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July 1998


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회신: [TN] Au/Ni/Cu PROBLEM (1 message)
회신: [TN] OMEGA-PLY (1 message)
"Standard" fabrication allowance (1 message)
(TN) Polyimide SeeThru Stencil (1 message)
: Assy : Solder on Gold finger (3 messages)
: Component Solderability (2 messages)
: Dropout IC. (1 message)
<No subject> (3 messages)
<None> (1 message)
a plea from a researcher (1 message)
A word about Spam. (1 message)
Acceptability criteria for innerlayer interconnect (2 messages)
Acid and oil recycling (2 messages)
Acid SnPb Conditioner w/vapr phase Reflow (2 messages)
Acid SnPb Conditioner w/vapr phase Reflow -Reply (2 messages)
Acid stoper in developing (5 messages)
adara press (1 message)
Admin Notice: Commenting on Standards (1 message)
ADMIN REPLY-PLEASE DO NOT OPEN THIS LINK: [TN] hdd (1 message)
Al vs. Au wire (1 message)
Alternate Solder Paste Supplier (1 message)
ALUMINUM WEDGE BONDING?? (1 message)
An aqueous cleaning question (4 messages)
Analysis (4 messages)
Analysis labs (2 messages)
Anyone knows of an agressive resist developin equipment (2 messages)
AOI of DST-foil (4 messages)
Apology for trip plans posting (1 message)
ass'y: Torque on FR-4 (1 message)
assembly (1 message)
Assembly process for plastic parts (2 messages)
Assembly unusual part? (2 messages)
Assembly/Surface Finishes (1 message)
ASSY: BGA sanity check (5 messages)
Assy: cause-effect diagram (20 messages)
Assy: cause-effect diagram -Reply (1 message)
ASSY: Duroid Material (3 messages)
assy: flip chip (5 messages)
ASSY: Gold Finger Configurations (2 messages)
ASSY: In-Line Inspection and SPC (1 message)
ASSY: RTV Repair to PWAs (2 messages)
ASSY: Thermally/Electrically Conductive Epoxy (4 messages)
ASSY:In-Line Inspec (1 message)
ASSY:Reliability, SMT (2 messages)
Attempted rework of Oxidized HASL boards (1 message)
Attn. Users of DEK ProFlow system (4 messages)
Attn: Change of screen name (1 message)
Au/Ni/Cu PROBLEM (7 messages)
Automated COF Assembly (1 message)
Automotive Standard Thermal Application Spec. (2 messages)
Available Plating Options (1 message)
BAAN system (1 message)
Base Materials (3 messages)
Base Materials - more.... (1 message)
batch reflow ovens (3 messages)
BGA - X-ray (1 message)
BGA Ball Attachment Process (9 messages)
BGA reballing equipment (2 messages)
BGA soldering on Immersion Nickel Gold PCB (2 messages)
Black Epoxy (4 messages)
Black Oxide Filtration (4 messages)
Black Oxide Filtration -Reply (1 message)
Bond strength pins (2 messages)
Boron Electroless Nickel (1 message)
Bull**** (2 messages)
Bull****:: ADMIN RESPONSE (2 messages)
Buried Capacitance (2 messages)
Buried Capacitance? (2 messages)
C.O.P.S. software from Camalot (Speedline). (7 messages)
C.O.P.S. Software problems (2 messages)
Call for Papers - IPC Expo '99 (1 message)
CAM Software for Pick & Place (2 messages)
Carbon Ink (1 message)
Carbon Ink -Reply (1 message)
Carbon ink resource (3 messages)
Carbon ink resource -Reply (1 message)
Carbon Ink Suppliers. (1 message)
Cause & Effect Diagram (1 message)
Cause and effect diagram (1 message)
cause effect diagram, (1 message)
cause-effect diagram - some gentle advice (1 message)
CEM-1 (4 messages)
chemically resistant pump (2 messages)
Coax Cable Assemblies (1 message)
Column Grid Arrays (4 messages)
Component tape pulling force. (1 message)
Compositech laminates (1 message)
Conductive Epoxy adhesive (4 messages)
Conductive Epoxy adhesive -Reply (1 message)
Conductive Expoxy Adhesive (1 message)
Conductor Routing (1 message)
Conductor Routing Question (3 messages)
Confirmation of Receipt (2 messages)
Conformal coating (3 messages)
Conformal Coating Adhesion over low res. Fluxes (3 messages)
Contact Systems CS-400C (3 messages)
Contamination Testing for Water Soluble Flux Residue (1 message)
Contract Test Labs for SERA White Tin Tests (Florida CirTech (1 message)
Contract Test Labs for SERA White Tin Tests (Florida CirTech Omikron) (1 message)
Controlled Impedance Testing (3 messages)
Copper Stains on suface of Au Fingers (2 messages)
CP642 vs CM88-CM or Fuji vs Panasonic (4 messages)
CP642 vs CM88-CM or Fuji vs Panasonic- Part II (3 messages)
Cracked capacitors and bulbuous joints (2 messages)
CSP underfill, (2 messages)
CSR 2600 (1 message)
CSR2600 (1 message)
CTE of PCB Laminates (3 messages)
CTE of PCB Laminates -Reply (2 messages)
CTE of PCB material [aramid info] (1 message)
CTE of PCB material. (3 messages)
Cu stains on Au fingers (1 message)
DEK ProFlow (1 message)
delamination (4 messages)
Delamination Problems (4 messages)
Design & DFM Software (5 messages)
DEWETTING (3 messages)
Diazo adhesive transfer film (2 messages)
Diazo adhesive transfer film -Reply (1 message)
Diode Polarity (2 messages)
Diversion, flame if you will! (1 message)
Dropped boards (2 messages)
Dump Criteria for Solder Strip (5 messages)
Dump Criteria for Solder Strip (fwd) (1 message)
Duofoil Replacement (2 messages)
EIA sts. (2 messages)
ELECTRIC TESTER FOR BGA (1 message)
Electrical Testing Techniques (1 message)
Electro-Migration (1 message)
Electroless Copper Plating on Teflon and BT (4 messages)
Electroless Nickel (3 messages)
Electronic meters for copper thickness (3 messages)
Electronic/ESD Packaging Guidelines (3 messages)
Electropolishing Laser-Cut Stencils (5 messages)
ENVIORNMENTAL DATA IN PACKAGING (2 messages)
Environmental tests for press-fit components (1 message)
EP&P article, Au diffusion in near eutectic solder. (1 message)
EPCmail-3 (1 message)
equipment selection model (2 messages)
ESD Faraday shielding (2 messages)
ESD grounding (3 messages)
etch factor (3 messages)
Express Packaging Services and John Lau (1 message)
Fab : Solder mask thickness (4 messages)
Fab : Solder mask thicknessA Reply (1 message)
Fab: Bow & Twist (2 messages)
FAB: FR-4 Thermal Limits? (1 message)
Fab: Permanganate (5 messages)
FAB: Plugged, Filled &/or Tented Vias (2 messages)
Farewell TechNet - Technical Writer Available (2 messages)
Fidutial Requirements (2 messages)
Final/Sort Inspection (1 message)
Flow patterns on multi-layer boards (1 message)
Fluid Head (1 message)
Flux on Goldfinger (5 messages)
FR-4 Emittance (4 messages)
FR-5 vs Warp & Twist (3 messages)
FR4 and EP3 (1 message)
FR4 insulator thickness (1 message)
Fw: Travel arrangements to Austin, TX Sept 23 - 26, 1998 (1 message)
Fw: Travel arrangements to Dallas Sept 15, 1998 (5 messages)
FW: [TN] C.O.P.S. Software problems (1 message)
FW: [TN] Electropolishing Laser-Cut Stencils (1 message)
FW: [TN] Mil-S-13949 (1 message)
FW: [TN] MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS (1 message)
Fwd: reflow oven (10 messages)
Gen: Finstrate Finestrate (1 message)
GEN: IPC Standard for Stencil Apertures (2 messages)
Get The Cash You Need Now!!! (1 message)
Glenbrook x-ray?? (12 messages)
Glue Print (1 message)
Gold Cleaning/Etching (3 messages)
Gold Coated Solder (1 message)
Gold Finish (2 messages)
Gold thickness - Edge (2 messages)
Good Gas Mask?? (1 message)
hdd (1 message)
Help with Ionic Contamination testing (1 message)
HF BGA Testing (2 messages)
Homeplate-shaped Pads (3 messages)
Hot Bar Soldering?? (8 messages)
HTC Contact (2 messages)
I need some CEM3 .059 1/1 and 1/0 laminate (1 message)
Ideas for PCB Supplier Survey Content (2 messages)
immersion Au (2 messages)
Immersion gold for wire bonding (2 messages)
Immersion gold for wire bonding, a reply (1 message)
Impedance (5 messages)
Inf On Facit Paper Tape Puncher (3 messages)
inquire (1 message)
Intermetallic Phase: BGA soldering on Immersion Nickel Gold PCB (2 messages)
International Approvals (1 message)
intrusive reflow and all (1 message)
IPC HOLE TO LEAD RATIOS (1 message)
IPC Standards (1 message)
IPC std procedure for PCB storage condition. (4 messages)
IPC-1710 and 1720 (1 message)
IPC-B-36 Test Coupons (2 messages)
IPC-D-325A Question (4 messages)
Is Ni/Au Discoloration comments from manufacturer valid? (1 message)
Is there a masking product that is non-conductive and can be left on after conformal coating. (1 message)
J-STD-001B (1 message)
KEMET capacitor 2225 size --not suitable for wave solder ing??? (4 messages)
KEMET capacitor 2225 size --not suitable for wave soldering??? (1 message)
Lab for Ion chromatography (IC) analysis (3 messages)
Lab to do MILSTD883 testing (2 messages)
Lab to do MILSTD883 testing -Reply (1 message)
Land/Hole fabrication allowance (1 message)
lead free solder (4 messages)
Lead Solderability (4 messages)
Lead Solderability II (3 messages)
Lead Trimming Question ? (2 messages)
Lead Trimming Question ? -Reply (1 message)
Lg component mounting advice (1 message)
Listing of PCB CAD Companies (4 messages)
Look for contact information of Express Packaging Systems and Joh n Lau (1 message)
Looking for A Pcad Designer or Bureau... (1 message)
Looking for Barnaby Tack (1 message)
Looking for BGA X ray inspection criteria (1 message)
LOOKING FOR MANUFACTURE CAN WORK GETEK 0.0035 (1 message)
Magazines and Journals (4 messages)
mailing list (2 messages)
Manganin wire (3 messages)
Manual insertion cycle time (3 messages)
Manual Insertion Time (2 messages)
Max operating temp - PBGA (1 message)
Micro Via Processing (1 message)
Midwest Circuit Association (1 message)
Mil Std P28809 - Ionic Residue PCB (2 messages)
Mil-S-13949 (2 messages)
MIL-S-13949 Cancellation Notice (1 message)
MIL-STD-130 (5 messages)
Military Spec Crossovers (1 message)
Military Specifications (1 message)
Mini Micro Stencil Phone # (2 messages)
Mini Micro Stencil Phone # -Reply (1 message)
Modeling moisture exposure in laminate (1 message)
MOUNTING HOLE (2 messages)
MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS (3 messages)
MVIIF vs CP642 or Fuji vs Panasert - Part II (2 messages)
N-Proply-Bromide (Ensolv) compatability with Uralane 575 3 and 5750 (1 message)
N-Proply-Bromide (Ensolv) compatability with Uralane 5753 and 5750 (1 message)
N-Ray Inspection (2 messages)
Need CAD format descriptions (4 messages)
need Reliability laboratory (3 messages)
Need Supplier (1 message)
Nelco web site (2 messages)
Ni plated vias (1 message)
Nickel Melting Point (7 messages)
Nickel Melting Point -Reply (2 messages)
Nickel Plated Via's (1 message)
No Clean Flux (3 messages)
no clean fluxes (3 messages)
No-clean and board incoming cleanliness (2 messages)
North Texas Chapter ~ IPC Designers Council Meeting July 9th @ 6:30PM (1 message)
Not read: Lead Solderability II (2 messages)
Not read: need info: automated counting chip capacitors / resisto rs (1 message)
Obsolete FR2 1.60mm 1/1 - 4500kg (1 message)
OMEGA-PLY (2 messages)
OSP thickness (1 message)
Oven belt speeds (3 messages)
Oxidized HASL boards (3 messages)
Part Numbering System (1 message)
PCB and Solder Paste Test Equipment (5 messages)
PCB CAD Software Co's (1 message)
PCB Coatings Available (1 message)
PCB Fabrication Machine (1 message)
PCB Finish Options (1 message)
PCB Land Pattern for 1825 Ceramic Capactor (1 message)
PCB Maximum Heat Excursions (2 messages)
PCB papers for Am. Electroplater and Surface Finishers-June 21-24 (1 message)
PCB Sales Opportunity (1 message)
PCB Thickness (3 messages)
people advertising in technet! (4 messages)
people advertising in technet! -Reply (2 messages)
Phosphorous content of electroless Ni (2 messages)
Plant lay-out software (3 messages)
Plating (6 messages)
Plating -Reply (2 messages)
Plating Thickness (5 messages)
Polyimide M/L with pure nickel inner layers (2 messages)
Polyimide See Thru Stencils for Printing Solder Paste (9 messages)
Polyimide SeeThru Stencil (2 messages)
Processes (1 message)
Provide me your current BGA Spec on void (6 messages)
PTH Hole to Lead Ratio (1 message)
PWBA Handling (4 messages)
Qfp's in wave (4 messages)
RE : Sequential lamination for blind via (1 message)
RE : [TN] Immersion gold for wire bonding, a reply (1 message)
Re2000A (1 message)
Read: Lead Solderability II (8 messages)
ReDewetting (2 messages)
Reduced Black Oxide - Acid Resistance (2 messages)
Register for Service (1 message)
registration test method (1 message)
Reliability monitor program, Statistically sound? (2 messages)
Reliability, thermal and electrical modeling for BGAs (1 message)
REMOVE (1 message)
research analyst (1 message)
Resin Regeneration (3 messages)
Re[2]: [TN] Assy: cause-effect diagram (3 messages)
Re[2]: [TN] Au/Ni/Cu PROBLEM (4 messages)
Re[2]: [TN] Conformal coating (1 message)
RF Ground Thermal Considerations (1 message)
Rigid Bd. Corner Welds (1 message)
Routing Techniques (1 message)
S-N curves for solder (2 messages)
sampling plan (2 messages)
Scoring (13 messages)
see items (1 message)
Separating email for designers, fabricators and assembly (1 message)
Sequential lamination for blind via (2 messages)
SERA and White Tin (1 message)
SERA and White Tin, reply (3 messages)
SERA Testers (3 messages)
SiGE vrs GaAs (1 message)
Silicone grease around soldered joints! (5 messages)
SMB, SOD123 Footprint (1 message)
SMD pads on hybrids (3 messages)
Sn/Pb/Ag Phase Diagram (3 messages)
Solder ball ussues with NC paste (3 messages)
Solder ball ussues with NC paste -Reply (4 messages)
Solder ball ussues with NC paste -Reply -Reply (2 messages)
Solder Balls (1 message)
solder balls/ solder fines (1 message)
solder fines/solder ball (1 message)
solder joint of low profile smd (1 message)
solder mask between pads part2 (1 message)
Solder on Goldfinger (2 messages)
Solder Shear results (2 messages)
solder short (4 messages)
Solder Short - Steve Gregory (2 messages)
Solder strip dump criteria (1 message)
Solder thickness needed after HASL (6 messages)
Solder-ball (5 messages)
Solderability of BGA (1 message)
Solderability test - period of validation (3 messages)
Soldering microswitch legs (2 messages)
Soldermask web at fine pitch components leads (2 messages)
solderpaste screen (4 messages)
Solid Solder Deposits (1 message)
source for EMI/RFI shields (6 messages)
Sources for SAM and Fein Focus (6 messages)
Spanish Translation of IPC-A-610B (1 message)
SPC (8 messages)
SPC IMPLEMETATION (1 message)
Special Technologies (1 message)
Specific Listing For CAD PCB Software (1 message)
Spray Fluxer (5 messages)
spray fluxing (7 messages)
standard mounting of chip components (1 message)
Standard Panel Sizes (2 messages)
Stiffer FR4 material? (4 messages)
Stiffer FR4 material? -Reply (1 message)
Subject: Automotive Standard Thermal Application Spec (2 messages)
Subscribe (5 messages)
Subscription (2 messages)
Super flat PCB (9 messages)
Supplier Survey (1 message)
Supplier Survey Format Final Edition (2 messages)
Suppliers for White ID material for PCB (2 messages)
Surface to hole ratio of copper plating (4 messages)
SV: [TN] Washing of small PCB (1 message)
tact time for Fuji CP6(PnP) (1 message)
Tamura (1 message)
tantalum caps (1 message)
TechNet Digest - 14 Jul 1998 - Special issue (1 message)
TechNet Digest - 19 Jul 1998 to 20 Jul 1998 - Special issue (1 message)
TechNet E-Mail Forum (2 messages)
Technologies for blind HW (4 messages)
teletype (2 messages)
test stamps (1 message)
Thermal Cycling Chambers (3 messages)
Thermal cycling to determine board reliability (5 messages)
Thermal relief and RF design (1 message)
Thermal relief and RF design -Reply (1 message)
Thermallly conductive PWB materials (5 messages)
Thermally conductive PWB materials (2 messages)
Thick Laminate Wanted (1 message)
Thinner for Alpha 615/25 flux (2 messages)
Through Hole Technology (THT) Solder Joint Reliability (2 messages)
Tin Whiskers (1 message)
tinning temperature (1 message)
TN:Need Tinning service for SMT (1 message)
Tolerances for routed slots in pcb (1 message)
Too much mail from TechNET! - Here is a solution... (2 messages)
Torque on FR-4 (1 message)
Torque specifications (1 message)
Training (2 messages)
Traveler/Route sheet software (3 messages)
uBGA assy (4 messages)
Underfill (2 messages)
Underfill epoxy for flip chip (2 messages)
Underfill epoxy for flip chip -Reply (1 message)
Unregistered SMT components (8 messages)
unsubscribe (4 messages)
updated IPC (2 messages)
Vertical Fill on Through-hole Motherboard Connectors (1 message)
Voltage derating of Aluminum Electrolytic Caps (1 message)
Warpage (5 messages)
Wave Solder Pot Temp-63/37 (2 messages)
Wave Soldering Mixed Technology CCAs (3 messages)
wetting balances (4 messages)
Where to start? (2 messages)
White ID Materail (3 messages)
White Tin Immersion (11 messages)
Windows 95 Backup (3 messages)
Wire Bonding and Immersion White Tin (1 message)
Wirebonding on Solder (1 message)
X_ray Inspection Systems (1 message)
[TN] Acid SnPb Conditioner w/vapr phase Reflow (2 messages)
[TN] Assy: cause-effect diagram (2 messages)
[TN] Au/Ni/Cu PROBLEM (1 message)
[TN] Buried Capacitance? (1 message)
[TN] Conformal coating (1 message)
[TN] Flux on Goldfinger (1 message)
[TN] Glenbrook x-ray?? (1 message)
[TN] SMD pads on hybrids (1 message)
[TN] Soldermask web at fine pitch components leads (1 message)
[TN] Spray Fluxer (1 message)
[TN] Thermallly conductive PWB materials (1 message)

