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June 1998


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Table of Contents:

% of lead wetting (2 messages)
(Fwd) Termination Loss (4 messages)
(TN) AMP Mictor (1 message)
(TN)AMP Mictor (2 messages)
25mil SMT connectors, 16mil TQFPs (14mm package), 0402 (1 message)
25mil SMT connectors, 16mil TQFPs (14mm package), 0402 c hips (2 messages)
25mil SMT connectors, 16mil TQFPs (14mm package), 0402 chips (1 message)
3-feet drop test (4 messages)
: Ink permanency Test and Adhesive Strength (3 messages)
: Solder Fatigue in Space Electronics (3 messages)
<No subject> (7 messages)
address transfere (1 message)
adhesive on solders (1 message)
Adhesives for Attaching Heat SInks to IC's (4 messages)
Adhesives on Solder (4 messages)
Admin Reply: TN] Advertising on the TechNet Forum (1 message)
Advertising on the TechNet Forum (10 messages)
Alignment problem (3 messages)
ALTERNATIVE (1 message)
alternatives for pth (1 message)
Aluminum core in vapor phase (1 message)
AMP Mictor (1 message)
Anti-Static Bags (7 messages)
Any Users of DigitalTest MTS300 ICT Machines? (2 messages)
AOI systems (8 messages)
Apologies (1 message)
ASSEM: MATTE VS GLOSSY (5 messages)
Assembly (6 messages)
Assembly - Russ (1 message)
ASSEMBLY:Barcoding (3 messages)
ASSY (1 message)
ASSY: BGA sanity check (11 messages)
Assy: chip on glass (1 message)
Assy: Component Date Code Policy for No-Clean Processing (1 message)
Assy: Reliability, exposed copper, and moisture (1 message)
ASSY: TUNING RIBBON ATTACHMENT (1 message)
ASSY: Use of No Clean Flux in a Nitrogen Atmosphere? (2 messages)
ASSY: Video camera for digitized image capture (6 messages)
Atlanta Chapter Designers Council Meeting (1 message)
Automated Taping Machine (2 messages)
BGA First Time Yields (3 messages)
BGA Footprint (2 messages)
BGA Keepout (1 message)
BGA land patterns (2 messages)
BGA periphery clearance (6 messages)
BGA reconditioning service???? (3 messages)
BGAs in SPACE applications (3 messages)
Board Material for a 500mhz to 2ghz Application. (4 messages)
board substrate for RF/microwave (3 messages)
Bonding of Silica to Silica and Silica to Pd (2 messages)
CAD question (2 messages)
CAD Questions: Basic (4 messages)
CAM package that support Cadence Allegro? (2 messages)
Casting epoxy (1 message)
CCA MOD (3 messages)
CCA Sponsors HDI Conference (1 message)
Chip Resistor formula for spec IPC-SM-287 (1996). (2 messages)
Chip Termination Finish (4 messages)
Cimnet system (1 message)
CIRCUIT TRACE RESISTIVITY (2 messages)
Citric acid (1 message)
Citric cleaning (1 message)
Cleaning Process after Electroless copper (6 messages)
CMK Corporation (1 message)
Compaq PCI backplanes (2 messages)
component marking (1 message)
Components - Exposed Cu on Component Lead Ends (5 messages)
Conductive Belt (1 message)
Conductive Epoxy for Solder termination (5 messages)
Confirmation of Receipt (2 messages)
Conformal coating (3 messages)
Conformal Coating? (6 messages)
Connector problem (?) (3 messages)
Connector problem (?) -Reply (1 message)
Contamination Testing for Water Soluble Flux Residue (4 messages)
Conveyorised Plasma (1 message)
Copper diffusion into Zinc (1 message)
Copper Invar Copper (3 messages)
Copper Invar Copper -Reply (1 message)
CP642 vs Micron 32mm carrier tape (2 messages)
defect marking (5 messages)
Deleted Message (1 message)
Delidder (2 messages)
DES: ODB++ format (6 messages)
Diameter of Holes in Reinforcement (re: Flex Stiffener) (1 message)
die shear specification (2 messages)
Dielectric Testing (1 message)
dip conformal coating (5 messages)
Drill Wander (3 messages)
Drill2Gerber converter (reply) (1 message)
dross in the solder pot (7 messages)
drying (1 message)
DST Foil (1 message)
Electroless Nickel/gold again (2 messages)
Email address req for Electrovert (5 messages)
Enormous MCM - M&P Q's (3 messages)
Enquiry... (2 messages)
Entek OSP (4 messages)
EPCmail (1 message)
EPS (1 message)
Error in - GEN: DI Water System Capacity (1 message)
exposure box (1 message)
FAB - Laser drilled microvia resin removal? (3 messages)
FAB etchback IPC-6012 (1 message)
FAB: Horizontal HASL (1 message)
Fab: info on equipment (1 message)
Fab: plug vias (6 messages)
FAB: Plugged, Filled &/or Tented Vias (3 messages)
FAB: Selective Solder Stripping (4 messages)
FAB: solder over nickel (4 messages)
FEM modelling (2 messages)
Fidutial Requirements (1 message)
fine-pitch component specification (2 messages)
Flex Circuit Board houses (8 messages)
Flex Circuit Vendors (6 messages)
Flex Circuit Vendors -Reply (1 message)
Flex/rigid manufacturers in China (4 messages)
FORD BURN IN (1 message)
FREE Warehouse Equipment Catalog! (1 message)
Frequency Performance of FR-4 (4 messages)
Future new Procedures in IPC-7711 (4 messages)
FW: [TN] component marking (1 message)
FW: [TN] IC top mark (1 message)
Fwd: [TN] intrusive reflow and all (1 message)
FYI Tanatalums (1 message)
GaAs ICs (1 message)
Gap welding to FR4 (1 message)
Gap welding to FR4. (1 message)
GEN: DI Water System Capacity (2 messages)
Gen: Name (1 message)
Gen: Name? (6 messages)
GEN:DFM (4 messages)
Gerber From 1:1 Artwork (4 messages)
German-English Dictionary in CD for Telephony terms (2 messages)
Gold Coated Solder (4 messages)
Gold Coated Solder - a Followup (2 messages)
Gold contamination! (3 messages)
Gold over Tin vs. Gold over Tin-Nickel (3 messages)
Gold plating of PWB's (2 messages)
Gold Recovery (1 message)
Gold thickness - Edge (1 message)
Gold to nickel adhesion (2 messages)
Greater Boston DC Chapter Meeting, Thursday 18-June (1 message)
Handheld O2 Measurement (1 message)
Heat dissipation design for power resistors (2 messages)
Heat Reflective Coating (2 messages)
Heat Reflective Coating -Reply (1 message)
help!! (4 messages)
Help/Markers (2 messages)
HELP: Cracking Discretes on PCB's (4 messages)
HK CONVENTIONAL CNTR SEMINAR - 28TH JULY, 1998 (2 messages)
How to buy IPC Gerber? (1 message)
How to Clean RMA Flux? (4 messages)
HR Contact in Pueblo (1 message)
hybrid manufacturing questions (1 message)
IC top mark (6 messages)
ICT and FT testers (2 messages)
Immersion white Tin PCB surface finish (3 messages)
Interim Meeting Announcement FlexibleCircuits Committee (1 message)
Interim Meeting Announcement ― Flexible Circuits Committee (1 message)
intrusive reflow and all (11 messages)
Ionic Contaminate Calculation (1 message)
IPC HOLE TO LEAD RATIOS (2 messages)
IPC Spec 4101 (Epoxy Spots) (2 messages)
IPC standard (2 messages)
IPC standard 4 part number description? (1 message)
IPC Standard Question (1 message)
IPC-T-50 (2 messages)
IPCchat session announcement (2 messages)
J-STD-001A vs. -001B (4 messages)
Job opportuniyt (2 messages)
jumper wire turnish after solder wave (1 message)
Junk email? (2 messages)
Land Pattern Fo (1 message)
Land Pattern Formulas (1 message)
Land Pattern Formulas 4 IPC-SM-782? (3 messages)
Liquid Photoresist (1 message)
Looking for contract mfg. (1 message)
Love (2 messages)
Low-melt solder alloys for desoldering (4 messages)
MacDermid (3 messages)
Machining of polyimide flex material. (3 messages)
Material Database for Microelectronic Packaging (4 messages)
materials ? (1 message)
Measling/Crazing (4 messages)
Mechanical properties of solder (1 message)
Metallized teflon film (1 message)
Micro BGA Rework (2 messages)
MICROWAVE PCB (1 message)
Mil-Std-2000A Question (5 messages)
Moisture Sensitive Devices (1 message)
Moisture sensitive SMD-ICs (6 messages)
NASA Approved Liquid Solder Masks (3 messages)
NASA Approved Liquid Solder Masks -Reply (1 message)
Need E-mail address (1 message)
Nickel foil (2 messages)
Nickel over Copper (1 message)
Nitrogen in the wavesolderingproces (7 messages)
Not read: Subscribe (1 message)
Not read: [TN] shadow plating electroless ni au (1 message)
Obsolete FR4 0/0 (1 message)
Obsolete TRACE 924E O/S tester - is it of any use? (1 message)
oil well drilling pad material specs (2 messages)
Old pcb milling machines (1 message)
Outgassing problem in pcb's soldering (5 messages)
Overplated blind via's (8 messages)
Oxided Gold Tips (3 messages)
Paradigm by Cimnet Systems (2 messages)
Parylene Conformal Coating line requirements. (2 messages)
PCB Defect Evaluation (1 message)
PCB Etching Process (1 message)
PCB finish comparison studies (4 messages)
PCB Manufacturer: Yield & cost for Nickel-Gold v/s HASL (2 messages)
PCB Mfg.: Yield & cost for Nickel-Gold Vs HASL (1 message)
PCBAMP (2 messages)
PCI Cards (2 messages)
PEELABLE REQUIREMENT (2 messages)
Peelable Soldermask (1 message)
Pinholes in reflowed SMT (2 messages)
Pink Anti-static Poly Film & PCB's (1 message)
PLAN NOW TO ATTEND (1 message)
Plasma cycle (1 message)
Plastic parts (2 messages)
Plating of SMT leads (1 message)
Polyimide See Thru Stencils for Printing Solder Paste (2 messages)
Polyimide Tapes for HASL, etc... (1 message)
Poor Solderability on TSOPs (4 messages)
Pramod Patel/solder joint reliability (2 messages)
Punched Non-Supported Holes in FR-4 (2 messages)
PWB Layer Stack-up (3 messages)
PWB Procurement Recommendations (3 messages)
Radial Cracks on Cyanide Ester resin (4 messages)
Re2000A (1 message)
Read: RE: [TN] shadow plating electroless ni au (1 message)
Reference Designator Problem (1 message)
Reference designators (3 messages)
Reflow quiz (2 messages)
Reflow soldering: forced gas vs. infra-red (3 messages)
Reliability rating (2 messages)
Reliability Risk related Electroless Nickel/immersion gold (3 messages)
Resent: IPC Spec 4101 (Epoxy Spots) (1 message)
Review of Mask Cure Chat (1 message)
Rp: Selective Solering Pallets for Wave Solder (3 messages)
Sbj: Semi Aqueous Cleaner (2 messages)
searching for a pull test machine ! (5 messages)
see items (1 message)
see items stated (5 messages)
See items stated (melfs) (1 message)
Selective Soldering Pallets for Wave Soldering (5 messages)
shadow plating electroless ni au (7 messages)
Shear IPC values charts per components type (2 messages)
silicone conformal coatings (2 messages)
SM Components/Solder Acceptability (1 message)
SMT Reliability (7 messages)
SMT Tape splicers (1 message)
SMTA Rework Symposium (3 messages)
Sn/Bi Solder properties (1 message)
Solder Fatigue in Space Electronics (3 messages)
Solder Mask (1 message)
Solder mask between fine pitch (1 message)
Solder mask between fine pitch pads (4 messages)
solder mask between pads part2 (1 message)
Solder mask profile information (6 messages)
solder preform arrays (2 messages)
Solder problem (3 messages)
Solder Removal Methods (5 messages)
Solder Sample Testing? (8 messages)
Solder smear (2 messages)
Solderability of bare boards (1 message)
solderability of Hasl'd boards (2 messages)
solderability problem (4 messages)
SOLDERBALLS on bareboards (8 messages)
Soldering to Gold Plated Components (5 messages)
Soldermask flaking in immersion gold process (2 messages)
Soldermask flaking in immersion gold process -Reply (1 message)
Soldermask flaking in immersion gold process -Reply -Reply (1 message)
Soldermask/Pads (1 message)
some ideas pl... (1 message)
SOURCE FOR BACKUP (1 message)
SPC software (3 messages)
spray fluxing (1 message)
Standard for P/N & BOM formats? (2 messages)
stop TechNet email (2 messages)
stop TECHNET! (2 messages)
subscirbe (1 message)
subscribe (1 message)
Subscribe TechNet Jim Herard (1 message)
Subscribing (1 message)
Sv: [TN] Electroless Nickel/gold again (1 message)
switch from chromic-based etchants (2 messages)
T/H Open due to air entrapment (1 message)
tantalum caps (3 messages)
Tape residue elimination (8 messages)
Teardropping BGA's (4 messages)
Tech mtg - Conductive Adhesive (1 message)
terminals tarnished (dull) (3 messages)
Test - please ignore (1 message)
Textbooks on Photo tools (3 messages)
Thanks from the woodpeck (1 message)
Thanks, y'all (2 messages)
Thermal Reliefs (2 messages)
Thickness Measurements (3 messages)
Thru-hole Reliability (6 messages)
Torque on FR-4 (1 message)
traces used as a fuse (1 message)
Ultrasonic cleaning (4 messages)
Unformed Leads (2 messages)
Unplated thru holes (2 messages)
Unsubscribe (1 message)
uwave curing ovens (2 messages)
Vendor Source (3 messages)
VIA HOLE and COMPONENT HOLE DEFINITION (4 messages)
Video on Wave Fluxing (1 message)
VOC free flux/Optifluxer (3 messages)
void size specification for BGA's (5 messages)
Washing of small PCB (7 messages)
Washing of small PCB vs. ESD (1 message)
water soluble spacers (3 messages)
Wave Solder Pot Temp-63/37 (3 messages)
Wave v Reflow for Flexible circuits (2 messages)
Whew! (1 message)
wire & tinning specs (1 message)
Wire Bond / Test (1 message)
Wire Bonding (4 messages)
wire wrap (1 message)
Wires being used on PCB Assemblies (4 messages)
Your reply (1 message)
[TN] Poor Solderability on TSOPs (1 message)
[TN] Reliability Risk related Electroless Nickel/imme (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

