)
Call for Papers - IPC Expo '99 (1 message)
CAM Software for Pick & Place (2 messages)
Carbon Ink (1 message)
Carbon Ink -Reply (1 message)
Carbon ink resource (3 messages)
Carbon ink resource -Reply (1 message)
Carbon Ink Suppliers. (1 message)
Cause & Effect Diagram (1 message)
Cause and effect diagram (1 message)
cause effect diagram, (1 message)
cause-effect diagram - some gentle advice (1 message)
CEM-1 (4 messages)
chemically resistant pump (2 messages)
Coax Cable Assemblies (1 message)
Column Grid Arrays (4 messages)
Component tape pulling force. (1 message)
Compositech laminates (1 message)
Conductive Epoxy adhesive (4 messages)
Conductive Epoxy adhesive -Reply (1 message)
Conductive Expoxy Adhesive (1 message)
Conductor Routing (1 message)
Conductor Routing Question (3 messages)
Confirmation of Receipt (2 messages)
Conformal coating (3 messages)
Conformal Coating Adhesion over low res. Fluxes (3 messages)
Contact Systems CS-400C (3 messages)
Contamination Testing for Water Soluble Flux Residue (1 message)
Contract Test Labs for SERA White Tin Tests (Florida CirTech (1 message)
Contract Test Labs for SERA White Tin Tests (Florida CirTech Omikron) (1 message)
Controlled Impedance Testing (3 messages)
Copper Stains on suface of Au Fingers (2 messages)
CP642 vs CM88-CM or Fuji vs Panasonic (4 messages)
CP642 vs CM88-CM or Fuji vs Panasonic- Part II (3 messages)
Cracked capacitors and bulbuous joints (2 messages)
CSP underfill, (2 messages)
CSR 2600 (1 message)
CSR2600 (1 message)
CTE of PCB Laminates (3 messages)
CTE of PCB Laminates -Reply (2 messages)
CTE of PCB material [aramid info] (1 message)
CTE of PCB material. (3 messages)
Cu stains on Au fingers (1 message)
DEK ProFlow (1 message)
delamination (4 messages)
Delamination Problems (4 messages)
Design & DFM Software (5 messages)
DEWETTING (3 messages)
Diazo adhesive transfer film (2 messages)
Diazo adhesive transfer film -Reply (1 message)
Diode Polarity (2 messages)
Diversion, flame if you will! (1 message)
Dropped boards (2 messages)
Dump Criteria for Solder Strip (5 messages)
Dump Criteria for Solder Strip (fwd) (1 message)
Duofoil Replacement (2 messages)
EIA sts. (2 messages)
ELECTRIC TESTER FOR BGA (1 message)
Electrical Testing Techniques (1 message)
Electro-Migration (1 message)
Electroless Copper Plating on Teflon and BT (4 messages)
Electroless Nickel (3 messages)
Electronic meters for copper thickness (3 messages)
Electronic/ESD Packaging Guidelines (3 messages)
Electropolishing Laser-Cut Stencils (5 messages)
ENVIORNMENTAL DATA IN PACKAGING (2 messages)
Environmental tests for press-fit components (1 message)
EP&P article, Au diffusion in near eutectic solder. (1 message)
EPCmail-3 (1 message)
equipment selection model (2 messages)
ESD Faraday shielding (2 messages)
ESD grounding (3 messages)
Etch Factor (3 messages)
Express Packaging Services and John Lau (1 message)
Fab : Solder mask thickness (4 messages)
Fab : Solder mask thicknessA Reply (1 message)
Fab: Bow & Twist (2 messages)
FAB: FR-4 Thermal Limits? (1 message)
Fab: Permanganate (5 messages)
FAB: Plugged, Filled &/or Tented Vias (2 messages)
Farewell TechNet - Technical Writer Available (2 messages)
Fidutial Requirements (2 messages)
Final/Sort Inspection (1 message)
Flow patterns on multi-layer boards (1 message)
Fluid Head (1 message)
Flux on Goldfinger (5 messages)
FR-4 Emittance (4 messages)
FR-5 vs Warp & Twist (3 messages)
FR4 and EP3 (1 message)
FR4 insulator thickness (1 message)
Fw: Travel arrangements to Austin, TX Sept 23 - 26, 1998 (1 message)
Fw: Travel arrangements to Dallas Sept 15, 1998 (5 messages)
FW: [TN] C.O.P.S. Software problems (1 message)
FW: [TN] Electropolishing Laser-Cut Stencils (1 message)
FW: [TN] Mil-S-13949 (1 message)
FW: [TN] MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS (1 message)
Fwd: reflow oven (10 messages)
Gen: Finstrate Finestrate (1 message)
GEN: IPC Standard for Stencil Apertures (2 messages)
Get The Cash You Need Now!!! (1 message)
Glenbrook x-ray?? (12 messages)
Glue Print (1 message)
Gold Cleaning/Etching (3 messages)
Gold Coated Solder (1 message)
Gold Finish (2 messages)
Gold thickness - Edge (2 messages)
Good Gas Mask?? (1 message)
hdd (1 message)
Help with Ionic Contamination testing (1 message)
HF BGA Testing (2 messages)
Homeplate-shaped Pads (3 messages)
Hot Bar Soldering?? (8 messages)
HTC Contact (2 messages)
I need some CEM3 .059 1/1 and 1/0 laminate (1 message)
Ideas for PCB Supplier Survey Content (2 messages)
immersion Au (2 messages)
Immersion gold for wire bonding (2 messages)
Immersion gold for wire bonding, a reply (1 message)
Impedance (5 messages)
Inf On Facit Paper Tape Puncher (3 messages)
inquire (1 message)
Intermetallic Phase: BGA soldering on Immersion Nickel Gold PCB (2 messages)
International Approvals (1 message)
intrusive reflow and all (1 message)
IPC HOLE TO LEAD RATIOS (1 message)
IPC Standards (1 message)
IPC std procedure for PCB storage condition. (4 messages)
IPC-1710 and 1720 (1 message)
IPC-B-36 Test Coupons (2 messages)
IPC-D-325A Question (4 messages)
Is Ni/Au Discoloration comments from manufacturer valid? (1 message)
Is there a masking product that is non-conductive and can be left on after conformal coating. (1 message)
J-STD-001B (1 message)
KEMET capacitor 2225 size --not suitable for wave solder ing??? (4 messages)
KEMET capacitor 2225 size --not suitable for wave soldering??? (1 message)
Lab for Ion chromatography (IC) analysis (3 messages)
Lab to do MILSTD883 testing (2 messages)
Lab to do MILSTD883 testing -Reply (1 message)
Land/Hole fabrication allowance (1 message)
lead free solder (4 messages)
Lead Solderability (4 messages)
Lead Solderability II (3 messages)
Lead Trimming Question ? (2 messages)
Lead Trimming Question ? -Reply (1 message)
Lg component mounting advice (1 message)
Listing of PCB CAD Companies (4 messages)
Look for contact information of Express Packaging Systems and Joh n Lau (1 message)
Looking for A Pcad Designer or Bureau... (1 message)
Looking for Barnaby Tack (1 message)
Looking for BGA X ray inspection criteria (1 message)
LOOKING FOR MANUFACTURE CAN WORK GETEK 0.0035 (1 message)
Magazines and Journals (4 messages)
mailing list (2 messages)
Manganin wire (3 messages)
Manual Insertion Cycle Time (3 messages)
Manual Insertion Time (2 messages)
Max operating temp - PBGA (1 message)
Micro Via Processing (1 message)
Midwest Circuit Association (1 message)
Mil Std P28809 - Ionic Residue PCB (2 messages)
Mil-S-13949 (2 messages)
MIL-S-13949 Cancellation Notice (1 message)
MIL-STD-130 (5 messages)
Military Spec Crossovers (1 message)
Military Specifications (1 message)
Mini Micro Stencil Phone # (2 messages)
Mini Micro Stencil Phone # -Reply (1 message)
Modeling moisture exposure in laminate (1 message)
MOUNTING HOLE (2 messages)
MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS (3 messages)
MVIIF vs CP642 or Fuji vs Panasert - Part II (2 messages)
N-Proply-Bromide (Ensolv) compatability with Uralane 575 3 and 5750 (1 message)
N-Proply-Bromide (Ensolv) compatability with Uralane 5753 and 5750 (1 message)
N-Ray Inspection (2 messages)
Need CAD format descriptions (4 messages)
need Reliability laboratory (3 messages)
Need Supplier (1 message)
Nelco web site (2 messages)
Ni plated vias (1 message)
Nickel Melting Point (7 messages)
Nickel Melting Point -Reply (2 messages)
Nickel Plated Via's (1 message)
No Clean Flux (3 messages)
no clean fluxes (3 messages)
No-clean and board incoming cleanliness (2 messages)
North Texas Chapter ~ IPC Designers Council Meeting July 9th @ 6:30PM (1 message)
Not read: Lead Solderability II (2 messages)
Not read: need info: automated counting chip capacitors / resisto rs (1 message)
Obsolete FR2 1.60mm 1/1 - 4500kg (1 message)
OMEGA-PLY (2 messages)
OSP thickness (1 message)
Oven belt speeds (3 messages)
Oxidized HASL boards (3 messages)
Part Numbering System (1 message)
PCB and Solder Paste Test Equipment (5 messages)
PCB CAD Software Co's (1 message)
PCB Coatings Available (1 message)
PCB Fabrication Machine (1 message)
PCB Finish Options (1 message)
PCB Land Pattern for 1825 Ceramic Capactor (1 message)
PCB Maximum Heat Excursions (2 messages)
PCB papers for Am. Electroplater and Surface Finishers-June 21-24 (1 message)
PCB Sales Opportunity (1 message)
PCB Thickness (3 messages)
people advertising in technet! (4 messages)
people advertising in technet! -Reply (2 messages)
Phosphorous content of electroless Ni (2 messages)
Plant lay-out software (3 messages)
Plating (6 messages)
Plating -Reply (2 messages)
Plating Thickness (5 messages)
Polyimide M/L with pure nickel inner layers (2 messages)
Polyimide See Thru Stencils for Printing Solder Paste (9 messages)
Polyimide SeeThru Stencil (2 messages)
Processes (1 message)
Provide me your current BGA Spec on void (6 messages)
PTH Hole to Lead Ratio (1 message)
PWBA Handling (4 messages)
Qfp's in wave (4 messages)
RE : Sequential lamination for blind via (1 message)
RE : [TN] Immersion gold for wire bonding, a reply (1 message)
Re2000A (1 message)
Read: Lead Solderability II (8 messages)
ReDewetting (2 messages)
Reduced Black Oxide - Acid Resistance (2 messages)
Register for Service (1 message)
registration test method (1 message)
Reliability monitor program, Statistically sound? (2 messages)
Reliability, thermal and electrical modeling for BGAs (1 message)
REMOVE (1 message)
research analyst (1 message)
Resin Regeneration (3 messages)
Re[2]: [TN] Assy: cause-effect diagram (3 messages)
Re[2]: [TN] Au/Ni/Cu PROBLEM (4 messages)
Re[2]: [TN] Conformal coating (1 message)
RF Ground Thermal Considerations (1 message)
Rigid Bd. Corner Welds (1 message)
Routing Techniques (1 message)
S-N curves for solder (2 messages)
sampling plan (2 messages)
Scoring (13 messages)
see items (1 message)
Separating email for designers, fabricators and assembly (1 message)
Sequential lamination for blind via (2 messages)
SERA and White Tin (1 message)
SERA and White Tin, reply (3 messages)
SERA Testers (3 messages)
SiGE vrs GaAs (1 message)
Silicone grease around soldered joints! (5 messages)
SMB, SOD123 Footprint (1 message)
SMD pads on hybrids (3 messages)
Sn/Pb/Ag Phase Diagram (3 messages)
Solder ball ussues with NC paste (3 messages)
Solder ball ussues with NC paste -Reply (4 messages)
Solder ball ussues with NC paste -Reply -Reply (2 messages)
Solder Balls (1 message)
solder balls/ solder fines (1 message)
solder fines/solder ball (1 message)
solder joint of low profile smd (1 message)
solder mask between pads part2 (1 message)
Solder on Goldfinger (2 messages)
Solder Shear results (2 messages)
solder short (4 messages)
Solder Short - Steve Gregory (2 messages)
Solder strip dump criteria (1 message)
Solder thickness needed after HASL (6 messages)
Solder-ball (5 messages)
Solderability of µBGA (1 message)
Solderability test - period of validation (3 messages)
Soldering microswitch legs (2 messages)
Soldermask web at fine pitch components leads (2 messages)
solderpaste screen (4 messages)
Solid Solder Deposits (1 message)
source for EMI/RFI shields (6 messages)
Sources for SAM and Fein Focus (6 messages)
Spanish Translation of IPC-A-610B (1 message)
SPC (8 messages)
SPC IMPLEMETATION (1 message)
Special Technologies (1 message)
Specific Listing For CAD PCB Software (1 message)
Spray Fluxer (5 messages)
spray fluxing (7 messages)
standard mounting of chip components (1 message)
Standard Panel Sizes (2 messages)
Stiffer FR4 material? (4 messages)
Stiffer FR4 material? -Reply (1 message)
Subject: Automotive Standard Thermal Application Spec (2 messages)
subscribe (5 messages)
subscription (2 messages)
Super flat PCB (9 messages)
Supplier Survey (1 message)
Supplier Survey Format Final Edition (2 messages)
Suppliers for White ID material for PCB (2 messages)
Surface to hole ratio of copper plating (4 messages)
SV: [TN] Washing of small PCB (1 message)
tact time for Fuji CP6(PnP) (1 message)
Tamura (1 message)
tantalum caps (1 message)
TechNet Digest - 14 Jul 1998 - Special issue (1 message)
TechNet Digest - 19 Jul 1998 to 20 Jul 1998 - Special issue (1 message)
TechNet E-Mail Forum (2 messages)
Technologies for blind HW (4 messages)
teletype (2 messages)
test stamps (1 message)
Thermal Cycling Chambers (3 messages)
Thermal cycling to determine board reliability (5 messages)
Thermal relief and RF design (1 message)
Thermal relief and RF design -Reply (1 message)
Thermallly conductive PWB materials (5 messages)
Thermally conductive PWB materials (2 messages)
Thick Laminate Wanted (1 message)
Thinner for Alpha 615/25 flux (2 messages)
Through Hole Technology (THT) Solder Joint Reliability (2 messages)
Tin Whiskers (1 message)
tinning temperature (1 message)
TN:Need Tinning service for SMT (1 message)
Tolerances for routed slots in pcb (1 message)
Too much mail from TechNET! - Here is a solution... (2 messages)
Torque on FR-4 (1 message)
Torque specifications (1 message)
Training (2 messages)
Traveler/Route sheet software (3 messages)
uBGA assy (4 messages)
Underfill (2 messages)
Underfill epoxy for flip chip (2 messages)
Underfill epoxy for flip chip -Reply (1 message)
Unregistered SMT components (8 messages)
Unsubscribe (4 messages)
updated IPC (2 messages)
Vertical Fill on Through-hole Motherboard Connectors (1 message)
Voltage derating of Aluminum Electrolytic Caps (1 message)
Warpage (5 messages)
Wave Solder Pot Temp-63/37 (2 messages)
Wave Soldering Mixed Technology CCAs (3 messages)
wetting balances (4 messages)
Where to start? (2 messages)
White ID Materail (3 messages)
White Tin Immersion (11 messages)
Windows 95 Backup (3 messages)
Wire Bonding and Immersion White Tin (1 message)
Wirebonding on Solder (1 message)
X_ray Inspection Systems (1 message)
[TN] Acid SnPb Conditioner w/vapr phase Reflow (2 messages)
[TN] Assy: cause-effect diagram (2 messages)
[TN] Au/Ni/Cu PROBLEM (1 message)
[TN] Buried Capacitance? (1 message)
[TN] Conformal coating (1 message)
[TN] Flux on Goldfinger (1 message)
[TN] Glenbrook x-ray?? (1 message)
[TN] SMD pads on hybrids (1 message)
[TN] Soldermask web at fine pitch components leads (1 message)
[TN] Spray Fluxer (1 message)
[TN] Thermallly conductive PWB materials (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

회신: [TN] Au/Ni/Cu PROBLEM

회신: [TN] Au/Ni/Cu PROBLEM

Jin-ho Lee

Sat, 4 Jul 1998 07:37:22 +0900

30 lines

New Thread

회신: [TN] OMEGA-PLY

회신: [TN] OMEGA-PLY

Jin-ho Lee

Wed, 15 Jul 1998 08:45:40 +0900

31 lines

New Thread

Re:

Thomas Then

Tue, 14 Jul 1998 15:21:11 +1000

27 lines

New Thread

"Standard" fabrication allowance

"Standard" fabrication allowance

Mike Spencer

Wed, 29 Jul 1998 16:09:03 -0700

48 lines

New Thread

(TN) Polyimide SeeThru Stencil

Re: (TN) Polyimide SeeThru Stencil

Marc O. Bituagan

Tue, 21 Jul 1998 18:08:12 +0000

35 lines

New Thread

: Assy : Solder on Gold finger

Re: : Assy : Solder on Gold finger

Noppadol S.