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Date

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New Thread

회신: [TN] Au/Ni/Cu PROBLEM

회신: [TN] Au/Ni/Cu PROBLEM

Jin-ho Lee <[log in to unmask]>

Sat, 4 Jul 1998 07:37:22 +0900

30 lines

New Thread

회신: [TN] OMEGA-PLY

회신: [TN] OMEGA-PLY

Jin-ho Lee <[log in to unmask]>

Wed, 15 Jul 1998 08:45:40 +0900

31 lines

New Thread

Re:

Thomas Then <[log in to unmask]>

Tue, 14 Jul 1998 15:21:11 +1000

27 lines

New Thread

"Standard" fabrication allowance

"Standard" fabrication allowance

Mike Spencer <[log in to unmask]>

Wed, 29 Jul 1998 16:09:03 -0700

48 lines

New Thread

(TN) Polyimide SeeThru Stencil

Re: (TN) Polyimide SeeThru Stencil

Marc O. Bituagan <[log in to unmask]>

Tue, 21 Jul 1998 18:08:12 +0000

35 lines

New Thread

: Assy : Solder on Gold finger

: Assy : Solder on Gold finger

Poh Kong Hui <[log in to unmask]>

Thu, 16 Jul 1998 01:41:48 +0800

30 lines

Re: : Assy : Solder on Gold finger

Ryan Jennens <[log in to unmask]>

Wed, 15 Jul 1998 14:16:13 -0400

34 lines

Re: : Assy : Solder on Gold finger

Noppadol S. <[log in to unmask]>

Sat, 25 Jul 1998 16:34:33 +0700

92 lines

New Thread

: Component Solderability

: Component Solderability

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 22 Jul 1998 07:57:00 PDT

39 lines

Re: : Component Solderability

Ryan Jennens <[log in to unmask]>

Wed, 22 Jul 1998 12:01:30 -0400

29 lines

New Thread

: Dropout IC.

: Dropout IC.

Poh Kong Hui <[log in to unmask]>

Thu, 2 Jul 1998 22:58:45 +0800

30 lines

New Thread

<No subject>

<No subject>

Paul Wilson <[log in to unmask]>

Mon, 6 Jul 1998 05:53:22 -0400

22 lines

<No subject>

_***_ (Bulll*sEye) <[log in to unmask]>

Fri, 17 Jul 1998 11:35:59 -0700

144 lines

<No subject>

Curt Öst <[log in to unmask]>

Mon, 20 Jul 1998 11:38:00 +0200

28 lines

New Thread

<None>

<None>

James A. Zeman <[log in to unmask]>

Tue, 21 Jul 1998 15:06:00 -0500

66 lines

New Thread

a plea from a researcher

a plea from a researcher

Alex Stennett <[log in to unmask]>

Wed, 8 Jul 1998 09:57:12 +0000

65 lines

New Thread

A word about Spam.

A word about Spam.

Hugo Scaramuzza <[log in to unmask]>

Wed, 29 Jul 1998 13:07:21 -0500

62 lines

New Thread

Acceptability criteria for innerlayer interconnect

Acceptability criteria for innerlayer interconnect

John Sater <[log in to unmask]>

Sun, 19 Jul 1998 03:52:16 -0700

37 lines

Re: Acceptability criteria for innerlayer interconnect

[log in to unmask]

Sun, 19 Jul 1998 15:37:17 EDT

28 lines

New Thread

Acid and oil recycling

Acid and oil recycling

Christopher Rhodes <[log in to unmask]>

Wed, 22 Jul 1998 11:06:30 -0500

50 lines

Re: Acid and oil recycling

Leslie O. Connally <[log in to unmask]>

Wed, 22 Jul 1998 13:03:22 -0700

86 lines

New Thread

Acid SnPb Conditioner w/vapr phase Reflow

Acid SnPb Conditioner w/vapr phase Reflow

Zachery D Boettcher <[log in to unmask]>

Mon, 27 Jul 1998 18:54:56 +0100

28 lines

Re: Acid SnPb Conditioner w/vapr phase Reflow

<Rudy Sedlak> <[log in to unmask]>

Mon, 27 Jul 1998 21:53:09 EDT

37 lines

New Thread

Acid SnPb Conditioner w/vapr phase Reflow -Reply

Re: Acid SnPb Conditioner w/vapr phase Reflow -Reply

Zachery D Boettcher <[log in to unmask]>

Tue, 28 Jul 1998 12:16:15 +0100

28 lines

Re: Acid SnPb Conditioner w/vapr phase Reflow -Reply

Ted Stern <[log in to unmask]>

Tue, 28 Jul 1998 13:53:58 -0700

68 lines

New Thread

Acid stoper in developing

Acid stoper in developing

WHATEVER <[log in to unmask]>

Tue, 21 Jul 1998 22:31:19 -0500

32 lines

Re: Acid stoper in developing

Nelson, John <[log in to unmask]>

Wed, 22 Jul 1998 08:04:39 -0400

43 lines

Re: Acid stoper in developing

Jacob Mozel <[log in to unmask]>

Wed, 22 Jul 1998 23:43:56 +0300

59 lines

Re: Acid stoper in developing

Smith Russell MSM LAPO US <[log in to unmask]>

Thu, 23 Jul 1998 05:29:00 +0200

66 lines

Re: Acid stoper in developing

WHATEVER <[log in to unmask]>

Thu, 23 Jul 1998 16:57:11 -0500

89 lines

New Thread

adara press

adara press

james <[log in to unmask]>

Sat, 4 Jul 1998 10:20:27 +0800

32 lines

New Thread

Admin Notice: Commenting on Standards

Admin Notice: Commenting on Standards

Jack Crawford <[log in to unmask]>

Thu, 2 Jul 1998 11:38:30 -0500

197 lines

New Thread

ADMIN REPLY-PLEASE DO NOT OPEN THIS LINK: [TN] hdd

ADMIN REPLY-PLEASE DO NOT OPEN THIS LINK: [TN] hdd

Jack Crawford <[log in to unmask]>

Mon, 6 Jul 1998 20:25:59 -0500

33 lines

New Thread

Al vs. Au wire

Al vs. Au wire

Edwin Maximo <[log in to unmask]>

Fri, 17 Jul 1998 17:29:58 +0000

36 lines

New Thread

Alternate Solder Paste Supplier

Alternate Solder Paste Supplier

Hogue, Pat (AZ76) <[log in to unmask]>

Wed, 8 Jul 1998 19:57:24 -0400

25 lines

New Thread

ALUMINUM WEDGE BONDING??

ALUMINUM WEDGE BONDING??

[log in to unmask]

Wed, 15 Jul 1998 14:29:27 -0400

42 lines

New Thread

An aqueous cleaning question

An aqueous cleaning question

Bill Page <[log in to unmask]>

Mon, 20 Jul 1998 10:49:07 -0400

37 lines

Re: An aqueous cleaning question

[log in to unmask]

Mon, 20 Jul 1998 11:28:05 -0500

45 lines

Re: An aqueous cleaning question

Andy Magee <[log in to unmask]>

Mon, 20 Jul 1998 22:36:26 -0400

67 lines

Re: An aqueous cleaning question

Paul Wilson <[log in to unmask]>

Tue, 21 Jul 1998 06:19:35 -0400

127 lines

New Thread

Analysis

Analysis

Louis, Edwin <[log in to unmask]>

Mon, 20 Jul 1998 01:17:00 -0400

67 lines

Re: Analysis

Tamara Bloomer <[log in to unmask]>

Mon, 20 Jul 1998 13:14:45 -0500

98 lines

Re: Analysis

Vaughan, Ralph H <[log in to unmask]>

Mon, 20 Jul 1998 11:45:30 -0700

104 lines

Re: Analysis

<Rudy Sedlak> <[log in to unmask]>

Mon, 20 Jul 1998 20:08:58 EDT

33 lines

New Thread

Analysis labs

Analysis labs

Gina Hernefjord <[log in to unmask]>

Sun, 12 Jul 1998 22:41:08 +0200

22 lines

Re: Analysis labs

Jack Crawford <[log in to unmask]>

Mon, 13 Jul 1998 09:23:41 -0500

39 lines

New Thread

Anyone knows of an agressive resist developin equipment

Anyone knows of an agressive resist developin equipment

John Sater <[log in to unmask]>

Sat, 4 Jul 1998 23:38:53 -0700

45 lines

Re: Anyone knows of an agressive resist developin equipment

Fulabhai Patel <[log in to unmask]>

Sun, 5 Jul 1998 09:10:07 -0700

71 lines

New Thread

AOI of DST-foil

AOI of DST-foil

Jan Thuesen <[log in to unmask]>

Mon, 20 Jul 1998 14:39:43 +0200

40 lines

Re: AOI of DST-foil

Dave Kleinman <[log in to unmask]>

Mon, 20 Jul 1998 09:26:59 -0700

76 lines

Re: AOI of DST-foil

Phil Dam <[log in to unmask]>

Mon, 20 Jul 1998 13:09:11 EDT

32 lines

Re: AOI of DST-foil

Ascot <[log in to unmask]>

Mon, 20 Jul 1998 14:01:01 +0000

30 lines

New Thread

Apology for trip plans posting

Apology for trip plans posting

Steve Collins <[log in to unmask]>

Thu, 30 Jul 1998 14:45:37 -0600

32 lines

New Thread

ass'y: Torque on FR-4

Re: ass'y: Torque on FR-4

Jerry Cupples <[log in to unmask]>

Wed, 1 Jul 1998 10:48:07 -0500

89 lines

New Thread

assembly

assembly

Vertefeuille, Russ (AZ77) <[log in to unmask]>

Tue, 28 Jul 1998 15:36:49 -0500

27 lines

New Thread

Assembly process for plastic parts

Assembly process for plastic parts

Stuart Korringa <[log in to unmask]>

Fri, 24 Jul 1998 08:21:50 -0400

40 lines

Re: Assembly process for plastic parts

Russ Winslow <[log in to unmask]>

Fri, 24 Jul 1998 10:56:00 -0700

82 lines

New Thread

Assembly unusual part?

Assembly unusual part?

[log in to unmask]

Wed, 15 Jul 1998 14:32:20 EDT

44 lines

Re: Assembly unusual part?

sahmad <[log in to unmask]>

Fri, 17 Jul 1998 10:26:46 -0600

76 lines

New Thread

Assembly/Surface Finishes

Assembly/Surface Finishes

David D Hillman <[log in to unmask]>

Wed, 8 Jul 1998 16:35:40 -0500

35 lines

New Thread

ASSY: BGA sanity check

Re: ASSY: BGA sanity check

Maguire, James F <[log in to unmask]>

Wed, 1 Jul 1998 08:31:22 -0700

101 lines

Re: ASSY: BGA sanity check

Fulton Feng <[log in to unmask]>

Wed, 1 Jul 1998 19:23:37 -0400

123 lines

Re: ASSY: BGA sanity check

sahmad <[log in to unmask]>

Wed, 8 Jul 1998 14:29:10 -0600

170 lines

Re: ASSY: BGA sanity check

Jean-Paul Clech <[log in to unmask]>

Thu, 9 Jul 1998 16:35:57 EDT

44 lines

Re: ASSY: BGA sanity check

Hurst, Joe <[log in to unmask]>

Mon, 13 Jul 1998 07:58:35 -0400

205 lines

New Thread

Assy: cause-effect diagram

Assy: cause-effect diagram

Jerry Cupples <[log in to unmask]>

Wed, 8 Jul 1998 11:19:09 -0500

41 lines

Re: Assy: cause-effect diagram

Kimmey, Frank <[log in to unmask]>

Wed, 8 Jul 1998 09:27:23 -0700

79 lines

Re: Assy: cause-effect diagram

Hamilton, Richard -4454 <[log in to unmask]>

Wed, 8 Jul 1998 10:12:28 -0700

72 lines

Re: Assy: cause-effect diagram

Jack Bryant <[log in to unmask]>

Wed, 8 Jul 1998 13:35:17 -0400

109 lines

Re: Assy: cause-effect diagram

Devlin, Dan <[log in to unmask]>

Wed, 8 Jul 1998 14:11:50 -0400

70 lines

Re: Assy: cause-effect diagram

Joe Wackerman <[log in to unmask]>

Wed, 8 Jul 1998 11:29:29 -0700

74 lines

Re: Assy: cause-effect diagram

Angie Marques <[log in to unmask]>

Wed, 8 Jul 1998 11:28:01 -0400

30 lines

Re: Assy: cause-effect diagram

[log in to unmask]

Wed, 8 Jul 1998 13:39:39 -0500

103 lines

Re: Assy: cause-effect diagram

Eric Zanin <[log in to unmask]>

Wed, 8 Jul 1998 12:50:17 +0000

25 lines

Re: Assy: cause-effect diagram

Nasir Hanif <[log in to unmask]>

Wed, 8 Jul 1998 14:23:09 -0500

27 lines

Re: Assy: cause-effect diagram

Lon Weffers <[log in to unmask]>

Thu, 9 Jul 1998 08:16:29 +0200

69 lines

Re: Assy: cause-effect diagram

Gus Morvillo <[log in to unmask]>

Thu, 9 Jul 1998 09:19:30 -0400

28 lines

Re: Assy: cause-effect diagram

BPL Ltd. <[log in to unmask]>

Thu, 9 Jul 1998 19:13:54 +0530

67 lines

Re: Assy: cause-effect diagram

Frank K. Frimpong <[log in to unmask]>

Thu, 9 Jul 1998 14:46:36 +0000

82 lines

Re: Assy: cause-effect diagram

Lamond, Doug <[log in to unmask]>

Thu, 9 Jul 1998 08:46:02 -0500

95 lines

Re: Assy: cause-effect diagram

Stammely, Tim <[log in to unmask]>

Thu, 9 Jul 1998 12:49:16 -0400

122 lines

Re: Assy: cause-effect diagram

Anil K. Singh <[log in to unmask]>

Fri, 10 Jul 1998 05:57:43 +0000

105 lines

Re: Assy: cause-effect diagram

Kelvin Ang <[log in to unmask]>

Fri, 10 Jul 1998 09:02:58 +0800

66 lines

Re: Assy: cause-effect diagram

Bobby R. Mangona <[log in to unmask]>

Thu, 9 Jul 1998 09:20:31 +0000

31 lines

Re: Assy: cause-effect diagram

[log in to unmask]

Sun, 12 Jul 1998 12:23:29 EDT

23 lines

New Thread

Assy: cause-effect diagram -Reply

Re: Assy: cause-effect diagram -Reply

Ron Hayashi <[log in to unmask]>

Thu, 9 Jul 1998 09:47:15 -0700

23 lines

New Thread

ASSY: Duroid Material

ASSY: Duroid Material

Jan Satterfield <[log in to unmask]>

Tue, 14 Jul 1998 11:24:19 -0600

29 lines

Re: ASSY: Duroid Material

Eric Zanin <[log in to unmask]>

Wed, 15 Jul 1998 13:25:23 +0000

25 lines

Re: ASSY: Duroid Material

Ron Desilets <[log in to unmask]>

Fri, 24 Jul 1998 14:25:59 -0700

84 lines

New Thread

assy: flip chip

assy: flip chip

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 29 Jul 1998 15:38:00 -0400

31 lines

Re: assy: flip chip

Bill Davis <[log in to unmask]>

Wed, 29 Jul 1998 13:34:14 -0700

71 lines

Re: assy: flip chip

Alderete, Michael <[log in to unmask]>

Wed, 29 Jul 1998 17:12:27 -0700

70 lines

Re: assy: flip chip

David D Hillman <[log in to unmask]>

Thu, 30 Jul 1998 07:57:15 -0500

72 lines

Re: assy: flip chip

David Gonnerman <[log in to unmask]>

Thu, 30 Jul 1998 08:24:31 -0500

110 lines

New Thread

ASSY: Gold Finger Configurations

ASSY: Gold Finger Configurations

Stephen R. Gregory <[log in to unmask]>

Tue, 28 Jul 1998 09:07:42 EDT

41 lines

Re: ASSY: Gold Finger Configurations

Mauricio Castro <[log in to unmask]>

Tue, 28 Jul 1998 08:36:09 -0500

74 lines

New Thread

ASSY: In-Line Inspection and SPC

ASSY: In-Line Inspection and SPC

Juha Uski <[log in to unmask]>

Wed, 15 Jul 1998 16:28:38 +0000

37 lines

New Thread

ASSY: RTV Repair to PWAs

ASSY: RTV Repair to PWAs

[log in to unmask]