% of lead wetting

% of lead wetting

Gabriela Bogdan <[log in to unmask]>

Wed, 3 Jun 1998 23:41:33 +0300

40 lines

Re: % of lead wetting

Werner Engelmaier <[log in to unmask]>

Thu, 4 Jun 1998 12:12:52 EDT

36 lines

New Thread

(Fwd) Termination Loss

(Fwd) Termination Loss

Bobby R. Mangona <[log in to unmask]>

Mon, 1 Jun 1998 13:09:08 +0000

34 lines

Re: (Fwd) Termination Loss

Bill Davis <[log in to unmask]>

Mon, 1 Jun 1998 09:12:21 -0700

57 lines

Re: (Fwd) Termination Loss

Hogue, Pat (AZ76) <[log in to unmask]>

Mon, 1 Jun 1998 11:10:28 -0500

54 lines

Re: (Fwd) Termination Loss

Stephen R. Gregory <[log in to unmask]>

Mon, 1 Jun 1998 14:02:58 EDT

55 lines

New Thread

(TN) AMP Mictor

Re: (TN) AMP Mictor

Mike Becker <[log in to unmask]>

Wed, 3 Jun 1998 09:30:39 -0700

26 lines

New Thread

(TN)AMP Mictor

(TN)AMP Mictor

Jim Zanolli <[log in to unmask]>

Mon, 1 Jun 1998 15:45:15 -0400

25 lines

Re: (TN)AMP Mictor

Hal Winslow <[log in to unmask]>

Tue, 2 Jun 1998 04:49:30 PDT

58 lines

New Thread

25mil SMT connectors, 16mil TQFPs (14mm package), 0402

25mil SMT connectors, 16mil TQFPs (14mm package), 0402

Yves Trudell <[log in to unmask]>

Thu, 4 Jun 1998 12:01:28 -0400

56 lines

New Thread

25mil SMT connectors, 16mil TQFPs (14mm package), 0402 c hips

Re: 25mil SMT connectors, 16mil TQFPs (14mm package), 0402 c hips

Collins, Graham <[log in to unmask]>

Mon, 1 Jun 1998 14:39:36 -0300

62 lines

Re: 25mil SMT connectors, 16mil TQFPs (14mm package), 0402 c hips

Yves Trudell <[log in to unmask]>

Mon, 1 Jun 1998 16:41:54 -0400

99 lines

New Thread

25mil SMT connectors, 16mil TQFPs (14mm package), 0402 chips

Re: 25mil SMT connectors, 16mil TQFPs (14mm package), 0402 chips

Eddie Brunker <[log in to unmask]>

Mon, 1 Jun 1998 09:22:45 +0100

62 lines

New Thread

3-feet drop test

3-feet drop test

Chan, Marcelo <[log in to unmask]>

Fri, 5 Jun 1998 09:38:02 -0400

34 lines

Re: 3-feet drop test

Delsen Testing Laboratories <[log in to unmask]>

Fri, 5 Jun 1998 08:05:30 -0700

69 lines

Re: 3-feet drop test

Werner Engelmaier <[log in to unmask]>

Fri, 5 Jun 1998 17:39:39 EDT

35 lines

Re: 3-feet drop test

Douglas Mckean <[log in to unmask]>

Fri, 5 Jun 1998 15:01:08 -0700

58 lines

New Thread

: Ink permanency Test and Adhesive Strength

: Ink permanency Test and Adhesive Strength

Poh Kong Hui <[log in to unmask]>

Wed, 3 Jun 1998 21:41:50 +0800

33 lines

Re: : Ink permanency Test and Adhesive Strength

David Gonnerman <[log in to unmask]>

Wed, 3 Jun 1998 08:47:01 -0500

77 lines

Re: : Ink permanency Test and Adhesive Strength

Vicki Heideman <[log in to unmask]>

Wed, 3 Jun 1998 11:16:55 -0500

100 lines

New Thread

: Solder Fatigue in Space Electronics

: Solder Fatigue in Space Electronics

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 24 Jun 1998 09:49:00 PDT

32 lines

Re: : Solder Fatigue in Space Electronics

Karl Sweitzer <[log in to unmask]>

Wed, 24 Jun 1998 11:58:39 -0400

60 lines

Re: : Solder Fatigue in Space Electronics

Werner Engelmaier <[log in to unmask]>

Wed, 24 Jun 1998 12:47:27 EDT

45 lines

New Thread

<No subject>

<No subject>

9i799w2 <[log in to unmask]>

Tue, 2 Jun 1998 05:23:16 +0200

140 lines

<No subject>

Paul Klasek <[log in to unmask]>

Tue, 2 Jun 1998 13:49:42 +1000

167 lines

<No subject>

Mitch Morey <[log in to unmask]>

Thu, 4 Jun 1998 09:49:12 -0700

109 lines

<No subject>

p2241266 <[log in to unmask]>

Thu, 11 Jun 1998 10:41:03 +0800

52 lines

<No subject>

[log in to unmask]

Fri, 26 Jun 1998 14:21:16 PST

28 lines

<No subject>

S.L.N.MURTHY <[log in to unmask]>

Sat, 27 Jun 1998 10:32:32 -0700

83 lines

<No subject>

Wolfgang Schenke <[log in to unmask]>

Sun, 28 Jun 1998 06:58:55 -0700

59 lines

New Thread

address transfere

address transfere

Tezak Tim <[log in to unmask]>

Tue, 23 Jun 1998 15:38:00 -0400

40 lines

New Thread

adhesive on solders

Re: adhesive on solders

[log in to unmask]

Tue, 9 Jun 1998 16:11:30 +0200

78 lines

New Thread

Adhesives for Attaching Heat SInks to IC's

Adhesives for Attaching Heat SInks to IC's

Bill Davis <[log in to unmask]>

Mon, 15 Jun 1998 08:01:29 -0700

33 lines

Re: Adhesives for Attaching Heat SInks to IC's

Brad Vanderhoof <[log in to unmask]>

Mon, 15 Jun 1998 09:48:54 PDT

59 lines

Re: Adhesives for Attaching Heat SInks to IC's

Jorg Richstein <[log in to unmask]>

Tue, 16 Jun 1998 08:40:53 +0200

24 lines

Re: Adhesives for Attaching Heat SInks to IC's

Bill Davis <[log in to unmask]>

Tue, 16 Jun 1998 07:08:36 -0700

44 lines

New Thread

Adhesives on Solder

Adhesives on Solder

[log in to unmask]

Tue, 9 Jun 1998 11:34:40 +0200

74 lines

Re: Adhesives on Solder

<Rudy Sedlak> <[log in to unmask]>

Tue, 9 Jun 1998 08:01:03 EDT

49 lines

Re: Adhesives on Solder

Aric parr <[log in to unmask]>

Tue, 9 Jun 1998 08:20:43 EDT

77 lines

Re: Adhesives on Solder

David Anderson <[log in to unmask]>

Tue, 9 Jun 1998 08:30:00 -0500

49 lines

New Thread

Admin Reply: TN] Advertising on the TechNet Forum

Admin Reply: TN] Advertising on the TechNet Forum

Jack Crawford <[log in to unmask]>

Fri, 12 Jun 1998 14:32:37 -0500

54 lines

New Thread

Advertising on the TechNet Forum

Re: Advertising on the TechNet Forum

Phil Culpovich <[log in to unmask]>

Thu, 11 Jun 1998 18:04:11 -0700

39 lines

Re: Advertising on the TechNet Forum

Stephen R. Gregory <[log in to unmask]>

Thu, 11 Jun 1998 21:20:23 EDT

71 lines

Re: Advertising on the TechNet Forum

JB <[log in to unmask]>

Fri, 12 Jun 1998 17:35:04 +0800

83 lines

Re: Advertising on the TechNet Forum

Barbara Burcham <[log in to unmask]>

Fri, 12 Jun 1998 07:17:06 -0700

70 lines

Re: Advertising on the TechNet Forum

[log in to unmask]

Fri, 12 Jun 1998 09:34:22 -0500

52 lines

Re: Advertising on the TechNet Forum

Byron L. Miller <[log in to unmask]>

Fri, 12 Jun 1998 07:58:37 -0700

44 lines

Re: Advertising on the TechNet Forum

Joy, Stephen C <[log in to unmask]>

Fri, 12 Jun 1998 08:46:00 -0700

85 lines

Re: Advertising on the TechNet Forum

Ed Holton <[log in to unmask]>

Mon, 15 Jun 1998 09:42:53 -0400

84 lines

Re: Advertising on the TechNet Forum

Roger Mouton <[log in to unmask]>

Mon, 15 Jun 1998 12:08:50 EDT

25 lines

Re: Advertising on the TechNet Forum

Tom Kropski <[log in to unmask]>

Mon, 15 Jun 1998 14:53:10 -0400

112 lines

New Thread

Alignment problem

Alignment problem

Angie Marques <[log in to unmask]>

Wed, 10 Jun 1998 11:22:34 -0400

31 lines

Re: Alignment problem

Matthew Park <[log in to unmask]>

Wed, 10 Jun 1998 11:50:50 -0700

74 lines

Re: Alignment problem

Stephen R. Gregory <[log in to unmask]>

Wed, 10 Jun 1998 15:08:39 EDT

74 lines

New Thread

ALTERNATIVE

ALTERNATIVE

Dileep Mohan Chakravarthi <[log in to unmask]>

Wed, 10 Jun 1998 15:57:15 +0500

59 lines

New Thread

alternatives for pth

alternatives for pth

Johannes Sivula <[log in to unmask]>

Thu, 25 Jun 1998 08:15:35 +0300

109 lines

New Thread

Aluminum core in vapor phase

Aluminum core in vapor phase

Tom Obarski x4286 <[log in to unmask]>

Mon, 29 Jun 1998 09:05:52 -0400

29 lines

New Thread

AMP Mictor

Re: AMP Mictor

Hal Winslow <[log in to unmask]>

Wed, 3 Jun 1998 11:04:29 PDT

44 lines

New Thread

Anti-Static Bags

Anti-Static Bags

Mike Bailey <[log in to unmask]>

Thu, 4 Jun 1998 10:33:34 -0400

31 lines

Re: Anti-Static Bags

Alex Neussendorfer <[log in to unmask]>

Thu, 4 Jun 1998 12:44:27 -0500

56 lines

Re: Anti-Static Bags

Hogue, Pat (AZ76) <[log in to unmask]>

Thu, 4 Jun 1998 13:55:21 -0400

65 lines

Re: Anti-Static Bags

Jim Marsico 516-595-5879 <[log in to unmask]>

Thu, 4 Jun 1998 13:44:00 -0400

31 lines

Re: Anti-Static Bags

[log in to unmask]

Thu, 4 Jun 1998 15:02:03 -0600

58 lines

Re: Anti-Static Bags

Jay Soderberg <[log in to unmask]>

Thu, 4 Jun 1998 16:04:23 -0600

51 lines

Re: Anti-Static Bags

Leslie O. Connally <[log in to unmask]>

Thu, 4 Jun 1998 16:19:39 -0700

85 lines

New Thread

Any Users of DigitalTest MTS300 ICT Machines?

Any Users of DigitalTest MTS300 ICT Machines?

Keith Bridgen <[log in to unmask]>

Thu, 11 Jun 1998 08:31:37 +1000

41 lines

Re: Any Users of DigitalTest MTS300 ICT Machines?

Richard Tassone <[log in to unmask]>

Wed, 10 Jun 1998 17:39:03 +0100

89 lines

New Thread

AOI systems

AOI systems

Kathy Palumbo <[log in to unmask]>

Thu, 4 Jun 1998 17:17:31 -0700

38 lines

Re: AOI systems

Stephen R. Gregory <[log in to unmask]>

Thu, 4 Jun 1998 21:42:13 EDT

50 lines

Re: AOI systems

Johannes Sivula <[log in to unmask]>

Fri, 5 Jun 1998 13:09:39 +0300

156 lines

Re: AOI systems

Chan, Marcelo <[log in to unmask]>

Fri, 5 Jun 1998 08:23:53 -0400

100 lines

Re: AOI systems

Nasir Hanif <[log in to unmask]>

Fri, 5 Jun 1998 08:43:47 -0500

30 lines

Re: AOI systems

Peter Willaert <[log in to unmask]>

Tue, 9 Jun 1998 15:50:03 +0200

81 lines

Re: AOI systems

LI YUAN <[log in to unmask]>

Tue, 9 Jun 1998 09:37:01 -0600

35 lines

Re: AOI systems

Stephen R. Gregory <[log in to unmask]>

Tue, 9 Jun 1998 11:59:59 EDT

29 lines

New Thread

Apologies

Apologies

Phil Culpovich <[log in to unmask]>

Fri, 12 Jun 1998 14:11:51 -0700

43 lines

New Thread

ASSEM: MATTE VS GLOSSY

ASSEM: MATTE VS GLOSSY

Robert Welch <[log in to unmask]>

Thu, 4 Jun 1998 12:22:57 +0000

37 lines

Re: ASSEM: MATTE VS GLOSSY

Mike Barmuta <[log in to unmask]>

Thu, 4 Jun 1998 11:15:36 -0700

84 lines

Re: ASSEM: MATTE VS GLOSSY

Challoner, Scott <[log in to unmask]>

Thu, 4 Jun 1998 13:28:00 CDT

113 lines

Re: ASSEM: MATTE VS GLOSSY

Mike Barmuta <[log in to unmask]>

Thu, 4 Jun 1998 14:28:32 -0700

146 lines

Re: ASSEM: MATTE VS GLOSSY

Graham Naisbitt <[log in to unmask]>

Wed, 10 Jun 1998 09:44:41 +0100

190 lines

New Thread

Assembly

Assembly

Vertefeuille, Russ (AZ77) <[log in to unmask]>

Fri, 5 Jun 1998 11:20:14 -0500

36 lines

Re: Assembly

Jan Satterfield <[log in to unmask]>

Fri, 5 Jun 1998 10:50:04 -0600

63 lines

Re: Assembly

Jeff Guynn <[log in to unmask]>

Fri, 5 Jun 1998 11:46:34 -0500

68 lines

Re: Assembly

Brad Vanderhoof <[log in to unmask]>

Fri, 5 Jun 1998 09:59:48 PDT

65 lines

Re: Assembly

Stephen R. Gregory <[log in to unmask]>

Fri, 5 Jun 1998 13:12:36 EDT

63 lines

Re: Assembly

E.A. Speer <[log in to unmask]>

Fri, 5 Jun 1998 13:59:07 -0400

88 lines

New Thread

Assembly - Russ

Assembly - Russ

Hurst, Joe <[log in to unmask]>

Fri, 5 Jun 1998 12:37:31 -0400

55 lines

New Thread

ASSEMBLY:Barcoding

Re: ASSEMBLY:Barcoding

Nicholas Kane <[log in to unmask]>

Wed, 24 Jun 1998 21:57:33 +1000

39 lines

Re: ASSEMBLY:Barcoding

Tim Gallagher <[log in to unmask]>

Wed, 24 Jun 1998 09:17:58 -0400

40 lines

Re: ASSEMBLY:Barcoding

Stephen R. Gregory <[log in to unmask]>

Wed, 24 Jun 1998 10:57:50 EDT

55 lines

New Thread

ASSY

ASSY

[log in to unmask]

Sat, 6 Jun 1998 07:23:47 -0500

33 lines

New Thread

ASSY: BGA sanity check

ASSY: BGA sanity check

Jerry Cupples <[log in to unmask]>

Tue, 23 Jun 1998 17:15:22 -0500

47 lines

Re: ASSY: BGA sanity check

Paul Klasek <[log in to unmask]>

Wed, 24 Jun 1998 08:41:06 +1000

86 lines

Re: ASSY: BGA sanity check

David D Hillman <[log in to unmask]>

Wed, 24 Jun 1998 07:08:40 -0500

95 lines

Re: ASSY: BGA sanity check

Bev Christian <[log in to unmask]>

Wed, 24 Jun 1998 08:44:46 -0400

87 lines

Re: ASSY: BGA sanity check

Bev Christian <[log in to unmask]>

Wed, 24 Jun 1998 11:23:04 -0400

90 lines

Re: ASSY: BGA sanity check

ETS <[log in to unmask]>

Wed, 24 Jun 1998 09:10:15 -0700

96 lines

Re: ASSY: BGA sanity check

Paul Klasek <[log in to unmask]>

Thu, 25 Jun 1998 09:10:44 +1000

160 lines

ASSY: BGA sanity check

[log in to unmask]

Wed, 24 Jun 1998 21:00:44 EDT

37 lines

Re: ASSY: BGA sanity check

Yves Trudell <[log in to unmask]>

Thu, 25 Jun 1998 11:29:12 -0400

68 lines

Re: ASSY: BGA sanity check

ETS <[log in to unmask]>

Thu, 25 Jun 1998 14:38:42 -0700

77 lines

Re: ASSY: BGA sanity check

ETS <[log in to unmask]>

Thu, 25 Jun 1998 14:38:46 -0700

237 lines

New Thread

Assy: chip on glass

Assy: chip on glass

Edwin Maximo <[log in to unmask]>

Wed, 17 Jun 1998 09:22:47 +0000

32 lines

New Thread

Assy: Component Date Code Policy for No-Clean Processing

Assy: Component Date Code Policy for No-Clean Processing

Sherman Banks <[log in to unmask]>

Tue, 9 Jun 1998 13:25:54 -0700

37 lines

New Thread

Assy: Reliability, exposed copper, and moisture

Re: Assy: Reliability, exposed copper, and moisture

[log in to unmask]

Sat, 30 May 1998 00:12:29 EDT

28 lines

New Thread

ASSY: TUNING RIBBON ATTACHMENT

ASSY: TUNING RIBBON ATTACHMENT

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 3 Jun 1998 15:09:00 -0400

42 lines

New Thread

ASSY: Use of No Clean Flux in a Nitrogen Atmosphere?

ASSY: Use of No Clean Flux in a Nitrogen Atmosphere?

Terry Huddleston <[log in to unmask]>

Fri, 5 Jun 1998 11:41:44 -0500

37 lines

Re: ASSY: Use of No Clean Flux in a Nitrogen Atmosphere?

