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March 1998


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Table of Contents:

!00% Electrical Test (3 messages)
...copper foil thickness... (2 messages)
1600 Volt Electrical Test (4 messages)
4 March 98 Meeting, Tech Soci NepconWest (Anaheim, Calif) (1 message)
55100 vs 31032 vs 6012 (2 messages)
: Cleaning boards with conformal coat (2 messages)
: FAB: Flash Gold (3 messages)
??????TQFP FOOT PRINT SAME AS PQFP??????? (3 messages)
Address of SSThal (2 messages)
Admin Comment: [TN] MATERIAL FOR SALE (1 message)
ALERT: Document in "" was suspended; (1 message)
Alpha 564 replacement (3 messages)
Alphalevel as replacement for electroplated Ni/Au (3 messages)
AlphaLevel as replacement for Electroplated Nickel Gold (4 messages)
ANSI/IPC-A-610 Revision B - Section 4.1 (3 messages)
Apology to all (1 message)
ass'y (2 messages)
Assembly - Component Mounting (2 messages)
Assembly - Solder reflow (2 messages)
Assembly/Solderability (1 message)
ASSY: Intermittent Short (5 messages)
ASSY: IPC Benchmark Study (2 messages)
ASSY: Level III Testing (1 message)
ASSY: PARTS SOLDERABILITY (5 messages)
ASSY:Preventive Maintenance Cleaning of PWB Assemblies (3 messages)
ASSY:PVA equipment (2 messages)
ASSY:PVA equipment -Reply (2 messages)
ATTN: BUY stamp mark inks (1 message)
Automatic Spray Fluxers (2 messages)
bare board test witness marks (2 messages)
Bare board testing nd it's impact on assembly (6 messages)
bare board witness marks (1 message)
BGA package dimensions (2 messages)
BGA Re-balling (1 message)
BGA SIR Patterns (5 messages)
Bonded heatsinks (2 messages)
Capacitance Formulas in IPC 317 (1 message)
carbon film screening (2 messages)
CARBON INK (2 messages)
Carbon Ink Vs. Gold Finish (5 messages)
carbon ink/film (1 message)
Causes & Corrective Actions for Solder Balls (5 messages)
Chip Resistor Value (1 message)
Chip resistors (3 messages)
Chip-Scale Process and Assembly (1 message)
circuit board trace repair (5 messages)
clarification of wording (2 messages)
Completly Clean (3 messages)
Completly Clean - Handbook Info (1 message)
Component Land Design (2 messages)
Component Land Design - Charles (1 message)
Conductor width (2 messages)
Confirmation of Receipt (1 message)
Conformal Coating Dewetting (4 messages)
Conformal Coating equipment (1 message)
Contact resistance (7 messages)
copper etching (7 messages)
copper etching -Reply (4 messages)
Copper foil thickness (3 messages)
Copper Foil Weight (1 message)
Copper sulfate crystals (8 messages)
Copper sulfate crystals -Reply (1 message)
Corrosion after electroless tin finish (1 message)
corrosivity HASL v GOLD (1 message)
Data Conversion, <*.tif> to photoplotter (3 messages)
Deburring machine (1 message)
Delamination (3 messages)
Delco (1 message)
DES: Fusing limits of tracks (1 message)
DI water (2 messages)
dielectric constant (6 messages)
Direct plating vs Electroless copper (1 message)
Double Reflow: Component Weight vs. Pad Contact Area Rat io (2 messages)
Double Reflow: Component Weight vs. Pad Contact Area Ratio (2 messages)
Drill Drawing (4 messages)
Drill format question (5 messages)
Dross Reduction (1 message)
DTP Measurements source (1 message)
Durability of Circuit Boards (1 message)
early SMT (1 message)
electrodialytic processes (1 message)