Mon, 6 Jul 1998 14:15:19 -0600

30 lines

Re: ASSY: RTV Repair to PWAs

Stephen R. Gregory <[log in to unmask]>

Mon, 6 Jul 1998 16:13:32 EDT

45 lines

New Thread

ASSY: Thermally/Electrically Conductive Epoxy

ASSY: Thermally/Electrically Conductive Epoxy

Jan Satterfield <[log in to unmask]>

Mon, 6 Jul 1998 09:30:29 -0600

28 lines

Re: ASSY: Thermally/Electrically Conductive Epoxy

Chan, Marcelo <[log in to unmask]>

Mon, 6 Jul 1998 11:55:31 -0400

62 lines

Re: ASSY: Thermally/Electrically Conductive Epoxy

Jan Satterfield <[log in to unmask]>

Mon, 6 Jul 1998 12:58:01 -0600

90 lines

Re: ASSY: Thermally/Electrically Conductive Epoxy

by Dr. Eden Chen XianSong <[log in to unmask]>

Tue, 7 Jul 1998 09:03:12 +0800

96 lines

New Thread

ASSY:In-Line Inspec

Re: ASSY:In-Line Inspec

Marc O. Bituagan <[log in to unmask]>

Fri, 17 Jul 1998 13:03:39 +0000

28 lines

New Thread

ASSY:Reliability, SMT

ASSY:Reliability, SMT

James Patten <[log in to unmask]>

Wed, 22 Jul 1998 07:55:32 -0700

35 lines

Re: ASSY:Reliability, SMT

Aric parr <[log in to unmask]>

Mon, 27 Jul 1998 07:40:12 EDT

66 lines

New Thread

Attempted rework of Oxidized HASL boards

Re: Attempted rework of Oxidized HASL boards

John Waite <[log in to unmask]>

Wed, 8 Jul 1998 08:28:18 -0400

66 lines

New Thread

Attn. Users of DEK ProFlow system

Attn. Users of DEK ProFlow system

Bruce Robertson <[log in to unmask]>

Thu, 9 Jul 1998 09:22:02 +1200

40 lines

Re: Attn. Users of DEK ProFlow system

Frank, Jr. Komitsky <[log in to unmask]>

Wed, 8 Jul 1998 18:10:59 -0400

68 lines

Re: Attn. Users of DEK ProFlow system

Kathy Palumbo <[log in to unmask]>

Wed, 8 Jul 1998 15:14:34 -0700

119 lines

Re: Attn. Users of DEK ProFlow system

Stephen R. Gregory <[log in to unmask]>

Wed, 8 Jul 1998 19:19:41 EDT

51 lines

New Thread

Attn: Change of screen name

Re: Attn: Change of screen name

Kurt E. Brehm <[log in to unmask]>

Sat, 25 Jul 1998 14:48:26 EDT

24 lines

New Thread

Au/Ni/Cu PROBLEM

Au/Ni/Cu PROBLEM

Hooper Doug <[log in to unmask]>

Fri, 3 Jul 1998 10:20:00 -0500

46 lines

Re: Au/Ni/Cu PROBLEM

Charles Barker <[log in to unmask]>

Fri, 3 Jul 1998 15:09:07 -0500

82 lines

Re: Au/Ni/Cu PROBLEM

Frank, Jr. Komitsky <[log in to unmask]>

Sat, 4 Jul 1998 10:38:01 -0400

84 lines

Re: Au/Ni/Cu PROBLEM

Paul Gould <[log in to unmask]>

Sun, 5 Jul 1998 08:34:27 +0100

82 lines

Re: Au/Ni/Cu PROBLEM

<Rudy Sedlak> <[log in to unmask]>

Sun, 5 Jul 1998 10:23:12 EDT

50 lines

Re: Au/Ni/Cu PROBLEM

Paul Gould <[log in to unmask]>

Mon, 6 Jul 1998 20:13:40 +0100

71 lines

Re: Au/Ni/Cu PROBLEM

Noppadol S. <[log in to unmask]>

Tue, 7 Jul 1998 08:48:45 +0700

152 lines

New Thread

Automated COF Assembly

Automated COF Assembly

Jay Bitanga <[log in to unmask]>

Wed, 22 Jul 1998 08:41:12 +0000

75 lines

New Thread

Automotive Standard Thermal Application Spec.

Automotive Standard Thermal Application Spec.

Kelly Kovalovsky <[log in to unmask]>

Tue, 28 Jul 1998 10:18:02 -0400

26 lines

Re: Automotive Standard Thermal Application Spec.

Werner Engelmaier <[log in to unmask]>

Tue, 28 Jul 1998 21:54:49 EDT

35 lines

New Thread

Available Plating Options

Available Plating Options

Hugh Scott Miller <[log in to unmask]>

Sun, 19 Jul 1998 16:48:10 -0400

42 lines

New Thread

BAAN system

BAAN system

Marc O. Bituagan <[log in to unmask]>

Sat, 11 Jul 1998 16:20:16 +0000

30 lines

New Thread

Base Materials

Base Materials

Hugh Scott Miller <[log in to unmask]>

Sun, 19 Jul 1998 16:47:32 -0400

40 lines

Re: Base Materials

David Heywood <[log in to unmask]>

Mon, 20 Jul 1998 10:25:28 +0100

83 lines

Re: Base Materials

Kwong Chin <[log in to unmask]>

Mon, 20 Jul 1998 09:12:45 -0400

98 lines

New Thread

Base Materials - more....

Base Materials - more....

JB <[log in to unmask]>

Mon, 20 Jul 1998 09:08:40 +0800

69 lines

New Thread

batch reflow ovens

batch reflow ovens

Brett Goldstein <[log in to unmask]>

Mon, 13 Jul 1998 08:38:44 +0000

32 lines

Re: batch reflow ovens

Eric Zanin <[log in to unmask]>

Mon, 13 Jul 1998 10:19:11 +0000

25 lines

Re: batch reflow ovens

Matthias Mansfeld <[log in to unmask]>

Mon, 13 Jul 1998 21:02:37 +0200

49 lines

New Thread

BGA - X-ray

BGA - X-ray

David Lehmann <[log in to unmask]>

Thu, 30 Jul 1998 14:14:09 -0700

46 lines

New Thread

BGA Ball Attachment Process

BGA Ball Attachment Process

Kathy Palumbo <[log in to unmask]>

Fri, 17 Jul 1998 11:22:31 -0700

33 lines

Re: BGA Ball Attachment Process

Devlin, Dan <[log in to unmask]>

Fri, 17 Jul 1998 14:53:22 -0400

58 lines

Re: BGA Ball Attachment Process

sahmad <[log in to unmask]>

Fri, 17 Jul 1998 12:54:44 -0600

87 lines

Re: BGA Ball Attachment Process

McMonagle, Michael R. <[log in to unmask]>

Fri, 17 Jul 1998 13:56:38 -0500

65 lines

Re: BGA Ball Attachment Process

Angie Marques <[log in to unmask]>

Fri, 17 Jul 1998 13:11:53 -0400

33 lines

Re: BGA Ball Attachment Process

Parvez M.S. Patel <[log in to unmask]>

Sat, 18 Jul 1998 12:37:01 -0400

68 lines

Re: BGA Ball Attachment Process

[log in to unmask]

Mon, 20 Jul 1998 09:43:18 -0500

37 lines

Re: BGA Ball Attachment Process

sahmad <[log in to unmask]>

Mon, 20 Jul 1998 09:41:08 -0600

61 lines

Re: BGA Ball Attachment Process

[log in to unmask]

Tue, 21 Jul 1998 13:56:40 PST

62 lines

New Thread

BGA reballing equipment

BGA reballing equipment

XO Tronic Ltd. <[log in to unmask]>

Mon, 27 Jul 1998 16:30:09 +0530

30 lines

Re: BGA reballing equipment

Russ Winslow <[log in to unmask]>

Mon, 27 Jul 1998 10:48:57 -0700

55 lines

New Thread

BGA soldering on Immersion Nickel Gold PCB

BGA soldering on Immersion Nickel Gold PCB

Earl Moon <[log in to unmask]>

Fri, 31 Jul 1998 08:19:22 -0700

39 lines

Re: BGA soldering on Immersion Nickel Gold PCB

Leslie O. Connally <[log in to unmask]>

Fri, 31 Jul 1998 10:52:17 -0700

69 lines

New Thread

Black Epoxy

Black Epoxy

Edwin Maximo <[log in to unmask]>

Wed, 8 Jul 1998 08:47:06 +0000

33 lines

Black Epoxy

Edwin Maximo <[log in to unmask]>

Thu, 23 Jul 1998 11:38:27 +0000

36 lines

Re: Black Epoxy

McMonagle, Michael R. <[log in to unmask]>

Thu, 23 Jul 1998 07:42:33 -0500

63 lines

Re: Black Epoxy

Russ Winslow <[log in to unmask]>

Fri, 24 Jul 1998 11:01:22 -0700

65 lines

New Thread

Black Oxide Filtration

Black Oxide Filtration

Chris Rucinski <[log in to unmask]>

Mon, 20 Jul 1998 11:06:53 -0700

35 lines

Re: Black Oxide Filtration

Mike Bailey <[log in to unmask]>

Mon, 20 Jul 1998 11:18:19 -0400

27 lines

Re: Black Oxide Filtration

Joe Felts <[log in to unmask]>

Tue, 21 Jul 1998 00:22:02 -0700

68 lines

Re: Black Oxide Filtration

Eltek Ltd. - Process Engineering <[log in to unmask]>

Tue, 21 Jul 1998 15:07:33 +0300

96 lines

New Thread

Black Oxide Filtration -Reply

Re: Black Oxide Filtration -Reply

Fred Johnson <[log in to unmask]>

Tue, 21 Jul 1998 17:28:31 +0100

49 lines

New Thread

Bond strength pins

Bond strength pins

<David Albin> <[log in to unmask]>

Mon, 13 Jul 1998 16:52:57 +0000

28 lines

Re: Bond strength pins

[log in to unmask]

Mon, 13 Jul 1998 17:21:11 EDT

34 lines

New Thread

Boron Electroless Nickel

Boron Electroless Nickel

Hogue, Pat (AZ76) <[log in to unmask]>

Fri, 31 Jul 1998 09:55:18 -0700

41 lines

New Thread

Bull****

Re: Bull****

McMonagle, Michael R. <[log in to unmask]>

Fri, 17 Jul 1998 12:23:16 -0500

171 lines

Re: Bull****

Mauro Nardini <[log in to unmask]>

Fri, 17 Jul 1998 10:54:39 -0700

196 lines

New Thread

Bull****:: ADMIN RESPONSE

Re: Bull****:: ADMIN RESPONSE

Hugo Scaramuzza <[log in to unmask]>

Fri, 17 Jul 1998 12:55:07 -0500

34 lines

Re: Bull****:: ADMIN RESPONSE

Dick Desrosiers <[log in to unmask]>

Fri, 17 Jul 1998 14:48:13 EDT

21 lines

New Thread

Buried Capacitance

Buried Capacitance

Earl Moon <[log in to unmask]>

Fri, 31 Jul 1998 04:50:10 -0700

36 lines

Re: Buried Capacitance

Edwards, Ted A (AZ75) <[log in to unmask]>

Fri, 31 Jul 1998 11:21:58 -0500

64 lines

New Thread

Buried Capacitance?

Re: Buried Capacitance?

Howard Lin <[log in to unmask]>

Tue, 21 Jul 1998 11:12:55 +0800

31 lines

Re: Buried Capacitance?

Kuczynski Michael <[log in to unmask]>

Tue, 21 Jul 1998 07:05:56 -0400

48 lines

New Thread

C.O.P.S. software from Camalot (Speedline).

C.O.P.S. software from Camalot (Speedline).

Arroyave, John (FL51) <[log in to unmask]>

Fri, 24 Jul 1998 10:09:24 -0400

37 lines

Re: C.O.P.S. software from Camalot (Speedline).

Jared Lang <[log in to unmask]>

Fri, 24 Jul 1998 07:36:48 -0700

89 lines

Re: C.O.P.S. software from Camalot (Speedline).

Paul Stolar <[log in to unmask]>

Fri, 24 Jul 1998 10:05:47 -0600

74 lines

Re: C.O.P.S. software from Camalot (Speedline).

Paul Klasek <[log in to unmask]>

Mon, 27 Jul 1998 10:01:04 +1000

121 lines

Re: C.O.P.S. software from Camalot (Speedline).

Nasir Hanif <[log in to unmask]>

Mon, 27 Jul 1998 12:36:53 -0500

36 lines

Re: C.O.P.S. software from Camalot (Speedline).

Nasir Hanif <[log in to unmask]>

Mon, 27 Jul 1998 12:26:50 -0500

40 lines

Re: C.O.P.S. software from Camalot (Speedline).

Paul Klasek <[log in to unmask]>

Wed, 29 Jul 1998 08:18:04 +1000

127 lines

New Thread

C.O.P.S. Software problems

C.O.P.S. Software problems

Arroyave, John (FL51) <[log in to unmask]>

Tue, 28 Jul 1998 10:06:30 -0400

73 lines

Re: C.O.P.S. Software problems

Paul Klasek <[log in to unmask]>

Wed, 29 Jul 1998 09:25:31 +1000

151 lines

New Thread

Call for Papers - IPC Expo '99

Call for Papers - IPC Expo '99

Lisa Williams <[log in to unmask]>

Fri, 10 Jul 1998 10:15:17 -0500

172 lines

New Thread

CAM Software for Pick & Place

CAM Software for Pick & Place

Jared Lang <[log in to unmask]>

Thu, 30 Jul 1998 10:37:22 -0700

71 lines

Re: CAM Software for Pick & Place

Jerry Cupples <[log in to unmask]>

Thu, 30 Jul 1998 13:03:21 -0500

51 lines

New Thread

Carbon Ink

Carbon Ink

Andrea Henry <[log in to unmask]>

Wed, 22 Jul 1998 08:51:35 PDT

25 lines

New Thread

Carbon Ink -Reply

Carbon Ink -Reply

Ron Hayashi <[log in to unmask]>

Wed, 22 Jul 1998 09:13:22 -0700

37 lines

New Thread

Carbon ink resource

Re: Carbon ink resource

Howard Lin <[log in to unmask]>

Mon, 20 Jul 1998 20:15:43 +0800

30 lines

Re: Carbon ink resource

Colin <[log in to unmask]>

Mon, 20 Jul 1998 07:18:54 -0500

53 lines

Re: Carbon ink resource

Valquirio N. Carvalho <[log in to unmask]>

Mon, 20 Jul 1998 19:42:02 -0400

61 lines

New Thread

Carbon ink resource -Reply

Re: Carbon ink resource -Reply

Steve Rathbun <[log in to unmask]>

Tue, 21 Jul 1998 10:38:57 -0700

35 lines

New Thread

Carbon Ink Suppliers.

Carbon Ink Suppliers.

Ron Hayashi <[log in to unmask]>

Tue, 21 Jul 1998 12:09:27 -0700

37 lines

New Thread

Cause & Effect Diagram

Cause & Effect Diagram

Gabriel D Sulyok <[log in to unmask]>

Thu, 9 Jul 1998 09:55:43 -0400

23 lines

New Thread

Cause and effect diagram

Cause and effect diagram

Nick Nicolaides <[log in to unmask]>

Mon, 13 Jul 1998 10:17:07 -0400

23 lines

New Thread

cause effect diagram,

cause effect diagram,

Francisco Rios <[log in to unmask]>

Thu, 9 Jul 1998 09:53:44 -0700

24 lines

New Thread

cause-effect diagram - some gentle advice

Re: cause-effect diagram - some gentle advice

JoAnn Amerson <[log in to unmask]>

Wed, 8 Jul 1998 15:02:17 -0400

31 lines

New Thread

CEM-1

CEM-1

Tom Burek <[log in to unmask]>

Mon, 20 Jul 1998 17:32:09 -0500

27 lines

Re: CEM-1

김달영 과장 전자 본사개발지원팀 <[log in to unmask]>

Tue, 21 Jul 1998 08:09:58 +0900

64 lines

Re: CEM-1

Don Vischulis <[log in to unmask]>

Mon, 20 Jul 1998 19:42:34 -0500

38 lines

Re: CEM-1

Kwong Chin <[log in to unmask]>

Tue, 21 Jul 1998 19:42:15 -0400

90 lines

New Thread

chemically resistant pump

chemically resistant pump

Alex Stennett <[log in to unmask]>

Tue, 21 Jul 1998 10:16:58 +0000

48 lines

Re: chemically resistant pump

Smith Russell MSM LAPO US <[log in to unmask]>

Thu, 23 Jul 1998 03:59:00 +0200

78 lines

New Thread

Coax Cable Assemblies

Coax Cable Assemblies

[log in to unmask]

Fri, 24 Jul 1998 06:40:38 EDT

27 lines

New Thread

Column Grid Arrays

Column Grid Arrays

[log in to unmask]

Thu, 30 Jul 1998 07:44:33 -0600

33 lines

Re: Column Grid Arrays

Collins, Graham <[log in to unmask]>

Thu, 30 Jul 1998 10:21:50 -0300

74 lines

Re: Column Grid Arrays

Clive Ffitch <[log in to unmask]>

Fri, 31 Jul 1998 10:34:37 PST

114 lines

Re: Column Grid Arrays

Russ Winslow <[log in to unmask]>

Fri, 31 Jul 1998 14:14:46 -0700

73 lines

New Thread

Component tape pulling force.

Component tape pulling force.