Cobey Schmidt <[log in to unmask]>

Fri, 5 Jun 1998 15:27:06 -0500

83 lines

New Thread

ASSY: Video camera for digitized image capture

ASSY: Video camera for digitized image capture

Jerry Cupples <[log in to unmask]>

Tue, 9 Jun 1998 15:45:30 -0500

57 lines

Re: ASSY: Video camera for digitized image capture

Cobey Schmidt <[log in to unmask]>

Tue, 9 Jun 1998 15:56:20 -0500

125 lines

Re: ASSY: Video camera for digitized image capture

Paul Klasek <[log in to unmask]>

Wed, 10 Jun 1998 17:21:24 +1000

144 lines

Re: ASSY: Video camera for digitized image capture

Graham Naisbitt <[log in to unmask]>

Wed, 10 Jun 1998 08:40:08 +0100

102 lines

Re: ASSY: Video camera for digitized image capture

William T. (Tom) Taylor <[log in to unmask]>

Wed, 10 Jun 1998 10:54:33 -0400

26 lines

Re: ASSY: Video camera for digitized image capture

Stephen R. Gregory <[log in to unmask]>

Wed, 10 Jun 1998 21:54:10 EDT

84 lines

New Thread

Atlanta Chapter Designers Council Meeting

Atlanta Chapter Designers Council Meeting

[log in to unmask]

Mon, 22 Jun 1998 08:19:59 EDT

451 lines

New Thread

Automated Taping Machine

Automated Taping Machine

tgyee <[log in to unmask]>

Thu, 25 Jun 1998 09:02:34 PST

26 lines

Re: Automated Taping Machine

Coleman, Rob <[log in to unmask]>

Thu, 25 Jun 1998 07:29:38 -0500

52 lines

New Thread

BGA First Time Yields

BGA First Time Yields

Wallisch, Ernst <[log in to unmask]>

Thu, 11 Jun 1998 11:26:00 -0400

37 lines

Re: BGA First Time Yields

Chan, Marcelo <[log in to unmask]>

Thu, 11 Jun 1998 11:33:54 -0400

71 lines

Re: BGA First Time Yields

Yves Trudell <[log in to unmask]>

Thu, 11 Jun 1998 12:48:01 -0400

99 lines

New Thread

BGA Footprint

Re: BGA Footprint

Jeremy POLLARD <[log in to unmask]>

Sun, 31 May 1998 12:44:56 +0930

107 lines

Re: BGA Footprint

Chan, Marcelo <[log in to unmask]>

Mon, 1 Jun 1998 11:23:00 -0400

165 lines

New Thread

BGA Keepout

BGA Keepout

Kuczynski Michael <[log in to unmask]>

Thu, 11 Jun 1998 11:28:42 -0400

35 lines

New Thread

BGA land patterns

BGA land patterns

Wallisch, Ernst <[log in to unmask]>

Mon, 15 Jun 1998 14:15:37 -0400

38 lines

Re: BGA land patterns

Alex Neussendorfer <[log in to unmask]>

Mon, 15 Jun 1998 16:01:31 -0500

71 lines

New Thread

BGA periphery clearance

BGA periphery clearance

Wallisch, Ernst <[log in to unmask]>

Thu, 11 Jun 1998 11:05:54 -0400

38 lines

Re: BGA periphery clearance

Cobey Schmidt <[log in to unmask]>

Thu, 11 Jun 1998 10:17:22 -0500

88 lines

Re: BGA periphery clearance

Matthew Park <[log in to unmask]>

Thu, 11 Jun 1998 09:26:18 -0700

82 lines

Re: BGA periphery clearance

Jim Marsico 516-595-5879 <[log in to unmask]>

Thu, 11 Jun 1998 12:52:00 -0400

35 lines

Re: BGA periphery clearance

Thomas C Han <[log in to unmask]>

Fri, 12 Jun 1998 12:13:31 -0700

32 lines

Re: BGA periphery clearance

ceng <[log in to unmask]>

Sun, 14 Jun 1998 11:28:40 +0800

57 lines

New Thread

BGA reconditioning service????

BGA reconditioning service????

ryu <[log in to unmask]>

Tue, 9 Jun 1998 23:59:10 -0700

23 lines

Re: BGA reconditioning service????

Signorelli, Paul <[log in to unmask]>

Wed, 10 Jun 1998 09:09:25 -0600

45 lines

Re: BGA reconditioning service????

Bill Davis <[log in to unmask]>

Wed, 10 Jun 1998 09:49:13 -0700

68 lines

New Thread

BGAs in SPACE applications

BGAs in SPACE applications

John Mastorides <[log in to unmask]>

Thu, 4 Jun 1998 15:49:22 -0400

28 lines

Re: BGAs in SPACE applications

sahmad <[log in to unmask]>

Thu, 4 Jun 1998 14:33:53 -0600

54 lines

Re: BGAs in SPACE applications

Werner Engelmaier <[log in to unmask]>

Thu, 4 Jun 1998 23:17:40 EDT

43 lines

New Thread

Board Material for a 500mhz to 2ghz Application.

Board Material for a 500mhz to 2ghz Application.

Michael Thiel <[log in to unmask]>

Tue, 16 Jun 1998 15:08:12 -0500

32 lines

Re: Board Material for a 500mhz to 2ghz Application.

Manfred Huschka <[log in to unmask]>

Wed, 17 Jun 1998 03:01:58 -0500

78 lines

Re: Board Material for a 500mhz to 2ghz Application.

[log in to unmask]

Thu, 18 Jun 1998 00:35:19 EDT

26 lines

Re: Board Material for a 500mhz to 2ghz Application.

Arturo J. Aguayo <[log in to unmask]>

Fri, 19 Jun 1998 11:31:27 -0700

58 lines

New Thread

board substrate for RF/microwave

board substrate for RF/microwave

Matthew Park <[log in to unmask]>

Mon, 8 Jun 1998 08:22:11 -0700

37 lines

Re: board substrate for RF/microwave

Steve Collins <[log in to unmask]>

Mon, 8 Jun 1998 13:35:58 -0600

66 lines

Re: board substrate for RF/microwave

Arturo J. Aguayo <[log in to unmask]>

Thu, 11 Jun 1998 21:22:17 -0700

70 lines

New Thread

Bonding of Silica to Silica and Silica to Pd

Bonding of Silica to Silica and Silica to Pd

LI YUAN <[log in to unmask]>

Wed, 17 Jun 1998 14:02:30 -0600

36 lines

Re: Bonding of Silica to Silica and Silica to Pd

<Rudy Sedlak> <[log in to unmask]>

Wed, 17 Jun 1998 21:52:10 EDT

38 lines

New Thread

CAD question

CAD question

Ken Patel <[log in to unmask]>

Tue, 9 Jun 1998 14:19:13 -0700

38 lines

Re: CAD question

Paul Anderson <[log in to unmask]>

Wed, 10 Jun 1998 11:20:39 -0400

74 lines

New Thread

CAD Questions: Basic

Re: CAD Questions: Basic

Jeff Seeger <[log in to unmask]>

Sat, 30 May 1998 06:41:24 -0400

57 lines

Re: CAD Questions: Basic

JoAnn Amerson <[log in to unmask]>

Mon, 1 Jun 1998 08:23:51 +0000

78 lines

Re: CAD Questions: Basic

Olson, Jack C <[log in to unmask]>

Mon, 1 Jun 1998 08:21:31 -0700

65 lines

Re: CAD Questions: Basic

Paul Anderson <[log in to unmask]>

Sat, 30 May 1998 09:22:22 -0400

77 lines

New Thread

CAM package that support Cadence Allegro?

CAM package that support Cadence Allegro?

Ken Patel <[log in to unmask]>

Thu, 11 Jun 1998 16:33:11 -0700

32 lines

Re: CAM package that support Cadence Allegro?

Mitch Morey <[log in to unmask]>

Thu, 11 Jun 1998 18:02:08 -0700

74 lines

New Thread

Casting epoxy

Casting epoxy

by Dr. Eden Chen XianSong <[log in to unmask]>

Tue, 16 Jun 1998 10:13:20 +0800

42 lines

New Thread

CCA MOD

CCA MOD

Vaughan, Ralph H <[log in to unmask]>

Mon, 1 Jun 1998 05:42:28 -0700

36 lines

Re: CCA MOD

Bill Davis <[log in to unmask]>

Mon, 1 Jun 1998 10:45:56 -0700

66 lines

Re: CCA MOD

Arthur Kahlich <[log in to unmask]>

Mon, 1 Jun 1998 10:43:46 -0700

65 lines

New Thread

CCA Sponsors HDI Conference

CCA Sponsors HDI Conference

Dennis Maggi <[log in to unmask]>

Tue, 2 Jun 1998 13:50:21 EDT

44 lines

New Thread

Chip Resistor formula for spec IPC-SM-287 (1996).

Chip Resistor formula for spec IPC-SM-287 (1996).

Arellano, Albert D <[log in to unmask]>

Mon, 1 Jun 1998 11:54:40 -0500

43 lines

Re: Chip Resistor formula for spec IPC-SM-287 (1996).

Gary Ferrari <[log in to unmask]>

Mon, 1 Jun 1998 11:37:22 -0500

85 lines

New Thread

Chip Termination Finish

Chip Termination Finish

Tom Lambert <[log in to unmask]>

Wed, 24 Jun 1998 10:17:22 -0700

24 lines

Re: Chip Termination Finish

Rob Schetty <[log in to unmask]>

Wed, 24 Jun 1998 20:02:18 -0400

52 lines

Re: Chip Termination Finish

David D Hillman <[log in to unmask]>

Thu, 25 Jun 1998 09:23:52 -0500

107 lines

Re: Chip Termination Finish

superflx <[log in to unmask]>

Thu, 25 Jun 1998 15:03:45 -0400

51 lines

New Thread

Cimnet system

Cimnet system

Gary Christenson <[log in to unmask]>

Mon, 22 Jun 1998 15:37:10 -0700

24 lines

New Thread

CIRCUIT TRACE RESISTIVITY

CIRCUIT TRACE RESISTIVITY

Richard G Smith <[log in to unmask]>

Tue, 9 Jun 1998 15:19:26 -0600

36 lines

Re: CIRCUIT TRACE RESISTIVITY

Karl Sweitzer <[log in to unmask]>

Tue, 9 Jun 1998 17:37:26 -0400

74 lines

New Thread

Citric acid

Citric acid

Zecal Engineering <[log in to unmask]>

Thu, 18 Jun 1998 08:00:39 -0400

24 lines

New Thread

Citric cleaning

Citric cleaning

Zecal Engineering <[log in to unmask]>

Thu, 18 Jun 1998 13:26:39 -0400

23 lines

New Thread

Cleaning Process after Electroless copper

Cleaning Process after Electroless copper

Jacob Ransborg <[log in to unmask]>

Thu, 18 Jun 1998 01:04:50 +0200

31 lines

Re: Cleaning Process after Electroless copper

[log in to unmask]

Wed, 17 Jun 1998 20:17:08 -0700

51 lines

Re: Cleaning Process after Electroless copper

Fulabhai Patel <[log in to unmask]>

Wed, 17 Jun 1998 22:38:08 -0700

77 lines

Re: Cleaning Process after Electroless copper

Nelson, John <[log in to unmask]>

Thu, 18 Jun 1998 07:48:15 -0400

58 lines

Re: Cleaning Process after Electroless copper

Coleman, Rob <[log in to unmask]>

Thu, 18 Jun 1998 08:31:58 -0500

60 lines

Re: Cleaning Process after Electroless copper

SMITH RUSSELL MSM PO US <[log in to unmask]>

Thu, 25 Jun 1998 04:44:00 +0200

59 lines

New Thread

CMK Corporation

CMK Corporation

William E. Johnson <[log in to unmask]>

Thu, 11 Jun 1998 18:38:57 -0700

21 lines

New Thread

Compaq PCI backplanes

Compaq PCI backplanes

Marc Strickland <[log in to unmask]>

Fri, 5 Jun 1998 10:12:17 -0700

27 lines

Compaq PCI backplanes

Jon Johnson <[log in to unmask]>

Mon, 8 Jun 1998 14:16:08 -0400

49 lines

New Thread

component marking

component marking

Aura Esporalas <[log in to unmask]>

Wed, 10 Jun 1998 17:57:11 +0000

47 lines

New Thread

Components - Exposed Cu on Component Lead Ends

Components - Exposed Cu on Component Lead Ends

Rob Schetty <[log in to unmask]>

Fri, 5 Jun 1998 14:00:10 -0400

31 lines

Re: Components - Exposed Cu on Component Lead Ends

Stephen R. Gregory <[log in to unmask]>

Fri, 5 Jun 1998 15:26:49 EDT

59 lines

Re: Components - Exposed Cu on Component Lead Ends

Rob Schetty <[log in to unmask]>

Fri, 5 Jun 1998 16:57:00 -0400

87 lines

Re: Components - Exposed Cu on Component Lead Ends

Bill Davis <[log in to unmask]>

Mon, 8 Jun 1998 07:47:52 -0700

57 lines

Re: Components - Exposed Cu on Component Lead Ends

David D Hillman <[log in to unmask]>

Tue, 16 Jun 1998 17:19:31 -0500

77 lines

New Thread

Conductive Belt

Conductive Belt

Alvin Leong <[log in to unmask]>

Thu, 4 Jun 1998 22:47:28 +0800

33 lines

New Thread

Conductive Epoxy for Solder termination

Conductive Epoxy for Solder termination

by Dr. Eden Chen XianSong <[log in to unmask]>

Mon, 15 Jun 1998 11:35:01 +0800

43 lines

Re: Conductive Epoxy for Solder termination

Matthew Park <[log in to unmask]>

Mon, 15 Jun 1998 15:03:58 -0700

107 lines

Re: Conductive Epoxy for Solder termination

by Dr. Eden Chen XianSong <[log in to unmask]>

Tue, 16 Jun 1998 09:15:13 +0800

170 lines

Re: Conductive Epoxy for Solder termination

sahmad <[log in to unmask]>

Tue, 16 Jun 1998 08:46:01 -0600

137 lines

Re: Conductive Epoxy for Solder termination

Paul Klasek <[log in to unmask]>

Thu, 18 Jun 1998 09:18:07 +1000

94 lines

New Thread

Confirmation of Receipt

Confirmation of Receipt

Undetermined origin c/o LISTSERV administrator <[log in to unmask]>

Tue, 2 Jun 1998 18:50:20 EDT

29 lines

Confirmation of Receipt

Undetermined origin c/o LISTSERV administrator <[log in to unmask]>

Thu, 11 Jun 1998 08:25:50 EDT

29 lines

New Thread

Conformal coating

Conformal coating

David Greenman <[log in to unmask]>

Tue, 9 Jun 1998 21:23:30 -0400

35 lines

Conformal Coating

Martin <[log in to unmask]>

Thu, 18 Jun 1998 14:50:16 -0700

87 lines

Re: Conformal Coating

Graham Naisbitt <[log in to unmask]>

Fri, 19 Jun 1998 23:19:15 +0100

184 lines

New Thread

Conformal Coating?

Conformal Coating?

Rick Thompson <[log in to unmask]>

Wed, 17 Jun 1998 20:09:56 -0700

39 lines

Re: Conformal Coating?

Blanchet, Richard <[log in to unmask]>

Thu, 18 Jun 1998 08:22:38 -0400

79 lines

Re: Conformal Coating?

Aric parr <[log in to unmask]>

Thu, 18 Jun 1998 10:49:20 EDT

95 lines

Re: Conformal Coating?

Jack Crawford <[log in to unmask]>

Thu, 18 Jun 1998 10:18:15 -0500

72 lines

Re: Conformal Coating?

Barry Ritchie <[log in to unmask]>

Thu, 18 Jun 1998 15:11:02 -0400

104 lines

Re: Conformal Coating?

Peter Swanson <[log in to unmask]>

Fri, 19 Jun 1998 18:43:28 GMT

40 lines

New Thread

Connector problem (?)

Connector problem (?)

George Toman <[log in to unmask]>

Wed, 3 Jun 1998 16:13:57 -0400

41 lines

Re: Connector problem (?)

Cobey Schmidt <[log in to unmask]>

Wed, 3 Jun 1998 15:25:15 -0500

74 lines

Re: Connector problem (?)