Electroless basket MFG. (2 messages)
Electroless Copper wastetreatment (3 messages)
Electroless Nickel / gold (4 messages)
electroless nickel vs electrolytic nickel (1 message)
Electroless nickel vs. electrolytic nickel (1 message)
Electronic Devices - Age Limits (3 messages)
Electroplated Tin Finish (2 messages)
ElectroStatics revamps website related to Static Electricty in printed circuit board manufacturing and other electronics markets. (was Re: [TN] Re Air Ion Level Measurement) (1 message)
eless Pd (2 messages)
ENTEK 106A OSP Remaining (1 message)
Environmental tests for press-fit components (1 message)
Ergonomic Inspection Equipment/Scopes (1 message)
Ergonomic issues in Final I (1 message)
Ergonomic issues in Final Inspection (10 messages)
ESD (10 messages)
European Help! (8 messages)
Exposure Frames (2 messages)
Exposure Units (1 message)
Exposure units ? (4 messages)
FAB - Barrel Cracking (2 messages)
FAB - Heat-sink (1 message)
FAB/DES: Electronic data interchange (EDI) (8 messages)
fab/design EDI (1 message)
FAB: Electroless Nickel/Immersion Gold for rotary contac ts (1 message)
FAB: Electroless Nickel/Immersion Gold for rotary contacts (2 messages)
FAB: French PCB Specifications (1 message)
FAB: Hydraulic press "how to" reference material (3 messages)
FAB: Hydraulic press "how to" reference material -Reply (1 message)
FAB: IPC-4101 vs Mil-S-13949 (2 messages)
FAB: laboratory electroless nickel (4 messages)
FAB: laboratory electroless nickel -Reply (1 message)
FAb: Solderlevel (2 messages)
FAb: Solderlevel -Reply (5 messages)
FAB:Special Process (1 message)
FAR Chrystal catellation termination Solder Joint Criteri (1 message)
footprint (2 messages)
FR4 Relative Permittivity (3 messages)
FR4 vs Polyimide (3 messages)
Free European Solder Finish Seminar (1 message)
Fuji SMT Equip. (1 message)
FW: [CN] Specs for conductor spacing per volt to satisfy FactoryMutual? (1 message)
FW: [TN] BGA package dimensions (1 message)
FW: [TN] FAB/DES: Electronic data interchange (EDI) (3 messages)
FW: [TN] mil-c-28809 equivalent (1 message)
FW: [TN] Read: clarification of wording (1 message)
FW: [TN] Wafter Diceing Water Req. (1 message)
Fwd: [CN] Specs for conductor spacing per volt to satisfy FactoryMutual? (1 message)
Gas Tight Testing (1 message)
GDS Translator (6 messages)
Gen #2: 1997 IPC Roadmap (1 message)
Gen: 1997 IPC Roadmap (1 message)
Gen: dpmo (2 messages)
Gen: SMTA/IMAPS EXPO '98 Dallas (1 message)
Gen: Solder ppm (1 message)
Gen: Use of SMT devices (7 messages)
Gen: Use of SMT devices -Reply (1 message)
Gerber Question - Thanks (1 message)
GLASS ARTWORK (5 messages)
Gold -Finger Bevel Issue (2 messages)
Gold Flash vs Gold Plate on PCB connector Fingers (5 messages)
Gold Porosity (5 messages)
Goldfingers (1 message)
Grainy copper deposit. (3 messages)
Grainy copper deposit. -Reply (2 messages)
Greater Boston IPCDC Chapter meeting 25-Mar 6pm (1 message)
Haloing Measurement (2 messages)
HANDBOOK OF PRINTED CIRCUIT (3 messages)
HASL thickness Specification (2 messages)
HASL Thickness Specs. (1 message)
Heavy metals (4 messages)
Hole Pattern Accuracy (1 message)
holes in aluminium (1 message)
hot air knife (1 message)
How to reduce Kirkendall void? (3 messages)
Immersion Gold (3 messages)
Immersion Gold -Reply (1 message)