Noppadol S. <[log in to unmask]>

Wed, 22 Jul 1998 17:08:41 +0700

30 lines

New Thread

Compositech laminates

Compositech laminates

[log in to unmask]

Thu, 16 Jul 1998 02:44:50 -0400

32 lines

New Thread

Conductive Epoxy adhesive

Conductive Epoxy adhesive

Percy Childe <[log in to unmask]>

Wed, 22 Jul 1998 19:37:21 +0800

29 lines

Re: Conductive Epoxy adhesive

Brent Alcorn <[log in to unmask]>

Wed, 22 Jul 1998 10:17:33 -0300

41 lines

Re: Conductive Epoxy adhesive

Eric Yakobson <[log in to unmask]>

Wed, 22 Jul 1998 11:18:27 -0400

60 lines

Re: Conductive Epoxy adhesive

<Eden Chen> <[log in to unmask]>

Thu, 23 Jul 1998 08:56:49 +0800

57 lines

New Thread

Conductive Epoxy adhesive -Reply

Re: Conductive Epoxy adhesive -Reply

Matthew Park <[log in to unmask]>

Wed, 22 Jul 1998 07:43:39 -0700

60 lines

New Thread

Conductive Expoxy Adhesive

Conductive Expoxy Adhesive

Percy Childe <[log in to unmask]>

Wed, 22 Jul 1998 19:31:37 +0800

33 lines

New Thread

Conductor Routing

Re: Conductor Routing

R. Christopher Lott <[log in to unmask]>

Thu, 23 Jul 1998 16:46:10 -0500

36 lines

New Thread

Conductor Routing Question

Conductor Routing Question

R. Christopher Lott <[log in to unmask]>

Thu, 23 Jul 1998 14:50:18 -0500

54 lines

Re: Conductor Routing Question

Dennis Beerman <[log in to unmask]>

Thu, 23 Jul 1998 16:18:50 -0400

84 lines

Re: Conductor Routing Question

Scott Decker <[log in to unmask]>

Thu, 23 Jul 1998 13:26:52 -0700

94 lines

New Thread

Confirmation of Receipt

Confirmation of Receipt

Undetermined origin c/o LISTSERV administrator <[log in to unmask]>

Wed, 8 Jul 1998 09:04:43 EDT

29 lines

Confirmation of Receipt

Undetermined origin c/o LISTSERV administrator <[log in to unmask]>

Mon, 13 Jul 1998 15:48:15 EDT

29 lines

New Thread

Conformal coating

Conformal coating

<Eden Chen> <[log in to unmask]>

Wed, 29 Jul 1998 14:26:49 +0800

37 lines

Re: Conformal coating

Aric parr <[log in to unmask]>

Wed, 29 Jul 1998 07:43:36 EDT

100 lines

Re: Conformal coating

ETS <[log in to unmask]>

Wed, 29 Jul 1998 13:05:30 -0700

81 lines

New Thread

Conformal Coating Adhesion over low res. Fluxes

Conformal Coating Adhesion over low res. Fluxes

Mark Pozorski <[log in to unmask]>

Fri, 17 Jul 1998 11:03:15 -0600

29 lines

Re: Conformal Coating Adhesion over low res. Fluxes

Vaughan, Ralph H <[log in to unmask]>

Fri, 17 Jul 1998 09:33:09 -0700

64 lines

Re: Conformal Coating Adhesion over low res. Fluxes

Aric parr <[log in to unmask]>

Fri, 17 Jul 1998 13:07:50 EDT

62 lines

New Thread

Contact Systems CS-400C

Contact Systems CS-400C

Rick Thompson <[log in to unmask]>

Fri, 10 Jul 1998 13:13:13 -0700

33 lines

Re: Contact Systems CS-400C

[log in to unmask]

Fri, 10 Jul 1998 16:27:04 -0500

66 lines

Re: Contact Systems CS-400C

Rick Thompson <[log in to unmask]>

Fri, 10 Jul 1998 14:36:13 -0700

101 lines

New Thread

Contamination Testing for Water Soluble Flux Residue

Re: Contamination Testing for Water Soluble Flux Residue

Alan Brewin <[log in to unmask]>

Tue, 30 Jun 1998 17:06:15 +0100

133 lines

New Thread

Contract Test Labs for SERA White Tin Tests (Florida CirTech

Re: Contract Test Labs for SERA White Tin Tests (Florida CirTech

Douglas Pauls <[log in to unmask]>

Fri, 17 Jul 1998 10:29:21 EDT

38 lines

New Thread

Contract Test Labs for SERA White Tin Tests (Florida CirTech Omikron)

Contract Test Labs for SERA White Tin Tests (Florida CirTech Omikron)

Paul Wilson <[log in to unmask]>

Fri, 17 Jul 1998 08:49:38 -0400

56 lines

New Thread

Controlled Impedance Testing

Controlled Impedance Testing

James A. Zeman <[log in to unmask]>

Tue, 21 Jul 1998 13:38:00 -0500

25 lines

Re: Controlled Impedance Testing

Paul Gould <[log in to unmask]>

Tue, 21 Jul 1998 22:42:34 +0100

38 lines

Re: Controlled Impedance Testing

Lyle Anderson <[log in to unmask]>

Wed, 22 Jul 1998 08:39:54 -0700

47 lines

New Thread

Copper Stains on suface of Au Fingers

Copper Stains on suface of Au Fingers

Lamond, Doug <[log in to unmask]>

Tue, 7 Jul 1998 08:43:59 -0500

45 lines

Re: Copper Stains on suface of Au Fingers

Ryan Jennens <[log in to unmask]>

Tue, 7 Jul 1998 11:29:52 -0400

30 lines

New Thread

CP642 vs CM88-CM or Fuji vs Panasonic

CP642 vs CM88-CM or Fuji vs Panasonic

My Nguyen <[log in to unmask]>

Mon, 20 Jul 1998 18:42:06 -0700

41 lines

CP642 vs CM88-CM or Fuji vs Panasonic

Jeff Hempton <[log in to unmask]>

Tue, 21 Jul 1998 08:54:12 -0500

109 lines

Re: CP642 vs CM88-CM or Fuji vs Panasonic

Richard Tassone <[log in to unmask]>

Tue, 21 Jul 1998 07:16:02 +0100

89 lines

Re: CP642 vs CM88-CM or Fuji vs Panasonic

Aric parr <[log in to unmask]>

Tue, 21 Jul 1998 10:26:23 EDT

164 lines

New Thread

CP642 vs CM88-CM or Fuji vs Panasonic- Part II

CP642 vs CM88-CM or Fuji vs Panasonic- Part II

My Nguyen <[log in to unmask]>

Thu, 23 Jul 1998 21:19:15 -0700

205 lines

CP642 vs CM88-CM or Fuji vs Panasonic- Part II

Jeff Hempton <[log in to unmask]>

Fri, 24 Jul 1998 13:33:30 -0500

239 lines

Re: CP642 vs CM88-CM or Fuji vs Panasonic- Part II

Mark Pozorski <[log in to unmask]>

Mon, 27 Jul 1998 10:31:38 -0600

277 lines

New Thread

Cracked capacitors and bulbuous joints

Cracked capacitors and bulbuous joints

CHEUNG, Steven (Collroad) <[log in to unmask]>

Thu, 16 Jul 1998 14:54:00 +0000

25 lines

Re: Cracked capacitors and bulbuous joints

McMonagle, Michael R. <[log in to unmask]>

Mon, 20 Jul 1998 07:39:57 -0500

64 lines

New Thread

CSP underfill,

CSP underfill,

<Eden Chen> <[log in to unmask]>

Fri, 31 Jul 1998 13:57:49 +0800

41 lines

Re: CSP underfill,

[log in to unmask]

Fri, 31 Jul 1998 09:50:12 EDT

26 lines

New Thread

CSR 2600

CSR 2600

Ed Kneller <[log in to unmask]>

Mon, 6 Jul 1998 06:42:24 -0700

34 lines

New Thread

CSR2600

CSR2600

Ed Kneller <[log in to unmask]>

Mon, 6 Jul 1998 06:39:39 -0700

27 lines

New Thread

CTE of PCB Laminates

CTE of PCB Laminates

KK Chin <[log in to unmask]>

Tue, 14 Jul 1998 16:29:10 -0700

30 lines

Re: CTE of PCB Laminates

Werner Engelmaier <[log in to unmask]>

Wed, 15 Jul 1998 08:07:11 EDT

41 lines

Re: CTE of PCB Laminates

Gerald G. Gagnon <[log in to unmask]>

Wed, 15 Jul 1998 08:18:44 -0400

79 lines

New Thread

CTE of PCB Laminates -Reply

Re: CTE of PCB Laminates -Reply

Fred Johnson <[log in to unmask]>

Wed, 15 Jul 1998 14:51:38 +0100

114 lines

Re: CTE of PCB Laminates -Reply

Gerald G. Gagnon <[log in to unmask]>

Wed, 15 Jul 1998 10:39:56 -0400

160 lines

New Thread

CTE of PCB material [aramid info]

Re: CTE of PCB material [aramid info]

Alderete, Michael <[log in to unmask]>

Thu, 23 Jul 1998 14:34:42 -0700

85 lines

New Thread

CTE of PCB material.

CTE of PCB material.

Frank K. Frimpong <[log in to unmask]>

Thu, 23 Jul 1998 13:30:12 +0000

36 lines

Re: CTE of PCB material.

Karl Sweitzer <[log in to unmask]>

Thu, 23 Jul 1998 10:59:37 -0400

83 lines

Re: CTE of PCB material.

Lyle Wallig <[log in to unmask]>

Thu, 23 Jul 1998 11:04:37 EDT

38 lines

New Thread

Cu stains on Au fingers

Re: Cu stains on Au fingers

Andy Magee <[log in to unmask]>

Wed, 8 Jul 1998 12:10:30 -0400

33 lines

New Thread

DEK ProFlow

Re: DEK ProFlow

Kathy Palumbo <[log in to unmask]>

Wed, 22 Jul 1998 12:53:33 -0700

767 lines

New Thread

delamination

delamination

Melanie Racuya <[log in to unmask]>

Mon, 27 Jul 1998 19:07:10 +0000

43 lines

Re: delamination

Andy Magee <[log in to unmask]>

Mon, 27 Jul 1998 08:41:52 -0400

70 lines

Re: delamination

Werner Engelmaier <[log in to unmask]>

Mon, 27 Jul 1998 10:25:52 EDT

38 lines

Re: delamination

Matthew Sanders <[log in to unmask]>

Mon, 27 Jul 1998 15:40:46 -0700

71 lines

New Thread

Delamination Problems

Delamination Problems

Chris Elliott <[log in to unmask]>

Fri, 10 Jul 1998 19:33:05 -0400

77 lines

Re: Delamination Problems

David Heywood <[log in to unmask]>

Mon, 13 Jul 1998 09:16:52 +0100

112 lines

Re: Delamination Problems

JB <[log in to unmask]>

Mon, 13 Jul 1998 15:49:20 +0800

149 lines

Re: Delamination Problems

Frank K. Frimpong <[log in to unmask]>

Wed, 15 Jul 1998 11:46:00 +0000

182 lines

New Thread

Design & DFM Software

Design & DFM Software

Richard List <[log in to unmask]>

Tue, 7 Jul 1998 15:20:07 -0700

28 lines

Design & DFM Software

Richard List <[log in to unmask]>

Wed, 8 Jul 1998 10:19:50 -0700

30 lines

Design & DFM Software

Dave Roesler <[log in to unmask]>

Thu, 9 Jul 1998 15:34:16 -0500

90 lines

Design & DFM Software

Richard List <[log in to unmask]>

Thu, 9 Jul 1998 16:07:58 -0700

39 lines

Re: Design & DFM Software

Jeff Seeger <[log in to unmask]>

Thu, 9 Jul 1998 20:03:57 -0400

44 lines

New Thread

DEWETTING

DEWETTING

starr devere <[log in to unmask]>

Wed, 1 Jul 1998 08:51:09 -0700

35 lines

Re: DEWETTING

Mark Simmons <[log in to unmask]>

Wed, 1 Jul 1998 09:41:08 -0700

30 lines

Re: DEWETTING

Stephen R. Gregory <[log in to unmask]>

Wed, 1 Jul 1998 16:00:44 EDT

50 lines

New Thread

Diazo adhesive transfer film

Diazo adhesive transfer film

Lisa Parker <[log in to unmask]>

Fri, 17 Jul 1998 10:03:51 -0500

31 lines

Re: Diazo adhesive transfer film

Lyle Anderson <[log in to unmask]>

Wed, 22 Jul 1998 16:05:43 -0700

60 lines

New Thread

Diazo adhesive transfer film -Reply

Diazo adhesive transfer film -Reply

Bob Stumpf <[log in to unmask]>

Tue, 21 Jul 1998 13:48:16 -0700

58 lines

New Thread

Diode Polarity

Diode Polarity

Gail Herman <[log in to unmask]>

Thu, 30 Jul 1998 16:48:38 -0400

40 lines

Re: Diode Polarity

Rick Thompson <[log in to unmask]>

Thu, 30 Jul 1998 15:06:19 -0700

83 lines

New Thread

Diversion, flame if you will!

Diversion, flame if you will!

Karen Tellefsen <[log in to unmask]>

Fri, 31 Jul 1998 15:52:06 -0700

46 lines

New Thread

Dropped boards

Dropped boards

Vernon Presnell <[log in to unmask]>

Thu, 30 Jul 1998 09:30:00 -0700

24 lines

Re: Dropped boards

Michael Hilton <[log in to unmask]>

Thu, 30 Jul 1998 15:44:41 -0400

45 lines

New Thread

Dump Criteria for Solder Strip

Dump Criteria for Solder Strip

Michael D. Doty <[log in to unmask]>

Wed, 1 Jul 1998 22:21:49 -0400

25 lines

Re: Dump Criteria for Solder Strip

Frank, Jr. Komitsky <[log in to unmask]>

Thu, 2 Jul 1998 00:23:49 -0400

56 lines

Re: Dump Criteria for Solder Strip

<Rudy Sedlak> <[log in to unmask]>

Thu, 2 Jul 1998 00:48:44 EDT

46 lines

Re: Dump Criteria for Solder Strip

Coleman, Rob <[log in to unmask]>

Thu, 2 Jul 1998 08:22:00 -0500

58 lines

Re: Dump Criteria for Solder Strip

Lenny Kurup <[log in to unmask]>

Thu, 2 Jul 1998 13:21:09 -0400

30 lines

New Thread

Dump Criteria for Solder Strip (fwd)

Re: Dump Criteria for Solder Strip (fwd)

Lenny Kurup <[log in to unmask]>

Mon, 6 Jul 1998 13:52:26 -0400

30 lines

New Thread

Duofoil Replacement

Duofoil Replacement

Mike Bailey <[log in to unmask]>

Mon, 20 Jul 1998 12:04:20 -0400

26 lines

Re: Duofoil Replacement

Afri Singh <[log in to unmask]>

Tue, 21 Jul 1998 20:06:00 -0400

43 lines

New Thread

EIA sts.

EIA sts.

Noppadol S. <[log in to unmask]>

Mon, 20 Jul 1998 17:11:31 +0700

27 lines

Re: EIA sts.

Bob Seyfert <[log in to unmask]>

Mon, 20 Jul 1998 14:26:40 -0400

56 lines

New Thread

ELECTRIC TESTER FOR BGA

ELECTRIC TESTER FOR BGA

Lee Sang Soo <[log in to unmask]>

Sat, 25 Jul 1998 07:30:18 +0900

31 lines

New Thread

Electrical Testing Techniques

Electrical Testing Techniques

Hugh Scott Miller <[log in to unmask]>

Sun, 19 Jul 1998 16:47:43 -0400

37 lines

New Thread

Electro-Migration

Re: Electro-Migration

Andy Magee <[log in to unmask]>

Tue, 21 Jul 1998 17:37:40 -0400

31 lines

New Thread

Electroless Copper Plating on Teflon and BT

Electroless Copper Plating on Teflon and BT

tgyee <[log in to unmask]>

Tue, 14 Jul 1998 18:19:55 PST

30 lines

Re: Electroless Copper Plating on Teflon and BT

Alex Stennett <[log in to unmask]>

Tue, 14 Jul 1998 12:19:14 +0000

50 lines

Re: Electroless Copper Plating on Teflon and BT

John Bushie <[log in to unmask]>

Tue, 14 Jul 1998 08:06:48 -0500

79 lines

Re: Electroless Copper Plating on Teflon and BT

Leslie O. Connally <[log in to unmask]>

Wed, 15 Jul 1998 10:04:40 -0700

74 lines

New Thread

Electroless Nickel

Electroless Nickel

Earl Moon <[log in to unmask]>

Fri, 31 Jul 1998 04:57:29 -0700

39 lines

Re: Electroless Nickel

Gabriela Bogdan <[log in to unmask]>

Fri, 31 Jul 1998 22:07:32 +0300

65 lines

Re: Electroless Nickel

Mike Bailey <[log in to unmask]>

Fri, 31 Jul 1998 15:18:45 -0400

37 lines

New Thread

Electronic meters for copper thickness

Electronic meters for copper thickness

Ed Cosper <[log in to unmask]>

Tue, 7 Jul 1998 17:39:16 -0500

31 lines

Re: Electronic meters for copper thickness

Joseph Zacharias <[log in to unmask]>

Wed, 8 Jul 1998 05:25:32 -0700

68 lines

Re: Electronic meters for copper thickness

Don Vischulis <[log in to unmask]>

Wed, 8 Jul 1998 21:01:38 -0500

43 lines

New Thread

Electronic/ESD Packaging Guidelines

Electronic/ESD Packaging Guidelines

Thexton, Duane <[log in to unmask]>

Tue, 28 Jul 1998 08:19:29 -0700

33 lines

Re: Electronic/ESD Packaging Guidelines

Joaquin Molina <[log in to unmask]>

Tue, 28 Jul 1998 15:30:27 -0400

93 lines

Re: Electronic/ESD Packaging Guidelines

Stuart Chessen <[log in to unmask]>

Wed, 29 Jul 1998 08:06:51 -0700

62 lines

New Thread

Electropolishing Laser-Cut Stencils

Electropolishing Laser-Cut Stencils

Todd Ness <[log in to unmask]>

Fri, 10 Jul 1998 09:13:28 +0000

56 lines

Re: Electropolishing Laser-Cut Stencils

Stephen R. Gregory <[log in to unmask]>

Fri, 10 Jul 1998 13:40:15 EDT

83 lines

Re: Electropolishing Laser-Cut Stencils

Brad Vanderhoof <[log in to unmask]>

Fri, 10 Jul 1998 11:08:15 PDT

83 lines

Re: Electropolishing Laser-Cut Stencils

Charles Barker <[log in to unmask]>

Fri, 10 Jul 1998 13:28:02 -0500

87 lines

Re: Electropolishing Laser-Cut Stencils

Brad Kendall <[log in to unmask]>

Mon, 13 Jul 1998 08:40:28 -0400

114 lines

New Thread

ENVIORNMENTAL DATA IN PACKAGING

ENVIORNMENTAL DATA IN PACKAGING

Sudarshan Siddhaye <[log in to unmask]>

Mon, 20 Jul 1998 12:12:51 -0700

39 lines

Re: ENVIORNMENTAL DATA IN PACKAGING

Stephen R. Gregory <[log in to unmask]>

Mon, 20 Jul 1998 18:59:58 EDT

56 lines

New Thread

Environmental tests for press-fit components

Re: Environmental tests for press-fit components

Johannes Sivula <[log in to unmask]>

Tue, 30 Jun 1998 09:59:26 +0300

156 lines

New Thread

EP&P article, Au diffusion in near eutectic solder.