Stephen R. Gregory <[log in to unmask]>

Wed, 3 Jun 1998 17:21:36 EDT

36 lines

New Thread

Connector problem (?) -Reply

Connector problem (?) -Reply

SOKKHON OU <[log in to unmask]>

Wed, 3 Jun 1998 15:39:42 -0600

24 lines

New Thread

Contamination Testing for Water Soluble Flux Residue

Contamination Testing for Water Soluble Flux Residue

Kathy Palumbo <[log in to unmask]>

Mon, 29 Jun 1998 13:39:35 -0700

40 lines

Re: Contamination Testing for Water Soluble Flux Residue

Aric parr <[log in to unmask]>

Tue, 30 Jun 1998 06:47:50 EDT

90 lines

Re: Contamination Testing for Water Soluble Flux Residue

Kevin Stokes <[log in to unmask]>

Tue, 30 Jun 1998 07:45:06 -0400

91 lines

Re: Contamination Testing for Water Soluble Flux Residue

[log in to unmask]

Tue, 30 Jun 1998 09:53:59 -0500

67 lines

New Thread

Conveyorised Plasma

Re: Conveyorised Plasma

Eltek Ltd. - Process Engineering <[log in to unmask]>

Mon, 1 Jun 1998 08:01:37 +0300

53 lines

New Thread

Copper diffusion into Zinc

Copper diffusion into Zinc

Glenn Pelkey <[log in to unmask]>

Mon, 8 Jun 1998 08:25:38 PDT

36 lines

New Thread

Copper Invar Copper

Copper Invar Copper

Robert Jordan <[log in to unmask]>

Thu, 25 Jun 1998 11:55:24 -0700

30 lines

Re: Copper Invar Copper

Karl Sweitzer <[log in to unmask]>

Fri, 26 Jun 1998 08:15:27 -0400

41 lines

Re: Copper Invar Copper

Chris Hunt <[log in to unmask]>

Fri, 26 Jun 1998 13:27:10 +0100

66 lines

New Thread

Copper Invar Copper -Reply

Copper Invar Copper -Reply

Fred Johnson <[log in to unmask]>

Thu, 25 Jun 1998 21:01:30 +0100

74 lines

New Thread

CP642 vs Micron 32mm carrier tape

CP642 vs Micron 32mm carrier tape

My Nguyen <[log in to unmask]>

Wed, 24 Jun 1998 18:10:04 -0700

41 lines

Re: CP642 vs Micron 32mm carrier tape

Stephen R. Gregory <[log in to unmask]>

Wed, 24 Jun 1998 22:22:04 EDT

89 lines

New Thread

defect marking

defect marking

Dave Pick -"process engineer" <[log in to unmask]>

Wed, 24 Jun 1998 18:10:28 -0600

26 lines

Re: defect marking

Dudi Banitt <[log in to unmask]>

Thu, 25 Jun 1998 08:09:33 +-300

105 lines

Re: defect marking

McMonagle, Michael R. <[log in to unmask]>

Thu, 25 Jun 1998 07:01:28 -0500

54 lines

Re: defect marking

Stephen R. Gregory <[log in to unmask]>

Thu, 25 Jun 1998 11:39:09 EDT

39 lines

Re: defect marking

Edward J. Valentine <[log in to unmask]>

Thu, 25 Jun 1998 13:02:00 -0700

52 lines

New Thread

Deleted Message

Deleted Message

Undetermined origin c/o LISTSERV administrator <[log in to unmask]>

Wed, 24 Jun 1998 11:37:55 EDT

28 lines

New Thread

Delidder

Delidder

Nick Nicolaides <[log in to unmask]>

Fri, 5 Jun 1998 17:31:07 -0400

26 lines

Re: Delidder

Bill Davis <[log in to unmask]>

Mon, 8 Jun 1998 08:54:21 -0700

51 lines

New Thread

DES: ODB++ format

DES: ODB++ format

Jerry Cupples <[log in to unmask]>

Wed, 3 Jun 1998 13:18:36 -0500

35 lines

Re: DES: ODB++ format

John Parsons <[log in to unmask]>

Wed, 3 Jun 1998 12:42:04 +0000

63 lines

Re: DES: ODB++ format

Brock Hunter <[log in to unmask]>

Wed, 3 Jun 1998 15:33:47 -0400

47 lines

Re: DES: ODB++ format

Mitch Morey <[log in to unmask]>

Wed, 3 Jun 1998 14:06:40 -0700

72 lines

Re: DES: ODB++ format

S.L.N.MURTHY <[log in to unmask]>

Thu, 4 Jun 1998 08:19:16 +0530

71 lines

Re: DES: ODB++ format

Doug Jeffery <[log in to unmask]>

Thu, 4 Jun 1998 04:56:00 -0500

73 lines

New Thread

Diameter of Holes in Reinforcement (re: Flex Stiffener)

Re: Diameter of Holes in Reinforcement (re: Flex Stiffener)

Dupriest, Don <[log in to unmask]>

Thu, 4 Jun 1998 16:07:30 -0600

105 lines

New Thread

die shear specification

die shear specification

Ricky Javier <rjavier@[192.1.1.215]>

Mon, 22 Jun 1998 13:32:43 +0000

43 lines

Re: die shear specification

Glenn Pelkey <[log in to unmask]>

Mon, 22 Jun 1998 08:07:44 PDT

36 lines

New Thread

Dielectric Testing

Dielectric Testing

[log in to unmask]

Wed, 10 Jun 1998 12:52:11 -0400

29 lines

New Thread

dip conformal coating

dip conformal coating

Cory and Lise Steeby <[log in to unmask]>

Tue, 9 Jun 1998 05:24:39 -0500

38 lines

Re: dip conformal coating

Aric parr <[log in to unmask]>

Tue, 9 Jun 1998 08:12:00 EDT

77 lines

Re: dip conformal coating

Thexton, Duane <[log in to unmask]>

Tue, 9 Jun 1998 07:05:03 -0700

79 lines

Re: dip conformal coating

ETS <[log in to unmask]>

Tue, 9 Jun 1998 09:09:40 -0700

75 lines

Re: dip conformal coating

Graham Naisbitt <[log in to unmask]>

Wed, 10 Jun 1998 11:14:51 +0100

118 lines

New Thread

Drill Wander

Drill Wander

Richard MacCutcheon <[log in to unmask]>

Tue, 16 Jun 1998 14:24:00 -0600

34 lines

Re: Drill Wander

Rout Lead <[log in to unmask]>

Mon, 22 Jun 1998 10:35:27 -0500

26 lines

Re: Drill Wander

Chris Williams <[log in to unmask]>

Mon, 22 Jun 1998 13:07:20 -0400

41 lines

New Thread

Drill2Gerber converter (reply)

Drill2Gerber converter (reply)

Khaled H. Fouad <[log in to unmask]>

Sun, 28 Jun 1998 17:36:03 +0300

35 lines

New Thread

dross in the solder pot

Re: dross in the solder pot

<Jason M. Smith> <[log in to unmask]>

Thu, 25 Jun 1998 16:07:38 -0400

38 lines

Re: dross in the solder pot

Justin Braime <[log in to unmask]>

Fri, 26 Jun 1998 11:02:41 +1200

67 lines

Re: dross in the solder pot

[log in to unmask]

Fri, 26 Jun 1998 07:09:17 -0500

78 lines

Re: dross in the solder pot

Ed Holton <[log in to unmask]>

Fri, 26 Jun 1998 08:35:18 -0400

108 lines

Re: dross in the solder pot

Aric parr <[log in to unmask]>

Fri, 26 Jun 1998 08:48:52 EDT

71 lines

Re: dross in the solder pot

Ed Holton <[log in to unmask]>

Fri, 26 Jun 1998 09:15:44 -0400

106 lines

Re: dross in the solder pot

Paul Klasek <[log in to unmask]>

Sat, 27 Jun 1998 18:04:10 +1000

184 lines

New Thread

drying

drying

[log in to unmask]

Sun, 21 Jun 1998 17:56:57 EDT

26 lines

New Thread

DST Foil

Re: DST Foil

[log in to unmask]

Wed, 10 Jun 1998 10:18:14 EDT

42 lines

New Thread

Electroless Nickel/gold again

Electroless Nickel/gold again

Jacob Sickmann Ransborg <[log in to unmask]>

Wed, 10 Jun 1998 10:38:32 +0200

40 lines

Re: Electroless Nickel/gold again

Russell S Gregory <[log in to unmask]>

Wed, 10 Jun 1998 16:17:56 EDT

31 lines

New Thread

Email address req for Electrovert

Email address req for Electrovert

Roger M Unwin <[log in to unmask]>

Tue, 9 Jun 1998 14:49:46 +0100

30 lines

Re: Email address req for Electrovert

<Jason M. Smith> <[log in to unmask]>

Tue, 9 Jun 1998 10:13:02 -0400

64 lines

Re: Email address req for Electrovert

Jared Lang <[log in to unmask]>

Tue, 9 Jun 1998 08:21:59 -0700

74 lines

Re: Email address req for Electrovert

Kathy Palumbo <[log in to unmask]>

Tue, 9 Jun 1998 08:21:24 -0700

61 lines

Re: Email address req for Electrovert

Jim Mathis <[log in to unmask]>

Tue, 9 Jun 1998 13:20:13 EDT

25 lines

New Thread

Enormous MCM - M&P Q's

Enormous MCM - M&P Q's

Steve <[log in to unmask]>

Thu, 11 Jun 1998 13:51:57 -0700

43 lines

Re: Enormous MCM - M&P Q's

Karl Sweitzer <[log in to unmask]>

Fri, 12 Jun 1998 08:42:54 -0400

92 lines

Re: Enormous MCM - M&P Q's

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 12 Jun 1998 15:36:00 -0400

30 lines

New Thread

Enquiry...

Enquiry...

Elmec <[log in to unmask]>

Thu, 18 Jun 1998 16:16:41 +0530

419 lines

Re: Enquiry...

ETS <[log in to unmask]>

Thu, 18 Jun 1998 08:49:04 -0700

65 lines

New Thread

Entek OSP

Entek OSP

Bill Davis <[log in to unmask]>

Mon, 15 Jun 1998 07:57:07 -0700

22 lines

Re: Entek OSP

Coleman, Ron <[log in to unmask]>

Mon, 15 Jun 1998 12:05:47 -0500

58 lines

Re: Entek OSP

Eltek Ltd. - Process Engineering <[log in to unmask]>

Tue, 16 Jun 1998 07:32:43 +0300

54 lines

Re: Entek OSP

[log in to unmask]

Tue, 16 Jun 1998 15:28:40 -0700

79 lines

New Thread

EPCmail

EPCmail

Philip Stoten <[log in to unmask]>

Tue, 30 Jun 1998 16:17:21 +0000

376 lines

New Thread

EPS

EPS

H H TONG <[log in to unmask]>

Sun, 31 May 1998 16:54:37 +0800

27 lines

New Thread

Error in - GEN: DI Water System Capacity

Error in - GEN: DI Water System Capacity

Robert E. Mesick <[log in to unmask]>

Tue, 30 Jun 1998 11:00:42 -0700

64 lines

New Thread

exposure box

exposure box

Edwin Maximo <[log in to unmask]>

Fri, 5 Jun 1998 10:25:38 +0000

33 lines

New Thread

FAB - Laser drilled microvia resin removal?

FAB - Laser drilled microvia resin removal?

Gregory S Bartlett <[log in to unmask]>

Tue, 9 Jun 1998 13:56:00 -0400

36 lines

Re: FAB - Laser drilled microvia resin removal?

[log in to unmask]

Wed, 10 Jun 1998 01:38:51 EDT

51 lines

Re: FAB - Laser drilled microvia resin removal?

[log in to unmask]

Wed, 10 Jun 1998 08:20:58 -0700

53 lines

New Thread

FAB etchback IPC-6012

FAB etchback IPC-6012

George Franck <[log in to unmask]>

Tue, 2 Jun 1998 11:56:14 -0400

35 lines

New Thread

FAB: Horizontal HASL

FAB: Horizontal HASL

Jan Thuesen <[log in to unmask]>

Mon, 22 Jun 1998 12:28:03 +0200

41 lines

New Thread

Fab: info on equipment

Fab: info on equipment

Blanchet, Richard <[log in to unmask]>

Wed, 3 Jun 1998 14:56:12 -0400

34 lines

New Thread

Fab: plug vias

Fab: plug vias

Blanchet, Richard <[log in to unmask]>

Tue, 23 Jun 1998 16:19:07 -0400

34 lines

Re: Fab: plug vias

Afri Singh <[log in to unmask]>

Tue, 23 Jun 1998 18:48:46 -0400

53 lines

Re: Fab: plug vias

Andy Slade <[log in to unmask]>

Wed, 24 Jun 1998 07:35:13 -0400

66 lines

Re: Fab: plug vias

John Haman Jr. <[log in to unmask]>

Wed, 24 Jun 1998 08:31:59 -0400

70 lines

Re: Fab: plug vias

Blanchet, Richard <[log in to unmask]>

Thu, 25 Jun 1998 10:10:14 -0400

72 lines

Re: Fab: plug vias

<Rudy Sedlak> <[log in to unmask]>

Fri, 26 Jun 1998 11:20:44 EDT

45 lines

New Thread

FAB: Plugged, Filled &/or Tented Vias

FAB: Plugged, Filled &/or Tented Vias

Lisa Williams <[log in to unmask]>

Mon, 15 Jun 1998 16:31:19 -0500

30 lines

Re: FAB: Plugged, Filled &/or Tented Vias

Ron Payne <[log in to unmask]>

Mon, 22 Jun 1998 13:35:02 -0700

59 lines

Re: FAB: Plugged, Filled &/or Tented Vias

Fred Watt <[log in to unmask]>

Mon, 22 Jun 1998 16:46:29 -0700

63 lines

New Thread

FAB: Selective Solder Stripping

FAB: Selective Solder Stripping

D. Rooke <[log in to unmask]>

Thu, 18 Jun 1998 07:37:55 -0400

33 lines

Re: FAB: Selective Solder Stripping

Mike Holmes x4356 <[log in to unmask]>

Thu, 18 Jun 1998 08:06:04 -0400

57 lines

Re: FAB: Selective Solder Stripping

Andy Slade <[log in to unmask]>

Thu, 18 Jun 1998 09:45:16 -0400

65 lines

Re: FAB: Selective Solder Stripping

[log in to unmask]

Mon, 22 Jun 1998 09:49:28 EDT

34 lines

New Thread

FAB: solder over nickel

FAB: solder over nickel

Tom Bresnan <[log in to unmask]>

Thu, 18 Jun 1998 12:38:40 -0400

40 lines

Re: FAB: solder over nickel

Don Vischulis <[log in to unmask]>

Thu, 18 Jun 1998 20:31:08 -0500

64 lines

Re: FAB: solder over nickel

Christine Lizzul Rinne <[log in to unmask]>

Fri, 19 Jun 1998 11:00:36 -0400

74 lines

Re: FAB: solder over nickel

Fulabhai Patel <[log in to unmask]>

Fri, 19 Jun 1998 09:02:13 -0700

86 lines

New Thread

FEM modelling

FEM modelling

by Dr. Eden Chen XianSong <[log in to unmask]>

Tue, 23 Jun 1998 17:28:51 +0800

37 lines

Re: FEM modelling

LI YUAN <[log in to unmask]>

Wed, 24 Jun 1998 15:10:48 -0600

61 lines

New Thread

Fidutial Requirements

Fidutial Requirements

arrigo.tony <[log in to unmask]>

Tue, 30 Jun 1998 09:21:00 -0700

65 lines

New Thread

fine-pitch component specification

fine-pitch component specification

d. terstegge <[log in to unmask]>

Mon, 22 Jun 1998 15:52:19 GMT

36 lines

Re: fine-pitch component specification

Bill Davis <[log in to unmask]>

Mon, 22 Jun 1998 09:06:15 -0700

63 lines

New Thread

Flex Circuit Board houses

Flex Circuit Board houses

Stammely, Tim <[log in to unmask]>

Thu, 11 Jun 1998 08:25:31 -0400

30 lines

Re: Flex Circuit Board houses

Dave Roesler <[log in to unmask]>

Thu, 11 Jun 1998 08:23:44 -0500

63 lines

Re: Flex Circuit Board houses

[log in to unmask]

Thu, 11 Jun 1998 09:27:27 EDT

29 lines

Re: Flex Circuit Board houses

John Denton <[log in to unmask]>

Thu, 11 Jun 1998 09:38:32 -0400

53 lines

Re: Flex Circuit Board houses

Richard Tassone <[log in to unmask]>

Thu, 11 Jun 1998 06:37:46 +0100

83 lines

Re: Flex Circuit Board houses

Richard Tassone <[log in to unmask]>

Thu, 11 Jun 1998 06:43:51 +0100

82 lines

Re: Flex Circuit Board houses

Dr. M. Stampanoni <[log in to unmask]>

Thu, 11 Jun 1998 17:42:15 +0200

57 lines

Re: Flex Circuit Board houses

Chetan Shah <[log in to unmask]>

Thu, 11 Jun 1998 22:49:21 +0000

29 lines

New Thread

Flex Circuit Vendors

Flex Circuit Vendors

Jon Johnson <[log in to unmask]>

Wed, 17 Jun 1998 08:43:00 -0400

38 lines

Re: Flex Circuit Vendors

Dave Roesler <[log in to unmask]>

Wed, 17 Jun 1998 10:38:26 -0500

68 lines

Re: Flex Circuit Vendors

Zhang, Jay <[log in to unmask]>

Wed, 17 Jun 1998 11:57:02 -0500

72 lines

Re: Flex Circuit Vendors

[log in to unmask]

Wed, 17 Jun 1998 16:23:51 EDT

23 lines

Re: Flex Circuit Vendors

Bill Davis <[log in to unmask]>

Wed, 17 Jun 1998 13:44:48 -0700

43 lines

Re: Flex Circuit Vendors

Andy Magee <[log in to unmask]>

Wed, 17 Jun 1998 18:31:49 -0400

47 lines

New Thread

Flex Circuit Vendors -Reply

Re: Flex Circuit Vendors -Reply

Ron Hayashi <[log in to unmask]>

Wed, 17 Jun 1998 15:06:44 -0700

22 lines

New Thread

Flex/rigid manufacturers in China

Flex/rigid manufacturers in China

Eric Christison <[log in to unmask]>

Thu, 11 Jun 1998 17:37:27 +0100

36 lines

Re: Flex/rigid manufacturers in China

Bill Davis <[log in to unmask]>

Thu, 11 Jun 1998 10:30:01 -0700

67 lines

Re: Flex/rigid manufacturers in China

Zhang, Jay <[log in to unmask]>

Thu, 11 Jun 1998 14:20:44 -0500

120 lines

Re: Flex/rigid manufacturers in China

[log in to unmask]

Tue, 16 Jun 1998 18:57:50 EDT

39 lines

New Thread

FORD BURN IN

Re: FORD BURN IN

[log in to unmask]

Mon, 1 Jun 1998 11:52:47 EDT

60 lines

New Thread

FREE Warehouse Equipment Catalog!