Sat, 25 Jul 1998 16:34:33 +0700

92 lines

Re: : Assy : Solder on Gold finger

Ryan Jennens

Wed, 15 Jul 1998 14:16:13 -0400

34 lines

: Assy : Solder on Gold finger

Poh Kong Hui

Thu, 16 Jul 1998 01:41:48 +0800

30 lines

New Thread

: Component Solderability

Re: : Component Solderability

Ryan Jennens

Wed, 22 Jul 1998 12:01:30 -0400

29 lines

: Component Solderability

Kasprzak, Bill (esd) US

Wed, 22 Jul 1998 07:57:00 PDT

39 lines

New Thread

: Dropout IC.

: Dropout IC.

Poh Kong Hui

Thu, 2 Jul 1998 22:58:45 +0800

30 lines

New Thread

<No subject>

<No subject>

=?Iso-8859-1?Q?Curt_=D6st?=

Mon, 20 Jul 1998 11:38:00 +0200

28 lines

<No subject>

_***_ (Bulll*sEye)

Fri, 17 Jul 1998 11:35:59 -0700

144 lines

<No subject>

Paul Wilson

Mon, 6 Jul 1998 05:53:22 -0400

22 lines

New Thread

<None>

<None>

James A. Zeman

Tue, 21 Jul 1998 15:06:00 -0500

66 lines

New Thread

a plea from a researcher

a plea from a researcher

Alex Stennett

Wed, 8 Jul 1998 09:57:12 +0000

65 lines

New Thread

A word about Spam.

A word about Spam.

Hugo Scaramuzza

Wed, 29 Jul 1998 13:07:21 -0500

62 lines

New Thread

Acceptability criteria for innerlayer interconnect

Re: Acceptability criteria for innerlayer interconnect

<>

Sun, 19 Jul 1998 15:37:17 EDT

28 lines

Acceptability criteria for innerlayer interconnect

John Sater

Sun, 19 Jul 1998 03:52:16 -0700

37 lines

New Thread

Acid and oil recycling

Re: Acid and oil recycling

Leslie O. Connally

Wed, 22 Jul 1998 13:03:22 -0700

86 lines

Acid and oil recycling

Christopher Rhodes

Wed, 22 Jul 1998 11:06:30 -0500

50 lines

New Thread

Acid SnPb Conditioner w/vapr phase Reflow

Re: Acid SnPb Conditioner w/vapr phase Reflow

<Rudy Sedlak>

Mon, 27 Jul 1998 21:53:09 EDT

37 lines

Acid SnPb Conditioner w/vapr phase Reflow

Zachery D Boettcher

Mon, 27 Jul 1998 18:54:56 +0100

28 lines

New Thread

Acid SnPb Conditioner w/vapr phase Reflow -Reply

Re: Acid SnPb Conditioner w/vapr phase Reflow -Reply

Ted Stern

Tue, 28 Jul 1998 13:53:58 -0700

68 lines

Re: Acid SnPb Conditioner w/vapr phase Reflow -Reply

Zachery D Boettcher

Tue, 28 Jul 1998 12:16:15 +0100

28 lines

New Thread

Acid stoper in developing

Re: Acid stoper in developing

WHATEVER

Thu, 23 Jul 1998 16:57:11 -0500

89 lines

Re: Acid stoper in developing

Smith Russell MSM LAPO US

Thu, 23 Jul 1998 05:29:00 +0200

66 lines

Re: Acid stoper in developing

Jacob Mozel

Wed, 22 Jul 1998 23:43:56 +0300

59 lines

Re: Acid stoper in developing

Nelson, John

Wed, 22 Jul 1998 08:04:39 -0400

43 lines

Acid stoper in developing

WHATEVER

Tue, 21 Jul 1998 22:31:19 -0500

32 lines

New Thread

adara press

adara press

james

Sat, 4 Jul 1998 10:20:27 +0800

32 lines

New Thread

Admin Notice: Commenting on Standards

Admin Notice: Commenting on Standards

Jack Crawford

Thu, 2 Jul 1998 11:38:30 -0500

197 lines

New Thread

ADMIN REPLY-PLEASE DO NOT OPEN THIS LINK: [TN] hdd

ADMIN REPLY-PLEASE DO NOT OPEN THIS LINK: [TN] hdd

Jack Crawford

Mon, 6 Jul 1998 20:25:59 -0500

33 lines

New Thread

Al vs. Au wire

Al vs. Au wire

Edwin Maximo

Fri, 17 Jul 1998 17:29:58 +0000

36 lines

New Thread

Alternate Solder Paste Supplier

Alternate Solder Paste Supplier

Hogue, Pat (AZ76)

Wed, 8 Jul 1998 19:57:24 -0400

25 lines

New Thread

ALUMINUM WEDGE BONDING??

ALUMINUM WEDGE BONDING??

<>

Wed, 15 Jul 1998 14:29:27 -0400

42 lines

New Thread

An aqueous cleaning question

Re: An aqueous cleaning question

Paul Wilson

Tue, 21 Jul 1998 06:19:35 -0400

127 lines

Re: An aqueous cleaning question

Andy Magee

Mon, 20 Jul 1998 22:36:26 -0400

67 lines

Re: An aqueous cleaning question

<>

Mon, 20 Jul 1998 11:28:05 -0500

45 lines

An aqueous cleaning question

Bill Page

Mon, 20 Jul 1998 10:49:07 -0400

37 lines

New Thread

Analysis

Re: Analysis

<Rudy Sedlak>

Mon, 20 Jul 1998 20:08:58 EDT

33 lines

Re: Analysis

Vaughan, Ralph H

Mon, 20 Jul 1998 11:45:30 -0700

104 lines

Re: Analysis

Tamara Bloomer

Mon, 20 Jul 1998 13:14:45 -0500

98 lines

Analysis

Louis, Edwin

Mon, 20 Jul 1998 01:17:00 -0400

67 lines

New Thread

Analysis labs

Re: Analysis labs

Jack Crawford

Mon, 13 Jul 1998 09:23:41 -0500

39 lines

Analysis labs

Gina Hernefjord

Sun, 12 Jul 1998 22:41:08 +0200

22 lines

New Thread

Anyone knows of an agressive resist developin equipment

Re: Anyone knows of an agressive resist developin equipment

Fulabhai Patel

Sun, 5 Jul 1998 09:10:07 -0700

71 lines

Anyone knows of an agressive resist developin equipment

John Sater

Sat, 4 Jul 1998 23:38:53 -0700

45 lines

New Thread

AOI of DST-foil

Re: AOI of DST-foil

Ascot

Mon, 20 Jul 1998 14:01:01 +0000

30 lines

Re: AOI of DST-foil

Phil Dam

Mon, 20 Jul 1998 13:09:11 EDT

32 lines

Re: AOI of DST-foil

Dave Kleinman

Mon, 20 Jul 1998 09:26:59 -0700

76 lines

AOI of DST-foil

Jan Thuesen

Mon, 20 Jul 1998 14:39:43 +0200

40 lines

New Thread

Apology for trip plans posting

Apology for trip plans posting

Steve Collins

Thu, 30 Jul 1998 14:45:37 -0600

32 lines

New Thread

ass'y: Torque on FR-4

Re: ass'y: Torque on FR-4

Jerry Cupples

Wed, 1 Jul 1998 10:48:07 -0500

89 lines

New Thread

assembly

assembly

Vertefeuille, Russ (AZ77)

Tue, 28 Jul 1998 15:36:49 -0500

27 lines

New Thread

Assembly process for plastic parts

Re: Assembly process for plastic parts

Russ Winslow

Fri, 24 Jul 1998 10:56:00 -0700

82 lines

Assembly process for plastic parts

Stuart Korringa

Fri, 24 Jul 1998 08:21:50 -0400

40 lines

New Thread

Assembly unusual part?

Re: Assembly unusual part?

sahmad

Fri, 17 Jul 1998 10:26:46 -0600

76 lines

Assembly unusual part?

<>

Wed, 15 Jul 1998 14:32:20 EDT

44 lines

New Thread

Assembly/Surface Finishes

Assembly/Surface Finishes

David D Hillman

Wed, 8 Jul 1998 16:35:40 -0500

35 lines

New Thread

ASSY: BGA sanity check

Re: ASSY: BGA sanity check

Hurst, Joe

Mon, 13 Jul 1998 07:58:35 -0400

205 lines

Re: ASSY: BGA sanity check

Jean-Paul Clech

Thu, 9 Jul 1998 16:35:57 EDT

44 lines

Re: ASSY: BGA sanity check

sahmad

Wed, 8 Jul 1998 14:29:10 -0600

170 lines

Re: ASSY: BGA sanity check

Fulton Feng

Wed, 1 Jul 1998 19:23:37 -0400

123 lines

Re: ASSY: BGA sanity check

Maguire, James F

Wed, 1 Jul 1998 08:31:22 -0700

101 lines

New Thread

Assy: cause-effect diagram

Re: Assy: cause-effect diagram

<>

Sun, 12 Jul 1998 12:23:29 EDT

23 lines

Re: Assy: cause-effect diagram

Bobby R. Mangona

Thu, 9 Jul 1998 09:20:31 +0000

31 lines

Re: Assy: cause-effect diagram

Kelvin Ang

Fri, 10 Jul 1998 09:02:58 +0800

66 lines

Re: Assy: cause-effect diagram

Anil K. Singh

Fri, 10 Jul 1998 05:57:43 +0000

105 lines

Re: Assy: cause-effect diagram

Stammely, Tim

Thu, 9 Jul 1998 12:49:16 -0400

122 lines

Re: Assy: cause-effect diagram

Lamond, Doug

Thu, 9 Jul 1998 08:46:02 -0500

95 lines

Re: Assy: cause-effect diagram

Frank K. Frimpong

Thu, 9 Jul 1998 14:46:36 +0000

82 lines

Re: Assy: cause-effect diagram

BPL Ltd.

Thu, 9 Jul 1998 19:13:54 +0530

67 lines

Re: Assy: cause-effect diagram

Gus Morvillo

Thu, 9 Jul 1998 09:19:30 -0400

28 lines

Re: Assy: cause-effect diagram

Lon Weffers

Thu, 9 Jul 1998 08:16:29 +0200

69 lines

Re: Assy: cause-effect diagram

Nasir Hanif

Wed, 8 Jul 1998 14:23:09 -0500

27 lines

Re: Assy: cause-effect diagram

Eric Zanin

Wed, 8 Jul 1998 12:50:17 +0000

25 lines

Re: Assy: cause-effect diagram

<>

Wed, 8 Jul 1998 13:39:39 -0500

103 lines

Re: Assy: cause-effect diagram

Angie Marques

Wed, 8 Jul 1998 11:28:01 -0400

30 lines

Re: Assy: cause-effect diagram

Joe Wackerman

Wed, 8 Jul 1998 11:29:29 -0700

74 lines

Re: Assy: cause-effect diagram

Devlin, Dan

Wed, 8 Jul 1998 14:11:50 -0400

70 lines

Re: Assy: cause-effect diagram

Jack Bryant

Wed, 8 Jul 1998 13:35:17 -0400

109 lines

Re: Assy: cause-effect diagram

Hamilton, Richard -4454

Wed, 8 Jul 1998 10:12:28 -0700

72 lines

Re: Assy: cause-effect diagram

Kimmey, Frank

Wed, 8 Jul 1998 09:27:23 -0700

79 lines

Assy: cause-effect diagram

Jerry Cupples

Wed, 8 Jul 1998 11:19:09 -0500

41 lines

New Thread

Assy: cause-effect diagram -Reply

Re: Assy: cause-effect diagram -Reply

Ron Hayashi

Thu, 9 Jul 1998 09:47:15 -0700

23 lines

New Thread

ASSY: Duroid Material

Re: ASSY: Duroid Material

Ron Desilets

Fri, 24 Jul 1998 14:25:59 -0700

84 lines

Re: ASSY: Duroid Material

Eric Zanin

Wed, 15 Jul 1998 13:25:23 +0000

25 lines

ASSY: Duroid Material

Jan Satterfield

Tue, 14 Jul 1998 11:24:19 -0600

29 lines

New Thread

assy: flip chip

Re: assy: flip chip

David Gonnerman

Thu, 30 Jul 1998 08:24:31 -0500

110 lines

Re: assy: flip chip

David D Hillman

Thu, 30 Jul 1998 07:57:15 -0500

72 lines

Re: assy: flip chip

Alderete, Michael

Wed, 29 Jul 1998 17:12:27 -0700

70 lines

Re: assy: flip chip

Bill Davis

Wed, 29 Jul 1998 13:34:14 -0700

71 lines

assy: flip chip

Jim Marsico 516-595-5879

Wed, 29 Jul 1998 15:38:00 -0400

31 lines

New Thread

ASSY: Gold Finger Configurations

Re: ASSY: Gold Finger Configurations

Mauricio Castro

Tue, 28 Jul 1998 08:36:09 -0500

74 lines

ASSY: Gold Finger Configurations

Stephen R. Gregory

Tue, 28 Jul 1998 09:07:42 EDT

41 lines

New Thread

ASSY: In-Line Inspection and SPC

ASSY: In-Line Inspection and SPC

Juha Uski

Wed, 15 Jul 1998 16:28:38 +0000

37 lines

New Thread

ASSY: RTV Repair to PWAs

Re: ASSY: RTV Repair to PWAs

Stephen R. Gregory

Mon, 6 Jul 1998 16:13:32 EDT

45 lines

ASSY: RTV Repair to PWAs

<>

Mon, 6 Jul 1998 14:15:19 -0600

30 lines

New Thread

ASSY: Thermally/Electrically Conductive Epoxy

Re: ASSY: Thermally/Electrically Conductive Epoxy

by Dr. Eden Chen XianSong

Tue, 7 Jul 1998 09:03:12 +0800

96 lines

Re: ASSY: Thermally/Electrically Conductive Epoxy

Jan Satterfield

Mon, 6 Jul 1998 12:58:01 -0600

90 lines

Re: ASSY: Thermally/Electrically Conductive Epoxy

Chan, Marcelo

Mon, 6 Jul 1998 11:55:31 -0400

62 lines

ASSY: Thermally/Electrically Conductive Epoxy

Jan Satterfield

Mon, 6 Jul 1998 09:30:29 -0600

28 lines

New Thread

ASSY:In-Line Inspec

Re: ASSY:In-Line Inspec

Marc O. Bituagan

Fri, 17 Jul 1998 13:03:39 +0000

28 lines

New Thread

ASSY:Reliability, SMT

Re: ASSY:Reliability, SMT

Aric parr

Mon, 27 Jul 1998 07:40:12 EDT

66 lines

ASSY:Reliability, SMT

James Patten

Wed, 22 Jul 1998 07:55:32 -0700

35 lines

New Thread

Attempted rework of Oxidized HASL boards

Re: Attempted rework of Oxidized HASL boards

John Waite

Wed, 8 Jul 1998 08:28:18 -0400

66 lines

New Thread

Attn. Users of DEK ProFlow system

Re: Attn. Users of DEK ProFlow system

Stephen R. Gregory

Wed, 8 Jul 1998 19:19:41 EDT

51 lines

Re: Attn. Users of DEK ProFlow system

Kathy Palumbo

Wed, 8 Jul 1998 15:14:34 -0700

119 lines

Re: Attn. Users of DEK ProFlow system

Frank, Jr. Komitsky

Wed, 8 Jul 1998 18:10:59 -0400

68 lines

Attn. Users of DEK ProFlow system

Bruce Robertson

Thu, 9 Jul 1998 09:22:02 +1200

40 lines

New Thread

Attn: Change of screen name

Re: Attn: Change of screen name

Kurt E. Brehm

Sat, 25 Jul 1998 14:48:26 EDT

24 lines

New Thread

Au/Ni/Cu PROBLEM

Re: Au/Ni/Cu PROBLEM

Noppadol S.