EP&P article, Au diffusion in near eutectic solder.

Alderete, Michael <[log in to unmask]>

Wed, 8 Jul 1998 07:32:29 -0700

28 lines

New Thread

EPCmail-3

EPCmail-3

Philip Stoten <[log in to unmask]>

Tue, 14 Jul 1998 17:59:57 +0100

739 lines

New Thread

equipment selection model

equipment selection model

LI YUAN <[log in to unmask]>

Wed, 1 Jul 1998 10:13:42 -0600

39 lines

Re: equipment selection model

Tenison Stone <[log in to unmask]>

Wed, 1 Jul 1998 13:10:07 -0500

80 lines

New Thread

ESD Faraday shielding

ESD Faraday shielding

FREDA CHILCOTE <[log in to unmask]>

Fri, 17 Jul 1998 12:40:32 -0700

31 lines

Re: ESD Faraday shielding

Chilcote, Jim (AZ75) <[log in to unmask]>

Fri, 17 Jul 1998 18:40:59 -0500

65 lines

New Thread

ESD grounding

ESD grounding

KC Chan <[log in to unmask]>

Tue, 28 Jul 1998 11:20:01 +0800

31 lines

Re: ESD grounding

Ralph Hersey <[log in to unmask]>

Mon, 27 Jul 1998 22:13:17 -0700

110 lines

Re: ESD grounding

No Name Available <[log in to unmask]>

Tue, 28 Jul 1998 22:17:38 EDT

26 lines

New Thread

etch factor

etch factor

James Patten <[log in to unmask]>

Tue, 7 Jul 1998 07:18:57 -0700

27 lines

Re: etch factor

Eddie Brunker <[log in to unmask]>

Tue, 7 Jul 1998 15:42:10 +0100

34 lines

Re: Etch Factor

Phil Culpovich <[log in to unmask]>

Wed, 8 Jul 1998 06:42:46 -0700

66 lines

New Thread

Express Packaging Services and John Lau

Re: Express Packaging Services and John Lau

Alderete, Michael <[log in to unmask]>

Wed, 29 Jul 1998 09:33:26 -0700

49 lines

New Thread

Fab : Solder mask thickness

Fab : Solder mask thickness

Blanchet, Richard <[log in to unmask]>

Wed, 22 Jul 1998 11:19:30 -0400

32 lines

Re: Fab : Solder mask thickness

Brett Goldstein <[log in to unmask]>

Wed, 22 Jul 1998 18:02:54 +0000

51 lines

Re: Fab : Solder mask thickness

[log in to unmask]

Wed, 22 Jul 1998 18:41:15 EDT

24 lines

Re: Fab : Solder mask thickness

Aric parr <[log in to unmask]>

Thu, 23 Jul 1998 07:35:36 EDT

82 lines

New Thread

Fab : Solder mask thicknessA Reply

Re: Fab : Solder mask thicknessA Reply

George Milad <[log in to unmask]>

Wed, 22 Jul 1998 13:40:43 EDT

33 lines

New Thread

Fab: Bow & Twist

Fab: Bow & Twist

Steve Collins <[log in to unmask]>

Tue, 14 Jul 1998 10:53:13 -0600

30 lines

Re: Fab: Bow & Twist

Desroches, Charles <[log in to unmask]>

Tue, 14 Jul 1998 13:06:23 -0400

78 lines

New Thread

FAB: FR-4 Thermal Limits?

Re: FAB: FR-4 Thermal Limits?

[log in to unmask]

Mon, 27 Jul 1998 14:01:19 -0500

30 lines

New Thread

Fab: Permanganate

Fab: Permanganate

Ed Cosper <[log in to unmask]>

Fri, 24 Jul 1998 12:03:30 -0500

30 lines

Re: Fab: Permanganate

[log in to unmask]

Fri, 24 Jul 1998 13:08:35 EDT

27 lines

Re: Fab: Permanganate

Mike Bailey <[log in to unmask]>

Fri, 24 Jul 1998 10:41:17 -0400

28 lines

Re: Fab: Permanganate

<Rudy Sedlak> <[log in to unmask]>

Fri, 24 Jul 1998 20:20:00 EDT

31 lines

Re: Fab: Permanganate

Michael Carano <[log in to unmask]>

Sat, 25 Jul 1998 10:27:20 -0700

44 lines

New Thread

FAB: Plugged, Filled &/or Tented Vias

Re: FAB: Plugged, Filled &/or Tented Vias

Mary Elsis <[log in to unmask]>

Wed, 1 Jul 1998 08:56:09 -0500

38 lines

Re: FAB: Plugged, Filled &/or Tented Vias

Leslie O. Connally <[log in to unmask]>

Wed, 1 Jul 1998 08:23:03 -0700

63 lines

New Thread

Farewell TechNet - Technical Writer Available

Farewell TechNet - Technical Writer Available

Douglas H. Bennett <[log in to unmask]>

Tue, 28 Jul 1998 14:05:41 -0700

42 lines

Re: Farewell TechNet - Technical Writer Available

Paul Klasek <[log in to unmask]>

Wed, 29 Jul 1998 09:49:22 +1000

78 lines

New Thread

Fidutial Requirements

Re: Fidutial Requirements

Graham, Christy [MICOM:LAVE] <[log in to unmask]>

Thu, 2 Jul 1998 08:41:55 -0700

53 lines

Re: Fidutial Requirements

Lisa Williams <[log in to unmask]>

Thu, 2 Jul 1998 11:49:41 -0500

83 lines

New Thread

Final/Sort Inspection

Final/Sort Inspection

Mary Lou Carlson <[log in to unmask]>

Thu, 9 Jul 1998 12:29:43 -0700

88 lines

New Thread

Flow patterns on multi-layer boards

Flow patterns on multi-layer boards

MICHAEL DODSON <[log in to unmask]>

Tue, 14 Jul 1998 17:37:06 +0000

37 lines

New Thread

Fluid Head

Fluid Head

WHATEVER <[log in to unmask]>

Thu, 23 Jul 1998 23:18:56 -0500

28 lines

New Thread

Flux on Goldfinger

Flux on Goldfinger

Muhammad, Masdi <[log in to unmask]>

Wed, 22 Jul 1998 16:16:00 -0700

33 lines

Re: Flux on Goldfinger

PELCHAT_JM <[log in to unmask]>

Thu, 23 Jul 1998 07:15:01 -0400

65 lines

Re: Flux on Goldfinger

superflx <[log in to unmask]>

Fri, 24 Jul 1998 10:09:08 -0400

52 lines

Re: Flux on Goldfinger

Noppadol S. <[log in to unmask]>

Sat, 25 Jul 1998 15:03:10 +0700

60 lines

Re: Flux on Goldfinger

PELCHAT_JM <[log in to unmask]>

Tue, 28 Jul 1998 08:27:37 -0400

67 lines

New Thread

FR-4 Emittance

FR-4 Emittance

Mark Harrand <[log in to unmask]>

Mon, 6 Jul 1998 17:33:16 -0600

34 lines

Re: FR-4 Emittance

Stephen R. Gregory <[log in to unmask]>

Mon, 6 Jul 1998 19:54:12 EDT

45 lines

Re: FR-4 Emittance

David Whalley <[log in to unmask]>

Tue, 7 Jul 1998 12:50:05 +0100

47 lines

Re: FR-4 Emittance

Leslie O. Connally <[log in to unmask]>

Wed, 8 Jul 1998 08:28:38 -0700

76 lines

New Thread

FR-5 vs Warp & Twist

FR-5 vs Warp & Twist

김달영 과장 전자 본사개발지원팀 <[log in to unmask]>

Tue, 14 Jul 1998 09:34:43 +0900

35 lines

Re: FR-5 vs Warp & Twist

Jerome Sallo <[log in to unmask]>

Tue, 14 Jul 1998 10:30:26 EDT

27 lines

Re: FR-5 vs Warp & Twist

Frank K. Frimpong <[log in to unmask]>

Tue, 14 Jul 1998 15:59:15 +0000

36 lines

New Thread

FR4 and EP3

FR4 and EP3

Ian Squires <[log in to unmask]>

Tue, 21 Jul 1998 17:13:26 PDT

45 lines

New Thread

FR4 insulator thickness

FR4 insulator thickness

Hurst, Joe <[log in to unmask]>

Fri, 31 Jul 1998 09:46:24 -0400

34 lines

New Thread

Fw: Travel arrangements to Austin, TX Sept 23 - 26, 1998

Fw: Travel arrangements to Austin, TX Sept 23 - 26, 1998

Steve Collins <[log in to unmask]>

Thu, 30 Jul 1998 12:35:42 -0600

45 lines

New Thread

Fw: Travel arrangements to Dallas Sept 15, 1998

Fw: Travel arrangements to Dallas Sept 15, 1998

Steve Collins <[log in to unmask]>

Thu, 30 Jul 1998 12:37:17 -0600

43 lines

Re: Fw: Travel arrangements to Dallas Sept 15, 1998

Brian K. Doughty <[log in to unmask]>

Thu, 30 Jul 1998 14:37:17 EDT

26 lines

Fw: Travel arrangements to Dallas Sept 15, 1998

Matthew Park <[log in to unmask]>

Thu, 30 Jul 1998 12:43:07 -0700

70 lines

Re: Fw: Travel arrangements to Dallas Sept 15, 1998

JoAnn Amerson <[log in to unmask]>

Thu, 30 Jul 1998 15:48:52 -0400

63 lines

Re: Fw: Travel arrangements to Dallas Sept 15, 1998

John Denton <[log in to unmask]>

Thu, 30 Jul 1998 17:11:13 -0400

86 lines

New Thread

FW: [TN] C.O.P.S. Software problems

FW: [TN] C.O.P.S. Software problems

Paul Klasek <[log in to unmask]>

Thu, 30 Jul 1998 09:48:04 +1000

238 lines

New Thread

FW: [TN] Electropolishing Laser-Cut Stencils

FW: [TN] Electropolishing Laser-Cut Stencils

Dhawan, Ashok <[log in to unmask]>

Wed, 15 Jul 1998 17:00:21 -0500

139 lines

New Thread

FW: [TN] Mil-S-13949

FW: [TN] Mil-S-13949

Sheila Smith <[log in to unmask]>

Fri, 31 Jul 1998 09:36:43 -0400

68 lines

New Thread

FW: [TN] MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

FW: [TN] MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

Chilcote, Jim (AZ75) <[log in to unmask]>

Wed, 22 Jul 1998 10:55:13 -0500

54 lines

New Thread

Fwd: reflow oven

Fwd: reflow oven

Angie Marques <[log in to unmask]>

Fri, 10 Jul 1998 10:54:07 -0400

38 lines

Re: Fwd: reflow oven

Stephen R. Gregory <[log in to unmask]>

Fri, 10 Jul 1998 14:21:24 EDT

54 lines

Re: Fwd: reflow oven

Sean Heffernan <[log in to unmask]>

Fri, 10 Jul 1998 11:34:36 -0400

36 lines

Re: Fwd: reflow oven

ETS <[log in to unmask]>

Fri, 10 Jul 1998 12:24:56 -0700

69 lines

Re: Fwd: reflow oven

ETS <[log in to unmask]>

Fri, 10 Jul 1998 12:34:43 -0700

60 lines

Re: Fwd: reflow oven

Stephen R. Gregory <[log in to unmask]>

Fri, 10 Jul 1998 15:58:42 EDT

72 lines

Re: Fwd: reflow oven

ETS <[log in to unmask]>

Fri, 10 Jul 1998 14:10:56 -0700

111 lines

Re: Fwd: reflow oven

Kathy Palumbo <[log in to unmask]>

Fri, 10 Jul 1998 15:21:40 -0700

79 lines

Re: Fwd: reflow oven

Stephen R. Gregory <[log in to unmask]>

Fri, 10 Jul 1998 18:59:19 EDT

73 lines

Fwd: reflow oven

Jeff Hempton <[log in to unmask]>

Mon, 13 Jul 1998 11:56:30 -0500

80 lines

New Thread

Gen: Finstrate Finestrate

Gen: Finstrate Finestrate

David Bergman <[log in to unmask]>

Wed, 22 Jul 1998 17:48:40 -0500

38 lines

New Thread

GEN: IPC Standard for Stencil Apertures

GEN: IPC Standard for Stencil Apertures

Jan Satterfield <[log in to unmask]>

Thu, 9 Jul 1998 15:28:25 -0600

20 lines

Re: GEN: IPC Standard for Stencil Apertures

Jack Crawford <[log in to unmask]>

Thu, 9 Jul 1998 16:57:39 -0500

40 lines

New Thread

Get The Cash You Need Now!!!

Get The Cash You Need Now!!!

Advanced Funding <[log in to unmask]>

Mon, 27 Jul 1998 06:28:43 +0200

58 lines

New Thread

Glenbrook x-ray??

Glenbrook x-ray??

Rick Thompson <[log in to unmask]>

Wed, 29 Jul 1998 11:27:43 -0700

36 lines

Re: Glenbrook x-ray??

Cobey Schmidt <[log in to unmask]>

Wed, 29 Jul 1998 13:37:23 -0500

80 lines

Re: Glenbrook x-ray??

Sean Heffernan <[log in to unmask]>

Wed, 29 Jul 1998 13:01:43 -0700

81 lines

Re: Glenbrook x-ray??

Rick Thompson <[log in to unmask]>

Wed, 29 Jul 1998 13:19:43 -0700

110 lines

Re: Glenbrook x-ray??

Paul Gould <[log in to unmask]>

Wed, 29 Jul 1998 22:45:27 +0100

61 lines

Re: Glenbrook x-ray??

Brad Kendall <[log in to unmask]>

Thu, 30 Jul 1998 08:43:45 -0400

87 lines

Re: Glenbrook x-ray??

David D Hillman <[log in to unmask]>

Thu, 30 Jul 1998 08:16:08 -0500

85 lines

Re: Glenbrook x-ray??

Bev Christian <[log in to unmask]>

Thu, 30 Jul 1998 09:28:54 -0400

138 lines

Re: Glenbrook x-ray??

Paul Klasek <[log in to unmask]>

Fri, 31 Jul 1998 09:15:31 +1000

157 lines

Re: Glenbrook x-ray??

Stephen R. Gregory <[log in to unmask]>

Thu, 30 Jul 1998 19:48:32 EDT

55 lines

Re: Glenbrook x-ray??

David D Hillman <[log in to unmask]>

Fri, 31 Jul 1998 13:10:18 -0500

107 lines

Re: Glenbrook x-ray??

Gabriela Bogdan <[log in to unmask]>

Fri, 31 Jul 1998 21:55:38 +0300

206 lines

New Thread

Glue Print

Glue Print

Paul Stolar <[log in to unmask]>

Thu, 9 Jul 1998 13:26:15 -0600

33 lines

New Thread

Gold Cleaning/Etching

Gold Cleaning/Etching

Meschter, Stephan J <[log in to unmask]>

Wed, 1 Jul 1998 12:09:30 -0400

42 lines

Re: Gold Cleaning/Etching

Lenny Kurup <[log in to unmask]>

Wed, 1 Jul 1998 14:11:28 -0400

61 lines

Re: Gold Cleaning/Etching

<Rudy Sedlak> <[log in to unmask]>

Wed, 1 Jul 1998 21:53:09 EDT

54 lines

New Thread

Gold Coated Solder

Re: Gold Coated Solder

sahmad <[log in to unmask]>

Mon, 27 Jul 1998 16:44:21 -0600

136 lines

New Thread

Gold Finish

Gold Finish

Neil Atkinson <[log in to unmask]>

Mon, 13 Jul 1998 14:04:29 +0100

61 lines

Re: Gold Finish

Smith Russell MSM LAPO US <[log in to unmask]>

Wed, 15 Jul 1998 05:14:00 +0200

69 lines

New Thread

Gold thickness - Edge

Re: Gold thickness - Edge

[log in to unmask]

Wed, 1 Jul 1998 12:27:19 -0700

102 lines

Re: Gold thickness - Edge

Jerry Cupples <[log in to unmask]>

Wed, 1 Jul 1998 15:29:49 -0500

57 lines

New Thread

Good Gas Mask??

Re: Good Gas Mask??