FREE Warehouse Equipment Catalog!

A Plus Warehouse <[log in to unmask]>

Thu, 25 Jun 1998 17:46:00 -0400

30 lines

New Thread

Frequency Performance of FR-4

Re: Frequency Performance of FR-4

Arturo J. Aguayo <[log in to unmask]>

Tue, 2 Jun 1998 08:01:47 -0700

147 lines

Re: Frequency Performance of FR-4

Arturo J. Aguayo <[log in to unmask]>

Tue, 2 Jun 1998 08:12:46 -0700

61 lines

Re: Frequency Performance of FR-4

Mitch Morey <[log in to unmask]>

Tue, 2 Jun 1998 09:54:38 -0700

91 lines

Re: Frequency Performance of FR-4

LI YUAN <[log in to unmask]>

Fri, 5 Jun 1998 13:29:09 -0600

114 lines

New Thread

Future new Procedures in IPC-7711

Future new Procedures in IPC-7711

Matthias Mansfeld <[log in to unmask]>

Thu, 11 Jun 1998 00:16:25 +0200

47 lines

Re: Future new Procedures in IPC-7711

Cash, Alan <[log in to unmask]>

Wed, 10 Jun 1998 18:33:59 -0400

72 lines

Re: Future new Procedures in IPC-7711

Jack Crawford <[log in to unmask]>

Wed, 10 Jun 1998 18:52:47 -0500

90 lines

Re: Future new Procedures in IPC-7711

Peggi Blakley <[log in to unmask]>

Thu, 11 Jun 1998 07:15:14 -0500

75 lines

New Thread

FW: [TN] component marking

FW: [TN] component marking

Dhawan, Ashok <[log in to unmask]>

Wed, 10 Jun 1998 08:56:24 -0500

81 lines

New Thread

FW: [TN] IC top mark

FW: [TN] IC top mark

Blanchet, Richard <[log in to unmask]>

Thu, 11 Jun 1998 08:02:16 -0400

79 lines

New Thread

Fwd: [TN] intrusive reflow and all

Fwd: [TN] intrusive reflow and all

[log in to unmask]

Sun, 28 Jun 1998 22:22:57 EDT

76 lines

New Thread

FYI Tanatalums

FYI Tanatalums

[log in to unmask]

Mon, 29 Jun 1998 08:57:11 -0400

33 lines

New Thread

GaAs ICs

GaAs ICs

Kuan Kuan Ng <[log in to unmask]>

Sat, 13 Jun 1998 10:49:30 +0800

30 lines

New Thread

Gap welding to FR4

Gap welding to FR4

[log in to unmask]

Sat, 6 Jun 1998 21:25:23 EDT

28 lines

New Thread

Gap welding to FR4.

Gap welding to FR4.

[log in to unmask]

Wed, 3 Jun 1998 22:42:17 EDT

28 lines

New Thread

GEN: DI Water System Capacity

GEN: DI Water System Capacity

Paul Wilson <[log in to unmask]>

Mon, 29 Jun 1998 06:28:42 -0400

51 lines

GEN: DI Water System Capacity

Robert E. Mesick <[log in to unmask]>

Tue, 30 Jun 1998 09:10:53 +0000

126 lines

New Thread

Gen: Name

Re: Gen: Name

TOM HYBISKE <[log in to unmask]>

Fri, 5 Jun 1998 13:05:33 +0000

28 lines

New Thread

Gen: Name?

Gen: Name?

Jan Satterfield <[log in to unmask]>

Fri, 5 Jun 1998 10:29:10 -0600

24 lines

Re: Gen: Name?

Ralph Hersey <[log in to unmask]>

Mon, 8 Jun 1998 11:25:20 -0700

94 lines

Re: Gen: Name?

JoAnn Amerson <[log in to unmask]>

Mon, 8 Jun 1998 14:58:35 -0400

104 lines

Re: Gen: Name?

Olson, Jack C <[log in to unmask]>

Tue, 9 Jun 1998 13:10:55 -0700

39 lines

Re: Gen: Name?

Cobey Schmidt <[log in to unmask]>

Tue, 9 Jun 1998 15:48:45 -0500

83 lines

Re: Gen: Name?

Cash, Alan <[log in to unmask]>

Wed, 10 Jun 1998 17:21:44 -0400

119 lines

New Thread

GEN:DFM

GEN:DFM

Larry Davis <[log in to unmask]>

Tue, 2 Jun 1998 08:07:36 -0500

30 lines

Re: GEN:DFM

Paul Stolar <[log in to unmask]>

Tue, 2 Jun 1998 09:14:15 -0600

63 lines

Re: GEN:DFM

Gagrani, Kishore <[log in to unmask]>

Tue, 2 Jun 1998 11:09:28 -0400

101 lines

Re: GEN:DFM

Chetan Shah <[log in to unmask]>

Tue, 2 Jun 1998 22:29:05 +0000

29 lines

New Thread

Gerber From 1:1 Artwork

Gerber From 1:1 Artwork

Tom Kropski <[log in to unmask]>

Mon, 1 Jun 1998 08:21:17 -0400

65 lines

Re: Gerber From 1:1 Artwork

John Laur <[log in to unmask]>

Mon, 1 Jun 1998 10:57:49 -0500

81 lines

Re: Gerber From 1:1 Artwork

<Rashesh Patel> <[log in to unmask]>

Mon, 1 Jun 1998 13:16:08 EDT

27 lines

Re: Gerber From 1:1 Artwork

Eddy <[log in to unmask]>

Tue, 2 Jun 1998 21:36:49 +0800

46 lines

New Thread

German-English Dictionary in CD for Telephony terms

German-English Dictionary in CD for Telephony terms

Konrad Benz <[log in to unmask]>

Tue, 9 Jun 1998 13:33:32 -0400

26 lines

Re: German-English Dictionary in CD for Telephony terms

David Whalley <[log in to unmask]>

Thu, 11 Jun 1998 09:17:20 +0100

36 lines

New Thread

Gold Coated Solder

Gold Coated Solder

Bill Fabry <[log in to unmask]>

Tue, 23 Jun 1998 12:00:16 -0700

56 lines

Re: Gold Coated Solder

David D Hillman <[log in to unmask]>

Tue, 23 Jun 1998 14:39:44 -0500

126 lines

Re: Gold Coated Solder

Stephen R. Gregory <[log in to unmask]>

Tue, 23 Jun 1998 17:06:23 EDT

87 lines

Re: Gold Coated Solder

SEM Lab, Inc. <[log in to unmask]>

Thu, 25 Jun 1998 13:26:45 -0500

86 lines

New Thread

Gold Coated Solder - a Followup

Gold Coated Solder - a Followup

Bill Fabry <[log in to unmask]>

Tue, 23 Jun 1998 14:45:28 -0700

36 lines

Re: Gold Coated Solder - a Followup

David D Hillman <[log in to unmask]>

Wed, 24 Jun 1998 06:52:34 -0500

74 lines

New Thread

Gold contamination!

Gold contamination!

Nicolas van der Heyden <[log in to unmask]>

Mon, 15 Jun 1998 11:20:09 -0400

43 lines

Re: Gold contamination!

Brad Vanderhoof <[log in to unmask]>

Mon, 15 Jun 1998 10:00:38 PDT

68 lines

Re: Gold contamination!

Lenny Kurup <[log in to unmask]>

Mon, 15 Jun 1998 13:41:45 -0400

74 lines

New Thread

Gold over Tin vs. Gold over Tin-Nickel

Gold over Tin vs. Gold over Tin-Nickel

Fred Watt <[log in to unmask]>

Fri, 5 Jun 1998 11:19:07 -0700

25 lines

Re: Gold over Tin vs. Gold over Tin-Nickel

[log in to unmask]

Fri, 5 Jun 1998 16:20:38 -0500

126 lines

Re: Gold over Tin vs. Gold over Tin-Nickel

[log in to unmask]

Fri, 5 Jun 1998 20:06:05 EDT

31 lines

New Thread

Gold plating of PWB's

Gold plating of PWB's

Tim Frigon <[log in to unmask]>

Wed, 24 Jun 1998 14:50:34 -0500

29 lines

Re: Gold plating of PWB's

SEM Lab, Inc. <[log in to unmask]>

Thu, 25 Jun 1998 13:46:59 -0500

68 lines

New Thread

Gold Recovery

Gold Recovery

Byron L. Miller <[log in to unmask]>

Tue, 9 Jun 1998 12:31:08 -0700

35 lines

New Thread

Gold thickness - Edge

Gold thickness - Edge

Colin Weber <[log in to unmask]>

Wed, 1 Jul 1998 13:58:55 +1000

40 lines

New Thread

Gold to nickel adhesion

Gold to nickel adhesion

Modular Components National, Inc. <[log in to unmask]>

Fri, 19 Jun 1998 14:14:12 -0400

43 lines

Re: Gold to nickel adhesion

Lenny Kurup <[log in to unmask]>

Fri, 19 Jun 1998 15:37:01 -0400

32 lines

New Thread

Greater Boston DC Chapter Meeting, Thursday 18-June

Greater Boston DC Chapter Meeting, Thursday 18-June

Jeff Seeger <[log in to unmask]>

Fri, 12 Jun 1998 21:27:29 -0400

78 lines

New Thread

Handheld O2 Measurement

Handheld O2 Measurement

[log in to unmask]

Tue, 30 Jun 1998 09:56:31 -0500

37 lines

New Thread

Heat dissipation design for power resistors

Heat dissipation design for power resistors

Byrns Nancy <[log in to unmask]>

Wed, 3 Jun 1998 13:54:42 -0400

32 lines

HEAT DISSIPATION design for power resistors

Byrns Nancy <[log in to unmask]>

Thu, 11 Jun 1998 09:18:01 -0400

33 lines

New Thread

Heat Reflective Coating

Heat Reflective Coating

Gagrani, Kishore <[log in to unmask]>

Mon, 15 Jun 1998 15:22:30 -0400

31 lines

Re: Heat Reflective Coating

Paul Klasek <[log in to unmask]>

Tue, 16 Jun 1998 14:21:30 +1000

60 lines

New Thread

Heat Reflective Coating -Reply

Re: Heat Reflective Coating -Reply

Dennis Ostendorf <[log in to unmask]>

Mon, 22 Jun 1998 10:29:44 -0500

34 lines

New Thread

help!!

help!!

Steven R. Page <[log in to unmask]>

Mon, 1 Jun 1998 11:52:51 -0800

50 lines

Re: help!!

Carroll, George (MIS, GEFanuc, NA) <[log in to unmask]>

Mon, 1 Jun 1998 16:43:32 -0400

42 lines

Re: help!!

Nelson, John <[log in to unmask]>

Wed, 3 Jun 1998 07:44:29 -0400

47 lines

Re: help!!

Leslie O. Connally <[log in to unmask]>

Wed, 3 Jun 1998 09:17:36 -0700

50 lines

New Thread

Help/Markers

Help/Markers

Eltek Ltd. - Process Engineering <[log in to unmask]>

Mon, 29 Jun 1998 14:23:45 +0300

30 lines

Re: Help/Markers

McMonagle, Michael R. <[log in to unmask]>

Mon, 29 Jun 1998 07:12:11 -0500

57 lines

New Thread

HELP: Cracking Discretes on PCB's

HELP: Cracking Discretes on PCB's

Michael Lang <[log in to unmask]>

Sun, 28 Jun 1998 18:35:00 PDT

57 lines

Re: HELP: Cracking Discretes on PCB's

Haugaard Svend <[log in to unmask]>

Mon, 29 Jun 1998 08:42:49 +0200

39 lines

Re: HELP: Cracking Discretes on PCB's

Rupert, Martha L. <[log in to unmask]>

Mon, 29 Jun 1998 09:08:35 -0400

97 lines

Re: HELP: Cracking Discretes on PCB's

Rupert, Martha L. <[log in to unmask]>

Mon, 29 Jun 1998 09:18:07 -0400

73 lines

New Thread

HK CONVENTIONAL CNTR SEMINAR - 28TH JULY, 1998

HK CONVENTIONAL CNTR SEMINAR - 28TH JULY, 1998

[log in to unmask]

Fri, 19 Jan 1996 04:58:48 PM

54 lines

Re: HK CONVENTIONAL CNTR SEMINAR - 28TH JULY, 1998

harrimosa <[log in to unmask]>

Wed, 1 Jul 1998 08:32:51 +0800

106 lines

New Thread

How to buy IPC Gerber?

How to buy IPC Gerber?

Joseph Fan <[log in to unmask]>

Mon, 29 Jun 1998 12:03:18 +0800

34 lines

New Thread

How to Clean RMA Flux?

How to Clean RMA Flux?

Steven H Axdal <[log in to unmask]>

Mon, 1 Jun 1998 09:02:35 -0500

37 lines

Re: How to Clean RMA Flux?

Hogue, Pat (AZ76) <[log in to unmask]>

Mon, 1 Jun 1998 11:10:26 -0500

72 lines

Re: How to Clean RMA Flux?

[log in to unmask]

Tue, 2 Jun 1998 00:49:54 -0600

83 lines

Re: How to Clean RMA Flux?

Gregg Klawson <[log in to unmask]>

Tue, 2 Jun 1998 08:34:36 -0400

51 lines

New Thread

HR Contact in Pueblo

Re: HR Contact in Pueblo

[log in to unmask]

Wed, 24 Jun 1998 14:57:27 EDT

42 lines

New Thread

hybrid manufacturing questions

hybrid manufacturing questions

Ed Holton <[log in to unmask]>

Mon, 29 Jun 1998 16:39:59 -0400

47 lines

New Thread

IC top mark

IC top mark

Edwin Maximo <[log in to unmask]>

Wed, 10 Jun 1998 09:44:19 +0000

33 lines

Re: IC top mark

Stephen R. Gregory <[log in to unmask]>

Wed, 10 Jun 1998 22:08:08 EDT

38 lines

Re: IC top mark

Paul Klasek <[log in to unmask]>

Thu, 11 Jun 1998 12:57:50 +1000

88 lines

Re: IC top mark

Ralph Hersey <[log in to unmask]>

Wed, 10 Jun 1998 23:12:06 -0700

126 lines

Re: IC top mark

Craig Smith <[log in to unmask]>

Thu, 11 Jun 1998 10:43:29 -0400

61 lines

Re: IC top mark

Jared Lang <[log in to unmask]>

Thu, 11 Jun 1998 08:43:14 -0700

74 lines

New Thread

ICT and FT testers

ICT and FT testers

LI YUAN <[log in to unmask]>

Tue, 9 Jun 1998 14:59:23 -0600

25 lines

Re: ICT and FT testers

Gagrani, Kishore <[log in to unmask]>

Wed, 10 Jun 1998 08:26:53 -0400

74 lines

New Thread

Immersion white Tin PCB surface finish

Immersion white Tin PCB surface finish

Stammely, Tim <[log in to unmask]>

Fri, 19 Jun 1998 15:50:33 -0400

32 lines

Re: Immersion white Tin PCB surface finish

Jack Crawford <[log in to unmask]>

Fri, 19 Jun 1998 15:17:10 -0500

62 lines

Re: Immersion white Tin PCB surface finish

M. C. Chu <[log in to unmask]>

Mon, 22 Jun 1998 15:52:36 +0900

69 lines

New Thread

Interim Meeting Announcement FlexibleCircuits Committee

Re: Interim Meeting Announcement FlexibleCircuits Committee

ryan <[log in to unmask]>

Sun, 7 Jun 1998 13:16:02 -0400

24 lines

New Thread

Interim Meeting Announcement ― Flexible Circuits Committee

Interim Meeting Announcement ― Flexible Circuits Committee

Christopher Jorgensen <[log in to unmask]>

Wed, 3 Jun 1998 13:07:12 -0500

193 lines

New Thread

intrusive reflow and all

intrusive reflow and all

[log in to unmask]

Thu, 25 Jun 1998 09:10:37 EDT

42 lines

Re: intrusive reflow and all

David Gonnerman <[log in to unmask]>

Thu, 25 Jun 1998 09:28:55 -0500

84 lines

Re: intrusive reflow and all

Eddie Brunker <[log in to unmask]>

Thu, 25 Jun 1998 15:59:15 +0100

108 lines

Re: intrusive reflow and all

Jeff Hempton <[log in to unmask]>

Thu, 25 Jun 1998 11:17:50 -0500

140 lines

Re: intrusive reflow and all

McMonagle, Michael R. <[log in to unmask]>

Thu, 25 Jun 1998 11:57:35 -0500

193 lines

Re: intrusive reflow and all

[log in to unmask]

Thu, 25 Jun 1998 15:46:23 EDT

28 lines

Re: intrusive reflow and all

ETS <[log in to unmask]>

Thu, 25 Jun 1998 14:42:03 -0700

50 lines

Re: intrusive reflow and all

[log in to unmask]

Thu, 25 Jun 1998 18:42:55 EDT

75 lines

Intrusive reflow and all

Eddie Brunker <[log in to unmask]>

Fri, 26 Jun 1998 09:54:52 +0100

31 lines

Re: intrusive reflow and all

Paul Klasek <[log in to unmask]>

Sat, 27 Jun 1998 19:12:29 +1000

161 lines

Re: intrusive reflow and all

[log in to unmask]

Tue, 30 Jun 1998 18:12:05 EDT

62 lines

New Thread

Ionic Contaminate Calculation

Ionic Contaminate Calculation

Glenn Pelkey <[log in to unmask]>

Mon, 22 Jun 1998 17:29:07 PDT

36 lines

New Thread

IPC HOLE TO LEAD RATIOS

IPC HOLE TO LEAD RATIOS

[log in to unmask]

Tue, 30 Jun 1998 14:35:38 PST

18 lines

IPC HOLE TO LEAD RATIOS

[log in to unmask]

Tue, 30 Jun 1998 16:00:33 PST

28 lines

New Thread

IPC Spec 4101 (Epoxy Spots)

IPC Spec 4101 (Epoxy Spots)

Joel Fillion <[log in to unmask]>

Mon, 8 Jun 1998 17:03:59 -0700

31 lines

Re: IPC Spec 4101 (Epoxy Spots)

D. Rooke <[log in to unmask]>

Wed, 10 Jun 1998 21:46:50 -0400

56 lines

New Thread

IPC standard

IPC standard

Edwin Maximo <[log in to unmask]>

Mon, 8 Jun 1998 16:41:54 +0000

30 lines

Re: IPC standard

Kuan Kuan Ng <[log in to unmask]>

Tue, 9 Jun 1998 08:24:24 +0800

52 lines

New Thread

IPC standard 4 part number description?