Immersion Gold -Reply - Reliabillity Test [joints] (1 message)
Immersion gold on flexible circuits (3 messages)
IMMERSION NICKEL GOLD SPECS (1 message)
IMPEDANCE vs DK/Er vs Frequency (5 messages)
Incircuit testing low residue cca's (2 messages)
Information about laminate type (3 messages)
Ink marking & Copper thickness device (1 message)
Innerlayers cleaning (3 messages)
Innerlayers cleaning-reply (1 message)
Internet Message (1 message)
Interpretation help on SEM analysis done on PCBA (3 messages)
IPC Benchmark Studies (1 message)
IPC chat session (1 message)
IPC standard (3 messages)
IPC-A-610 Questions? (4 messages)
IPC-A-610B (1 message)
IPC-D-275 Coupon A (2 messages)
IPC-D-356 testing (2 messages)
IPCchat session announcement (2 messages)
J-001B Question Response. (1 message)
J-STD-001B Question (2 messages)
Justification For Environmental Controls (3 messages)
Kester OSP (4 messages)
l. (was Re: [TN] Innerlayers cleaning) (1 message)
Land Pattern and Component Modeling (7 messages)
Land Patterns, Geometries for Mentor Graphics (1 message)
Laser Solder Ball bumping (2 messages)
Lawrence R Blumberg/Endicott/IBM is out of the office. (1 message)
LCCC on FR4 (5 messages)
lead coplanarity (2 messages)
leadframe materials (5 messages)
Learning Curves (1 message)
Looking for Excimer Laser (2 messages)
Manufacturability Data for CBGA vs PBCA (2 messages)
MATERIAL FOR SALE !!!!GREAT PRICES!!!!!!! (1 message)
MATERIAL SOURCE: gold/tin wire solder (1 message)
MATERIAL SOURCE: gold/tin wire solder -Reply (1 message)
Mating Tin / Gold; SIMMs and sockets (1 message)
Message Content Question (10 messages)
Message Content Question -Reply (1 message)
Microsection etching solution (4 messages)
Microsection etching solution -Reply (4 messages)
MIL VS IPC CROSS REF (4 messages)
mil-c-28809 equivalent (3 messages)
MIL-PRF-31032 (1 message)
MIL-STD-171 (2 messages)
Mixed assemblies and the 'weak knee' associated with HASL (1 message)
More electroless nickel / gold (2 messages)
Mound Flexible Circuits Closes 3/13/98 (1 message)
Multiple Passes Through The Reflow Oven (2 messages)
NF C20-631 (1 message)
nitrogen requirements: component storage (1 message)
No Attachments on the TECHNET, Please (2 messages)
NON-THERMALLY RELEIVED VIAS (2 messages)
oblong lands (3 messages)
Obsolete FR2 1.60mm 35/35 panels (1 message)
Odd Number Layup-warpage (4 messages)
oops (2 messages)
Organic residue in Microetch bath (3 messages)
OSP COATED BOARDS (4 messages)
Pad Size (1 message)
PAGINA WEB (3 messages)
Palladium (4 messages)
palladium joints (1 message)
Palladium Leads (1 message)
Palladium plated (1 message)
Palladium Plating... (1 message)
Panel Thickness & Copper Weight device (2 messages)
Panelisation software (2 messages)
Parts Solderability (2) (5 messages)
patterning non-photoimageables (1 message)
PCB assy defect reporting criteria (7 messages)
PCB assy defect reporting criteria -Reply (1 message)
pcb fab info (4 messages)
Pd plated boards (1 message)
Peel force problems (3 messages)
Photoplotting (1 message)
Piccoli (1 message)
Plated through hole reliability (1 message)
Plating ? (1 message)
Plating Effects on Current Distribution (2 messages)
PLATING FIBER (3 messages)
Plating thin, less than .005", via layers (3 messages)
Plating: Shadow Defect (3 messages)
Plisters in Multilayer (2 messages)