Roland Jaquet <[log in to unmask]>

Fri, 24 Jul 1998 09:04:31 +0200

68 lines

New Thread

hdd

hdd

ciprian <[log in to unmask]>

Tue, 7 Jul 1998 00:47:35 +0300

27 lines

New Thread

Help with Ionic Contamination testing

Help with Ionic Contamination testing

Kevin Stokes <[log in to unmask]>

Fri, 31 Jul 1998 16:42:20 -0400

48 lines

New Thread

HF BGA Testing

HF BGA Testing

[log in to unmask]

Thu, 23 Jul 1998 08:29:53 -0500

43 lines

Re: HF BGA Testing

sahmad <[log in to unmask]>

Thu, 23 Jul 1998 07:51:27 -0600

71 lines

New Thread

Homeplate-shaped Pads

Homeplate-shaped Pads

Ryan Jennens <[log in to unmask]>

Tue, 14 Jul 1998 12:15:30 -0400

32 lines

Re: Homeplate-shaped Pads

Stephen R. Gregory <[log in to unmask]>

Tue, 14 Jul 1998 12:41:38 EDT

51 lines

Re: Homeplate-shaped Pads

Ian Squires <[log in to unmask]>

Wed, 15 Jul 1998 09:28:48 PDT

112 lines

New Thread

Hot Bar Soldering??

Hot Bar Soldering??

Bruce Robertson <[log in to unmask]>

Mon, 20 Jul 1998 13:16:28 +1200

42 lines

Re: Hot Bar Soldering??

Mike Becker <[log in to unmask]>

Sun, 19 Jul 1998 21:52:11 -0700

68 lines

Re: Hot Bar Soldering??

Paul Stolar <[log in to unmask]>

Mon, 20 Jul 1998 08:49:51 -0600

84 lines

Re: Hot Bar Soldering??

Mike Becker <[log in to unmask]>

Mon, 20 Jul 1998 08:12:30 -0700

68 lines

Re: Hot Bar Soldering??

[log in to unmask]

Tue, 21 Jul 1998 13:38:28 PST

76 lines

Re: Hot Bar Soldering??

SEM Lab, Inc. <[log in to unmask]>

Tue, 21 Jul 1998 15:31:17 -0500

76 lines

Re: Hot Bar Soldering??

Noppadol S. <[log in to unmask]>

Sat, 25 Jul 1998 14:47:58 +0700

93 lines

Re: Hot Bar Soldering??

Noppadol S. <[log in to unmask]>

Sat, 25 Jul 1998 14:51:32 +0700

95 lines

New Thread

HTC Contact

HTC Contact

Sauer, Steven T. <[log in to unmask]>

Thu, 9 Jul 1998 15:04:00 E

26 lines

Re: HTC Contact

Edward J. Valentine <[log in to unmask]>

Fri, 10 Jul 1998 13:14:01 -0700

59 lines

New Thread

I need some CEM3 .059 1/1 and 1/0 laminate

I need some CEM3 .059 1/1 and 1/0 laminate

Lisa Parker <[log in to unmask]>

Thu, 16 Jul 1998 13:25:52 -0500

33 lines

New Thread

Ideas for PCB Supplier Survey Content

Ideas for PCB Supplier Survey Content

Hugh Scott Miller <[log in to unmask]>

Tue, 21 Jul 1998 10:00:35 -0400

295 lines

Re: Ideas for PCB Supplier Survey Content

Andrew J. Scholand <[log in to unmask]>

Tue, 21 Jul 1998 13:18:34 -0400

63 lines

New Thread

immersion Au

immersion Au

Neil Atkinson <[log in to unmask]>

Wed, 15 Jul 1998 09:41:15 +0100

81 lines

Re: immersion Au

Lenny Kurup <[log in to unmask]>

Thu, 16 Jul 1998 15:35:47 -0400

65 lines

New Thread

Immersion gold for wire bonding

Re: Immersion gold for wire bonding

Howard Lin <[log in to unmask]>

Wed, 15 Jul 1998 21:46:58 +0800

29 lines

Re: Immersion gold for wire bonding

David D Hillman <[log in to unmask]>

Wed, 15 Jul 1998 09:21:02 -0500

71 lines

New Thread

Immersion gold for wire bonding, a reply

Re: Immersion gold for wire bonding, a reply

George Milad <[log in to unmask]>

Wed, 15 Jul 1998 20:54:27 EDT

35 lines

New Thread

Impedance

Impedance

[log in to unmask]

Thu, 9 Jul 1998 17:51:48 EDT

27 lines

Re: Impedance

Paul Gould <[log in to unmask]>

Fri, 10 Jul 1998 10:47:28 +0100

53 lines

Re: Impedance

Rhoads, Randall E <[log in to unmask]>

Fri, 10 Jul 1998 08:22:19 -0400

97 lines

Impedance

Valerie Webber <[log in to unmask]>

Fri, 10 Jul 1998 08:46:48 -0500

51 lines

Re: Impedance

Douglas Mckean <[log in to unmask]>

Fri, 10 Jul 1998 16:13:27 -0700

113 lines

New Thread

Inf On Facit Paper Tape Puncher

Inf On Facit Paper Tape Puncher

R. Srinivasan <[log in to unmask]>

Tue, 7 Jul 1998 19:01:45 +0800

33 lines

Re: Inf On Facit Paper Tape Puncher

Reddy, Srirama Thimma (Srirama) <[log in to unmask]>

Tue, 7 Jul 1998 07:14:55 -0400

66 lines

Re: Inf On Facit Paper Tape Puncher

Per Viklund <[log in to unmask]>

Tue, 7 Jul 1998 13:18:40 +0200

86 lines

New Thread

inquire

inquire

Benedicto Cruz <bcruz@[192.1.1.215]>

Sat, 1 Aug 1998 11:46:15 +0000

46 lines

New Thread

Intermetallic Phase: BGA soldering on Immersion Nickel Gold PCB

Intermetallic Phase: BGA soldering on Immersion Nickel Gold PCB

Joseph Furrer <[log in to unmask]>

Fri, 31 Jul 1998 09:08:45 +0200

56 lines

Re: Intermetallic Phase: BGA soldering on Immersion Nickel Gold PCB

David D Hillman <[log in to unmask]>

Fri, 31 Jul 1998 12:48:05 -0500

74 lines

New Thread

International Approvals

International Approvals

Hugh Scott Miller <[log in to unmask]>

Sun, 19 Jul 1998 16:48:36 -0400

42 lines

New Thread

intrusive reflow and all

Re: intrusive reflow and all

ETS <[log in to unmask]>

Wed, 1 Jul 1998 14:46:43 -0700

121 lines

New Thread

IPC HOLE TO LEAD RATIOS

Re: IPC HOLE TO LEAD RATIOS

Hurst, Joe <[log in to unmask]>

Wed, 1 Jul 1998 08:35:17 -0400

58 lines

New Thread

IPC Standards

IPC Standards

Joaquin Molina <[log in to unmask]>

Tue, 21 Jul 1998 16:59:38 -0400

36 lines

New Thread

IPC std procedure for PCB storage condition.

IPC std procedure for PCB storage condition.

Desroches, Charles <[log in to unmask]>

Thu, 16 Jul 1998 14:05:42 -0400

34 lines

Re: IPC std procedure for PCB storage condition.

Brian K. Doughty <[log in to unmask]>

Thu, 16 Jul 1998 16:53:50 EDT

27 lines

Re: IPC std procedure for PCB storage condition.

Lauren Yerant <[log in to unmask]>

Fri, 17 Jul 1998 10:32:55 -0500

56 lines

Re: IPC std procedure for PCB storage condition.

Lauren Yerant <[log in to unmask]>

Fri, 17 Jul 1998 10:47:58 -0500

49 lines

New Thread

IPC-1710 and 1720

IPC-1710 and 1720

David Bergman <[log in to unmask]>

Fri, 10 Jul 1998 10:06:34 -0500

63 lines

New Thread

IPC-B-36 Test Coupons

IPC-B-36 Test Coupons

Duy Nguyen <[log in to unmask]>

Tue, 14 Jul 1998 11:27:14 -0700

33 lines

Re: IPC-B-36 Test Coupons

[log in to unmask]

Tue, 14 Jul 1998 15:43:07 EDT

27 lines

New Thread

IPC-D-325A Question

IPC-D-325A Question

Steve Hawn <[log in to unmask]>

Mon, 20 Jul 1998 07:47:09 -0700

40 lines

Re: IPC-D-325A Question

JoAnn Amerson <[log in to unmask]>

Mon, 20 Jul 1998 11:11:40 -0400

58 lines

Re: IPC-D-325A Question

Gary Ferrari <[log in to unmask]>

Mon, 20 Jul 1998 18:49:09 -0500

80 lines

Re: IPC-D-325A Question

Lisa Williams <[log in to unmask]>

Tue, 21 Jul 1998 10:10:33 -0500

82 lines

New Thread

Is Ni/Au Discoloration comments from manufacturer valid?

Is Ni/Au Discoloration comments from manufacturer valid?

Ken Patel <[log in to unmask]>

Thu, 9 Jul 1998 10:03:56 -0700

46 lines

New Thread

Is there a masking product that is non-conductive and can be left on after conformal coating.

Is there a masking product that is non-conductive and can be left on after conformal coating.

Brent Alcorn <[log in to unmask]>

Mon, 6 Jul 1998 16:42:40 -0300

37 lines

New Thread

J-STD-001B

J-STD-001B

Steiger, Tina <[log in to unmask]>

Thu, 23 Jul 1998 11:50:34 -0500

21 lines

New Thread

KEMET capacitor 2225 size --not suitable for wave solder ing???

Re: KEMET capacitor 2225 size --not suitable for wave solder ing???

McMonagle, Michael R. <[log in to unmask]>

Thu, 2 Jul 1998 13:19:14 -0500

97 lines

Re: KEMET capacitor 2225 size --not suitable for wave solder ing???

Ed Holton <[log in to unmask]>

Mon, 6 Jul 1998 09:28:41 -0400

138 lines

Re: KEMET capacitor 2225 size --not suitable for wave solder ing???

John Maxwell <[log in to unmask]>

Thu, 9 Jul 1998 11:25:08 -0600

61 lines

Re: KEMET capacitor 2225 size --not suitable for wave solder ing???

Bev Christian <[log in to unmask]>

Thu, 9 Jul 1998 14:27:47 -0400

93 lines

New Thread

KEMET capacitor 2225 size --not suitable for wave soldering???

KEMET capacitor 2225 size --not suitable for wave soldering???

Dhawan, Ashok <[log in to unmask]>

Thu, 2 Jul 1998 12:57:03 -0500

46 lines

New Thread

Lab for Ion chromatography (IC) analysis

Lab for Ion chromatography (IC) analysis

Gregg Klawson <[log in to unmask]>

Tue, 14 Jul 1998 14:39:03 -0400

29 lines

Re: Lab for Ion chromatography (IC) analysis

David D Hillman <[log in to unmask]>

Tue, 14 Jul 1998 14:01:07 -0500

68 lines

Re: Lab for Ion chromatography (IC) analysis

Aric parr <[log in to unmask]>

Tue, 14 Jul 1998 15:31:55 EDT

57 lines

New Thread

Lab to do MILSTD883 testing

Lab to do MILSTD883 testing

Sheila Smith <[log in to unmask]>

Wed, 22 Jul 1998 12:24:06 -0400

31 lines

Re: Lab to do MILSTD883 testing

Russ Winslow <[log in to unmask]>

Fri, 24 Jul 1998 11:31:23 -0700

31 lines

New Thread

Lab to do MILSTD883 testing -Reply

Lab to do MILSTD883 testing -Reply

Ron Hayashi <[log in to unmask]>

Wed, 22 Jul 1998 09:35:51 -0700

23 lines

New Thread

Land/Hole fabrication allowance

Land/Hole fabrication allowance

Steve Hawn <[log in to unmask]>

Thu, 16 Jul 1998 11:48:39 -0700

30 lines

New Thread

lead free solder

lead free solder

Landes, Jeff <[log in to unmask]>

Thu, 23 Jul 1998 17:13:00 PDT

40 lines

Re: lead free solder

PELCHAT_JM <[log in to unmask]>

Fri, 24 Jul 1998 06:59:00 -0400

79 lines

Re: lead free solder

Sauer, Steven T. <[log in to unmask]>

Fri, 24 Jul 1998 08:15:00 E

86 lines

Re: lead free solder

Ed Holton <[log in to unmask]>

Fri, 24 Jul 1998 08:22:51 -0400

114 lines

New Thread

Lead Solderability

Lead Solderability

Jared Lang <[log in to unmask]>

Fri, 17 Jul 1998 15:15:55 -0700

53 lines

Lead Solderability

Kasprzak, Bill (esd) US <[log in to unmask]>

Sat, 18 Jul 1998 06:36:00 PDT

38 lines

Re: Lead Solderability

Ryan Jennens <[log in to unmask]>

Mon, 20 Jul 1998 08:51:06 -0400

32 lines

Re: Lead Solderability

Paul Terranova <[log in to unmask]>

Mon, 20 Jul 1998 11:20:06 -0400

105 lines

New Thread

Lead Solderability II

Lead Solderability II

Jared Lang <[log in to unmask]>

Tue, 21 Jul 1998 09:35:13 -0700

142 lines

Re: Lead Solderability II

Ryan Jennens <[log in to unmask]>

Tue, 21 Jul 1998 13:58:35 -0400

33 lines

Re: Lead Solderability II

David D Hillman <[log in to unmask]>

Tue, 21 Jul 1998 18:42:13 -0500

199 lines

New Thread

Lead Trimming Question ?

Lead Trimming Question ?

Chris_Smith <[log in to unmask]>

Thu, 16 Jul 1998 13:39:11 -0500

42 lines

Re: Lead Trimming Question ?

Paul Klasek <[log in to unmask]>

Sat, 18 Jul 1998 11:01:53 +1000

108 lines

New Thread

Lead Trimming Question ? -Reply

Lead Trimming Question ? -Reply

Matthew Park <[log in to unmask]>

Thu, 16 Jul 1998 14:04:47 -0700

94 lines

New Thread

Lg component mounting advice

Lg component mounting advice

PELCHAT_JM <[log in to unmask]>

Mon, 20 Jul 1998 08:33:44 -0400

40 lines

New Thread

Listing of PCB CAD Companies

Listing of PCB CAD Companies

[log in to unmask]

Wed, 29 Jul 1998 12:33:41 -0700

28 lines

Re: Listing of PCB CAD Companies

Fred Pescitelli <[log in to unmask]>

Wed, 29 Jul 1998 16:20:10 +0000

42 lines

Re: Listing of PCB CAD Companies

[log in to unmask]

Wed, 29 Jul 1998 17:16:31 EDT

33 lines

Listing of PCB CAD Companies

Thomas Martin <[log in to unmask]>

Thu, 30 Jul 1998 15:27:55 -0400

31 lines

New Thread

Look for contact information of Express Packaging Systems and Joh n Lau

Look for contact information of Express Packaging Systems and Joh n Lau

Yuan Li <[log in to unmask]>

Mon, 27 Jul 1998 15:57:39 -0700

27 lines

New Thread

Looking for A Pcad Designer or Bureau...

Looking for A Pcad Designer or Bureau...

Beller, Les <[log in to unmask]>

Wed, 8 Jul 1998 09:51:09 -0600

37 lines

New Thread

Looking for Barnaby Tack

Looking for Barnaby Tack

Joy, Stephen C <[log in to unmask]>

Tue, 21 Jul 1998 15:19:00 -0700

25 lines

New Thread

Looking for BGA X ray inspection criteria

Looking for BGA X ray inspection criteria

Rudolph Yu <[log in to unmask]>

Thu, 30 Jul 1998 13:24:56 -0700

32 lines

New Thread

LOOKING FOR MANUFACTURE CAN WORK GETEK 0.0035

LOOKING FOR MANUFACTURE CAN WORK GETEK 0.0035

Eddy <[log in to unmask]>

Fri, 10 Jul 1998 20:14:59 +0800

32 lines

New Thread

Magazines and Journals

Magazines and Journals

BPL - PCB Division <[log in to unmask]>

Wed, 8 Jul 1998 09:19:51 +0500

34 lines

Re: Magazines and Journals

ETS <[log in to unmask]>

Wed, 8 Jul 1998 09:08:23 -0700

79 lines

Re: Magazines and Journals

David Gonnerman <[log in to unmask]>

Wed, 8 Jul 1998 11:24:55 -0500

78 lines

Re: Magazines and Journals

Pratap Singh <[log in to unmask]>

Sun, 12 Jul 1998 12:56:00 -0700

61 lines

New Thread

mailing list

mailing list

Parvez M.S. Patel <[log in to unmask]>

Thu, 9 Jul 1998 14:36:12 -0400

36 lines

Re: mailing list

Jack Crawford <[log in to unmask]>

Thu, 9 Jul 1998 14:23:58 -0500

73 lines

New Thread

Manganin wire

Manganin wire

Tim Frigon <[log in to unmask]>

Mon, 6 Jul 1998 09:21:53 -0500

25 lines

Re: Manganin wire

superflx <[log in to unmask]>

Tue, 7 Jul 1998 09:01:17 -0400

44 lines

Re: Manganin wire

David D Hillman <[log in to unmask]>

Tue, 7 Jul 1998 09:02:26 -0500

85 lines

New Thread

Manual insertion cycle time

Manual insertion cycle time

Paul B <[log in to unmask]>

Wed, 8 Jul 1998 17:10:54 -0400

28 lines

Re: Manual insertion cycle time

Lon Weffers <[log in to unmask]>

Thu, 9 Jul 1998 08:13:32 +0200

54 lines

Re: Manual Insertion Cycle Time

Marc O. Bituagan <[log in to unmask]>

Thu, 9 Jul 1998 19:34:11 +0000

28 lines

New Thread

Manual Insertion Time

Manual Insertion Time

Kasprzak, Bill (esd) US <[log in to unmask]>

Fri, 10 Jul 1998 07:56:00 PDT

55 lines

Re: Manual Insertion Time

Paul Stolar <[log in to unmask]>

Fri, 10 Jul 1998 08:31:15 -0600

95 lines

New Thread

Max operating temp - PBGA

Max operating temp - PBGA

Mauro Nardini <[log in to unmask]>

Mon, 13 Jul 1998 14:43:13 -0700

42 lines

New Thread

Micro Via Processing

Micro Via Processing

[log in to unmask]