IPC standard 4 part number description?

Arellano, Albert D <[log in to unmask]>

Thu, 11 Jun 1998 16:28:36 -0500

25 lines

New Thread

IPC Standard Question

IPC Standard Question

Mayo, Daniel <[log in to unmask]>

Wed, 10 Jun 1998 12:57:37 -0400

37 lines

New Thread

IPC-T-50

Re: IPC-T-50

Joann Amerson <[log in to unmask]>

Wed, 10 Jun 1998 15:50:34 -0400

38 lines

Re: IPC-T-50

Graham, Christy <[log in to unmask]>

Wed, 10 Jun 1998 14:39:00 -0700

61 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Thu, 4 Jun 1998 11:22:58 -0700

53 lines

IPCchat session announcement

[log in to unmask]

Fri, 12 Jun 1998 13:10:04 -0700

46 lines

New Thread

J-STD-001A vs. -001B

J-STD-001A vs. -001B

John Mastorides <[log in to unmask]>

Tue, 9 Jun 1998 12:53:22 -0400

25 lines

Re: J-STD-001A vs. -001B

Doug Pauls <[log in to unmask]>

Tue, 9 Jun 1998 13:12:03 EDT

34 lines

Re: J-STD-001A vs. -001B

Jack Crawford <[log in to unmask]>

Wed, 10 Jun 1998 18:02:03 -0500

61 lines

Re: J-STD-001A vs. -001B

Stephen R. Gregory <[log in to unmask]>

Wed, 10 Jun 1998 20:02:31 EDT

53 lines

New Thread

Job opportuniyt

Job opportuniyt

[log in to unmask]

Mon, 22 Jun 1998 19:17:19 EDT

30 lines

Re: Job opportuniyt

Hugo Scaramuzza <[log in to unmask]>

Tue, 23 Jun 1998 11:13:39 -0500

63 lines

New Thread

jumper wire turnish after solder wave

jumper wire turnish after solder wave

Aura Esporalas <[log in to unmask]>

Wed, 10 Jun 1998 18:01:10 +0000

40 lines

New Thread

Junk email?

Re: Junk email?

JoAnn Amerson <[log in to unmask]>

Fri, 12 Jun 1998 12:44:26 -0400

40 lines

Re: Junk email?

Joseph E. J. Duclos Jr. <[log in to unmask]>

Fri, 12 Jun 1998 21:48:31 -0400

61 lines

New Thread

Land Pattern Fo

Re: Land Pattern Fo

James Patten <[log in to unmask]>

Fri, 12 Jun 1998 12:58:08 -0700

560 lines

New Thread

Land Pattern Formulas

Re: Land Pattern Formulas

Mike Buetow <[log in to unmask]>

Fri, 12 Jun 1998 16:35:22 -0500

30 lines

New Thread

Land Pattern Formulas 4 IPC-SM-782?

Land Pattern Formulas 4 IPC-SM-782?

Arellano, Albert D <[log in to unmask]>

Thu, 11 Jun 1998 17:46:06 -0500

41 lines

Re: Land Pattern Formulas 4 IPC-SM-782?

Stephen R. Gregory <[log in to unmask]>

Thu, 11 Jun 1998 20:03:14 EDT

68 lines

Land Pattern Formulas 4 IPC-SM-782?

Thomas Martin <[log in to unmask]>

Fri, 12 Jun 1998 13:08:53 -0400

27 lines

New Thread

Liquid Photoresist

Re: Liquid Photoresist

Tony Ridler <[log in to unmask]>

Mon, 1 Jun 1998 16:21:44 EDT

43 lines

New Thread

Looking for contract mfg.

Looking for contract mfg.

LI YUAN <[log in to unmask]>

Mon, 1 Jun 1998 09:34:27 -0600

32 lines

New Thread

Love

Love

[log in to unmask]

Mon, 22 Jun 1998 15:50:12 +0200

57 lines

Re: Love

Chan, Marcelo <[log in to unmask]>

Mon, 22 Jun 1998 09:56:00 -0400

41 lines

New Thread

Low-melt solder alloys for desoldering

Low-melt solder alloys for desoldering

Tenison Stone <[log in to unmask]>

Wed, 24 Jun 1998 07:15:50 -0500

32 lines

Re: Low-melt solder alloys for desoldering

Mark Harrand <[log in to unmask]>

Wed, 24 Jun 1998 07:41:45 -0600

68 lines

Re: Low-melt solder alloys for desoldering

Peter Swanson <[log in to unmask]>

Thu, 25 Jun 1998 19:19:37 GMT

69 lines

Re: Low-melt solder alloys for desoldering

David D Hillman <[log in to unmask]>

Tue, 30 Jun 1998 08:50:07 -0500

128 lines

New Thread

MacDermid

MacDermid

Jana Carraway <[log in to unmask]>

Mon, 1 Jun 1998 13:56:12 PDT

28 lines

Re: MacDermid

Tom Colton <[log in to unmask]>

Tue, 2 Jun 1998 08:17:38 -0400

62 lines

Re: MacDermid

Leslie O. Connally <[log in to unmask]>

Wed, 3 Jun 1998 08:20:22 -0700

57 lines

New Thread

Machining of polyimide flex material.

Machining of polyimide flex material.

Torben Østeraa <[log in to unmask]>

Sun, 7 Jun 1998 10:14:56 +0000

39 lines

Re: Machining of polyimide flex material.

Hogue, Pat (AZ76) <[log in to unmask]>

Mon, 8 Jun 1998 12:40:48 -0400

81 lines

Re: Machining of polyimide flex material.

[log in to unmask]

Mon, 8 Jun 1998 17:33:22 +0000

75 lines

New Thread

Material Database for Microelectronic Packaging

Material Database for Microelectronic Packaging

by Dr. Eden Chen XianSong <[log in to unmask]>

Tue, 16 Jun 1998 14:47:44 +0800

33 lines

Material Database for Microelectronic Packaging

[log in to unmask]

Tue, 16 Jun 1998 09:20:40 +0200

78 lines

Re: Material Database for Microelectronic Packaging

Glenn Pelkey <[log in to unmask]>

Tue, 16 Jun 1998 17:13:33 PDT

28 lines

Re: Material Database for Microelectronic Packaging

David Whalley <[log in to unmask]>

Wed, 17 Jun 1998 10:49:52 +0100

27 lines

New Thread

materials ?

materials ?

Jae-heun Joung <[log in to unmask]>

Thu, 25 Jun 1998 23:04:29 +0900

33 lines

New Thread

Measling/Crazing

Measling/Crazing

Chafin, Ken G. <[log in to unmask]>

Wed, 24 Jun 1998 16:37:56 -0400

38 lines

Re: Measling/Crazing

Ed Cosper <[log in to unmask]>

Wed, 24 Jun 1998 16:50:59 -0500

77 lines

Re: Measling/Crazing

Ralph Hersey <[log in to unmask]>

Wed, 24 Jun 1998 16:48:31 -0700

108 lines

Re: Measling/Crazing

Collins, Graham <[log in to unmask]>

Thu, 25 Jun 1998 08:42:06 -0300

173 lines

New Thread

Mechanical properties of solder

Mechanical properties of solder

Tamir Ben-Shoshan <[log in to unmask]>

Thu, 4 Jun 1998 08:38:21 +0200

32 lines

New Thread

Metallized teflon film

Re: Metallized teflon film

Ron Desilets <[log in to unmask]>

Wed, 3 Jun 1998 10:37:19 -0700

74 lines

New Thread

Micro BGA Rework

Micro BGA Rework

Zulfakar Mohd Yassin <[log in to unmask]>

Wed, 1 Jul 1998 09:10:00 -0700

31 lines

Re: Micro BGA Rework

Joseph Fjelstad <[log in to unmask]>

Tue, 30 Jun 1998 19:09:26 -0700

57 lines

New Thread

MICROWAVE PCB

MICROWAVE PCB

Jae-heun Joung <[log in to unmask]>

Wed, 1 Jul 1998 10:16:35 +0900

29 lines

New Thread

Mil-Std-2000A Question

Mil-Std-2000A Question

Kenny Bloomquist <[log in to unmask]>

Wed, 24 Jun 1998 15:08:13 -0700

50 lines

Re: Mil-Std-2000A Question

McMonagle, Michael R. <[log in to unmask]>

Wed, 24 Jun 1998 17:09:19 -0500

89 lines

Re: Mil-Std-2000A Question

Kenny Bloomquist <[log in to unmask]>

Wed, 24 Jun 1998 15:29:38 -0700

35 lines

Re: Mil-Std-2000A Question

[log in to unmask]

Wed, 24 Jun 1998 18:39:48 -0600

123 lines

Re: Mil-Std-2000A Question

Graham Naisbitt <[log in to unmask]>

Sat, 27 Jun 1998 23:54:13 +0100

155 lines

New Thread

Moisture Sensitive Devices

Moisture Sensitive Devices

Jeff Guynn <[log in to unmask]>

Mon, 8 Jun 1998 14:02:23 -0500

43 lines

New Thread

Moisture sensitive SMD-ICs

Moisture sensitive SMD-ICs

Haugaard Svend <[log in to unmask]>

Wed, 17 Jun 1998 13:11:26 +0200

48 lines

Re: Moisture sensitive SMD-ICs

Scott Martin <[log in to unmask]>

Wed, 17 Jun 1998 11:09:26 -0600

69 lines

Re: Moisture sensitive SMD-ICs

Jeff Guynn <[log in to unmask]>

Wed, 17 Jun 1998 13:58:42 -0500

33 lines

Re: Moisture sensitive SMD-ICs

Jeff Guynn <[log in to unmask]>

Wed, 17 Jun 1998 13:57:25 -0500

102 lines

Re: Moisture sensitive SMD-ICs

Scott Martin <[log in to unmask]>

Wed, 17 Jun 1998 13:19:26 -0600

53 lines

Re: Moisture sensitive SMD-ICs

Jeff Guynn <[log in to unmask]>

Wed, 17 Jun 1998 14:30:58 -0500

49 lines

New Thread

NASA Approved Liquid Solder Masks

NASA Approved Liquid Solder Masks

Bob Carhart <[log in to unmask]>

Wed, 17 Jun 1998 07:50:44 -0700

29 lines

Re: NASA Approved Liquid Solder Masks

Karl Sweitzer <[log in to unmask]>

Wed, 17 Jun 1998 12:02:30 -0400

55 lines

Re: NASA Approved Liquid Solder Masks

Sherry Warner <[log in to unmask]>

Thu, 18 Jun 1998 12:11:52 -0400

40 lines

New Thread

NASA Approved Liquid Solder Masks -Reply

NASA Approved Liquid Solder Masks -Reply

bob metcalf <[log in to unmask]>

Wed, 17 Jun 1998 16:06:06 -0700

54 lines

New Thread

Need E-mail address

Need E-mail address

Padmanabha Anandapuram Halappa <[log in to unmask]>

Tue, 30 Jun 1998 18:20:28 +0800

30 lines

New Thread

Nickel foil

Re: Nickel foil

SMITH RUSSELL MSM PO US <[log in to unmask]>

Sat, 30 May 1998 04:33:00 +0200

64 lines

Re: Nickel foil

Rupert, Martha L. <[log in to unmask]>

Mon, 1 Jun 1998 11:32:56 -0400

90 lines

New Thread

Nickel over Copper

Re: Nickel over Copper

Steven H Axdal <[log in to unmask]>

Fri, 19 Jun 1998 09:08:14 -0500

57 lines

New Thread

Nitrogen in the wavesolderingproces

Nitrogen in the wavesolderingproces

Jesper Kjærnulf Konge <[log in to unmask]>

Thu, 25 Jun 1998 12:45:16 +0200

96 lines

Nitrogen in the wavesolderingproces

[log in to unmask]

Thu, 25 Jun 1998 09:10:38 EDT

35 lines

Re: Nitrogen in the wavesolderingproces

Ed Holton <[log in to unmask]>

Thu, 25 Jun 1998 10:16:36 -0400

178 lines

Re: Nitrogen in the wavesolderingproces

superflx <[log in to unmask]>

Thu, 25 Jun 1998 15:19:30 -0400

91 lines

Re: Nitrogen in the wavesolderingproces

Shin, Simon <[log in to unmask]>

Thu, 25 Jun 1998 14:04:04 -0600

78 lines

Re: Nitrogen in the wavesolderingproces

Ed Holton <[log in to unmask]>

Fri, 26 Jun 1998 11:28:28 -0400

150 lines

Re: Nitrogen in the wavesolderingproces

Craig Smith <[log in to unmask]>

Mon, 29 Jun 1998 14:16:47 -0400

165 lines

New Thread

Not read: Subscribe

Not read: Subscribe

Mike Wilson <[log in to unmask]>

Mon, 15 Jun 1998 05:05:58 -0700

62 lines

New Thread

Not read: [TN] shadow plating electroless ni au

Not read: [TN] shadow plating electroless ni au

Darrell J. Drake <[log in to unmask]>

Thu, 11 Jun 1998 10:10:22 -0500

22 lines

New Thread

Obsolete FR4 0/0

Obsolete FR4 0/0

JB <[log in to unmask]>

Wed, 3 Jun 1998 18:33:31 +0800

32 lines

New Thread

Obsolete TRACE 924E O/S tester - is it of any use?

Obsolete TRACE 924E O/S tester - is it of any use?

JB <[log in to unmask]>

Fri, 12 Jun 1998 17:51:57 +0800

32 lines

New Thread

oil well drilling pad material specs

oil well drilling pad material specs

Jayne Benson <[log in to unmask]>

Thu, 25 Jun 1998 16:41:14 -0500

28 lines

Re: oil well drilling pad material specs

Hurst, Joe <[log in to unmask]>

Fri, 26 Jun 1998 14:52:20 -0400

57 lines

New Thread

Old pcb milling machines

Old pcb milling machines

Gert Kristensen <[log in to unmask]>

Wed, 10 Jun 1998 22:45:30 +1000

44 lines

New Thread

Outgassing problem in pcb's soldering

Outgassing problem in pcb's soldering

[log in to unmask]

Sat, 13 Jun 1998 12:24:10 +0200

48 lines

Re: Outgassing problem in pcb's soldering

[log in to unmask]

Sat, 13 Jun 1998 08:53:09 EDT

33 lines

Re: Outgassing problem in pcb's soldering

[log in to unmask]

Sat, 13 Jun 1998 09:40:43 EDT

48 lines

Re: Outgassing problem in pcb's soldering

Bev Christian <[log in to unmask]>

Sat, 13 Jun 1998 23:24:01 -0400

100 lines

Re: Outgassing problem in pcb's soldering

Paul Gould <[log in to unmask]>

Sun, 14 Jun 1998 16:29:57 +0100

91 lines

New Thread

Overplated blind via's

Overplated blind via's

[log in to unmask]

Tue, 16 Jun 1998 19:22:30 GMT

38 lines

Re: Overplated blind via's

Joy, Stephen C <[log in to unmask]>

Tue, 16 Jun 1998 12:53:00 -0700

84 lines

Re: Overplated blind via's

by Dr. Eden Chen XianSong <[log in to unmask]>

Wed, 17 Jun 1998 09:00:35 +0800

116 lines

Re: Overplated blind via's

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 17 Jun 1998 09:59:51 +0300

75 lines

Re: Overplated blind via's

George Franck <[log in to unmask]>

Wed, 17 Jun 1998 08:39:36 -0400

106 lines

Re: Overplated blind via's

Andy Slade <[log in to unmask]>

Wed, 17 Jun 1998 12:56:34 -0400

140 lines

Re: Overplated blind via's

Kent Johnson <[log in to unmask]>

Thu, 18 Jun 1998 07:59:39 -0600

76 lines

Re: Overplated blind via's

Sid Tryzbiak <[log in to unmask]>

Mon, 22 Jun 1998 07:00:02 -0400

74 lines

New Thread

Oxided Gold Tips

Oxided Gold Tips

Chris Rucinski <[log in to unmask]>

Wed, 10 Jun 1998 16:22:12 -0700

39 lines

Re: Oxided Gold Tips

<Rudy Sedlak> <[log in to unmask]>

Thu, 11 Jun 1998 03:53:19 EDT

55 lines

Re: Oxided Gold Tips

Lenny Kurup <[log in to unmask]>

Fri, 12 Jun 1998 14:36:41 -0400

68 lines

New Thread

Paradigm by Cimnet Systems

Paradigm by Cimnet Systems

Tom Monico <[log in to unmask]>

Mon, 22 Jun 1998 14:36:29 -0400

73 lines

Re: Paradigm by Cimnet Systems

Frank Jalili <[log in to unmask]>

Sun, 21 Jun 1998 15:22:22 CDT

113 lines

New Thread

Parylene Conformal Coating line requirements.