Tue, 7 Jul 1998 08:48:45 +0700

152 lines

Re: Au/Ni/Cu PROBLEM

Paul Gould

Mon, 6 Jul 1998 20:13:40 +0100

71 lines

Re: Au/Ni/Cu PROBLEM

<Rudy Sedlak>

Sun, 5 Jul 1998 10:23:12 EDT

50 lines

Re: Au/Ni/Cu PROBLEM

Paul Gould

Sun, 5 Jul 1998 08:34:27 +0100

82 lines

Re: Au/Ni/Cu PROBLEM

Frank, Jr. Komitsky

Sat, 4 Jul 1998 10:38:01 -0400

84 lines

Re: Au/Ni/Cu PROBLEM

Charles Barker

Fri, 3 Jul 1998 15:09:07 -0500

82 lines

Au/Ni/Cu PROBLEM

Hooper Doug

Fri, 3 Jul 1998 10:20:00 -0500

46 lines

New Thread

Automated COF Assembly

Automated COF Assembly

Jay Bitanga

Wed, 22 Jul 1998 08:41:12 +0000

75 lines

New Thread

Automotive Standard Thermal Application Spec.

Re: Automotive Standard Thermal Application Spec.

Werner Engelmaier

Tue, 28 Jul 1998 21:54:49 EDT

35 lines

Automotive Standard Thermal Application Spec.

Kelly Kovalovsky

Tue, 28 Jul 1998 10:18:02 -0400

26 lines

New Thread

Available Plating Options

Available Plating Options

Hugh Scott Miller

Sun, 19 Jul 1998 16:48:10 -0400

42 lines

New Thread

BAAN system

BAAN system

Marc O. Bituagan

Sat, 11 Jul 1998 16:20:16 +0000

30 lines

New Thread

Base Materials

Re: Base Materials

Kwong Chin

Mon, 20 Jul 1998 09:12:45 -0400

98 lines

Re: Base Materials

David Heywood

Mon, 20 Jul 1998 10:25:28 +0100

83 lines

Base Materials

Hugh Scott Miller

Sun, 19 Jul 1998 16:47:32 -0400

40 lines

New Thread

Base Materials - more....

Base Materials - more....

JB

Mon, 20 Jul 1998 09:08:40 +0800

69 lines

New Thread

batch reflow ovens

Re: batch reflow ovens

Matthias Mansfeld

Mon, 13 Jul 1998 21:02:37 +0200

49 lines

Re: batch reflow ovens

Eric Zanin

Mon, 13 Jul 1998 10:19:11 +0000

25 lines

batch reflow ovens

Brett Goldstein

Mon, 13 Jul 1998 08:38:44 +0000

32 lines

New Thread

BGA - X-ray

BGA - X-ray

David Lehmann

Thu, 30 Jul 1998 14:14:09 -0700

46 lines

New Thread

BGA Ball Attachment Process

Re: BGA Ball Attachment Process

<>

Tue, 21 Jul 1998 13:56:40 PST

62 lines

Re: BGA Ball Attachment Process

sahmad

Mon, 20 Jul 1998 09:41:08 -0600

61 lines

Re: BGA Ball Attachment Process

<>

Mon, 20 Jul 1998 09:43:18 -0500

37 lines

Re: BGA Ball Attachment Process

Parvez M.S. Patel

Sat, 18 Jul 1998 12:37:01 -0400

68 lines

Re: BGA Ball Attachment Process

Angie Marques

Fri, 17 Jul 1998 13:11:53 -0400

33 lines

Re: BGA Ball Attachment Process

McMonagle, Michael R.

Fri, 17 Jul 1998 13:56:38 -0500

65 lines

Re: BGA Ball Attachment Process

sahmad

Fri, 17 Jul 1998 12:54:44 -0600

87 lines

Re: BGA Ball Attachment Process

Devlin, Dan

Fri, 17 Jul 1998 14:53:22 -0400

58 lines

BGA Ball Attachment Process

Kathy Palumbo

Fri, 17 Jul 1998 11:22:31 -0700

33 lines

New Thread

BGA reballing equipment

Re: BGA reballing equipment

Russ Winslow

Mon, 27 Jul 1998 10:48:57 -0700

55 lines

BGA reballing equipment

XO Tronic Ltd.

Mon, 27 Jul 1998 16:30:09 +0530

30 lines

New Thread

BGA soldering on Immersion Nickel Gold PCB

Re: BGA soldering on Immersion Nickel Gold PCB

Leslie O. Connally

Fri, 31 Jul 1998 10:52:17 -0700

69 lines

BGA soldering on Immersion Nickel Gold PCB

Earl Moon

Fri, 31 Jul 1998 08:19:22 -0700

39 lines

New Thread

Black Epoxy

Re: Black Epoxy

Russ Winslow

Fri, 24 Jul 1998 11:01:22 -0700

65 lines

Re: Black Epoxy

McMonagle, Michael R.

Thu, 23 Jul 1998 07:42:33 -0500

63 lines

Black Epoxy

Edwin Maximo

Thu, 23 Jul 1998 11:38:27 +0000

36 lines

Black Epoxy

Edwin Maximo

Wed, 8 Jul 1998 08:47:06 +0000

33 lines

New Thread

Black Oxide Filtration

Re: Black Oxide Filtration

Eltek Ltd. - Process Engineering

Tue, 21 Jul 1998 15:07:33 +0300

96 lines

Re: Black Oxide Filtration

Joe Felts

Tue, 21 Jul 1998 00:22:02 -0700

68 lines

Re: Black Oxide Filtration

Mike Bailey

Mon, 20 Jul 1998 11:18:19 -0400

27 lines

Black Oxide Filtration

Chris Rucinski

Mon, 20 Jul 1998 11:06:53 -0700

35 lines

New Thread

Black Oxide Filtration -Reply

Re: Black Oxide Filtration -Reply

Fred Johnson

Tue, 21 Jul 1998 17:28:31 +0100

49 lines

New Thread

Bond strength pins

Re: Bond strength pins

<>

Mon, 13 Jul 1998 17:21:11 EDT

34 lines

Bond strength pins

<David Albin>

Mon, 13 Jul 1998 16:52:57 +0000

28 lines

New Thread

Boron Electroless Nickel

Boron Electroless Nickel

Hogue, Pat (AZ76)

Fri, 31 Jul 1998 09:55:18 -0700

41 lines

New Thread

Bull****

Re: Bull****

Mauro Nardini

Fri, 17 Jul 1998 10:54:39 -0700

196 lines

Re: Bull****

McMonagle, Michael R.

Fri, 17 Jul 1998 12:23:16 -0500

171 lines

New Thread

Bull****:: ADMIN RESPONSE

Re: Bull****:: ADMIN RESPONSE

Dick Desrosiers

Fri, 17 Jul 1998 14:48:13 EDT

21 lines

Re: Bull****:: ADMIN RESPONSE

Hugo Scaramuzza

Fri, 17 Jul 1998 12:55:07 -0500

34 lines

New Thread

Buried Capacitance

Re: Buried Capacitance

Edwards, Ted A (AZ75)

Fri, 31 Jul 1998 11:21:58 -0500

64 lines

Buried Capacitance

Earl Moon

Fri, 31 Jul 1998 04:50:10 -0700

36 lines

New Thread

Buried Capacitance?

Re: Buried Capacitance?

Kuczynski Michael

Tue, 21 Jul 1998 07:05:56 -0400

48 lines

Re: Buried Capacitance?

Howard Lin

Tue, 21 Jul 1998 11:12:55 +0800

31 lines

New Thread

C.O.P.S. software from Camalot (Speedline).

Re: C.O.P.S. software from Camalot (Speedline).

Paul Klasek

Wed, 29 Jul 1998 08:18:04 +1000

127 lines

Re: C.O.P.S. software from Camalot (Speedline).

Nasir Hanif

Mon, 27 Jul 1998 12:26:50 -0500

40 lines

Re: C.O.P.S. software from Camalot (Speedline).

Nasir Hanif

Mon, 27 Jul 1998 12:36:53 -0500

36 lines

Re: C.O.P.S. software from Camalot (Speedline).

Paul Klasek

Mon, 27 Jul 1998 10:01:04 +1000

121 lines

Re: C.O.P.S. software from Camalot (Speedline).

Paul Stolar

Fri, 24 Jul 1998 10:05:47 -0600

74 lines

Re: C.O.P.S. software from Camalot (Speedline).

Jared Lang

Fri, 24 Jul 1998 07:36:48 -0700

89 lines

C.O.P.S. software from Camalot (Speedline).

Arroyave, John (FL51)

Fri, 24 Jul 1998 10:09:24 -0400

37 lines

New Thread

C.O.P.S. Software problems

Re: C.O.P.S. Software problems

Paul Klasek

Wed, 29 Jul 1998 09:25:31 +1000

151 lines

C.O.P.S. Software problems

Arroyave, John (FL51)

Tue, 28 Jul 1998 10:06:30 -0400

73 lines

New Thread

Call for Papers - IPC Expo '99

Call for Papers - IPC Expo '99

Lisa Williams

Fri, 10 Jul 1998 10:15:17 -0500

172 lines

New Thread

CAM Software for Pick & Place

Re: CAM Software for Pick & Place

Jerry Cupples

Thu, 30 Jul 1998 13:03:21 -0500

51 lines

CAM Software for Pick & Place

Jared Lang

Thu, 30 Jul 1998 10:37:22 -0700

71 lines

New Thread

Carbon Ink

Carbon Ink

Andrea Henry

Wed, 22 Jul 1998 08:51:35 PDT

25 lines

New Thread

Carbon Ink -Reply

Carbon Ink -Reply

Ron Hayashi

Wed, 22 Jul 1998 09:13:22 -0700

37 lines

New Thread

Carbon ink resource

Re: Carbon ink resource

Valquirio N. Carvalho

Mon, 20 Jul 1998 19:42:02 -0400

61 lines

Re: Carbon ink resource

Colin

Mon, 20 Jul 1998 07:18:54 -0500

53 lines

Re: Carbon ink resource

Howard Lin

Mon, 20 Jul 1998 20:15:43 +0800

30 lines

New Thread

Carbon ink resource -Reply

Re: Carbon ink resource -Reply

Steve Rathbun

Tue, 21 Jul 1998 10:38:57 -0700

35 lines

New Thread

Carbon Ink Suppliers.

Carbon Ink Suppliers.

Ron Hayashi

Tue, 21 Jul 1998 12:09:27 -0700

37 lines

New Thread

Cause & Effect Diagram

Cause & Effect Diagram

Gabriel D Sulyok

Thu, 9 Jul 1998 09:55:43 -0400

23 lines

New Thread

Cause and effect diagram

Cause and effect diagram

Nick Nicolaides

Mon, 13 Jul 1998 10:17:07 -0400

23 lines

New Thread

cause effect diagram,

cause effect diagram,

Francisco Rios

Thu, 9 Jul 1998 09:53:44 -0700

24 lines

New Thread

cause-effect diagram - some gentle advice

Re: cause-effect diagram - some gentle advice

JoAnn Amerson

Wed, 8 Jul 1998 15:02:17 -0400

31 lines

New Thread

CEM-1

Re: CEM-1

Kwong Chin

Tue, 21 Jul 1998 19:42:15 -0400

90 lines

Re: CEM-1

Don Vischulis

Mon, 20 Jul 1998 19:42:34 -0500

38 lines

Re: CEM-1

=?euc-kr?B?sei03r+1ILD6wOUgwPzA2iC6u7vnsLO538H2v/jGwA==?=

Tue, 21 Jul 1998 08:09:58 +0900

64 lines

CEM-1

Tom Burek

Mon, 20 Jul 1998 17:32:09 -0500

27 lines

New Thread

chemically resistant pump

Re: chemically resistant pump

Smith Russell MSM LAPO US

Thu, 23 Jul 1998 03:59:00 +0200

78 lines

chemically resistant pump

Alex Stennett

Tue, 21 Jul 1998 10:16:58 +0000

48 lines

New Thread

Coax Cable Assemblies

Coax Cable Assemblies

<>

Fri, 24 Jul 1998 06:40:38 EDT

27 lines

New Thread

Column Grid Arrays

Re: Column Grid Arrays

Russ Winslow

Fri, 31 Jul 1998 14:14:46 -0700

73 lines

Re: Column Grid Arrays

Clive Ffitch

Fri, 31 Jul 1998 10:34:37 PST

114 lines

Re: Column Grid Arrays

Collins, Graham

Thu, 30 Jul 1998 10:21:50 -0300

74 lines

Column Grid Arrays

<>

Thu, 30 Jul 1998 07:44:33 -0600

33 lines

New Thread

Component tape pulling force.

Component tape pulling force.

Noppadol S.

Wed, 22 Jul 1998 17:08:41 +0700

30 lines

New Thread

Compositech laminates

Compositech laminates

<>

Thu, 16 Jul 1998 02:44:50 -0400

32 lines

New Thread

Conductive Epoxy adhesive

Re: Conductive Epoxy adhesive

<Eden Chen>

Thu, 23 Jul 1998 08:56:49 +0800

57 lines

Re: Conductive Epoxy adhesive

Eric Yakobson

Wed, 22 Jul 1998 11:18:27 -0400

60 lines

Re: Conductive Epoxy adhesive

Brent Alcorn

Wed, 22 Jul 1998 10:17:33 -0300

41 lines

Conductive Epoxy adhesive

Percy Childe

Wed, 22 Jul 1998 19:37:21 +0800

29 lines

New Thread

Conductive Epoxy adhesive -Reply

Re: Conductive Epoxy adhesive -Reply

Matthew Park

Wed, 22 Jul 1998 07:43:39 -0700

60 lines

New Thread

Conductive Expoxy Adhesive

Conductive Expoxy Adhesive

Percy Childe

Wed, 22 Jul 1998 19:31:37 +0800

33 lines

New Thread

Conductor Routing

Re: Conductor Routing

R. Christopher Lott

Thu, 23 Jul 1998 16:46:10 -0500

36 lines

New Thread

Conductor Routing Question

Re: Conductor Routing Question

Scott Decker

Thu, 23 Jul 1998 13:26:52 -0700

94 lines

Re: Conductor Routing Question

Dennis Beerman

Thu, 23 Jul 1998 16:18:50 -0400

84 lines

Conductor Routing Question

R. Christopher Lott

Thu, 23 Jul 1998 14:50:18 -0500

54 lines

New Thread

Confirmation of Receipt

Confirmation of Receipt

Undetermined origin c/o LISTSERV administrator

Mon, 13 Jul 1998 15:48:15 EDT

29 lines

Confirmation of Receipt

Undetermined origin c/o LISTSERV administrator

Wed, 8 Jul 1998 09:04:43 EDT

29 lines

New Thread

Conformal coating

Re: Conformal coating

ETS

Wed, 29 Jul 1998 13:05:30 -0700

81 lines

Re: Conformal coating

Aric parr

Wed, 29 Jul 1998 07:43:36 EDT

100 lines

Conformal coating

<Eden Chen>

Wed, 29 Jul 1998 14:26:49 +0800

37 lines

New Thread

Conformal Coating Adhesion over low res. Fluxes

Re: Conformal Coating Adhesion over low res. Fluxes

Aric parr

Fri, 17 Jul 1998 13:07:50 EDT

62 lines

Re: Conformal Coating Adhesion over low res. Fluxes

Vaughan, Ralph H

Fri, 17 Jul 1998 09:33:09 -0700

64 lines

Conformal Coating Adhesion over low res. Fluxes

Mark Pozorski

Fri, 17 Jul 1998 11:03:15 -0600

29 lines

New Thread

Contact Systems CS-400C

Re: Contact Systems CS-400C

Rick Thompson

Fri, 10 Jul 1998 14:36:13 -0700

101 lines

Re: Contact Systems CS-400C

<>

Fri, 10 Jul 1998 16:27:04 -0500

66 lines

Contact Systems CS-400C

Rick Thompson

Fri, 10 Jul 1998 13:13:13 -0700

33 lines

New Thread

Contamination Testing for Water Soluble Flux Residue

Re: Contamination Testing for Water Soluble Flux Residue

Alan Brewin

Tue, 30 Jun 1998 17:06:15 +0100

133 lines

New Thread

Contract Test Labs for SERA White Tin Tests (Florida CirTech

Re: Contract Test Labs for SERA White Tin Tests (Florida CirTech

Douglas Pauls

Fri, 17 Jul 1998 10:29:21 EDT

38 lines

New Thread

Contract Test Labs for SERA White Tin Tests (Florida CirTech Omikron)