Thu, 30 Jul 1998 11:55:54 -0500

28 lines

New Thread

Midwest Circuit Association

Midwest Circuit Association

Ron Videen <[log in to unmask]>

Mon, 20 Jul 1998 22:53:24 -0500

34 lines

New Thread

Mil Std P28809 - Ionic Residue PCB

Mil Std P28809 - Ionic Residue PCB

Liam Barry <[log in to unmask]>

Fri, 3 Jul 1998 09:54:17 +0100

31 lines

Re: Mil Std P28809 - Ionic Residue PCB

Cash, Alan <[log in to unmask]>

Fri, 17 Jul 1998 14:24:22 -0400

61 lines

New Thread

Mil-S-13949

Mil-S-13949

Vaughan, Ralph H <[log in to unmask]>

Fri, 31 Jul 1998 06:06:24 -0700

35 lines

Re: Mil-S-13949

Christopher Jorgensen <[log in to unmask]>

Fri, 31 Jul 1998 09:06:25 -0500

106 lines

New Thread

MIL-S-13949 Cancellation Notice

MIL-S-13949 Cancellation Notice

Jack Crawford <[log in to unmask]>

Fri, 10 Jul 1998 17:22:43 -0500

89 lines

New Thread

MIL-STD-130

MIL-STD-130

Kathy Palumbo <[log in to unmask]>

Thu, 16 Jul 1998 08:38:53 -0700

34 lines

Re: MIL-STD-130

sahmad <[log in to unmask]>

Thu, 16 Jul 1998 10:10:28 -0600

64 lines

Re: MIL-STD-130

Cash, Alan <[log in to unmask]>

Thu, 16 Jul 1998 14:41:46 -0400

72 lines

Re: MIL-STD-130

Tom Moore <[log in to unmask]>

Thu, 16 Jul 1998 21:29:17 -0400

89 lines

Re: MIL-STD-130

George Toman <[log in to unmask]>

Fri, 17 Jul 1998 08:46:04 -0400

136 lines

New Thread

Military Spec Crossovers

Military Spec Crossovers

Hogue, Pat (AZ76) <[log in to unmask]>

Tue, 14 Jul 1998 18:17:53 -0700

37 lines

New Thread

Military Specifications

Military Specifications

Robert J. Benson <[log in to unmask]>

Sun, 5 Jul 1998 17:27:49 -0700

78 lines

New Thread

Mini Micro Stencil Phone #

Mini Micro Stencil Phone #

Tenison Stone <[log in to unmask]>

Tue, 7 Jul 1998 13:29:19 -0500

33 lines

Re: Mini Micro Stencil Phone #

Rick Thompson <[log in to unmask]>

Tue, 7 Jul 1998 12:28:30 -0700

67 lines

New Thread

Mini Micro Stencil Phone # -Reply

Mini Micro Stencil Phone # -Reply

Ron Hayashi <[log in to unmask]>

Tue, 7 Jul 1998 11:41:08 -0700

23 lines

New Thread

Modeling moisture exposure in laminate

Re: Modeling moisture exposure in laminate

Manish <[log in to unmask]>

Sat, 11 Jul 1998 15:53:07 -0400

31 lines

New Thread

MOUNTING HOLE

MOUNTING HOLE

Jimmy J. Isla <[log in to unmask]>

Thu, 30 Jul 1998 16:10:59 -0700

25 lines

Re: MOUNTING HOLE

Brett Goldstein <[log in to unmask]>

Fri, 31 Jul 1998 08:58:28 +0000

45 lines

New Thread

MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

Eddie Brunker <[log in to unmask]>

Wed, 22 Jul 1998 15:50:47 +0100

31 lines

Re: MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

Jared Lang <[log in to unmask]>

Wed, 22 Jul 1998 10:40:21 -0700

77 lines

Re: MR TWAN/A.L. SERVICE/ULTRACLEAN II/TOOLTRONICS

[log in to unmask]

Thu, 23 Jul 1998 09:56:07 -0500

58 lines

New Thread

MVIIF vs CP642 or Fuji vs Panasert - Part II

MVIIF vs CP642 or Fuji vs Panasert - Part II

My Nguyen <[log in to unmask]>

Thu, 23 Jul 1998 21:36:39 -0700

69 lines

Re: MVIIF vs CP642 or Fuji vs Panasert - Part II

Matthew Park <[log in to unmask]>

Fri, 24 Jul 1998 10:48:41 -0700

150 lines

New Thread

N-Proply-Bromide (Ensolv) compatability with Uralane 575 3 and 5750

Re: N-Proply-Bromide (Ensolv) compatability with Uralane 575 3 and 5750

Bev Christian <[log in to unmask]>

Wed, 15 Jul 1998 23:11:33 -0400

70 lines

New Thread

N-Proply-Bromide (Ensolv) compatability with Uralane 5753 and 5750

N-Proply-Bromide (Ensolv) compatability with Uralane 5753 and 5750

Edward Boucher <[log in to unmask]>

Wed, 15 Jul 1998 16:05:26 -0400

35 lines

New Thread

N-Ray Inspection

N-Ray Inspection

Neubauer, Terri <[log in to unmask]>

Wed, 15 Jul 1998 10:25:51 -0400

34 lines

Re: N-Ray Inspection

Ralph Hersey <[log in to unmask]>

Wed, 15 Jul 1998 11:16:38 -0700

82 lines

New Thread

Need CAD format descriptions

Need CAD format descriptions

Helmut Wohland <[log in to unmask]>

Thu, 1 Jan 1970 01:00:00 +0000

35 lines

Re: Need CAD format descriptions

Matthias Mansfeld <[log in to unmask]>

Fri, 24 Jul 1998 16:26:13 +0200

63 lines

Re: Need CAD format descriptions

Robert Welch <[log in to unmask]>

Fri, 24 Jul 1998 11:19:08 +0000

28 lines

Re: Need CAD format descriptions

Jeff Seeger <[log in to unmask]>

Fri, 24 Jul 1998 15:39:47 -0400

52 lines

New Thread

need Reliability laboratory

need Reliability laboratory

Erat, Wolfgang <[log in to unmask]>

Mon, 20 Jul 1998 12:41:05 -0400

31 lines

Re: need Reliability laboratory

Ted Stern <[log in to unmask]>

Mon, 20 Jul 1998 15:01:04 -0700

57 lines

Re: need Reliability laboratory

Delsen Testing Laboratories <[log in to unmask]>

Mon, 20 Jul 1998 16:01:53 -0700

63 lines

New Thread

Need Supplier

Need Supplier

[log in to unmask]

Thu, 2 Jul 1998 13:31:13 EDT

27 lines

New Thread

Nelco web site

Re: Nelco web site

Howard Lin <[log in to unmask]>

Thu, 16 Jul 1998 00:38:14 +0800

24 lines

Re: Nelco web site

Alderete, Michael <[log in to unmask]>

Thu, 16 Jul 1998 07:09:43 -0700

47 lines

New Thread

Ni plated vias

Ni plated vias

Jim Herard <[log in to unmask]>

Wed, 8 Jul 1998 17:35:17 -0400

71 lines

New Thread

Nickel Melting Point

Nickel Melting Point

Ruben Irizarry <[log in to unmask]>

Thu, 16 Jul 1998 12:31:22 -0300

24 lines

Re: Nickel Melting Point

Paul Wilson <[log in to unmask]>

Thu, 16 Jul 1998 12:59:12 -0400

65 lines

Re: Nickel Melting Point

Larry Grazian <[log in to unmask]>

Thu, 16 Jul 1998 09:59:31 PDT

47 lines

Re: Nickel Melting Point

Meigs, Jonathan <[log in to unmask]>

Thu, 16 Jul 1998 13:07:00 -0700

48 lines

Re: Nickel Melting Point

McMonagle, Michael R. <[log in to unmask]>

Thu, 16 Jul 1998 12:14:49 -0500

55 lines

Re: Nickel Melting Point

Ruben Irizarry <[log in to unmask]>

Thu, 16 Jul 1998 14:19:10 -0300

23 lines

Re: Nickel Melting Point

Ruben Irizarry <[log in to unmask]>

Thu, 16 Jul 1998 14:54:55 -0300

22 lines

New Thread

Nickel Melting Point -Reply

Nickel Melting Point -Reply

Ron Hayashi <[log in to unmask]>

Thu, 16 Jul 1998 09:59:46 -0700

25 lines

Re: Nickel Melting Point -Reply

Ruben Irizarry <[log in to unmask]>

Thu, 16 Jul 1998 14:55:14 -0300

22 lines

New Thread

Nickel Plated Via's

Nickel Plated Via's

Signorelli, Paul <[log in to unmask]>

Wed, 8 Jul 1998 11:59:43 -0600

27 lines

New Thread

No Clean Flux

No Clean Flux

[log in to unmask]

Wed, 15 Jul 1998 16:29:04 PST

37 lines

Re: No Clean Flux

Brent Alcorn <[log in to unmask]>

Wed, 15 Jul 1998 14:04:09 -0300

58 lines

Re: No Clean Flux

Aric parr <[log in to unmask]>

Thu, 16 Jul 1998 07:08:31 EDT

101 lines

New Thread

no clean fluxes

no clean fluxes

Cheyenne Noda <[log in to unmask]>

Fri, 24 Jul 1998 15:00:19 -0700

33 lines

Re: no clean fluxes

Noppadol S. <[log in to unmask]>

Sat, 25 Jul 1998 15:33:40 +0700

61 lines

Re: no clean fluxes

Aric parr <[log in to unmask]>

Mon, 27 Jul 1998 07:27:34 EDT

111 lines

New Thread

No-clean and board incoming cleanliness

No-clean and board incoming cleanliness

Matthew Sanders <[log in to unmask]>

Mon, 27 Jul 1998 15:44:41 -0700

36 lines

Re: No-clean and board incoming cleanliness

Bev Christian <[log in to unmask]>

Mon, 27 Jul 1998 19:06:33 -0400

76 lines

New Thread

North Texas Chapter ~ IPC Designers Council Meeting July 9th @ 6:30PM

North Texas Chapter ~ IPC Designers Council Meeting July 9th @ 6:30PM

Keith Larson <[log in to unmask]>

Sat, 4 Jul 1998 06:55:20 -0500

227 lines

New Thread

Not read: Lead Solderability II

Not read: Lead Solderability II

Marc Strickland <[log in to unmask]>

Tue, 21 Jul 1998 17:20:36 -0700

76 lines

Not read: Lead Solderability II

Joseph E. J. Duclos Jr. <[log in to unmask]>

Tue, 21 Jul 1998 19:11:22 -0400

38 lines

New Thread

Not read: need info: automated counting chip capacitors / resisto rs

Not read: need info: automated counting chip capacitors / resisto rs

Mike Wilson <[log in to unmask]>

Mon, 27 Jul 1998 05:17:07 -0700

72 lines

New Thread

Obsolete FR2 1.60mm 1/1 - 4500kg

Obsolete FR2 1.60mm 1/1 - 4500kg

JB <[log in to unmask]>

Thu, 9 Jul 1998 15:18:19 +0800

36 lines

New Thread

OMEGA-PLY

OMEGA-PLY

Lee Sang Soo <[log in to unmask]>

Wed, 15 Jul 1998 07:21:10 +0900

31 lines

Re: OMEGA-PLY

[log in to unmask]

Tue, 14 Jul 1998 16:21:58 +0000

57 lines

New Thread

OSP thickness

OSP thickness

Predith, Ashley P <[log in to unmask]>

Tue, 14 Jul 1998 10:54:00 -0700

35 lines

New Thread

Oven belt speeds

Oven belt speeds

Charles Barker <[log in to unmask]>

Mon, 27 Jul 1998 08:39:17 -0500

28 lines

Re: Oven belt speeds

ETS <[log in to unmask]>

Mon, 27 Jul 1998 09:23:35 -0700

71 lines

Re: Oven belt speeds

Jan Satterfield <[log in to unmask]>

Mon, 27 Jul 1998 14:09:20 -0600

51 lines

New Thread

Oxidized HASL boards

Oxidized HASL boards

Thomas Jacob <[log in to unmask]>

Wed, 8 Jul 1998 12:08:34 +0200

43 lines

Re: Oxidized HASL boards

David D Hillman <[log in to unmask]>

Wed, 8 Jul 1998 08:22:50 -0500

99 lines

Re: Oxidized HASL boards

Lenny Kurup <[log in to unmask]>

Fri, 10 Jul 1998 12:25:24 -0400

67 lines

New Thread

Part Numbering System

Part Numbering System

Derek Wynne <[log in to unmask]>

Fri, 17 Jul 1998 16:31:12 +0100

91 lines

New Thread

PCB and Solder Paste Test Equipment

PCB and Solder Paste Test Equipment

Joaquin Molina <[log in to unmask]>

Tue, 21 Jul 1998 16:23:18 -0400

37 lines

Re: PCB and Solder Paste Test Equipment

Douglas Pauls <[log in to unmask]>

Tue, 21 Jul 1998 16:51:41 EDT

32 lines

PCB and Solder Paste Test Equipment

Joaquin Molina <[log in to unmask]>

Wed, 22 Jul 1998 12:24:54 -0400

37 lines

PCB and Solder Paste Test Equipment

Joaquin Molina <[log in to unmask]>

Thu, 23 Jul 1998 10:45:15 -0400

41 lines

PCB and Solder Paste Test Equipment

Joaquin Molina <[log in to unmask]>

Mon, 27 Jul 1998 11:53:06 -0400

43 lines

New Thread

PCB CAD Software Co's

Re: PCB CAD Software Co's

Mitch Morey <[log in to unmask]>

Thu, 30 Jul 1998 14:11:50 -0700

57 lines

New Thread

PCB Coatings Available

PCB Coatings Available

Hugh Scott Miller <[log in to unmask]>

Sun, 19 Jul 1998 16:48:02 -0400

35 lines

New Thread

PCB Fabrication Machine

PCB Fabrication Machine

ChongKwan Woo <[log in to unmask]>

Thu, 9 Jul 1998 12:15:55 +0900

40 lines

New Thread

PCB Finish Options

PCB Finish Options

Hugh Scott Miller <[log in to unmask]>

Sun, 19 Jul 1998 16:48:27 -0400

37 lines

New Thread

PCB Land Pattern for 1825 Ceramic Capactor

PCB Land Pattern for 1825 Ceramic Capactor

KK Chin <[log in to unmask]>

Thu, 16 Jul 1998 17:58:31 -0700

33 lines

New Thread

PCB Maximum Heat Excursions

Re: PCB Maximum Heat Excursions

[log in to unmask]

Tue, 21 Jul 1998 14:01:16 -0500

77 lines

Re: PCB Maximum Heat Excursions

Sauer, Steven T. <[log in to unmask]>

Tue, 21 Jul 1998 17:09:00 E

114 lines

New Thread

PCB papers for Am. Electroplater and Surface Finishers-June 21-24

PCB papers for Am. Electroplater and Surface Finishers-June 21-24

Richard Haynes <[log in to unmask]>

Fri, 31 Jul 1998 17:25:29 -0400

69 lines

New Thread

PCB Sales Opportunity

PCB Sales Opportunity

Allison Joy <[log in to unmask]>

Tue, 21 Jul 1998 21:27:47 -0700

26 lines

New Thread

PCB Thickness

PCB Thickness

Andy Heidelberg <[log in to unmask]>

Thu, 2 Jul 1998 11:34:18 -0600

46 lines

Re: PCB Thickness

Eric Christison <[log in to unmask]>

Fri, 3 Jul 1998 10:39:49 +0100

45 lines

Re: PCB Thickness

Joseph Zacharias <[log in to unmask]>

Mon, 6 Jul 1998 08:39:08 -0700

87 lines

New Thread

people advertising in technet!

people advertising in technet!

Alex Stennett <[log in to unmask]>

Mon, 27 Jul 1998 10:37:14 +0000

61 lines

Re: people advertising in technet!

Per Viklund <[log in to unmask]>

Mon, 27 Jul 1998 12:46:39 +0200

104 lines

Re: people advertising in technet!

JB <[log in to unmask]>

Mon, 27 Jul 1998 20:59:59 +0800

149 lines

Re: people advertising in technet!