Parylene Conformal Coating line requirements.

Brent Alcorn <[log in to unmask]>

Fri, 5 Jun 1998 08:48:42 -0300

35 lines

Re: Parylene Conformal Coating line requirements.

Graham Naisbitt <[log in to unmask]>

Wed, 10 Jun 1998 09:50:55 +0100

79 lines

New Thread

PCB Defect Evaluation

PCB Defect Evaluation

Scott M. Severson <[log in to unmask]>

Thu, 11 Jun 1998 16:03:00 -0600

34 lines

New Thread

PCB Etching Process

PCB Etching Process

Edwin V. Maximo <[log in to unmask]>

Mon, 1 Jun 1998 18:12:38 +0000

40 lines

New Thread

PCB finish comparison studies

PCB finish comparison studies

Scott Martin <[log in to unmask]>

Tue, 9 Jun 1998 16:22:33 -0600

27 lines

Re: PCB finish comparison studies

Joel Fillion <[log in to unmask]>

Tue, 9 Jun 1998 17:20:15 -0700

55 lines

Re: PCB finish comparison studies

Parvez M.S. Patel <[log in to unmask]>

Thu, 11 Jun 1998 21:41:19 -0400

60 lines

Re: PCB finish comparison studies

David D Hillman <[log in to unmask]>

Tue, 16 Jun 1998 12:09:38 -0500

72 lines

New Thread

PCB Manufacturer: Yield & cost for Nickel-Gold v/s HASL

PCB Manufacturer: Yield & cost for Nickel-Gold v/s HASL

Ken Patel <[log in to unmask]>

Thu, 11 Jun 1998 16:25:08 -0700

38 lines

Re: PCB Manufacturer: Yield & cost for Nickel-Gold v/s HASL

Paul Klasek <[log in to unmask]>

Fri, 12 Jun 1998 13:43:29 +1000

104 lines

New Thread

PCB Mfg.: Yield & cost for Nickel-Gold Vs HASL

Re: PCB Mfg.: Yield & cost for Nickel-Gold Vs HASL

Ron Hollandsworth <[log in to unmask]>

Fri, 12 Jun 1998 10:08:24 -0500

48 lines

New Thread

PCBAMP

PCBAMP

Tim Cables <[log in to unmask]>

Wed, 10 Jun 1998 10:14:09 -0400

34 lines

Re: PCBAMP

Olson, Jack C <[log in to unmask]>

Fri, 12 Jun 1998 10:32:53 -0700

46 lines

New Thread

PCI Cards

PCI Cards

Colin Weber <[log in to unmask]>

Tue, 30 Jun 1998 14:52:25 +1000

39 lines

Re: PCI Cards

Jerry Cupples <[log in to unmask]>

Tue, 30 Jun 1998 09:15:56 -0500

71 lines

New Thread

PEELABLE REQUIREMENT

PEELABLE REQUIREMENT

L.VINOD <[log in to unmask]>

Wed, 17 Jun 1998 10:06:59 +0500

54 lines

Re: PEELABLE REQUIREMENT

Noppadol S. <[log in to unmask]>

Thu, 18 Jun 1998 07:36:44 +0700

87 lines

New Thread

Peelable Soldermask

Peelable Soldermask

Brad Vanderhoof <[log in to unmask]>

Tue, 16 Jun 1998 09:20:22 PDT

32 lines

New Thread

Pinholes in reflowed SMT

Pinholes in reflowed SMT

Brett Goldstein <[log in to unmask]>

Fri, 26 Jun 1998 09:51:07 +0000

38 lines

Pinholes in reflowed SMT

Jeff Hempton <[log in to unmask]>

Fri, 26 Jun 1998 11:40:30 -0500

77 lines

New Thread

Pink Anti-static Poly Film & PCB's

Pink Anti-static Poly Film & PCB's

Larry Grazian <[log in to unmask]>

Mon, 22 Jun 1998 10:29:37 PDT

65 lines

New Thread

PLAN NOW TO ATTEND

PLAN NOW TO ATTEND

[log in to unmask]

Tue, 30 Jun 1998 11:07:06 PM

67 lines

New Thread

Plasma cycle

Plasma cycle

<Sovereign Circuits Inc.> <[log in to unmask]>

Tue, 9 Jun 1998 12:51:11 EDT

26 lines

New Thread

Plastic parts

Plastic parts

Vaughan, Ralph H <[log in to unmask]>

Fri, 19 Jun 1998 12:54:43 -0700

38 lines

Re: Plastic parts

Jeff Guynn <[log in to unmask]>

Mon, 22 Jun 1998 11:16:43 -0500

69 lines

New Thread

Plating of SMT leads

Plating of SMT leads

Mike Becker <[log in to unmask]>

Sun, 28 Jun 1998 19:41:10 -0700

25 lines

New Thread

Polyimide See Thru Stencils for Printing Solder Paste

Polyimide See Thru Stencils for Printing Solder Paste

Johannes Sivula <[log in to unmask]>

Thu, 25 Jun 1998 10:17:47 +0300

38 lines

Re: Polyimide See Thru Stencils for Printing Solder Paste

John Parsons <[log in to unmask]>

Thu, 25 Jun 1998 08:23:27 +0000

70 lines

New Thread

Polyimide Tapes for HASL, etc...

Polyimide Tapes for HASL, etc...

Bill Davis <[log in to unmask]>

Wed, 17 Jun 1998 07:50:24 -0700

62 lines

New Thread

Poor Solderability on TSOPs

Poor Solderability on TSOPs

McMonagle, Michael R. <[log in to unmask]>

Thu, 25 Jun 1998 16:29:45 -0500

43 lines

Re: Poor Solderability on TSOPs

Scott Martin <[log in to unmask]>

Thu, 25 Jun 1998 15:37:52 -0600

65 lines

Re: Poor Solderability on TSOPs

McMonagle, Michael R. <[log in to unmask]>

Thu, 25 Jun 1998 16:47:42 -0500

95 lines

Re: Poor Solderability on TSOPs

George Milad <[log in to unmask]>

Thu, 25 Jun 1998 18:49:59 EDT

28 lines

New Thread

Pramod Patel/solder joint reliability

Re: Pramod Patel/solder joint reliability

Werner Engelmaier <[log in to unmask]>

Tue, 30 Jun 1998 15:07:26 EDT

127 lines

Re: Pramod Patel/solder joint reliability

Singleton, Vern <[log in to unmask]>

Tue, 30 Jun 1998 15:42:06 -0400

175 lines

New Thread

Punched Non-Supported Holes in FR-4

Punched Non-Supported Holes in FR-4

[log in to unmask]

Wed, 24 Jun 1998 16:28:49 -0700

27 lines

Re: Punched Non-Supported Holes in FR-4

Ralph Hersey <[log in to unmask]>

Wed, 24 Jun 1998 16:51:18 -0700

56 lines

New Thread

PWB Layer Stack-up

PWB Layer Stack-up

Bob Walker <[log in to unmask]>

Thu, 25 Jun 1998 09:25:01 -0400

44 lines

Re: PWB Layer Stack-up

John Parsons <[log in to unmask]>

Thu, 25 Jun 1998 08:15:49 +0000

76 lines

Re: PWB Layer Stack-up

Don Vischulis <[log in to unmask]>

Fri, 26 Jun 1998 10:27:21 -0500

75 lines

New Thread

PWB Procurement Recommendations

PWB Procurement Recommendations

arrigo.tony <[log in to unmask]>

Tue, 30 Jun 1998 09:32:00 -0700

69 lines

Re: PWB Procurement Recommendations

Hitchcock, Darren <[log in to unmask]>

Tue, 30 Jun 1998 10:25:23 -0700

69 lines

Re: PWB Procurement Recommendations

Jay Soderberg <[log in to unmask]>

Tue, 30 Jun 1998 15:45:13 -0600

56 lines

New Thread

Radial Cracks on Cyanide Ester resin

Radial Cracks on Cyanide Ester resin

James A Larson <[log in to unmask]>

Mon, 8 Jun 1998 15:42:01 +0100

31 lines

Re: Radial Cracks on Cyanide Ester resin

George Franck <[log in to unmask]>

Mon, 8 Jun 1998 11:34:14 -0400

72 lines

Re: Radial Cracks on Cyanide Ester resin

Meschter, Stephan J <[log in to unmask]>

Mon, 8 Jun 1998 11:33:22 -0400

74 lines

Re: Radial Cracks on Cyanide Ester resin

[log in to unmask]

Mon, 8 Jun 1998 17:25:21 +0000

61 lines

New Thread

Re2000A

Re2000A

[log in to unmask]

Thu, 25 Jun 1998 09:42:44 EDT

37 lines

New Thread

Read: RE: [TN] shadow plating electroless ni au

Read: RE: [TN] shadow plating electroless ni au

Marc Strickland <[log in to unmask]>

Thu, 11 Jun 1998 06:54:41 -0700

28 lines

New Thread

Reference Designator Problem

Reference Designator Problem

Rich Mallicote <[log in to unmask]>

Fri, 19 Jun 1998 10:22:00 -0400

91 lines

New Thread

Reference designators

Reference designators

Mitch Morey <[log in to unmask]>

Mon, 15 Jun 1998 15:30:19 -0700

37 lines

Re: Reference designators

Mike Holmes x4356 <[log in to unmask]>

Tue, 16 Jun 1998 07:54:48 -0400

72 lines

Re: Reference designators

Yvon Hache <[log in to unmask]>

Tue, 16 Jun 1998 22:29:51 -0700

29 lines

New Thread

Reflow quiz

Reflow quiz

Ian Squires <[log in to unmask]>

Wed, 10 Jun 1998 08:53:09 PDT

66 lines

Re: Reflow quiz

Jeff Guynn <[log in to unmask]>

Wed, 10 Jun 1998 08:20:10 -0500

101 lines

New Thread

Reflow soldering: forced gas vs. infra-red

Reflow soldering: forced gas vs. infra-red

Stefan Pollmeier <[log in to unmask]>

Thu, 4 Jun 1998 21:29:03 +0200

49 lines

Re: Reflow soldering: forced gas vs. infra-red

Hogue, Pat (AZ76) <[log in to unmask]>

Thu, 4 Jun 1998 18:21:37 -0500

70 lines

Re: Reflow soldering: forced gas vs. infra-red

Devlin, Dan <[log in to unmask]>

Fri, 5 Jun 1998 09:40:12 -0400

93 lines

New Thread

Reliability rating

Reliability rating

Phil Bavaro <[log in to unmask]>

Fri, 26 Jun 1998 18:13:04 -0700

98 lines

Re: Reliability rating

Valquirio N. Carvalho <[log in to unmask]>

Sat, 27 Jun 1998 14:26:01 -0400

88 lines

New Thread

Reliability Risk related Electroless Nickel/immersion gold

Reliability Risk related Electroless Nickel/immersion gold

Ken Patel <[log in to unmask]>

Wed, 24 Jun 1998 11:54:11 -0700

38 lines

Re: Reliability Risk related Electroless Nickel/immersion gold

Leslie O. Connally <[log in to unmask]>

Wed, 24 Jun 1998 15:12:18 -0700

68 lines

Re: Reliability Risk related Electroless Nickel/immersion gold

George Milad <[log in to unmask]>

Thu, 25 Jun 1998 18:29:05 EDT

32 lines

New Thread

Resent: IPC Spec 4101 (Epoxy Spots)

Resent: IPC Spec 4101 (Epoxy Spots)

Joel Fillion <[log in to unmask]>

Wed, 10 Jun 1998 09:07:23 -0700

40 lines

New Thread

Review of Mask Cure Chat

Review of Mask Cure Chat

[log in to unmask]

Sat, 6 Jun 1998 02:23:22 EDT

27 lines

New Thread

Rp: Selective Solering Pallets for Wave Solder

Rp: Selective Solering Pallets for Wave Solder

Ron Hollandsworth <[log in to unmask]>

Thu, 4 Jun 1998 09:31:06 -0500

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Re: Rp: Selective Solering Pallets for Wave Solder

Greg Kilinski <[log in to unmask]>

Thu, 4 Jun 1998 07:58:35 -0700

31 lines

Re: Rp: Selective Solering Pallets for Wave Solder

Scott Martin <[log in to unmask]>

Thu, 4 Jun 1998 09:13:01 -0600

64 lines

New Thread

Sbj: Semi Aqueous Cleaner

Sbj: Semi Aqueous Cleaner

Ron Hollandsworth <[log in to unmask]>

Thu, 4 Jun 1998 07:02:05 -0500

48 lines

Re: Sbj: Semi Aqueous Cleaner

Charles Barker <[log in to unmask]>

Thu, 4 Jun 1998 08:28:00 -0500

85 lines

New Thread

searching for a pull test machine !

searching for a pull test machine !

Nicolas van der Heyden <[log in to unmask]>

Thu, 4 Jun 1998 11:58:44 -0400

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Re: searching for a pull test machine !

Sherry Warner <[log in to unmask]>

Thu, 4 Jun 1998 11:49:40 -0400

78 lines

Re: searching for a pull test machine !

sahmad <[log in to unmask]>

Thu, 4 Jun 1998 10:17:43 -0600

66 lines

Re: searching for a pull test machine !

[log in to unmask]

Thu, 4 Jun 1998 11:22:59 -0600

43 lines

Re: searching for a pull test machine !