Plotting problems (2 messages)
polyimide film (2 messages)
Post Conformal Coat Soldering (3 messages)
Press fit tooling house for PCB assembly tools (2 messages)
press-fit connectors (6 messages)
PTH Positional Hole Tolerance (6 messages)
PTH Positional Hole Tolerance -Reply (1 message)
Pull Strengths (1 message)
Punching molds (4 messages)
PVA equipment -Reply (1 message)
Quality Parameters for Wave Sold (4 messages)
Quality Parameters for Wave Sold -Reply (1 message)
Re : Request for Subscriber (1 message)
Re TraceRepair (1 message)
Re28809 (1 message)
Read: clarification of wording (1 message)
Reliability of Ceramic vs. Plastic IC Packages (2 messages)
Repair: Maximum allowable pad and jumper wires fro repair ? (2 messages)
REQ: HOLE LOCATION TOLERANCE (1 message)
Request for info on Crimping standards or workmanship guidelines (2 messages)
Response to Sam Mccorkels' question. (1 message)
Returned mail: User unknown (1 message)
revision (1 message)
Reward! (2 messages)
Re[2]: [TN] Parts Solderability (2) (5 messages)
Rinsing blind/small vias (3 messages)
Roku-Roku Sangyo (1 message)
sales in the east and south of USA (1 message)
Secondary reflow during wave (7 messages)
SIGNOFF Technet (1 message)
Silicone oil environments (2 messages)
Silver Plating (1 message)
Simple Solder Mask Question (7 messages)
Solder splash problem. (2 messages)
Solder surface tension measurements. (1 message)
Solder thief (3 messages)
Solderballs for FBGA (1 message)
soldermask cure (5 messages)
Soldermask Lamination (1 message)
Specs for Wire Crimping (2 messages)
standard (2 messages)
Stencil homogeneity (2 messages)
Subj: Solid Solder Deposit Technology (2 messages)
Subscribe< > (1 message)
Surface Mount Equipment (2 messages)
TAB Technology (1 message)
TAHNKS (2 messages)
Temp/freq dependancy upon diel const & diss fact (2 messages)
tenting via's (1 message)
tenting vias (3 messages)
Test Equipment Compatability (2 messages)
Test, please ignore (1 message)
The National Legal Video Association-survey (2 messages)
Thermal Clad Laminate (1 message)
Thermal plane "drill/fill/drill" vendor (1 message)
Thermal Vias (6 messages)
Thick Au + Solder Ball -> What happens? (1 message)
TI 32 MM Tape (2 messages)
Tin-Lead Plating Composition on Device Leads (2 messages)
Tin/Lead peeling off (4 messages)
TN:(ASSY) Palladium Plating... (1 message)
Torque Specs (3 messages)
TRAINING (1 message)
UNSUBSCRIBE (1 message)
URGENT!!!!!! Residues after Reflow (3 messages)
Vias filled with solder for ICT testing (4 messages)
VIAS IN SMT PADS (1 message)
Wafter Diceing Water Req. (3 messages)
Wave Solder Optimizer Contact (1 message)
Wavesoldering Pallets (2 messages)
What is FR404? (3 messages)
What is FR404? Reply (1 message)
What is the current price for......? (1 message)
Why Exposed Die Paddle Degrade the Thermal Performance? (1 message)
wrist straps (2 messages)
[ASSY} Prebake -Reply (1 message)
[DC] dielectric constant (1 message)
[DC] Need suggestions (7 messages)
[TN] ...copper foil thickness... (1 message)
[TN] HANDBOOK OF PRINTED CIRCUIT (1 message)
[TN] Parts Solderability (2) (1 message)
[TN] PTH Positional Hole Tolerance (1 message)
[TN] Simple Solder Mask Question (1 message)
[TN] tenting via's (1 message)
[TN] [DC] Need suggestions (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