Contract Test Labs for SERA White Tin Tests (Florida CirTech Omikron)

Paul Wilson

Fri, 17 Jul 1998 08:49:38 -0400

56 lines

New Thread

Controlled Impedance Testing

Re: Controlled Impedance Testing

Lyle Anderson

Wed, 22 Jul 1998 08:39:54 -0700

47 lines

Re: Controlled Impedance Testing

Paul Gould

Tue, 21 Jul 1998 22:42:34 +0100

38 lines

Controlled Impedance Testing

James A. Zeman

Tue, 21 Jul 1998 13:38:00 -0500

25 lines

New Thread

Copper Stains on suface of Au Fingers

Re: Copper Stains on suface of Au Fingers

Ryan Jennens

Tue, 7 Jul 1998 11:29:52 -0400

30 lines

Copper Stains on suface of Au Fingers

Lamond, Doug

Tue, 7 Jul 1998 08:43:59 -0500

45 lines

New Thread

CP642 vs CM88-CM or Fuji vs Panasonic

Re: CP642 vs CM88-CM or Fuji vs Panasonic

Aric parr

Tue, 21 Jul 1998 10:26:23 EDT

164 lines

Re: CP642 vs CM88-CM or Fuji vs Panasonic

Richard Tassone

Tue, 21 Jul 1998 07:16:02 +0100

89 lines

CP642 vs CM88-CM or Fuji vs Panasonic

Jeff Hempton

Tue, 21 Jul 1998 08:54:12 -0500

109 lines

CP642 vs CM88-CM or Fuji vs Panasonic

My Nguyen

Mon, 20 Jul 1998 18:42:06 -0700

41 lines

New Thread

CP642 vs CM88-CM or Fuji vs Panasonic- Part II

Re: CP642 vs CM88-CM or Fuji vs Panasonic- Part II

Mark Pozorski

Mon, 27 Jul 1998 10:31:38 -0600

277 lines

CP642 vs CM88-CM or Fuji vs Panasonic- Part II

Jeff Hempton

Fri, 24 Jul 1998 13:33:30 -0500

239 lines

CP642 vs CM88-CM or Fuji vs Panasonic- Part II

My Nguyen

Thu, 23 Jul 1998 21:19:15 -0700

205 lines

New Thread

Cracked capacitors and bulbuous joints

Re: Cracked capacitors and bulbuous joints

McMonagle, Michael R.

Mon, 20 Jul 1998 07:39:57 -0500

64 lines

Cracked capacitors and bulbuous joints

CHEUNG, Steven (Collroad)

Thu, 16 Jul 1998 14:54:00 +0000

25 lines

New Thread

CSP underfill,

Re: CSP underfill,

<>

Fri, 31 Jul 1998 09:50:12 EDT

26 lines

CSP underfill,

<Eden Chen>

Fri, 31 Jul 1998 13:57:49 +0800

41 lines

New Thread

CSR 2600

CSR 2600

Ed Kneller

Mon, 6 Jul 1998 06:42:24 -0700

34 lines

New Thread

CSR2600

CSR2600

Ed Kneller

Mon, 6 Jul 1998 06:39:39 -0700

27 lines

New Thread

CTE of PCB Laminates

Re: CTE of PCB Laminates

Gerald G. Gagnon

Wed, 15 Jul 1998 08:18:44 -0400

79 lines

Re: CTE of PCB Laminates

Werner Engelmaier

Wed, 15 Jul 1998 08:07:11 EDT

41 lines

CTE of PCB Laminates

KK Chin

Tue, 14 Jul 1998 16:29:10 -0700

30 lines

New Thread

CTE of PCB Laminates -Reply

Re: CTE of PCB Laminates -Reply

Gerald G. Gagnon

Wed, 15 Jul 1998 10:39:56 -0400

160 lines

Re: CTE of PCB Laminates -Reply

Fred Johnson

Wed, 15 Jul 1998 14:51:38 +0100

114 lines

New Thread

CTE of PCB material [aramid info]

Re: CTE of PCB material [aramid info]

Alderete, Michael

Thu, 23 Jul 1998 14:34:42 -0700

85 lines

New Thread

CTE of PCB material.

Re: CTE of PCB material.

Lyle Wallig

Thu, 23 Jul 1998 11:04:37 EDT

38 lines

Re: CTE of PCB material.

Karl Sweitzer

Thu, 23 Jul 1998 10:59:37 -0400

83 lines

CTE of PCB material.

Frank K. Frimpong

Thu, 23 Jul 1998 13:30:12 +0000

36 lines

New Thread

Cu stains on Au fingers

Re: Cu stains on Au fingers

Andy Magee

Wed, 8 Jul 1998 12:10:30 -0400

33 lines

New Thread

DEK ProFlow

Re: DEK ProFlow

Kathy Palumbo

Wed, 22 Jul 1998 12:53:33 -0700

767 lines

New Thread

delamination

Re: delamination

Matthew Sanders

Mon, 27 Jul 1998 15:40:46 -0700

71 lines

Re: delamination

Werner Engelmaier

Mon, 27 Jul 1998 10:25:52 EDT

38 lines

Re: delamination

Andy Magee

Mon, 27 Jul 1998 08:41:52 -0400

70 lines

delamination

Melanie Racuya

Mon, 27 Jul 1998 19:07:10 +0000

43 lines

New Thread

Delamination Problems

Re: Delamination Problems

Frank K. Frimpong

Wed, 15 Jul 1998 11:46:00 +0000

182 lines

Re: Delamination Problems

JB

Mon, 13 Jul 1998 15:49:20 +0800

149 lines

Re: Delamination Problems

David Heywood

Mon, 13 Jul 1998 09:16:52 +0100

112 lines

Delamination Problems

Chris Elliott

Fri, 10 Jul 1998 19:33:05 -0400

77 lines

New Thread

Design & DFM Software

Re: Design & DFM Software

Jeff Seeger

Thu, 9 Jul 1998 20:03:57 -0400

44 lines

Design & DFM Software

Richard List

Thu, 9 Jul 1998 16:07:58 -0700

39 lines

Design & DFM Software

Dave Roesler

Thu, 9 Jul 1998 15:34:16 -0500

90 lines

Design & DFM Software

Richard List

Wed, 8 Jul 1998 10:19:50 -0700

30 lines

Design & DFM Software

Richard List

Tue, 7 Jul 1998 15:20:07 -0700

28 lines

New Thread

DEWETTING

Re: DEWETTING

Stephen R. Gregory

Wed, 1 Jul 1998 16:00:44 EDT

50 lines

Re: DEWETTING

Mark Simmons

Wed, 1 Jul 1998 09:41:08 -0700

30 lines

DEWETTING

starr devere

Wed, 1 Jul 1998 08:51:09 -0700

35 lines

New Thread

Diazo adhesive transfer film

Re: Diazo adhesive transfer film

Lyle Anderson

Wed, 22 Jul 1998 16:05:43 -0700

60 lines

Diazo adhesive transfer film

Lisa Parker

Fri, 17 Jul 1998 10:03:51 -0500

31 lines

New Thread

Diazo adhesive transfer film -Reply

Diazo adhesive transfer film -Reply

Bob Stumpf

Tue, 21 Jul 1998 13:48:16 -0700

58 lines

New Thread

Diode Polarity

Re: Diode Polarity

Rick Thompson

Thu, 30 Jul 1998 15:06:19 -0700

83 lines

Diode Polarity

Gail Herman

Thu, 30 Jul 1998 16:48:38 -0400

40 lines

New Thread

Diversion, flame if you will!

Diversion, flame if you will!

Karen Tellefsen

Fri, 31 Jul 1998 15:52:06 -0700

46 lines

New Thread

Dropped boards

Re: Dropped boards

Michael Hilton

Thu, 30 Jul 1998 15:44:41 -0400

45 lines

Dropped boards

Vernon Presnell

Thu, 30 Jul 1998 09:30:00 -0700

24 lines

New Thread

Dump Criteria for Solder Strip

Re: Dump Criteria for Solder Strip

Lenny Kurup

Thu, 2 Jul 1998 13:21:09 -0400

30 lines

Re: Dump Criteria for Solder Strip

Coleman, Rob

Thu, 2 Jul 1998 08:22:00 -0500

58 lines

Re: Dump Criteria for Solder Strip

<Rudy Sedlak>

Thu, 2 Jul 1998 00:48:44 EDT

46 lines

Re: Dump Criteria for Solder Strip

Frank, Jr. Komitsky

Thu, 2 Jul 1998 00:23:49 -0400

56 lines

Dump Criteria for Solder Strip

Michael D. Doty

Wed, 1 Jul 1998 22:21:49 -0400

25 lines

New Thread

Dump Criteria for Solder Strip (fwd)

Re: Dump Criteria for Solder Strip (fwd)

Lenny Kurup

Mon, 6 Jul 1998 13:52:26 -0400

30 lines

New Thread

Duofoil Replacement

Re: Duofoil Replacement

Afri Singh

Tue, 21 Jul 1998 20:06:00 -0400

43 lines

Duofoil Replacement

Mike Bailey

Mon, 20 Jul 1998 12:04:20 -0400

26 lines

New Thread

EIA sts.

Re: EIA sts.

Bob Seyfert

Mon, 20 Jul 1998 14:26:40 -0400

56 lines

EIA sts.

Noppadol S.

Mon, 20 Jul 1998 17:11:31 +0700

27 lines

New Thread

ELECTRIC TESTER FOR BGA

ELECTRIC TESTER FOR BGA

Lee Sang Soo

Sat, 25 Jul 1998 07:30:18 +0900

31 lines

New Thread

Electrical Testing Techniques

Electrical Testing Techniques

Hugh Scott Miller

Sun, 19 Jul 1998 16:47:43 -0400

37 lines

New Thread

Electro-Migration

Re: Electro-Migration

Andy Magee

Tue, 21 Jul 1998 17:37:40 -0400

31 lines

New Thread

Electroless Copper Plating on Teflon and BT

Re: Electroless Copper Plating on Teflon and BT

Leslie O. Connally

Wed, 15 Jul 1998 10:04:40 -0700

74 lines

Re: Electroless Copper Plating on Teflon and BT

John Bushie

Tue, 14 Jul 1998 08:06:48 -0500

79 lines

Re: Electroless Copper Plating on Teflon and BT

Alex Stennett

Tue, 14 Jul 1998 12:19:14 +0000

50 lines

Electroless Copper Plating on Teflon and BT

tgyee

Tue, 14 Jul 1998 18:19:55 PST

30 lines

New Thread

Electroless Nickel

Re: Electroless Nickel

Mike Bailey

Fri, 31 Jul 1998 15:18:45 -0400

37 lines

Re: Electroless Nickel

Gabriela Bogdan

Fri, 31 Jul 1998 22:07:32 +0300

65 lines

Electroless Nickel

Earl Moon

Fri, 31 Jul 1998 04:57:29 -0700

39 lines

New Thread

Electronic meters for copper thickness

Re: Electronic meters for copper thickness

Don Vischulis

Wed, 8 Jul 1998 21:01:38 -0500

43 lines

Re: Electronic meters for copper thickness

Joseph Zacharias

Wed, 8 Jul 1998 05:25:32 -0700

68 lines

Electronic meters for copper thickness

Ed Cosper

Tue, 7 Jul 1998 17:39:16 -0500

31 lines

New Thread

Electronic/ESD Packaging Guidelines

Re: Electronic/ESD Packaging Guidelines

Stuart Chessen

Wed, 29 Jul 1998 08:06:51 -0700

62 lines

Re: Electronic/ESD Packaging Guidelines

Joaquin Molina

Tue, 28 Jul 1998 15:30:27 -0400

93 lines

Electronic/ESD Packaging Guidelines

Thexton, Duane

Tue, 28 Jul 1998 08:19:29 -0700

33 lines

New Thread

Electropolishing Laser-Cut Stencils

Re: Electropolishing Laser-Cut Stencils

Brad Kendall

Mon, 13 Jul 1998 08:40:28 -0400

114 lines

Re: Electropolishing Laser-Cut Stencils

Charles Barker

Fri, 10 Jul 1998 13:28:02 -0500

87 lines

Re: Electropolishing Laser-Cut Stencils

Brad Vanderhoof

Fri, 10 Jul 1998 11:08:15 PDT

83 lines

Re: Electropolishing Laser-Cut Stencils

Stephen R. Gregory

Fri, 10 Jul 1998 13:40:15 EDT

83 lines

Electropolishing Laser-Cut Stencils

Todd Ness

Fri, 10 Jul 1998 09:13:28 +0000

56 lines

New Thread

ENVIORNMENTAL DATA IN PACKAGING

Re: ENVIORNMENTAL DATA IN PACKAGING

Stephen R. Gregory

Mon, 20 Jul 1998 18:59:58 EDT

56 lines

ENVIORNMENTAL DATA IN PACKAGING

Sudarshan Siddhaye

Mon, 20 Jul 1998 12:12:51 -0700

39 lines

New Thread

Environmental tests for press-fit components

Re: Environmental tests for press-fit components

Johannes Sivula

Tue, 30 Jun 1998 09:59:26 +0300

156 lines

New Thread

EP&P article, Au diffusion in near eutectic solder.

EP&P article, Au diffusion in near eutectic solder.

Alderete, Michael

Wed, 8 Jul 1998 07:32:29 -0700

28 lines

New Thread

EPCmail-3

EPCmail-3

Philip Stoten

Tue, 14 Jul 1998 17:59:57 +0100

739 lines

New Thread

equipment selection model

Re: equipment selection model

Tenison Stone

Wed, 1 Jul 1998 13:10:07 -0500

80 lines

equipment selection model

LI YUAN

Wed, 1 Jul 1998 10:13:42 -0600

39 lines

New Thread

ESD Faraday shielding

Re: ESD Faraday shielding

Chilcote, Jim (AZ75)

Fri, 17 Jul 1998 18:40:59 -0500

65 lines

ESD Faraday shielding

FREDA CHILCOTE

Fri, 17 Jul 1998 12:40:32 -0700

31 lines

New Thread

ESD grounding

Re: ESD grounding

No Name Available

Tue, 28 Jul 1998 22:17:38 EDT

26 lines

Re: ESD grounding

Ralph Hersey

Mon, 27 Jul 1998 22:13:17 -0700

110 lines

ESD grounding

KC Chan

Tue, 28 Jul 1998 11:20:01 +0800

31 lines

New Thread

Etch Factor

Re: Etch Factor

Phil Culpovich

Wed, 8 Jul 1998 06:42:46 -0700

66 lines

Re: etch factor

Eddie Brunker

Tue, 7 Jul 1998 15:42:10 +0100

34 lines

etch factor

James Patten

Tue, 7 Jul 1998 07:18:57 -0700

27 lines

New Thread

Express Packaging Services and John Lau

Re: Express Packaging Services and John Lau

Alderete, Michael

Wed, 29 Jul 1998 09:33:26 -0700

49 lines

New Thread

Fab : Solder mask thickness

Re: Fab : Solder mask thickness

Aric parr

Thu, 23 Jul 1998 07:35:36 EDT

82 lines

Re: Fab : Solder mask thickness

<>

Wed, 22 Jul 1998 18:41:15 EDT

24 lines

Re: Fab : Solder mask thickness

Brett Goldstein

Wed, 22 Jul 1998 18:02:54 +0000

51 lines

Fab : Solder mask thickness

Blanchet, Richard

Wed, 22 Jul 1998 11:19:30 -0400

32 lines

New Thread

Fab : Solder mask thicknessA Reply

Re: Fab : Solder mask thicknessA Reply

George Milad

Wed, 22 Jul 1998 13:40:43 EDT

33 lines

New Thread

Fab: Bow & Twist

Re: Fab: Bow & Twist

Desroches, Charles

Tue, 14 Jul 1998 13:06:23 -0400

78 lines

Fab: Bow & Twist

Steve Collins

Tue, 14 Jul 1998 10:53:13 -0600

30 lines

New Thread

FAB: FR-4 Thermal Limits?