Richard Tassone <[log in to unmask]>

Mon, 27 Jul 1998 07:32:47 -0700

165 lines

New Thread

people advertising in technet! -Reply

Re: people advertising in technet! -Reply

Larry Campbell <[log in to unmask]>

Mon, 27 Jul 1998 09:46:26 -0400

24 lines

Re: people advertising in technet! -Reply

[log in to unmask]

Mon, 27 Jul 1998 13:22:13 EDT

23 lines

New Thread

Phosphorous content of electroless Ni

Phosphorous content of electroless Ni

Htter Simon <[log in to unmask]>

Mon, 6 Jul 1998 07:59:24 +0100

38 lines

Re: Phosphorous content of electroless Ni

Achim Neu <[log in to unmask]>

Wed, 8 Jul 1998 22:53:45 +0200

64 lines

New Thread

Plant lay-out software

Plant lay-out software

Marc O. Bituagan <[log in to unmask]>

Fri, 17 Jul 1998 15:05:08 +0000

35 lines

Re: Plant lay-out software

Lustig, Steven K.. <[log in to unmask]>

Fri, 17 Jul 1998 15:46:13 -0400

78 lines

Re: Plant lay-out software

Chris Johnston <[log in to unmask]>

Mon, 20 Jul 1998 09:20:24 +1000

67 lines

New Thread

Plating

Plating

Dick Desrosiers <[log in to unmask]>

Wed, 22 Jul 1998 11:13:17 EDT

27 lines

Re: Plating

Ed Cosper <[log in to unmask]>

Wed, 22 Jul 1998 11:08:10 -0500

73 lines

Re: Plating

Joel Fillion <[log in to unmask]>

Wed, 22 Jul 1998 08:51:57 -0700

60 lines

Re: Plating

Hans Rohr <[log in to unmask]>

Wed, 22 Jul 1998 20:41:18 -0400

49 lines

Re: Plating

Phil Culpovich <[log in to unmask]>

Wed, 22 Jul 1998 19:47:01 -0700

43 lines

Re: Plating

Goldman, Patricia J. <[log in to unmask]>

Thu, 23 Jul 1998 09:26:00 -0400

115 lines

New Thread

Plating -Reply

Plating -Reply

Ken Bridges <[log in to unmask]>

Wed, 22 Jul 1998 14:46:01 -0700

76 lines

Re: Plating -Reply

IPC TechNet <[log in to unmask]>

Wed, 22 Jul 1998 12:06:05 -0700

110 lines

New Thread

Plating Thickness

Plating Thickness

sarah <[log in to unmask]>

Wed, 29 Jul 1998 21:26:33 +0800

36 lines

Re: Plating Thickness

Lanoline <[log in to unmask]>

Wed, 29 Jul 1998 18:56:39 +0200

67 lines

Re: Plating Thickness

Nelson, John <[log in to unmask]>

Wed, 29 Jul 1998 13:20:14 -0400

54 lines

Re: Plating Thickness

Paul Gould <[log in to unmask]>

Wed, 29 Jul 1998 22:44:12 +0100

58 lines

Re: Plating Thickness

Lum Wee Mei <[log in to unmask]>

Thu, 30 Jul 1998 09:11:57 +0800

92 lines

New Thread

Polyimide M/L with pure nickel inner layers

Polyimide M/L with pure nickel inner layers

Maurice Colyer <[log in to unmask]>

Thu, 2 Jul 1998 00:19:33 +0100

54 lines

Re: Polyimide M/L with pure nickel inner layers

[log in to unmask]

Thu, 2 Jul 1998 11:14:29 EDT

32 lines

New Thread

Polyimide See Thru Stencils for Printing Solder Paste

Polyimide See Thru Stencils for Printing Solder Paste

Johannes Sivula <[log in to unmask]>

Tue, 30 Jun 1998 14:18:06 +0300

52 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Ryan Jennens <[log in to unmask]>

Mon, 6 Jul 1998 11:06:19 -0400

28 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Kathy Palumbo <[log in to unmask]>

Mon, 6 Jul 1998 09:26:21 -0700

96 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

McMonagle, Michael R. <[log in to unmask]>

Mon, 6 Jul 1998 12:23:50 -0500

136 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Kathy Palumbo <[log in to unmask]>

Mon, 6 Jul 1998 10:47:01 -0700

166 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Stephen R. Gregory <[log in to unmask]>

Mon, 6 Jul 1998 15:55:13 EDT

75 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Ryan Jennens <[log in to unmask]>

Mon, 6 Jul 1998 17:55:48 -0400

39 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Kathy Palumbo <[log in to unmask]>

Mon, 6 Jul 1998 17:25:15 -0700

81 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

Myug C. Chu <[log in to unmask]>

Tue, 21 Jul 1998 13:01:08 +0900

89 lines

New Thread

Polyimide SeeThru Stencil

Re: Polyimide SeeThru Stencil

Poh Kong Hui <[log in to unmask]>

Tue, 28 Jul 1998 21:42:58 +0800

30 lines

Re: Polyimide SeeThru Stencil

Ryan Jennens <[log in to unmask]>

Tue, 28 Jul 1998 10:07:08 -0400

50 lines

New Thread

Processes

Processes

Hugh Scott Miller <[log in to unmask]>

Sun, 19 Jul 1998 16:47:22 -0400

37 lines

New Thread

Provide me your current BGA Spec on void

Provide me your current BGA Spec on void

Ken Patel <[log in to unmask]>

Fri, 10 Jul 1998 15:21:55 -0700

33 lines

Re: Provide me your current BGA Spec on void

Bev Christian <[log in to unmask]>

Fri, 10 Jul 1998 22:16:26 -0400

73 lines

Re: Provide me your current BGA Spec on void

sahmad <[log in to unmask]>

Mon, 13 Jul 1998 13:14:00 -0600

62 lines

Re: Provide me your current BGA Spec on void

Sean Heffernan <[log in to unmask]>

Mon, 13 Jul 1998 12:37:21 -0400

35 lines

Re: Provide me your current BGA Spec on void

David D Hillman <[log in to unmask]>

Tue, 14 Jul 1998 08:33:41 -0500

121 lines

Re: Provide me your current BGA Spec on void

Bev Christian <[log in to unmask]>

Wed, 15 Jul 1998 22:46:17 -0400

157 lines

New Thread

PTH Hole to Lead Ratio

PTH Hole to Lead Ratio

Signorelli, Paul <[log in to unmask]>

Thu, 2 Jul 1998 11:29:23 -0600

24 lines

New Thread

PWBA Handling

PWBA Handling

Kenny Bloomquist <[log in to unmask]>

Fri, 31 Jul 1998 06:53:31 -0700

50 lines

Re: PWBA Handling

Stephen R. Gregory <[log in to unmask]>

Fri, 31 Jul 1998 10:37:26 EDT

87 lines

Re: PWBA Handling

Cash, Alan <[log in to unmask]>

Fri, 31 Jul 1998 10:47:08 -0400

145 lines

Re: PWBA Handling

PELCHAT_JM <[log in to unmask]>

Fri, 31 Jul 1998 12:29:22 -0400

100 lines

New Thread

Qfp's in wave

Qfp's in wave

Andre Bisson <[log in to unmask]>

Wed, 8 Jul 1998 07:45:00 -0400

45 lines

Re: Qfp's in wave

<Jason M. Smith> <[log in to unmask]>

Wed, 8 Jul 1998 07:58:37 -0400

78 lines

Re: Qfp's in wave

Sauer, Steven T. <[log in to unmask]>

Wed, 8 Jul 1998 10:19:00 E

87 lines

Re: Qfp's in wave

Ryan Jennens <[log in to unmask]>

Wed, 8 Jul 1998 13:40:40 -0400

31 lines

New Thread

RE : Sequential lamination for blind via

Re: RE : Sequential lamination for blind via

Andy Magee <[log in to unmask]>

Tue, 14 Jul 1998 11:29:29 -0400

63 lines

New Thread

RE : [TN] Immersion gold for wire bonding, a reply

RE : [TN] Immersion gold for wire bonding, a reply

Howard Lin <[log in to unmask]>

Thu, 16 Jul 1998 09:45:39 +0800

68 lines

New Thread

Re2000A

Re: Re2000A

Maguire, James F <[log in to unmask]>

Wed, 1 Jul 1998 08:33:36 -0700

92 lines

New Thread

Read: Lead Solderability II

Read: Lead Solderability II

Dave Willhard <[log in to unmask]>

Tue, 21 Jul 1998 12:02:20 -0600

39 lines

Read: Lead Solderability II

Ahne Oosterhof <[log in to unmask]>

Tue, 21 Jul 1998 14:43:34 -0700

37 lines

Read: Lead Solderability II

Darrell J. Drake <[log in to unmask]>

Tue, 21 Jul 1998 18:14:07 -0500

39 lines

Re: Read: Lead Solderability II

"Mark Elliott"@[log in to unmask]

Tue, 21 Jul 1998 16:21:59 PDT

22 lines

Read: Lead Solderability II

Michael Yarrow <[log in to unmask]>

Wed, 22 Jul 1998 11:31:00 +1000

39 lines

Read: Lead Solderability II

Peggi Blakley <[log in to unmask]>

Wed, 22 Jul 1998 11:59:19 -0500

40 lines

Re: Read: Lead Solderability II

Goldman, Patricia J. <[log in to unmask]>

Thu, 23 Jul 1998 10:21:00 -0400

51 lines

Re: Read: Lead Solderability II

Steve Collins <[log in to unmask]>

Thu, 23 Jul 1998 12:43:45 -0600

79 lines

New Thread

ReDewetting

ReDewetting

[log in to unmask]

Thu, 2 Jul 1998 09:54:07 EDT

75 lines

Re: ReDewetting

McMonagle, Michael R. <[log in to unmask]>

Thu, 2 Jul 1998 09:21:05 -0500

145 lines

New Thread

Reduced Black Oxide - Acid Resistance

Reduced Black Oxide - Acid Resistance

Russell S Gregory <[log in to unmask]>

Mon, 27 Jul 1998 15:34:28 EDT

42 lines

Re: Reduced Black Oxide - Acid Resistance

Paul Wilson <[log in to unmask]>

Tue, 28 Jul 1998 06:22:08 -0400

103 lines

New Thread

Register for Service

Register for Service

VINCENT KINOL <[log in to unmask]>

Mon, 6 Jul 1998 15:40:44 -0400

23 lines

New Thread

registration test method

registration test method

<Kim Heoung Kyu> <[log in to unmask]>

Mon, 20 Jul 1998 11:55:40 +0900

32 lines

New Thread

Reliability monitor program, Statistically sound?

Reliability monitor program, Statistically sound?

Carson Ho <[log in to unmask]>

Sat, 4 Jul 1998 13:50:47 PDT

34 lines

Re: Reliability monitor program, Statistically sound?

Werner Engelmaier <[log in to unmask]>

Sun, 5 Jul 1998 12:34:42 EDT

43 lines

New Thread

Reliability, thermal and electrical modeling for BGAs

Reliability, thermal and electrical modeling for BGAs

Yuan Li <[log in to unmask]>

Wed, 22 Jul 1998 16:41:02 -0700

33 lines

New Thread

REMOVE

REMOVE

Lichtenberg Yossi <[log in to unmask]>

Mon, 27 Jul 1998 08:04:14 +0200

86 lines

New Thread

research analyst

research analyst

Dave Burkhard <[log in to unmask]>

Mon, 6 Jul 1998 19:28:49 -0700

42 lines

New Thread

Resin Regeneration

Resin Regeneration

Alan Kreplick <[log in to unmask]>

Wed, 29 Jul 1998 14:54:01 -0400

35 lines

Re: Resin Regeneration

Kathy Palumbo <[log in to unmask]>

Wed, 29 Jul 1998 13:36:45 -0700

83 lines

Re: Resin Regeneration

Smith Russell MSM LAPO US <[log in to unmask]>

Thu, 30 Jul 1998 04:38:00 +0200

117 lines

New Thread

Re[2]: [TN] Assy: cause-effect diagram

Re: Re[2]: [TN] Assy: cause-effect diagram

<Jason M. Smith> <[log in to unmask]>

Wed, 8 Jul 1998 15:20:53 -0400

172 lines

Re: Re[2]: [TN] Assy: cause-effect diagram

Gu, Sam <[log in to unmask]>

Wed, 8 Jul 1998 16:52:23 -0700

249 lines

Re: Re[2]: [TN] Assy: cause-effect diagram

Dudi Banitt <[log in to unmask]>

Thu, 9 Jul 1998 07:58:46 +-300

286 lines

New Thread

Re[2]: [TN] Au/Ni/Cu PROBLEM

Re: Re[2]: [TN] Au/Ni/Cu PROBLEM

Leslie O. Connally <[log in to unmask]>

Wed, 8 Jul 1998 08:38:30 -0700

139 lines

Re: Re[2]: [TN] Au/Ni/Cu PROBLEM

Jacques A Coderre <[log in to unmask]>

Wed, 8 Jul 1998 10:43:23 -0400

191 lines

Re: Re[2]: [TN] Au/Ni/Cu PROBLEM

Lenny Kurup <[log in to unmask]>

Fri, 10 Jul 1998 12:19:57 -0400

133 lines

Re: Re[2]: [TN] Au/Ni/Cu PROBLEM

[log in to unmask]

Fri, 10 Jul 1998 13:03:52 EDT

39 lines

New Thread

Re[2]: [TN] Conformal coating

Re: Re[2]: [TN] Conformal coating

Mark Pozorski <[log in to unmask]>

Wed, 29 Jul 1998 10:13:55 -0600

50 lines

New Thread

RF Ground Thermal Considerations

RF Ground Thermal Considerations

[log in to unmask]

Tue, 21 Jul 1998 09:02:15 -0600

38 lines

New Thread

Rigid Bd. Corner Welds

Rigid Bd. Corner Welds

Youngblood, Lee <[log in to unmask]>

Wed, 8 Jul 1998 15:33:36 -0600

36 lines

New Thread

Routing Techniques

Routing Techniques

Hugh Scott Miller <[log in to unmask]>

Sun, 19 Jul 1998 16:47:52 -0400

37 lines

New Thread

S-N curves for solder

S-N curves for solder

Sheila Smith <[log in to unmask]>

Mon, 6 Jul 1998 10:59:09 -0400

31 lines

Re: S-N curves for solder

Werner Engelmaier <[log in to unmask]>

Tue, 7 Jul 1998 14:04:38 EDT

35 lines

New Thread

sampling plan

sampling plan

Francisco Rios <[log in to unmask]>

Thu, 23 Jul 1998 09:04:53 -0700

31 lines

Re: sampling plan

[log in to unmask]

Thu, 23 Jul 1998 11:30:12 -0500

73 lines

New Thread

Scoring

Scoring

[log in to unmask]

Thu, 30 Jul 1998 11:42:16 -0500

35 lines

Re: Scoring

Eldon Sanders <[log in to unmask]>

Thu, 30 Jul 1998 10:58:33 -0700

72 lines

Re: Scoring

Steve Collins <[log in to unmask]>

Thu, 30 Jul 1998 12:34:09 -0600

64 lines

Re: Scoring

Brian K. Doughty <[log in to unmask]>

Thu, 30 Jul 1998 14:40:51 EDT

35 lines

Re: Scoring

Mark Simmons <[log in to unmask]>

Thu, 30 Jul 1998 10:47:20 -0700

32 lines

Re: Scoring

JoAnn Amerson <[log in to unmask]>

Thu, 30 Jul 1998 15:10:23 -0400

52 lines

Re: Scoring

Jeff Hempton <[log in to unmask]>

Thu, 30 Jul 1998 14:54:15 -0500

62 lines

Re: Scoring

Jeff Hempton <[log in to unmask]>

Thu, 30 Jul 1998 15:12:20 -0500

31 lines

Re: Scoring

Erat, Wolfgang <[log in to unmask]>

Thu, 30 Jul 1998 16:40:42 -0400

68 lines

Re: Scoring

Mitch Morey <[log in to unmask]>

Thu, 30 Jul 1998 14:53:54 -0700

101 lines

Re: Scoring

Stephen R. Gregory <[log in to unmask]>

Thu, 30 Jul 1998 19:06:57 EDT

70 lines

Re: Scoring

Joseph E. J. Duclos Jr. <[log in to unmask]>

Thu, 30 Jul 1998 21:58:21 -0400

62 lines

Re: Scoring

Kwong Chin <[log in to unmask]>

Thu, 30 Jul 1998 09:52:03 -0400

101 lines

New Thread

see items

Re: see items

Noppadol S. <[log in to unmask]>

Fri, 3 Jul 1998 08:07:54 +0700

77 lines

New Thread

Separating email for designers, fabricators and assembly

Separating email for designers, fabricators and assembly

Coleman, Rob <[log in to unmask]>

Mon, 6 Jul 1998 15:47:17 -0500

21 lines

New Thread

Sequential lamination for blind via

Sequential lamination for blind via

Howard Lin <[log in to unmask]>

Sat, 11 Jul 1998 16:57:00 +0800

33 lines

Re: Sequential lamination for blind via

Andy Magee <[log in to unmask]>

Sun, 12 Jul 1998 08:14:08 -0400

53 lines

New Thread

SERA and White Tin

Re: SERA and White Tin

Michael Pavlov <[log in to unmask]>

Fri, 17 Jul 1998 15:08:38 EDT

35 lines

New Thread

SERA and White Tin, reply

SERA and White Tin, reply

Paul Wilson <[log in to unmask]>

Fri, 17 Jul 1998 13:00:08 -0400

84 lines

Re: SERA and White Tin, reply

Douglas Pauls <[log in to unmask]>

Fri, 17 Jul 1998 15:21:41 EDT

74 lines

Re: SERA and White Tin, reply

David D Hillman <[log in to unmask]>

Mon, 20 Jul 1998 09:58:09 -0500

125 lines

New Thread

SERA Testers

SERA Testers

Hogue, Pat (AZ76) <[log in to unmask]>

Tue, 14 Jul 1998 18:23:45 -0700

35 lines

Re: SERA Testers

David D Hillman <[log in to unmask]>

Wed, 15 Jul 1998 08:54:31 -0500

84 lines

Re: SERA Testers

Bogdan Gabi <[log in to unmask]>

Wed, 15 Jul 1998 17:20:15 +0200

31 lines

New Thread

SiGE vrs GaAs

SiGE vrs GaAs

Frank K. Frimpong <[log in to unmask]>

Wed, 1 Jul 1998 08:55:24 +0000

26 lines

New Thread

Silicone grease around soldered joints!

Silicone grease around soldered joints!

Dave Thomas <[log in to unmask]>

Fri, 31 Jul 1998 11:01:41 +0100

61 lines

Re: Silicone grease around soldered joints!

Bev Christian <[log in to unmask]>

Fri, 31 Jul 1998 08:29:20 -0400

107 lines

Re: Silicone grease around soldered joints!

Vaughan, Ralph H <[log in to unmask]>

Fri, 31 Jul 1998 05:33:49 -0700

94 lines

Re: Silicone grease around soldered joints!

Cash, Alan <[log in to unmask]>

Fri, 31 Jul 1998 09:57:16 -0400

98 lines

Re: Silicone grease around soldered joints!

Stephen R. Mikell <[log in to unmask]>

Fri, 31 Jul 1998 10:24:42 -0500

64 lines

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SMB, SOD123 Footprint

SMB, SOD123 Footprint

Colin Weber <[log in to unmask]>

Fri, 17 Jul 1998 16:13:04 +1000

51 lines

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