[log in to unmask]

Thu, 4 Jun 1998 15:17:18 -0400

30 lines

New Thread

see items

see items

Benedicto Cruz <[log in to unmask]>

Mon, 29 Jun 1998 11:05:06 +0000

46 lines

New Thread

see items stated

see items stated

Benedicto Cruz <[log in to unmask]>

Thu, 25 Jun 1998 11:19:18 +0000

49 lines

Re: see items stated

Rupert, Martha L. <[log in to unmask]>

Thu, 25 Jun 1998 10:34:31 -0400

145 lines

Re: see items stated

Eddie Brunker <[log in to unmask]>

Thu, 25 Jun 1998 16:52:35 +0100

107 lines

Re: see items stated

Charles Barker <[log in to unmask]>

Thu, 25 Jun 1998 17:19:12 -0500

87 lines

Re: see items stated

Stephen R. Gregory <[log in to unmask]>

Thu, 25 Jun 1998 19:20:29 EDT

70 lines

New Thread

See items stated (melfs)

Re: See items stated (melfs)

Jeff Hempton <[log in to unmask]>

Fri, 26 Jun 1998 09:08:03 -0500

33 lines

New Thread

Selective Soldering Pallets for Wave Soldering

Selective Soldering Pallets for Wave Soldering

Stammely, Tim <[log in to unmask]>

Mon, 1 Jun 1998 11:18:24 -0400

30 lines

Re: Selective Soldering Pallets for Wave Soldering

Jim Hepburn <[log in to unmask]>

Mon, 1 Jun 1998 13:13:57 -0400

80 lines

Re: Selective Soldering Pallets for Wave Soldering

Alan Kreplick <[log in to unmask]>

Mon, 1 Jun 1998 13:12:59 -0400

38 lines

Re: Selective Soldering Pallets for Wave Soldering

[log in to unmask]

Mon, 1 Jun 1998 12:35:27 -0500

33 lines

Re: Selective Soldering Pallets for Wave Soldering

E.A. Speer <[log in to unmask]>

Thu, 4 Jun 1998 08:42:10 -0400

84 lines

New Thread

shadow plating electroless ni au

shadow plating electroless ni au

Gabriela Bogdan <[log in to unmask]>

Wed, 10 Jun 1998 22:11:36 +0300

44 lines

Re: shadow plating electroless ni au

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 11 Jun 1998 09:32:08 +0300

81 lines

Re: shadow plating electroless ni au

Jim Douglas <[log in to unmask]>

Thu, 11 Jun 1998 08:24:54 +-100

169 lines

Re: shadow plating electroless ni au

Bogdan Gabi <[log in to unmask]>

Thu, 11 Jun 1998 10:38:56 +0200

25 lines

Re: shadow plating electroless ni au

<Rudy Sedlak> <[log in to unmask]>

Thu, 11 Jun 1998 03:52:56 EDT

46 lines

Re: shadow plating electroless ni au

Bogdan Gabi <[log in to unmask]>

Thu, 11 Jun 1998 11:03:49 +0200

25 lines

Re: shadow plating electroless ni au

[log in to unmask]

Thu, 11 Jun 1998 10:54:23 -0700

64 lines

New Thread

Shear IPC values charts per components type

Shear IPC values charts per components type

Paul Klasek <[log in to unmask]>

Wed, 3 Jun 1998 15:34:46 +1000

42 lines

Re: Shear IPC values charts per components type

Werner Engelmaier <[log in to unmask]>

Wed, 3 Jun 1998 22:28:28 EDT

38 lines

New Thread

silicone conformal coatings

silicone conformal coatings

David Paluck <[log in to unmask]>

Thu, 11 Jun 1998 09:58:38 -0500

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Re: silicone conformal coatings

Graham Naisbitt <[log in to unmask]>

Fri, 12 Jun 1998 00:41:51 +0100

92 lines

New Thread

SM Components/Solder Acceptability

SM Components/Solder Acceptability

Hooper Doug <[log in to unmask]>

Tue, 16 Jun 1998 08:56:00 -0500

31 lines

New Thread

SMT Reliability

SMT Reliability

Alan Kreplick <[log in to unmask]>

Mon, 8 Jun 1998 14:29:03 -0400

34 lines

SMT Reliability

Alan Kreplick <[log in to unmask]>

Wed, 17 Jun 1998 07:51:36 -0400

34 lines

Re: SMT Reliability

Cobey Schmidt <[log in to unmask]>

Wed, 17 Jun 1998 10:20:51 -0500

76 lines

Re: SMT Reliability

[log in to unmask]

Thu, 18 Jun 1998 00:42:05 EDT

32 lines

Re: SMT Reliability

Werner Engelmaier <[log in to unmask]>

Thu, 18 Jun 1998 08:42:43 EDT

32 lines

Re: SMT Reliability

Scott M. Severson <[log in to unmask]>

Thu, 18 Jun 1998 08:32:00 -0600

68 lines

Re: SMT Reliability

Werner Engelmaier <[log in to unmask]>

Thu, 18 Jun 1998 14:33:19 EDT

36 lines

New Thread

SMT Tape splicers

SMT Tape splicers

Harold <[log in to unmask]>

Sat, 13 Jun 1998 11:14:10 -0400

64 lines

New Thread

SMTA Rework Symposium

SMTA Rework Symposium

Enza Hill <[log in to unmask]>

Fri, 12 Jun 1998 12:43:30 -0500

52 lines

Re: SMTA Rework Symposium

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 12 Jun 1998 15:34:00 -0400

22 lines

Re: SMTA Rework Symposium

Cobey Schmidt <[log in to unmask]>

Fri, 12 Jun 1998 14:35:57 -0500

54 lines

New Thread

Sn/Bi Solder properties

Sn/Bi Solder properties

Mark Harrand <[log in to unmask]>

Thu, 4 Jun 1998 14:17:43 -0600

35 lines

New Thread

Solder Fatigue in Space Electronics

Solder Fatigue in Space Electronics

Karl Sweitzer <[log in to unmask]>

Mon, 22 Jun 1998 10:26:18 -0400

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Re: Solder Fatigue in Space Electronics

Kenny Bloomquist <[log in to unmask]>

Mon, 22 Jun 1998 07:49:33 -0700

44 lines

Re: Solder Fatigue in Space Electronics

Werner Engelmaier <[log in to unmask]>

Tue, 23 Jun 1998 11:51:07 EDT

39 lines

New Thread

Solder Mask

Solder Mask

[log in to unmask]

Sun, 7 Jun 1998 10:22:55 EDT

27 lines

New Thread

Solder mask between fine pitch

Re: Solder mask between fine pitch

Lainie Loveless <[log in to unmask]>

Wed, 24 Jun 1998 11:45:04 -0400

48 lines

New Thread

Solder mask between fine pitch pads

Solder mask between fine pitch pads

Gabriela Bogdan <[log in to unmask]>

Wed, 24 Jun 1998 18:09:23 +0300

30 lines

Re: Solder mask between fine pitch pads

Edward J. Valentine <[log in to unmask]>

Wed, 24 Jun 1998 13:07:31 -0700

61 lines

Re: Solder mask between fine pitch pads

John Haman Jr. <[log in to unmask]>

Wed, 24 Jun 1998 13:29:47 -0400

65 lines

Re: Solder mask between fine pitch pads

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 25 Jun 1998 12:08:07 +0300

61 lines

New Thread

solder mask between pads part2

solder mask between pads part2

Gabriela Bogdan <[log in to unmask]>

Thu, 25 Jun 1998 08:06:20 +0300

39 lines

New Thread

Solder mask profile information

Solder mask profile information

Joy, Stephen C <[log in to unmask]>

Tue, 16 Jun 1998 09:33:00 -0700

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Re: Solder mask profile information

David D Hillman <[log in to unmask]>

Tue, 16 Jun 1998 12:06:34 -0500

83 lines

Re: Solder mask profile information

Coleman, Rob <[log in to unmask]>

Tue, 16 Jun 1998 12:26:57 -0500

68 lines

Re: Solder mask profile information

David Gonnerman <[log in to unmask]>

Tue, 16 Jun 1998 13:56:35 -0500

123 lines

Re: Solder mask profile information

sahmad <[log in to unmask]>

Tue, 16 Jun 1998 13:40:20 -0600

64 lines

Re: Solder mask profile information

DAVID D RUND <[log in to unmask]>

Tue, 16 Jun 1998 13:01:19 -0700

95 lines

New Thread

solder preform arrays

solder preform arrays

zanolli <[log in to unmask]>

Tue, 9 Jun 1998 06:20:43 -0700

23 lines

Re: solder preform arrays

Stephen R. Gregory <[log in to unmask]>

Tue, 9 Jun 1998 18:24:06 EDT

38 lines

New Thread

Solder problem

Solder problem

Ricky Javier <[log in to unmask]>

Wed, 3 Jun 1998 15:23:14 +0000

40 lines

Re: Solder problem

Werner Engelmaier <[log in to unmask]>

Wed, 3 Jun 1998 22:28:30 EDT

33 lines

Re: Solder problem

Noppadol S. <[log in to unmask]>

Sat, 27 Jun 1998 08:47:04 +0700

94 lines

New Thread

Solder Removal Methods

Solder Removal Methods

[log in to unmask]

Fri, 5 Jun 1998 11:33:27 -0600

60 lines

Re: Solder Removal Methods

Jack Crawford <[log in to unmask]>

Fri, 5 Jun 1998 16:17:57 -0500

123 lines

Re: Solder Removal Methods

Don Vischulis <[log in to unmask]>

Sat, 6 Jun 1998 07:31:58 -0500

51 lines

Re: Solder Removal Methods

Aric parr <[log in to unmask]>

Mon, 8 Jun 1998 08:49:02 EDT

89 lines

Re: Solder Removal Methods

[log in to unmask]

Tue, 9 Jun 1998 07:25:10 -0600

44 lines

New Thread

Solder Sample Testing?

Solder Sample Testing?

Chris_Smith <[log in to unmask]>

Mon, 1 Jun 1998 07:46:02 -0500

45 lines

Re: Solder Sample Testing?

<Jason M. Smith> <[log in to unmask]>

Mon, 1 Jun 1998 11:35:27 -0400

86 lines

Re: Solder Sample Testing?

Ascot <[log in to unmask]>

Mon, 1 Jun 1998 12:11:00 +0000

31 lines

Re: Solder Sample Testing?

Ed Cosper <[log in to unmask]>

Mon, 1 Jun 1998 12:27:20 -0500

115 lines

Re: Solder Sample Testing?

Stephen R. Gregory <[log in to unmask]>

Mon, 1 Jun 1998 13:42:35 EDT

111 lines

Re: Solder Sample Testing?

[log in to unmask]

Mon, 1 Jun 1998 12:49:47 -0500

42 lines

Re: Solder Sample Testing?

Bill Davis <[log in to unmask]>

Mon, 1 Jun 1998 10:55:43 -0700

135 lines

Re: Solder Sample Testing?

Kane, Joseph <[log in to unmask]>

Mon, 1 Jun 1998 17:43:50 -0400

86 lines

New Thread

Solder smear

Solder smear

Matthew Sanders <[log in to unmask]>

Sat, 6 Jun 1998 15:31:16 -0700

33 lines

Re: Solder smear

Andy Cameron <[log in to unmask]>

Sun, 7 Jun 1998 14:15:37 EDT

30 lines

New Thread

Solderability of bare boards

Solderability of bare boards

Blanchet, Richard <[log in to unmask]>

Tue, 9 Jun 1998 08:07:21 -0400

35 lines

New Thread

solderability of Hasl'd boards

solderability of Hasl'd boards

<Jason M. Smith> <[log in to unmask]>

Fri, 5 Jun 1998 11:49:50 -0400

35 lines

Re: solderability of Hasl'd boards

Werner Engelmaier <[log in to unmask]>

Fri, 5 Jun 1998 17:39:41 EDT

35 lines

New Thread

solderability problem

solderability problem

Aura Esporalas <[log in to unmask]>

Sat, 6 Jun 1998 08:59:26 +0000

34 lines

Re: solderability problem

<Jason M. Smith> <[log in to unmask]>

Fri, 5 Jun 1998 21:37:54 -0400

71 lines

Re: solderability problem

Stephen R. Gregory <[log in to unmask]>

Fri, 5 Jun 1998 21:42:44 EDT

82 lines

Re: solderability problem

William Spalton <[log in to unmask]>

Sun, 7 Jun 1998 20:31:04 -0400

35 lines

New Thread

SOLDERBALLS on bareboards

SOLDERBALLS on bareboards

Erat, Wolfgang <[log in to unmask]>

Fri, 5 Jun 1998 09:56:29 -0400

32 lines

Re: SOLDERBALLS on bareboards

Cobey Schmidt <[log in to unmask]>

Fri, 5 Jun 1998 09:06:55 -0500

76 lines

Re: SOLDERBALLS on bareboards

Stephen R. Gregory <[log in to unmask]>

Fri, 5 Jun 1998 10:46:15 EDT

39 lines

Re: SOLDERBALLS on bareboards

Jeff Seeger <[log in to unmask]>

Fri, 5 Jun 1998 13:56:00 -0400

42 lines

Re: SOLDERBALLS on bareboards

Stammely, Tim <[log in to unmask]>

Fri, 5 Jun 1998 14:12:05 -0400

66 lines

Re: SOLDERBALLS on bareboards

[log in to unmask]

Fri, 5 Jun 1998 19:50:56 EDT

34 lines

Re: SOLDERBALLS on bareboards

[log in to unmask]

Fri, 5 Jun 1998 19:58:56 EDT

35 lines

Re: SOLDERBALLS on bareboards

ryan <[log in to unmask]>

Sun, 7 Jun 1998 13:13:23 -0400

36 lines

New Thread

Soldering to Gold Plated Components

Soldering to Gold Plated Components

Bruce Robertson <[log in to unmask]>

Fri, 5 Jun 1998 10:43:25 +1200

42 lines

Re: Soldering to Gold Plated Components

Hogue, Pat (AZ76) <[log in to unmask]>

Thu, 4 Jun 1998 18:18:31 -0500

70 lines

Re: Soldering to Gold Plated Components

Werner Engelmaier <[log in to unmask]>

Thu, 4 Jun 1998 23:17:38 EDT

37 lines

Re: Soldering to Gold Plated Components

Cash, Alan <[log in to unmask]>

Fri, 5 Jun 1998 09:35:39 -0400

80 lines

Re: Soldering to Gold Plated Components

Devlin, Dan <[log in to unmask]>

Fri, 5 Jun 1998 10:25:21 -0400

89 lines

New Thread

Soldermask flaking in immersion gold process

Soldermask flaking in immersion gold process

Keith Baverstock <[log in to unmask]>

Thu, 25 Jun 1998 10:54:31 +0100

27 lines

Re: Soldermask flaking in immersion gold process

Coleman, Rob <[log in to unmask]>

Thu, 25 Jun 1998 07:33:14 -0500

51 lines

New Thread

Soldermask flaking in immersion gold process -Reply

Soldermask flaking in immersion gold process -Reply

bob metcalf <[log in to unmask]>

Fri, 26 Jun 1998 09:32:43 -0700

53 lines

New Thread

Soldermask flaking in immersion gold process -Reply -Reply

Soldermask flaking in immersion gold process -Reply -Reply

Fred Axon <[log in to unmask]>

Fri, 26 Jun 1998 02:19:02 -0700

44 lines

New Thread

Soldermask/Pads

Soldermask/Pads

Kuczynski Michael <[log in to unmask]>

Wed, 24 Jun 1998 11:20:19 -0400

33 lines

New Thread

some ideas pl...

some ideas pl...

Parvez M.S. Patel <[log in to unmask]>

Thu, 11 Jun 1998 21:39:36 -0400

45 lines

New Thread

SOURCE FOR BACKUP

SOURCE FOR BACKUP

L.VINOD <[log in to unmask]>

Tue, 23 Jun 1998 14:33:59 +0500

56 lines

New Thread

SPC software

SPC software

Cecilia Rohrt <[log in to unmask]>

Wed, 24 Jun 1998 16:10:04 +0100

35 lines

Re: SPC software

Kenny Bloomquist <[log in to unmask]>

Wed, 24 Jun 1998 07:31:19 -0700

37 lines

Re: SPC software

[log in to unmask]

Wed, 24 Jun 1998 17:57:34 EDT

32 lines

New Thread

spray fluxing

spray fluxing

Evan D Jones <[log in to unmask]>

Wed, 1 Jul 1998 14:49:33 +1000

45 lines

New Thread

Standard for P/N & BOM formats?

Standard for P/N & BOM formats?

Arellano, Albert D <[log in to unmask]>

Wed, 3 Jun 1998 17:35:18 -0500

25 lines

Re: Standard for P/N & BOM formats?

Gary Ferrari <[log in to unmask]>

Thu, 4 Jun 1998 08:18:17 -0500

60 lines

New Thread

stop TechNet email

stop TechNet email

[log in to unmask]

Wed, 17 Jun 1998 12:32:35 -0700

24 lines

Re: stop TechNet email

Hugo Scaramuzza <[log in to unmask]>

Wed, 17 Jun 1998 09:30:56 -0500

41 lines

New Thread

stop TECHNET!

stop TECHNET!

[log in to unmask]

Wed, 3 Jun 1998 08:58:56 -0700

27 lines

Re: stop TECHNET!

[log in to unmask]

Wed, 17 Jun 1998 12:20:33 -0700

32 lines

New Thread

subscirbe

subscirbe

Jim Campo <[log in to unmask]>

Sat, 20 Jun 1998 15:11:05 -0400

27 lines

New Thread

subscribe

subscribe

jeremy <[log in to unmask]>

Tue, 30 Jun 1998 10:19:13 -0700

22 lines

New Thread

Subscribe TechNet Jim Herard

Subscribe TechNet Jim Herard

Jim Herard <[log in to unmask]>

Thu, 11 Jun 1998 12:12:04 -0400

25 lines

New Thread

Subscribing

Subscribing

Doug McGrigor <[log in to unmask]>

Tue, 23 Jun 1998 15:09:13 -0400

23 lines

New Thread

Sv: [TN] Electroless Nickel/gold again

Sv: [TN] Electroless Nickel/gold again

Jacob Ransborg <[log in to unmask]>

Wed, 17 Jun 1998 01:09:54 +0200

62 lines

New Thread

switch from chromic-based etchants

switch from chromic-based etchants

Holly Evans <[log in to unmask]>

Mon, 22 Jun 1998 14:10:34 -0400

63 lines

Re: switch from chromic-based etchants

[log in to unmask]

Tue, 23 Jun 1998 12:57:10 PST

100 lines

New Thread

T/H Open due to air entrapment

T/H Open due to air entrapment

jenny <[log in to unmask]>

Tue, 9 Jun 1998 10:06:31 +0800

31 lines

New Thread

tantalum caps

tantalum caps

TOSTEVIN_BC <[log in to unmask]>

Thu, 25 Jun 1998 15:31:01 -0400

43 lines

Re: tantalum caps

Cobey Schmidt <[log in to unmask]>

Thu, 25 Jun 1998 14:44:12 -0500

108 lines

Re: tantalum caps

Douglas Mckean <[log in to unmask]>

Thu, 25 Jun 1998 17:22:36 -0700

34 lines

New Thread

Tape residue elimination

Tape residue elimination

Duane Briggs <[log in to unmask]>

Mon, 1 Jun 1998 14:29:22 -0400

27 lines