Re: FAB: FR-4 Thermal Limits?

<>

Mon, 27 Jul 1998 14:01:19 -0500

30 lines

New Thread

Fab: Permanganate

Re: Fab: Permanganate

Michael Carano

Sat, 25 Jul 1998 10:27:20 -0700

44 lines

Re: Fab: Permanganate

<Rudy Sedlak>

Fri, 24 Jul 1998 20:20:00 EDT

31 lines

Re: Fab: Permanganate

Mike Bailey

Fri, 24 Jul 1998 10:41:17 -0400

28 lines

Re: Fab: Permanganate

<>

Fri, 24 Jul 1998 13:08:35 EDT

27 lines

Fab: Permanganate

Ed Cosper

Fri, 24 Jul 1998 12:03:30 -0500

30 lines

New Thread

FAB: Plugged, Filled &/or Tented Vias

Re: FAB: Plugged, Filled &/or Tented Vias

Leslie O. Connally

Wed, 1 Jul 1998 08:23:03 -0700

63 lines

Re: FAB: Plugged, Filled &/or Tented Vias

Mary Elsis

Wed, 1 Jul 1998 08:56:09 -0500

38 lines

New Thread

Farewell TechNet - Technical Writer Available

Re: Farewell TechNet - Technical Writer Available

Paul Klasek

Wed, 29 Jul 1998 09:49:22 +1000

78 lines

Farewell TechNet - Technical Writer Available

Douglas H. Bennett

Tue, 28 Jul 1998 14:05:41 -0700

42 lines

New Thread

Fidutial Requirements

Re: Fidutial Requirements

Lisa Williams

Thu, 2 Jul 1998 11:49:41 -0500

83 lines

Re: Fidutial Requirements

Graham, Christy [MICOM:LAVE]

Thu, 2 Jul 1998 08:41:55 -0700

53 lines

New Thread

Final/Sort Inspection

Final/Sort Inspection

Mary Lou Carlson

Thu, 9 Jul 1998 12:29:43 -0700

88 lines

New Thread

Flow patterns on multi-layer boards

Flow patterns on multi-layer boards

MICHAEL DODSON

Tue, 14 Jul 1998 17:37:06 +0000

37 lines

New Thread

Fluid Head

Fluid Head

WHATEVER

Thu, 23 Jul 1998 23:18:56 -0500

28 lines

New Thread

Flux on Goldfinger

Re: Flux on Goldfinger

PELCHAT_JM

Tue, 28 Jul 1998 08:27:37 -0400

67 lines

Re: Flux on Goldfinger

Noppadol S.

Sat, 25 Jul 1998 15:03:10 +0700

60 lines

Re: Flux on Goldfinger

superflx

Fri, 24 Jul 1998 10:09:08 -0400

52 lines

Re: Flux on Goldfinger

PELCHAT_JM

Thu, 23 Jul 1998 07:15:01 -0400

65 lines

Flux on Goldfinger

Muhammad, Masdi

Wed, 22 Jul 1998 16:16:00 -0700

33 lines

New Thread

FR-4 Emittance

Re: FR-4 Emittance

Leslie O. Connally

Wed, 8 Jul 1998 08:28:38 -0700

76 lines

Re: FR-4 Emittance

David Whalley

Tue, 7 Jul 1998 12:50:05 +0100

47 lines

Re: FR-4 Emittance

Stephen R. Gregory

Mon, 6 Jul 1998 19:54:12 EDT

45 lines

FR-4 Emittance

Mark Harrand

Mon, 6 Jul 1998 17:33:16 -0600

34 lines

New Thread

FR-5 vs Warp & Twist

Re: FR-5 vs Warp & Twist

Frank K. Frimpong

Tue, 14 Jul 1998 15:59:15 +0000

36 lines

Re: FR-5 vs Warp & Twist

Jerome Sallo

Tue, 14 Jul 1998 10:30:26 EDT

27 lines

FR-5 vs Warp & Twist

=?euc-kr?B?sei03r+1ILD6wOUgwPzA2iC6u7vnsLO538H2v/jGwA==?=

Tue, 14 Jul 1998 09:34:43 +0900

35 lines

New Thread

FR4 and EP3

FR4 and EP3

Ian Squires

Tue, 21 Jul 1998 17:13:26 PDT

45 lines

New Thread

FR4 insulator thickness

FR4 insulator thickness

Hurst, Joe

Fri, 31 Jul 1998 09:46:24 -0400

34 lines

New Thread

Fw: Travel arrangements to Austin, TX Sept 23 - 26, 1998

Fw: Travel arrangements to Austin, TX Sept 23 - 26, 1998

Steve Collins

Thu, 30 Jul 1998 12:35:42 -0600

45 lines

New Thread

Fw: Travel arrangements to Dallas Sept 15, 1998

Re: Fw: Travel arrangements to Dallas Sept 15, 1998

John Denton

Thu, 30 Jul 1998 17:11:13 -0400

86 lines

Re: Fw: Travel arrangements to Dallas Sept 15, 1998

JoAnn Amerson

Thu, 30 Jul 1998 15:48:52 -0400

63 lines

Fw: Travel arrangements to Dallas Sept 15, 1998

Matthew Park

Thu, 30 Jul 1998 12:43:07 -0700

70 lines

Re: Fw: Travel arrangements to Dallas Sept 15, 1998

Brian K. Doughty

Thu, 30 Jul 1998 14:37:17 EDT

26 lines

Fw: Travel arrangements to Dallas Sept 15, 1998

Steve Collins

Thu, 30 Jul 1998 12:37:17 -0600

43 lines

New Thread

FW: [TN] C.O.P.S. Software problems

FW: [TN] C.O.P.S. Software problems

Paul Klasek

Thu, 30 Jul 1998 09:48:04 +1000

238 lines

New Thread

FW: [TN] Electropolishing Laser-Cut Stencils

FW: [TN] Electropolishing Laser-Cut Stencils

Dhawan, Ashok

Wed, 15 Jul 1998 17:00:21 -0500

139 lines

New Thread

FW: [TN] Mil-S-13949

FW: [TN] Mil-S-13949

Sheila Smith

Fri, 31 Jul 1998 09:36:43 -0400

68 lines

New Thread

FW: [TN] MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

FW: [TN] MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

Chilcote, Jim (AZ75)

Wed, 22 Jul 1998 10:55:13 -0500

54 lines

New Thread

Fwd: reflow oven

Fwd: reflow oven

Jeff Hempton

Mon, 13 Jul 1998 11:56:30 -0500

80 lines

Re: Fwd: reflow oven

Stephen R. Gregory

Fri, 10 Jul 1998 18:59:19 EDT

73 lines

Re: Fwd: reflow oven

Kathy Palumbo

Fri, 10 Jul 1998 15:21:40 -0700

79 lines

Re: Fwd: reflow oven

ETS

Fri, 10 Jul 1998 14:10:56 -0700

111 lines

Re: Fwd: reflow oven

Stephen R. Gregory

Fri, 10 Jul 1998 15:58:42 EDT

72 lines

Re: Fwd: reflow oven

ETS

Fri, 10 Jul 1998 12:34:43 -0700

60 lines

Re: Fwd: reflow oven

ETS

Fri, 10 Jul 1998 12:24:56 -0700

69 lines

Re: Fwd: reflow oven

Sean Heffernan

Fri, 10 Jul 1998 11:34:36 -0400

36 lines

Re: Fwd: reflow oven

Stephen R. Gregory

Fri, 10 Jul 1998 14:21:24 EDT

54 lines

Fwd: reflow oven

Angie Marques

Fri, 10 Jul 1998 10:54:07 -0400

38 lines

New Thread

Gen: Finstrate Finestrate

Gen: Finstrate Finestrate

David Bergman

Wed, 22 Jul 1998 17:48:40 -0500

38 lines

New Thread

GEN: IPC Standard for Stencil Apertures

Re: GEN: IPC Standard for Stencil Apertures

Jack Crawford

Thu, 9 Jul 1998 16:57:39 -0500

40 lines

GEN: IPC Standard for Stencil Apertures

Jan Satterfield

Thu, 9 Jul 1998 15:28:25 -0600

20 lines

New Thread

Get The Cash You Need Now!!!

Get The Cash You Need Now!!!

Advanced Funding

Mon, 27 Jul 1998 06:28:43 +0200

58 lines

New Thread

Glenbrook x-ray??

Re: Glenbrook x-ray??

Gabriela Bogdan

Fri, 31 Jul 1998 21:55:38 +0300

206 lines

Re: Glenbrook x-ray??

David D Hillman

Fri, 31 Jul 1998 13:10:18 -0500

107 lines

Re: Glenbrook x-ray??

Stephen R. Gregory

Thu, 30 Jul 1998 19:48:32 EDT

55 lines

Re: Glenbrook x-ray??

Paul Klasek

Fri, 31 Jul 1998 09:15:31 +1000

157 lines

Re: Glenbrook x-ray??

Bev Christian

Thu, 30 Jul 1998 09:28:54 -0400

138 lines

Re: Glenbrook x-ray??

David D Hillman

Thu, 30 Jul 1998 08:16:08 -0500

85 lines

Re: Glenbrook x-ray??

Brad Kendall

Thu, 30 Jul 1998 08:43:45 -0400

87 lines

Re: Glenbrook x-ray??

Paul Gould

Wed, 29 Jul 1998 22:45:27 +0100

61 lines

Re: Glenbrook x-ray??

Rick Thompson

Wed, 29 Jul 1998 13:19:43 -0700

110 lines

Re: Glenbrook x-ray??

Sean Heffernan

Wed, 29 Jul 1998 13:01:43 -0700

81 lines

Re: Glenbrook x-ray??

Cobey Schmidt

Wed, 29 Jul 1998 13:37:23 -0500

80 lines

Glenbrook x-ray??

Rick Thompson

Wed, 29 Jul 1998 11:27:43 -0700

36 lines

New Thread

Glue Print

Glue Print

Paul Stolar

Thu, 9 Jul 1998 13:26:15 -0600

33 lines

New Thread

Gold Cleaning/Etching

Re: Gold Cleaning/Etching

<Rudy Sedlak>

Wed, 1 Jul 1998 21:53:09 EDT

54 lines

Re: Gold Cleaning/Etching

Lenny Kurup

Wed, 1 Jul 1998 14:11:28 -0400

61 lines

Gold Cleaning/Etching

Meschter, Stephan J

Wed, 1 Jul 1998 12:09:30 -0400

42 lines

New Thread

Gold Coated Solder

Re: Gold Coated Solder

sahmad

Mon, 27 Jul 1998 16:44:21 -0600

136 lines

New Thread

Gold Finish

Re: Gold Finish

Smith Russell MSM LAPO US

Wed, 15 Jul 1998 05:14:00 +0200

69 lines

Gold Finish

Neil Atkinson

Mon, 13 Jul 1998 14:04:29 +0100

61 lines

New Thread

Gold thickness - Edge

Re: Gold thickness - Edge

Jerry Cupples

Wed, 1 Jul 1998 15:29:49 -0500

57 lines

Re: Gold thickness - Edge

<>

Wed, 1 Jul 1998 12:27:19 -0700

102 lines

New Thread

Good Gas Mask??

Re: Good Gas Mask??

Roland Jaquet

Fri, 24 Jul 1998 09:04:31 +0200

68 lines

New Thread

hdd

hdd

ciprian

Tue, 7 Jul 1998 00:47:35 +0300

27 lines

New Thread

Help with Ionic Contamination testing

Help with Ionic Contamination testing

Kevin Stokes

Fri, 31 Jul 1998 16:42:20 -0400

48 lines

New Thread

HF BGA Testing

Re: HF BGA Testing

sahmad

Thu, 23 Jul 1998 07:51:27 -0600

71 lines

HF BGA Testing

<>

Thu, 23 Jul 1998 08:29:53 -0500

43 lines

New Thread

Homeplate-shaped Pads

Re: Homeplate-shaped Pads

Ian Squires

Wed, 15 Jul 1998 09:28:48 PDT

112 lines

Re: Homeplate-shaped Pads

Stephen R. Gregory

Tue, 14 Jul 1998 12:41:38 EDT

51 lines

Homeplate-shaped Pads

Ryan Jennens

Tue, 14 Jul 1998 12:15:30 -0400

32 lines

New Thread

Hot Bar Soldering??

Re: Hot Bar Soldering??

Noppadol S.

Sat, 25 Jul 1998 14:51:32 +0700

95 lines

Re: Hot Bar Soldering??

Noppadol S.

Sat, 25 Jul 1998 14:47:58 +0700

93 lines

Re: Hot Bar Soldering??

SEM Lab, Inc.

Tue, 21 Jul 1998 15:31:17 -0500

76 lines

Re: Hot Bar Soldering??

<>

Tue, 21 Jul 1998 13:38:28 PST

76 lines

Re: Hot Bar Soldering??

Mike Becker

Mon, 20 Jul 1998 08:12:30 -0700

68 lines

Re: Hot Bar Soldering??

Paul Stolar

Mon, 20 Jul 1998 08:49:51 -0600

84 lines

Re: Hot Bar Soldering??

Mike Becker

Sun, 19 Jul 1998 21:52:11 -0700

68 lines

Hot Bar Soldering??

Bruce Robertson

Mon, 20 Jul 1998 13:16:28 +1200

42 lines

New Thread

HTC Contact

Re: HTC Contact

Edward J. Valentine

Fri, 10 Jul 1998 13:14:01 -0700

59 lines

HTC Contact

Sauer, Steven T.

Thu, 9 Jul 1998 15:04:00 E

26 lines

New Thread

I need some CEM3 .059 1/1 and 1/0 laminate

I need some CEM3 .059 1/1 and 1/0 laminate

Lisa Parker

Thu, 16 Jul 1998 13:25:52 -0500

33 lines

New Thread

Ideas for PCB Supplier Survey Content

Re: Ideas for PCB Supplier Survey Content

Andrew J. Scholand

Tue, 21 Jul 1998 13:18:34 -0400

63 lines

Ideas for PCB Supplier Survey Content

Hugh Scott Miller

Tue, 21 Jul 1998 10:00:35 -0400

295 lines

New Thread

immersion Au

Re: immersion Au

Lenny Kurup

Thu, 16 Jul 1998 15:35:47 -0400

65 lines

immersion Au

Neil Atkinson

Wed, 15 Jul 1998 09:41:15 +0100

81 lines

New Thread

Immersion gold for wire bonding

Re: Immersion gold for wire bonding

David D Hillman

Wed, 15 Jul 1998 09:21:02 -0500

71 lines

Re: Immersion gold for wire bonding

Howard Lin

Wed, 15 Jul 1998 21:46:58 +0800

29 lines

New Thread

Immersion gold for wire bonding, a reply

Re: Immersion gold for wire bonding, a reply

George Milad

Wed, 15 Jul 1998 20:54:27 EDT

35 lines

New Thread

Impedance

Re: Impedance

Douglas Mckean

Fri, 10 Jul 1998 16:13:27 -0700

113 lines

Impedance

Valerie Webber

Fri, 10 Jul 1998 08:46:48 -0500

51 lines

Re: Impedance

Rhoads, Randall E

Fri, 10 Jul 1998 08:22:19 -0400

97 lines

Re: Impedance

Paul Gould

Fri, 10 Jul 1998 10:47:28 +0100

53 lines

Impedance

<>

Thu, 9 Jul 1998 17:51:48 EDT

27 lines

New Thread

Inf On Facit Paper Tape Puncher

Re: Inf On Facit Paper Tape Puncher

Per Viklund

Tue, 7 Jul 1998 13:18:40 +0200

86 lines

Re: Inf On Facit Paper Tape Puncher

Reddy, Srirama Thimma (Srirama)

Tue, 7 Jul 1998 07:14:55 -0400

66 lines

Inf On Facit Paper Tape Puncher

R. Srinivasan

Tue, 7 Jul 1998 19:01:45 +0800

33 lines

New Thread

inquire

inquire

Benedicto Cruz

Sat, 1 Aug 1998 11:46:15 +0000

46 lines

New Thread

Intermetallic Phase: BGA soldering on Immersion Nickel Gold PCB

Re: Intermetallic Phase: BGA soldering on Immersion Nickel Gold PCB

David D Hillman

Fri, 31 Jul 1998 12:48:05 -0500

74 lines

Intermetallic Phase: BGA soldering on Immersion Nickel Gold PCB

Joseph Furrer

Fri, 31 Jul 1998 09:08:45 +0200

56 lines

New Thread

International Approvals

International Approvals

Hugh Scott Miller

Sun, 19 Jul 1998 16:48:36 -0400

42 lines

New Thread

intrusive reflow and all

Re: intrusive reflow and all

ETS

Wed, 1 Jul 1998 14:46:43 -0700

121 lines

New Thread

IPC HOLE TO LEAD RATIOS

Re: IPC HOLE TO LEAD RATIOS

Hurst, Joe

Wed, 1 Jul 1998 08:35:17 -0400

58 lines

New Thread

IPC Standards

IPC Standards

Joaquin Molina

Tue, 21 Jul 1998 16:59:38 -0400

36 lines

New Thread

IPC std procedure for PCB storage condition.

Re: IPC std procedure for PCB storage condition.

Lauren Yerant

Fri, 17 Jul 1998 10:47:58 -0500

49 lines

Re: IPC std procedure for PCB storage condition.

Lauren Yerant

Fri, 17 Jul 1998 10:32:55 -0500

56 lines

Re: IPC std procedure for PCB storage condition.

Brian K. Doughty

Thu, 16 Jul 1998 16:53:50 EDT

27 lines

IPC std procedure for PCB storage condition.

Desroches, Charles

Thu, 16 Jul 1998 14:05:42 -0400

34 lines

New Thread

IPC-1710 and 1720

IPC-1710 and 1720

David Bergman

Fri, 10 Jul 1998 10:06:34 -0500

63 lines

New Thread

IPC-B-36 Test Coupons

Re: IPC-B-36 Test Coupons

<>

Tue, 14 Jul 1998 15:43:07 EDT

27 lines

IPC-B-36 Test Coupons

Duy Nguyen

Tue, 14 Jul 1998 11:27:14 -0700

33 lines

New Thread

IPC-D-325A Question

Re: IPC-D-325A Question

Lisa Williams

Tue, 21 Jul 1998 10:10:33 -0500

82 lines

Re: IPC-D-325A Question

Gary Ferrari

Mon, 20 Jul 1998 18:49:09 -0500

80 lines

Re: IPC-D-325A Question

JoAnn Amerson

Mon, 20 Jul 1998 11:11:40 -0400

58 lines

IPC-D-325A Question

Steve Hawn

Mon, 20 Jul 1998 07:47:09 -0700

40 lines

New Thread

Is Ni/Au Discoloration comments from manufacturer valid?

Is Ni/Au Discoloration comments from manufacturer valid?

Ken Patel

Thu, 9 Jul 1998 10:03:56 -0700

46 lines

New Thread

Is there a masking product that is non-conductive and can be left on after conformal coating.

Is there a masking product that is non-conductive and can be left on after conformal coating.

Brent Alcorn

Mon, 6 Jul 1998 16:42:40 -0300

37 lines

New Thread

J-STD-001B

J-STD-001B

Steiger, Tina

Thu, 23 Jul 1998 11:50:34 -0500

21 lines

New Thread

KEMET capacitor 2225 size --not suitable for wave solder ing???

Re: KEMET capacitor 2225 size --not suitable for wave solder ing???

Bev Christian

Thu, 9 Jul 1998 14:27:47 -0400

93 lines

Re: KEMET capacitor 2225 size --not suitable for wave solder ing???

John Maxwell

Thu, 9 Jul 1998 11:25:08 -0600

61 lines

Re: KEMET capacitor 2225 size --not suitable for wave solder ing???

Ed Holton

Mon, 6 Jul 1998 09:28:41 -0400

138 lines

Re: KEMET capacitor 2225 size --not suitable for wave solder ing???

McMonagle, Michael R.

Thu, 2 Jul 1998 13:19:14 -0500

97 lines

New Thread

KEMET capacitor 2225 size --not suitable for wave soldering???

KEMET capacitor 2225 size --not suitable for wave soldering???

Dhawan, Ashok

Thu, 2 Jul 1998 12:57:03 -0500

46 lines

New Thread

Lab for Ion chromatography (IC) analysis

Re: Lab for Ion chromatography (IC) analysis

Aric parr

Tue, 14 Jul 1998 15:31:55 EDT

57 lines

Re: Lab for Ion chromatography (IC) analysis

David D Hillman

Tue, 14 Jul 1998 14:01:07 -0500

68 lines

Lab for Ion chromatography (IC) analysis

Gregg Klawson

Tue, 14 Jul 1998 14:39:03 -0400

29 lines

New Thread

Lab to do MILSTD883 testing

Re: Lab to do MILSTD883 testing

Russ Winslow

Fri, 24 Jul 1998 11:31:23 -0700

31 lines

Lab to do MILSTD883 testing

Sheila Smith

Wed, 22 Jul 1998 12:24:06 -0400

31 lines

New Thread

Lab to do MILSTD883 testing -Reply

Lab to do MILSTD883 testing -Reply

Ron Hayashi

Wed, 22 Jul 1998 09:35:51 -0700

23 lines

New Thread

Land/Hole fabrication allowance

Land/Hole fabrication allowance

Steve Hawn

Thu, 16 Jul 1998 11:48:39 -0700

30 lines

New Thread

lead free solder

Re: lead free solder

Ed Holton

Fri, 24 Jul 1998 08:22:51 -0400

114 lines

Re: lead free solder

Sauer, Steven T.

Fri, 24 Jul 1998 08:15:00 E

86 lines

Re: lead free solder

PELCHAT_JM

Fri, 24 Jul 1998 06:59:00 -0400

79 lines

lead free solder

Landes, Jeff

Thu, 23 Jul 1998 17:13:00 PDT

40 lines

New Thread

Lead Solderability

Re: Lead Solderability

Paul Terranova

Mon, 20 Jul 1998 11:20:06 -0400

105 lines

Re: Lead Solderability

Ryan Jennens

Mon, 20 Jul 1998 08:51:06 -0400

32 lines

Lead Solderability

Kasprzak, Bill (esd) US

Sat, 18 Jul 1998 06:36:00 PDT

38 lines

Lead Solderability

Jared Lang

Fri, 17 Jul 1998 15:15:55 -0700

53 lines

New Thread

Lead Solderability II

Re: Lead Solderability II

David D Hillman

Tue, 21 Jul 1998 18:42:13 -0500

199 lines

Re: Lead Solderability II

Ryan Jennens

Tue, 21 Jul 1998 13:58:35 -0400

33 lines

Lead Solderability II

Jared Lang

Tue, 21 Jul 1998 09:35:13 -0700

142 lines

New Thread

Lead Trimming Question ?

Re: Lead Trimming Question ?

Paul Klasek

Sat, 18 Jul 1998 11:01:53 +1000

108 lines

Lead Trimming Question ?

Chris_Smith

Thu, 16 Jul 1998 13:39:11 -0500

42 lines

New Thread

Lead Trimming Question ? -Reply

Lead Trimming Question ? -Reply

Matthew Park

Thu, 16 Jul 1998 14:04:47 -0700

94 lines

New Thread

Lg component mounting advice

Lg component mounting advice

PELCHAT_JM

Mon, 20 Jul 1998 08:33:44 -0400

40 lines

New Thread

Listing of PCB CAD Companies

Listing of PCB CAD Companies

Thomas Martin

Thu, 30 Jul 1998 15:27:55 -0400

31 lines

Re: Listing of PCB CAD Companies

<>

Wed, 29 Jul 1998 17:16:31 EDT

33 lines

Re: Listing of PCB CAD Companies

Fred Pescitelli

Wed, 29 Jul 1998 16:20:10 +0000

42 lines

Listing of PCB CAD Companies

<>

Wed, 29 Jul 1998 12:33:41 -0700

28 lines

New Thread

Look for contact information of Express Packaging Systems and Joh n Lau

Look for contact information of Express Packaging Systems and Joh n Lau

Yuan Li

Mon, 27 Jul 1998 15:57:39 -0700

27 lines

New Thread

Looking for A Pcad Designer or Bureau...

Looking for A Pcad Designer or Bureau...

Beller, Les

Wed, 8 Jul 1998 09:51:09 -0600

37 lines

New Thread

Looking for Barnaby Tack

Looking for Barnaby Tack

Joy, Stephen C

Tue, 21 Jul 1998 15:19:00 -0700

25 lines

New Thread

Looking for BGA X ray inspection criteria

Looking for BGA X ray inspection criteria

Rudolph Yu

Thu, 30 Jul 1998 13:24:56 -0700

32 lines

New Thread

LOOKING FOR MANUFACTURE CAN WORK GETEK 0.0035

LOOKING FOR MANUFACTURE CAN WORK GETEK 0.0035

Eddy

Fri, 10 Jul 1998 20:14:59 +0800

32 lines

New Thread

Magazines and Journals

Re: Magazines and Journals

Pratap Singh

Sun, 12 Jul 1998 12:56:00 -0700

61 lines

Re: Magazines and Journals

David Gonnerman

Wed, 8 Jul 1998 11:24:55 -0500

78 lines

Re: Magazines and Journals

ETS

Wed, 8 Jul 1998 09:08:23 -0700

79 lines

Magazines and Journals

BPL - PCB Division

Wed, 8 Jul 1998 09:19:51 +0500

34 lines

New Thread

mailing list

Re: mailing list

Jack Crawford

Thu, 9 Jul 1998 14:23:58 -0500

73 lines

mailing list

Parvez M.S. Patel

Thu, 9 Jul 1998 14:36:12 -0400

36 lines

New Thread

Manganin wire

Re: Manganin wire

David D Hillman

Tue, 7 Jul 1998 09:02:26 -0500

85 lines

Re: Manganin wire

superflx

Tue, 7 Jul 1998 09:01:17 -0400

44 lines

Manganin wire

Tim Frigon

Mon, 6 Jul 1998 09:21:53 -0500

25 lines

New Thread

Manual Insertion Cycle Time

Re: Manual Insertion Cycle Time

Marc O. Bituagan

Thu, 9 Jul 1998 19:34:11 +0000

28 lines

Re: Manual insertion cycle time

Lon Weffers

Thu, 9 Jul 1998 08:13:32 +0200

54 lines

Manual insertion cycle time

Paul B

Wed, 8 Jul 1998 17:10:54 -0400

28 lines

New Thread

Manual Insertion Time

Re: Manual Insertion Time

Paul Stolar

Fri, 10 Jul 1998 08:31:15 -0600

95 lines

Manual Insertion Time

Kasprzak, Bill (esd) US

Fri, 10 Jul 1998 07:56:00 PDT

55 lines

New Thread

Max operating temp - PBGA

Max operating temp - PBGA

Mauro Nardini

Mon, 13 Jul 1998 14:43:13 -0700

42 lines

New Thread

Micro Via Processing

Micro Via Processing

<>

Thu, 30 Jul 1998 11:55:54 -0500

28 lines

New Thread

Midwest Circuit Association

Midwest Circuit Association

Ron Videen

Mon, 20 Jul 1998 22:53:24 -0500

34 lines

New Thread

Mil Std P28809 - Ionic Residue PCB

Re: Mil Std P28809 - Ionic Residue PCB

Cash, Alan

Fri, 17 Jul 1998 14:24:22 -0400

61 lines

Mil Std P28809 - Ionic Residue PCB

Liam Barry

Fri, 3 Jul 1998 09:54:17 +0100

31 lines

New Thread

Mil-S-13949

Re: Mil-S-13949

Christopher Jorgensen

Fri, 31 Jul 1998 09:06:25 -0500

106 lines

Mil-S-13949

Vaughan, Ralph H

Fri, 31 Jul 1998 06:06:24 -0700

35 lines

New Thread

MIL-S-13949 Cancellation Notice

MIL-S-13949 Cancellation Notice

Jack Crawford

Fri, 10 Jul 1998 17:22:43 -0500

89 lines

New Thread

MIL-STD-130

Re: MIL-STD-130

George Toman

Fri, 17 Jul 1998 08:46:04 -0400

136 lines

Re: MIL-STD-130

Tom Moore

Thu, 16 Jul 1998 21:29:17 -0400

89 lines

Re: MIL-STD-130

Cash, Alan

Thu, 16 Jul 1998 14:41:46 -0400

72 lines

Re: MIL-STD-130

sahmad

Thu, 16 Jul 1998 10:10:28 -0600

64 lines

MIL-STD-130

Kathy Palumbo

Thu, 16 Jul 1998 08:38:53 -0700

34 lines

New Thread

Military Spec Crossovers

Military Spec Crossovers

Hogue, Pat (AZ76)

Tue, 14 Jul 1998 18:17:53 -0700

37 lines

New Thread

Military Specifications

Military Specifications

Robert J. Benson

Sun, 5 Jul 1998 17:27:49 -0700

78 lines

New Thread

Mini Micro Stencil Phone #

Re: Mini Micro Stencil Phone #

Rick Thompson

Tue, 7 Jul 1998 12:28:30 -0700

67 lines

Mini Micro Stencil Phone #

Tenison Stone

Tue, 7 Jul 1998 13:29:19 -0500

33 lines

New Thread

Mini Micro Stencil Phone # -Reply

Mini Micro Stencil Phone # -Reply

Ron Hayashi

Tue, 7 Jul 1998 11:41:08 -0700

23 lines

New Thread

Modeling moisture exposure in laminate

Re: Modeling moisture exposure in laminate

Manish

Sat, 11 Jul 1998 15:53:07 -0400

31 lines

New Thread

MOUNTING HOLE

Re: MOUNTING HOLE

Brett Goldstein

Fri, 31 Jul 1998 08:58:28 +0000

45 lines

MOUNTING HOLE

Jimmy J. Isla

Thu, 30 Jul 1998 16:10:59 -0700

25 lines

New Thread

MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

Re: MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

<>

Thu, 23 Jul 1998 09:56:07 -0500

58 lines

Re: MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

Jared Lang

Wed, 22 Jul 1998 10:40:21 -0700

77 lines

MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

Eddie Brunker

Wed, 22 Jul 1998 15:50:47 +0100

31 lines

New Thread

MVIIF vs CP642 or Fuji vs Panasert - Part II

Re: MVIIF vs CP642 or Fuji vs Panasert - Part II

Matthew Park

Fri, 24 Jul 1998 10:48:41 -0700

150 lines

MVIIF vs CP642 or Fuji vs Panasert - Part II

My Nguyen

Thu, 23 Jul 1998 21:36:39 -0700

69 lines

New Thread

N-Proply-Bromide (Ensolv) compatability with Uralane 575 3 and 5750

Re: N-Proply-Bromide (Ensolv) compatability with Uralane 575 3 and 5750

Bev Christian

Wed, 15 Jul 1998 23:11:33 -0400

70 lines

New Thread

N-Proply-Bromide (Ensolv) compatability with Uralane 5753 and 5750

N-Proply-Bromide (Ensolv) compatability with Uralane 5753 and 5750

Edward Boucher

Wed, 15 Jul 1998 16:05:26 -0400

35 lines

New Thread

N-Ray Inspection

Re: N-Ray Inspection

Ralph Hersey

Wed, 15 Jul 1998 11:16:38 -0700

82 lines

N-Ray Inspection

Neubauer, Terri

Wed, 15 Jul 1998 10:25:51 -0400

34 lines

New Thread

Need CAD format descriptions

Re: Need CAD format descriptions

Jeff Seeger

Fri, 24 Jul 1998 15:39:47 -0400

52 lines

Re: Need CAD format descriptions

Robert Welch

Fri, 24 Jul 1998 11:19:08 +0000

28 lines

Re: Need CAD format descriptions

Matthias Mansfeld

Fri, 24 Jul 1998 16:26:13 +0200

63 lines

Need CAD format descriptions

Helmut Wohland

Thu, 1 Jan 1970 01:00:00 +0000

35 lines

New Thread

need Reliability laboratory

Re: need Reliability laboratory

Delsen Testing Laboratories

Mon, 20 Jul 1998 16:01:53 -0700

63 lines

Re: need Reliability laboratory

Ted Stern

Mon, 20 Jul 1998 15:01:04 -0700

57 lines

need Reliability laboratory

Erat, Wolfgang

Mon, 20 Jul 1998 12:41:05 -0400

31 lines

New Thread

Need Supplier

Need Supplier

<>

Thu, 2 Jul 1998 13:31:13 EDT

27 lines

New Thread

Nelco web site

Re: Nelco web site

Alderete, Michael

Thu, 16 Jul 1998 07:09:43 -0700

47 lines

Re: Nelco web site

Howard Lin

Thu, 16 Jul 1998 00:38:14 +0800

24 lines

New Thread

Ni plated vias

Ni plated vias

Jim Herard

Wed, 8 Jul 1998 17:35:17 -0400

71 lines

New Thread

Nickel Melting Point

Re: Nickel Melting Point

Ruben Irizarry

Thu, 16 Jul 1998 14:54:55 -0300

22 lines

Re: Nickel Melting Point

Ruben Irizarry

Thu, 16 Jul 1998 14:19:10 -0300

23 lines

Re: Nickel Melting Point

McMonagle, Michael R.

Thu, 16 Jul 1998 12:14:49 -0500

55 lines

Re: Nickel Melting Point

Meigs, Jonathan

Thu, 16 Jul 1998 13:07:00 -0700

48 lines

Re: Nickel Melting Point

Larry Grazian

Thu, 16 Jul 1998 09:59:31 PDT

47 lines

Re: Nickel Melting Point

Paul Wilson

Thu, 16 Jul 1998 12:59:12 -0400

65 lines

Nickel Melting Point

Ruben Irizarry

Thu, 16 Jul 1998 12:31:22 -0300

24 lines

New Thread

Nickel Melting Point -Reply

Re: Nickel Melting Point -Reply

Ruben Irizarry

Thu, 16 Jul 1998 14:55:14 -0300

22 lines

Nickel Melting Point -Reply

Ron Hayashi

Thu, 16 Jul 1998 09:59:46 -0700

25 lines

New Thread

Nickel Plated Via's

Nickel Plated Via's

Signorelli, Paul

Wed, 8 Jul 1998 11:59:43 -0600

27 lines

New Thread

No Clean Flux

Re: No Clean Flux

Aric parr

Thu, 16 Jul 1998 07:08:31 EDT

101 lines

Re: No Clean Flux

Brent Alcorn

Wed, 15 Jul 1998 14:04:09 -0300

58 lines

No Clean Flux

<>

Wed, 15 Jul 1998 16:29:04 PST

37 lines

New Thread

no clean fluxes

Re: no clean fluxes

Aric parr

Mon, 27 Jul 1998 07:27:34 EDT

111 lines

Re: no clean fluxes

Noppadol S.

Sat, 25 Jul 1998 15:33:40 +0700

61 lines

no clean fluxes

Cheyenne Noda

Fri, 24 Jul 1998 15:00:19 -0700

33 lines

New Thread

No-clean and board incoming cleanliness

Re: No-clean and board incoming cleanliness

Bev Christian

Mon, 27 Jul 1998 19:06:33 -0400

76 lines

No-clean and board incoming cleanliness

Matthew Sanders

Mon, 27 Jul 1998 15:44:41 -0700

36 lines

New Thread

North Texas Chapter ~ IPC Designers Council Meeting July 9th @ 6:30PM

North Texas Chapter ~ IPC Designers Council Meeting July 9th @ 6:30PM

Keith Larson

Sat, 4 Jul 1998 06:55:20 -0500

227 lines

New Thread

Not read: Lead Solderability II

Not read: Lead Solderability II

Joseph E. J. Duclos Jr.

Tue, 21 Jul 1998 19:11:22 -0400

38 lines

Not read: Lead Solderability II

Marc Strickland

Tue, 21 Jul 1998 17:20:36 -0700

76 lines

New Thread

Not read: need info: automated counting chip capacitors / resisto rs

Not read: need info: automated counting chip capacitors / resisto rs

Mike Wilson

Mon, 27 Jul 1998 05:17:07 -0700

72 lines

New Thread

Obsolete FR2 1.60mm 1/1 - 4500kg

Obsolete FR2 1.60mm 1/1 - 4500kg

JB

Thu, 9 Jul 1998 15:18:19 +0800

36 lines

New Thread

OMEGA-PLY

Re: OMEGA-PLY

<>

Tue, 14 Jul 1998 16:21:58 +0000

57 lines

OMEGA-PLY

Lee Sang Soo

Wed, 15 Jul 1998 07:21:10 +0900

31 lines

New Thread

OSP thickness

OSP thickness

Predith, Ashley P

Tue, 14 Jul 1998 10:54:00 -0700

35 lines

New Thread

Oven belt speeds

Re: Oven belt speeds

Jan Satterfield

Mon, 27 Jul 1998 14:09:20 -0600

51 lines

Re: Oven belt speeds

ETS

Mon, 27 Jul 1998 09:23:35 -0700

71 lines

Oven belt speeds

Charles Barker

Mon, 27 Jul 1998 08:39:17 -0500

28 lines

New Thread

Oxidized HASL boards

Re: Oxidized HASL boards

Lenny Kurup

Fri, 10 Jul 1998 12:25:24 -0400

67 lines

Re: Oxidized HASL boards

David D Hillman

Wed, 8 Jul 1998 08:22:50 -0500

99 lines

Oxidized HASL boards

Thomas Jacob

Wed, 8 Jul 1998 12:08:34 +0200

43 lines

New Thread

Part Numbering System

Part Numbering System

Derek Wynne

Fri, 17 Jul 1998 16:31:12 +0100

91 lines

New Thread

PCB and Solder Paste Test Equipment

PCB and Solder Paste Test Equipment

Joaquin Molina

Mon, 27 Jul 1998 11:53:06 -0400

43 lines

PCB and Solder Paste Test Equipment

Joaquin Molina

Thu, 23 Jul 1998 10:45:15 -0400

41 lines

PCB and Solder Paste Test Equipment

Joaquin Molina

Wed, 22 Jul 1998 12:24:54 -0400

37 lines

Re: PCB and Solder Paste Test Equipment

Douglas Pauls

Tue, 21 Jul 1998 16:51:41 EDT

32 lines

PCB and Solder Paste Test Equipment

Joaquin Molina

Tue, 21 Jul 1998 16:23:18 -0400

37 lines

New Thread

PCB CAD Software Co's

Re: PCB CAD Software Co's

Mitch Morey

Thu, 30 Jul 1998 14:11:50 -0700

57 lines

New Thread

PCB Coatings Available

PCB Coatings Available

Hugh Scott Miller

Sun, 19 Jul 1998 16:48:02 -0400

35 lines

New Thread

PCB Fabrication Machine

PCB Fabrication Machine

ChongKwan Woo

Thu, 9 Jul 1998 12:15:55 +0900

40 lines

New Thread

PCB Finish Options

PCB Finish Options

Hugh Scott Miller

Sun, 19 Jul 1998 16:48:27 -0400

37 lines

New Thread

PCB Land Pattern for 1825 Ceramic Capactor

PCB Land Pattern for 1825 Ceramic Capactor

KK Chin

Thu, 16 Jul 1998 17:58:31 -0700

33 lines

New Thread

PCB Maximum Heat Excursions

Re: PCB Maximum Heat Excursions

Sauer, Steven T.

Tue, 21 Jul 1998 17:09:00 E

114 lines

Re: PCB Maximum Heat Excursions

<>

Tue, 21 Jul 1998 14:01:16 -0500

77 lines

New Thread

PCB papers for Am. Electroplater and Surface Finishers-June 21-24

PCB papers for Am. Electroplater and Surface Finishers-June 21-24

Richard Haynes

Fri, 31 Jul 1998 17:25:29 -0400

69 lines

New Thread

PCB Sales Opportunity

PCB Sales Opportunity

Allison Joy

Tue, 21 Jul 1998 21:27:47 -0700

26 lines

New Thread

PCB Thickness

Re: PCB Thickness

Joseph Zacharias

Mon, 6 Jul 1998 08:39:08 -0700

87 lines

Re: PCB Thickness

Eric Christison

Fri, 3 Jul 1998 10:39:49 +0100

45 lines

PCB Thickness

Andy Heidelberg

Thu, 2 Jul 1998 11:34:18 -0600

46 lines

New Thread

people advertising in technet!

Re: people advertising in technet!

Richard Tassone

Mon, 27 Jul 1998 07:32:47 -0700

165 lines

Re: people advertising in technet!

JB

Mon, 27 Jul 1998 20:59:59 +0800

149 lines

Re: people advertising in technet!

Per Viklund

Mon, 27 Jul 1998 12:46:39 +0200

104 lines

people advertising in technet!

Alex Stennett

Mon, 27 Jul 1998 10:37:14 +0000

61 lines

New Thread

people advertising in technet! -Reply

Re: people advertising in technet! -Reply

<>

Mon, 27 Jul 1998 13:22:13 EDT

23 lines

Re: people advertising in technet! -Reply

Larry Campbell

Mon, 27 Jul 1998 09:46:26 -0400

24 lines

New Thread

Phosphorous content of electroless Ni

Re: Phosphorous content of electroless Ni

Achim Neu

Wed, 8 Jul 1998 22:53:45 +0200

64 lines

Phosphorous content of electroless Ni

Htter Simon

Mon, 6 Jul 1998 07:59:24 +0100

38 lines

New Thread

Plant lay-out software

Re: Plant lay-out software

Chris Johnston

Mon, 20 Jul 1998 09:20:24 +1000

67 lines

Re: Plant lay-out software

Lustig, Steven K..

Fri, 17 Jul 1998 15:46:13 -0400

78 lines

Plant lay-out software

Marc O. Bituagan

Fri, 17 Jul 1998 15:05:08 +0000

35 lines

New Thread

Plating

Re: Plating

Goldman, Patricia J.

Thu, 23 Jul 1998 09:26:00 -0400

115 lines

Re: Plating

Phil Culpovich

Wed, 22 Jul 1998 19:47:01 -0700

43 lines

Re: Plating

Hans Rohr

Wed, 22 Jul 1998 20:41:18 -0400

49 lines

Re: Plating

Joel Fillion

Wed, 22 Jul 1998 08:51:57 -0700

60 lines

Re: Plating

Ed Cosper

Wed, 22 Jul 1998 11:08:10 -0500

73 lines

Plating

Dick Desrosiers

Wed, 22 Jul 1998 11:13:17 EDT

27 lines

New Thread

Plating -Reply

Re: Plating -Reply

IPC TechNet

Wed, 22 Jul 1998 12:06:05 -0700

110 lines

Plating -Reply

Ken Bridges

Wed, 22 Jul 1998 14:46:01 -0700

76 lines

New Thread

Plating Thickness

Re: Plating Thickness

Lum Wee Mei

Thu, 30 Jul 1998 09:11:57 +0800

92 lines

Re: Plating Thickness

Paul Gould

Wed, 29 Jul 1998 22:44:12 +0100

58 lines

Re: Plating Thickness

Nelson, John

Wed, 29 Jul 1998 13:20:14 -0400

54 lines

Re: Plating Thickness

Lanoline

Wed, 29 Jul 1998 18:56:39 +0200

67 lines

Plating Thickness

sarah

Wed, 29 Jul 1998 21:26:33 +0800

36 lines

New Thread

Polyimide M/L with pure nickel inner layers

Re: Polyimide M/L with pure nickel inner layers

<>

Thu, 2 Jul 1998 11:14:29 EDT

32 lines

Polyimide M/L with pure nickel inner layers

Maurice Colyer

Thu, 2 Jul 1998 00:19:33 +0100

54 lines

New Thread

Polyimide See Thru Stencils for Printing Solder Paste

Re: Polyimide See Thru Stencils for Printing Solder Paste

Myug C. Chu

Tue, 21 Jul 1998 13:01:08 +0900

89 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Kathy Palumbo

Mon, 6 Jul 1998 17:25:15 -0700

81 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Ryan Jennens

Mon, 6 Jul 1998 17:55:48 -0400

39 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Stephen R. Gregory

Mon, 6 Jul 1998 15:55:13 EDT

75 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Kathy Palumbo

Mon, 6 Jul 1998 10:47:01 -0700

166 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

McMonagle, Michael R.

Mon, 6 Jul 1998 12:23:50 -0500

136 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Kathy Palumbo

Mon, 6 Jul 1998 09:26:21 -0700

96 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Ryan Jennens

Mon, 6 Jul 1998 11:06:19 -0400

28 lines

Polyimide See Thru Stencils for Printing Solder Paste

Johannes Sivula

Tue, 30 Jun 1998 14:18:06 +0300

52 lines

New Thread

Polyimide SeeThru Stencil

Re: Polyimide SeeThru Stencil

Ryan Jennens

Tue, 28 Jul 1998 10:07:08 -0400

50 lines

Re: Polyimide SeeThru Stencil

Poh Kong Hui

Tue, 28 Jul 1998 21:42:58 +0800

30 lines

New Thread

Processes

Processes

Hugh Scott Miller

Sun, 19 Jul 1998 16:47:22 -0400

37 lines

New Thread

Provide me your current BGA Spec on void

Re: Provide me your current BGA Spec on void

Bev Christian

Wed, 15 Jul 1998 22:46:17 -0400

157 lines

Re: Provide me your current BGA Spec on void

David D Hillman

Tue, 14 Jul 1998 08:33:41 -0500

121 lines

Re: Provide me your current BGA Spec on void

Sean Heffernan

Mon, 13 Jul 1998 12:37:21 -0400

35 lines

Re: Provide me your current BGA Spec on void

sahmad

Mon, 13 Jul 1998 13:14:00 -0600

62 lines

Re: Provide me your current BGA Spec on void

Bev Christian

Fri, 10 Jul 1998 22:16:26 -0400

73 lines

Provide me your current BGA Spec on void

Ken Patel

Fri, 10 Jul 1998 15:21:55 -0700

33 lines

New Thread

PTH Hole to Lead Ratio

PTH Hole to Lead Ratio

Signorelli, Paul

Thu, 2 Jul 1998 11:29:23 -0600

24 lines

New Thread

PWBA Handling

Re: PWBA Handling

PELCHAT_JM

Fri, 31 Jul 1998 12:29:22 -0400

100 lines

Re: PWBA Handling

Cash, Alan

Fri, 31 Jul 1998 10:47:08 -0400

145 lines

Re: PWBA Handling

Stephen R. Gregory

Fri, 31 Jul 1998 10:37:26 EDT

87 lines

PWBA Handling

Kenny Bloomquist

Fri, 31 Jul 1998 06:53:31 -0700

50 lines

New Thread

Qfp's in wave

Re: Qfp's in wave

Ryan Jennens

Wed, 8 Jul 1998 13:40:40 -0400

31 lines

Re: Qfp's in wave

Sauer, Steven T.

Wed, 8 Jul 1998 10:19:00 E

87 lines

Re: Qfp's in wave

<Jason M. Smith>

Wed, 8 Jul 1998 07:58:37 -0400

78 lines

Qfp's in wave

Andre Bisson

Wed, 8 Jul 1998 07:45:00 -0400

45 lines

New Thread

RE : Sequential lamination for blind via

Re: RE : Sequential lamination for blind via

Andy Magee

Tue, 14 Jul 1998 11:29:29 -0400

63 lines

New Thread

RE : [TN] Immersion gold for wire bonding, a reply

RE : [TN] Immersion gold for wire bonding, a reply

Howard Lin

Thu, 16 Jul 1998 09:45:39 +0800

68 lines

New Thread

Re2000A

Re: Re2000A

Maguire, James F

Wed, 1 Jul 1998 08:33:36 -0700

92 lines

New Thread

Read: Lead Solderability II

Re: Read: Lead Solderability II

Steve Collins

Thu, 23 Jul 1998 12:43:45 -0600

79 lines

Re: Read: Lead Solderability II

Goldman, Patricia J.

Thu, 23 Jul 1998 10:21:00 -0400

51 lines

Read: Lead Solderability II

Peggi Blakley

Wed, 22 Jul 1998 11:59:19 -0500

40 lines

Read: Lead Solderability II

Michael Yarrow

Wed, 22 Jul 1998 11:31:00 +1000

39 lines

Re: Read: Lead Solderability II

<>

Tue, 21 Jul 1998 16:21:59 PDT

22 lines

Read: Lead Solderability II

Darrell J. Drake

Tue, 21 Jul 1998 18:14:07 -0500

39 lines

Read: Lead Solderability II

Ahne Oosterhof

Tue, 21 Jul 1998 14:43:34 -0700

37 lines

Read: Lead Solderability II

Dave Willhard

Tue, 21 Jul 1998 12:02:20 -0600

39 lines

New Thread

ReDewetting

Re: ReDewetting

McMonagle, Michael R.

Thu, 2 Jul 1998 09:21:05 -0500

145 lines

ReDewetting

<>

Thu, 2 Jul 1998 09:54:07 EDT

75 lines

New Thread

Reduced Black Oxide - Acid Resistance

Re: Reduced Black Oxide - Acid Resistance

Paul Wilson

Tue, 28 Jul 1998 06:22:08 -0400

103 lines

Reduced Black Oxide - Acid Resistance

Russell S Gregory

Mon, 27 Jul 1998 15:34:28 EDT

42 lines

New Thread

Register for Service

Register for Service

VINCENT KINOL

Mon, 6 Jul 1998 15:40:44 -0400

23 lines

New Thread

registration test method

registration test method

<Kim Heoung Kyu>

Mon, 20 Jul 1998 11:55:40 +0900

32 lines

New Thread

Reliability monitor program, Statistically sound?

Re: Reliability monitor program, Statistically sound?

Werner Engelmaier

Sun, 5 Jul 1998 12:34:42 EDT

43 lines

Reliability monitor program, Statistically sound?

Carson Ho

Sat, 4 Jul 1998 13:50:47 PDT

34 lines

New Thread

Reliability, thermal and electrical modeling for BGAs

Reliability, thermal and electrical modeling for BGAs

Yuan Li

Wed, 22 Jul 1998 16:41:02 -0700

33 lines

New Thread

REMOVE

REMOVE

Lichtenberg Yossi

Mon, 27 Jul 1998 08:04:14 +0200

86 lines

New Thread

research analyst

research analyst

Dave Burkhard

Mon, 6 Jul 1998 19:28:49 -0700

42 lines

New Thread

Resin Regeneration

Re: Resin Regeneration

Smith Russell MSM LAPO US

Thu, 30 Jul 1998 04:38:00 +0200

117 lines

Re: Resin Regeneration

Kathy Palumbo

Wed, 29 Jul 1998 13:36:45 -0700

83 lines

Resin Regeneration

Alan Kreplick

Wed, 29 Jul 1998 14:54:01 -0400

35 lines

New Thread

Re[2]: [TN] Assy: cause-effect diagram

Re: Re[2]: [TN] Assy: cause-effect diagram

Dudi Banitt

Thu, 9 Jul 1998 07:58:46 +-300

286 lines

Re: Re[2]: [TN] Assy: cause-effect diagram

Gu, Sam

Wed, 8 Jul 1998 16:52:23 -0700

249 lines

Re: Re[2]: [TN] Assy: cause-effect diagram

<Jason M. Smith>

Wed, 8 Jul 1998 15:20:53 -0400

172 lines

New Thread

Re[2]: [TN] Au/Ni/Cu PROBLEM

Re: Re[2]: [TN] Au/Ni/Cu PROBLEM

<>

Fri, 10 Jul 1998 13:03:52 EDT

39 lines

Re: Re[2]: [TN] Au/Ni/Cu PROBLEM

Lenny Kurup

Fri, 10 Jul 1998 12:19:57 -0400

133 lines

Re: Re[2]: [TN] Au/Ni/Cu PROBLEM

Jacques A Coderre

Wed, 8 Jul 1998 10:43:23 -0400

191 lines

Re: Re[2]: [TN] Au/Ni/Cu PROBLEM

Leslie O. Connally

Wed, 8 Jul 1998 08:38:30 -0700

139 lines

New Thread

Re[2]: [TN] Conformal coating

Re: Re[2]: [TN] Conformal coating

Mark Pozorski

Wed, 29 Jul 1998 10:13:55 -0600

50 lines

New Thread

RF Ground Thermal Considerations

RF Ground Thermal Considerations

<>

Tue, 21 Jul 1998 09:02:15 -0600

38 lines

New Thread

Rigid Bd. Corner Welds

Rigid Bd. Corner Welds

Youngblood, Lee

Wed, 8 Jul 1998 15:33:36 -0600

36 lines

New Thread

Routing Techniques

Routing Techniques

Hugh Scott Miller

Sun, 19 Jul 1998 16:47:52 -0400

37 lines

New Thread

S-N curves for solder

Re: S-N curves for solder

Werner Engelmaier

Tue, 7 Jul 1998 14:04:38 EDT

35 lines

S-N curves for solder

Sheila Smith

Mon, 6 Jul 1998 10:59:09 -0400

31 lines

New Thread

sampling plan

Re: sampling plan

<>

Thu, 23 Jul 1998 11:30:12 -0500

73 lines

sampling plan

Francisco Rios

Thu, 23 Jul 1998 09:04:53 -0700

31 lines

New Thread

Scoring

Re: Scoring

Kwong Chin

Thu, 30 Jul 1998 09:52:03 -0400

101 lines

Re: Scoring

Joseph E. J. Duclos Jr.

Thu, 30 Jul 1998 21:58:21 -0400

62 lines

Re: Scoring

Stephen R. Gregory

Thu, 30 Jul 1998 19:06:57 EDT

70 lines

Re: Scoring

Mitch Morey

Thu, 30 Jul 1998 14:53:54 -0700

101 lines

Re: Scoring

Erat, Wolfgang

Thu, 30 Jul 1998 16:40:42 -0400

68 lines

Re: Scoring

Jeff Hempton

Thu, 30 Jul 1998 15:12:20 -0500

31 lines

Re: Scoring

Jeff Hempton

Thu, 30 Jul 1998 14:54:15 -0500

62 lines

Re: Scoring

JoAnn Amerson

Thu, 30 Jul 1998 15:10:23 -0400

52 lines

Re: Scoring

Mark Simmons

Thu, 30 Jul 1998 10:47:20 -0700

32 lines

Re: Scoring

Brian K. Doughty

Thu, 30 Jul 1998 14:40:51 EDT

35 lines

Re: Scoring

Steve Collins

Thu, 30 Jul 1998 12:34:09 -0600

64 lines

Re: Scoring

Eldon Sanders

Thu, 30 Jul 1998 10:58:33 -0700

72 lines

Scoring

<>

Thu, 30 Jul 1998 11:42:16 -0500

35 lines

New Thread

see items

Re: see items

Noppadol S.

Fri, 3 Jul 1998 08:07:54 +0700

77 lines

New Thread

Separating email for designers, fabricators and assembly

Separating email for designers, fabricators and assembly

Coleman, Rob

Mon, 6 Jul 1998 15:47:17 -0500

21 lines

New Thread

Sequential lamination for blind via

Re: Sequential lamination for blind via

Andy Magee

Sun, 12 Jul 1998 08:14:08 -0400

53 lines

Sequential lamination for blind via

Howard Lin

Sat, 11 Jul 1998 16:57:00 +0800

33 lines

New Thread

SERA and White Tin

Re: SERA and White Tin

Michael Pavlov

Fri, 17 Jul 1998 15:08:38 EDT

35 lines

New Thread

SERA and White Tin, reply

Re: SERA and White Tin, reply

David D Hillman

Mon, 20 Jul 1998 09:58:09 -0500

125 lines

Re: SERA and White Tin, reply

Douglas Pauls

Fri, 17 Jul 1998 15:21:41 EDT

74 lines

SERA and White Tin, reply

Paul Wilson

Fri, 17 Jul 1998 13:00:08 -0400

84 lines

New Thread

SERA Testers

Re: SERA Testers

Bogdan Gabi

Wed, 15 Jul 1998 17:20:15 +0200

31 lines

Re: SERA Testers

David D Hillman

Wed, 15 Jul 1998 08:54:31 -0500

84 lines

SERA Testers

Hogue, Pat (AZ76)

Tue, 14 Jul 1998 18:23:45 -0700

35 lines

New Thread

SiGE vrs GaAs

SiGE vrs GaAs

Frank K. Frimpong

Wed, 1 Jul 1998 08:55:24 +0000

26 lines

New Thread

Silicone grease around soldered joints!

Re: Silicone grease around soldered joints!

Stephen R. Mikell

Fri, 31 Jul 1998 10:24:42 -0500

64 lines

Re: Silicone grease around soldered joints!

Cash, Alan

Fri, 31 Jul 1998 09:57:16 -0400

98 lines

Re: Silicone grease around soldered joints!

Vaughan, Ralph H

Fri, 31 Jul 1998 05:33:49 -0700

94 lines

Re: Silicone grease around soldered joints!

Bev Christian

Fri, 31 Jul 1998 08:29:20 -0400

107 lines

Silicone grease around soldered joints!

Dave Thomas

Fri, 31 Jul 1998 11:01:41 +0100

61 lines

New Thread

SMB, SOD123 Footprint

SMB, SOD123 Footprint

Colin Weber

Fri, 17 Jul 1998 16:13:04 +1000

51 lines

New Thread

SMD pads on hybrids

Re: SMD pads on hybrids

<Eden Chen>

Mon, 27 Jul 1998 08:49:02 +0800

156 lines

Re: SMD pads on hybrids

Clive Ffitch

Fri, 24 Jul 1998 10:42:12 PST

119 lines

SMD pads on hybrids

Ed Holton

Thu, 23 Jul 1998 07:56:58 -0400

50 lines

New Thread

Sn/Pb/Ag Phase Diagram

Re: Sn/Pb/Ag Phase Diagram

sahmad

Mon, 20 Jul 1998 09:44:09 -0600

50 lines

Re: Sn/Pb/Ag Phase Diagram

SEM Lab, Inc.

Fri, 3 Jul 1998 07:31:59 -0500

58 lines

Sn/Pb/Ag Phase Diagram

Frank, Jr. Komitsky

Wed, 1 Jul 1998 02:26:42 -0400

25 lines

New Thread

Solder ball ussues with NC paste

Re: Solder ball ussues with NC paste

Brad Kendall

Tue, 14 Jul 1998 13:12:55 -0400

75 lines

Re: Solder ball ussues with NC paste

Matthias Mansfeld

Tue, 14 Jul 1998 17:54:25 +0200

38 lines

Solder ball ussues with NC paste

Andre Bisson

Fri, 10 Jul 1998 13:40:41 -0400

57 lines

New Thread

Solder ball ussues with NC paste -Reply

Re: Solder ball ussues with NC paste -Reply

Nasir Hanif

Tue, 14 Jul 1998 09:34:05 -0500

45 lines

Re: Solder ball ussues with NC paste -Reply

Brad Kendall

Tue, 14 Jul 1998 09:00:42 -0400

194 lines

Re: Solder ball ussues with NC paste -Reply

Andre Bisson

Mon, 13 Jul 1998 14:49:46 -0400

150 lines

Solder ball ussues with NC paste -Reply

Matthew Park

Mon, 13 Jul 1998 10:18:41 -0700

92 lines

New Thread

Solder ball ussues with NC paste -Reply -Reply

Re: Solder ball ussues with NC paste -Reply -Reply

Stephen R. Gregory

Mon, 13 Jul 1998 17:28:44 EDT

46 lines

Re: Solder ball ussues with NC paste -Reply -Reply

Matthew Park

Mon, 13 Jul 1998 13:47:46 -0700

213 lines

New Thread

Solder Balls

Solder Balls

Bobby R. Mangona

Thu, 30 Jul 1998 11:36:38 +0000

34 lines

New Thread

solder balls/ solder fines

solder balls/ solder fines

Valladares, Hector A (FL51)

Mon, 6 Jul 1998 12:17:31 -0400

37 lines

New Thread

solder fines/solder ball

solder fines/solder ball

Valladares, Hector A (FL51)

Thu, 2 Jul 1998 10:38:32 -0400

33 lines

New Thread

solder joint of low profile smd

solder joint of low profile smd

Bogdan Gabi

Mon, 6 Jul 1998 17:01:40 +0200

41 lines

New Thread

solder mask between pads part2

Re: solder mask between pads part2

Smith Russell MSM LAPO US

Fri, 3 Jul 1998 21:19:00 +0200

72 lines

New Thread

Solder on Goldfinger

Re: Solder on Goldfinger

ETS

Thu, 23 Jul 1998 14:15:08 -0700

88 lines

Solder on Goldfinger

Muhammad, Masdi

Wed, 22 Jul 1998 16:03:00 -0700

50 lines

New Thread

Solder Shear results

Re: Solder Shear results

Werner Engelmaier

Mon, 20 Jul 1998 17:33:45 EDT

34 lines

Solder Shear results

Tamara Bloomer

Mon, 20 Jul 1998 13:00:10 -0500

34 lines

New Thread

solder short

Re: solder short

Noppadol S.

Mon, 27 Jul 1998 12:30:25 +0700

101 lines

Re: solder short

Hans Rohr

Sat, 25 Jul 1998 19:57:22 -0400

41 lines

Re: solder short

Stephen R. Gregory

Sat, 25 Jul 1998 14:19:18 EDT

67 lines

solder short

Krishna Kalyan

Sat, 25 Jul 1998 09:07:03 PDT

32 lines

New Thread

Solder Short - Steve Gregory

Re: Solder Short - Steve Gregory

<>

Mon, 27 Jul 1998 21:05:53 EDT

23 lines

Re: Solder Short - Steve Gregory

<>

Mon, 27 Jul 1998 20:19:12 EDT

43 lines

New Thread

Solder strip dump criteria

Solder strip dump criteria

Michael D. Doty

Thu, 2 Jul 1998 21:36:20 -0400

35 lines

New Thread

Solder thickness needed after HASL

Re: Solder thickness needed after HASL

SEM Lab, Inc.

Mon, 13 Jul 1998 06:13:42 -0500

66 lines

Re: Solder thickness needed after HASL

Charles Barker

Fri, 10 Jul 1998 18:26:51 -0500

72 lines

Re: Solder thickness needed after HASL

Mark Simmons

Fri, 10 Jul 1998 15:23:32 -0700

31 lines

Re: Solder thickness needed after HASL

Mark Simmons

Fri, 10 Jul 1998 15:13:33 -0700

48 lines

Re: Solder thickness needed after HASL

Matthew Sanders

Fri, 10 Jul 1998 11:49:56 -0700

75 lines

Solder thickness needed after HASL

Charles Barker

Fri, 10 Jul 1998 12:20:31 -0500

35 lines

New Thread

Solder-ball

Re: Solder-ball

Frank, Jr. Komitsky

Wed, 29 Jul 1998 06:20:30 -0400

77 lines

Re: Solder-ball

Noppadol S.

Wed, 29 Jul 1998 08:01:43 +0700

79 lines