!00% Electrical Test

!00% Electrical Test

Hill, Mike E. <[log in to unmask]>

Fri, 13 Mar 1998 17:19:19 -0500

33 lines

Re: !00% Electrical Test

Hamilton, Richard -4454 <[log in to unmask]>

Mon, 16 Mar 1998 10:03:36 -0700

56 lines

Re: !00% Electrical Test

Ralph Hersey <[log in to unmask]>

Mon, 16 Mar 1998 10:51:07 -0800

92 lines

New Thread

...copper foil thickness...

...copper foil thickness...

JB <[log in to unmask]>

Thu, 26 Mar 1998 22:08:50 +0800

73 lines

Re: ...copper foil thickness...

APeder01 <[log in to unmask]>

Thu, 26 Mar 1998 10:06:09 -0500

175 lines

New Thread

1600 Volt Electrical Test

1600 Volt Electrical Test

Jim McNeal <[log in to unmask]>

Tue, 3 Mar 1998 09:17:30 -0600

38 lines

Re: 1600 Volt Electrical Test

HGross1029 <[log in to unmask]>

Tue, 3 Mar 1998 10:40:12 EST

25 lines

Re: 1600 Volt Electrical Test

Jim McNeal <[log in to unmask]>

Tue, 3 Mar 1998 10:02:37 -0600

52 lines

Re: 1600 Volt Electrical Test

Dudi Banitt <[log in to unmask]>

Wed, 4 Mar 1998 17:45:29 +0200

44 lines

New Thread

4 March 98 Meeting, Tech Soci NepconWest (Anaheim, Calif)

4 March 98 Meeting, Tech Soci NepconWest (Anaheim, Calif)

Bill Gaines B160 x2199 <[log in to unmask]>

Mon, 2 Mar 1998 10:53:07 -0800

45 lines

New Thread

55100 vs 31032 vs 6012

55100 vs 31032 vs 6012

Vanech, Bob <[log in to unmask]>

Sat, 21 Mar 1998 11:13:00 PST

50 lines

Re: 55100 vs 31032 vs 6012

Robisan1 <[log in to unmask]>

Sat, 21 Mar 1998 13:24:40 EST

45 lines

New Thread

: Cleaning boards with conformal coat

: Cleaning boards with conformal coat

Kasprzak, Bill (esd) US <[log in to unmask]>

Tue, 10 Mar 1998 08:31:00 PST

41 lines

Re: : Cleaning boards with conformal coat

Aric Parr <[log in to unmask]>

Tue, 10 Mar 1998 08:51:14 EST

71 lines

New Thread

: FAB: Flash Gold

Re: : FAB: Flash Gold

Poh Kong Hui <[log in to unmask]>

Mon, 23 Mar 1998 22:45:24 +0800

31 lines

Re: : FAB: Flash Gold

Yuen, Mike <[log in to unmask]>

Mon, 23 Mar 1998 09:13:00 CST

54 lines

Re: : FAB: Flash Gold

[log in to unmask]

Mon, 23 Mar 1998 09:13:19 -0800

79 lines

New Thread

??????TQFP FOOT PRINT SAME AS PQFP???????

??????TQFP FOOT PRINT SAME AS PQFP???????

Tom Paiva <[log in to unmask]>

Fri, 27 Mar 1998 09:38:07 -0000

29 lines

Re: ??????TQFP FOOT PRINT SAME AS PQFP???????

Eddie Brunker <[log in to unmask]>

Fri, 27 Mar 1998 15:21:52 GMT

57 lines

Re: ??????TQFP FOOT PRINT SAME AS PQFP???????

Brant R. McClelland <[log in to unmask]>

Fri, 27 Mar 1998 13:51:10 -0600

62 lines

New Thread

Address of SSThal

Address of SSThal

BPL-PCB, Doddaballapur <[log in to unmask]>

Tue, 31 Mar 1998 13:09:59 +0500

32 lines

Re: Address of SSThal

Fritz Steiner <[log in to unmask]>

Tue, 31 Mar 1998 12:39:22 +0200

71 lines

New Thread

Admin Comment: [TN] MATERIAL FOR SALE

Admin Comment: [TN] MATERIAL FOR SALE

Jack Crawford <[log in to unmask]>

Mon, 30 Mar 1998 14:19:16 -0600

64 lines

New Thread

ALERT: Document in "" was suspended;

ALERT: Document in "" was suspended;

[log in to unmask]

Fri, 27 Mar 1998 16:42:05 -0500

43 lines

New Thread

Alpha 564 replacement

Alpha 564 replacement

James Terveen <[log in to unmask]>

Mon, 30 Mar 1998 07:56:00 -0800

41 lines

Re: Alpha 564 replacement

Bev Christian <[log in to unmask]>

Mon, 30 Mar 1998 14:06:33 -0500

75 lines

Re: Alpha 564 replacement

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 31 Mar 1998 07:46:00 -0400

30 lines

New Thread

Alphalevel as replacement for electroplated Ni/Au

Re: Alphalevel as replacement for electroplated Ni/Au

SBarmash <[log in to unmask]>

Wed, 25 Mar 1998 19:45:43 EST

36 lines

Re: Alphalevel as replacement for electroplated Ni/Au

Eddie Brunker <[log in to unmask]>

Thu, 26 Mar 1998 14:46:09 GMT

58 lines

Re: Alphalevel as replacement for electroplated Ni/Au

HIHAT44 <[log in to unmask]>

Thu, 26 Mar 1998 10:44:18 EST

31 lines

New Thread

AlphaLevel as replacement for Electroplated Nickel Gold

AlphaLevel as replacement for Electroplated Nickel Gold

Rob Emery <[log in to unmask]>

Tue, 24 Mar 1998 15:16:32 -0000

80 lines

Re: AlphaLevel as replacement for Electroplated Nickel Gold

Kathy Palumbo <[log in to unmask]>

Tue, 24 Mar 1998 09:43:54 -0800

76 lines

Re: AlphaLevel as replacement for Electroplated Nickel Gold

Paul Klasek <[log in to unmask]>

Wed, 25 Mar 1998 09:17:35 +1100

93 lines

Re: AlphaLevel as replacement for Electroplated Nickel Gold

George Toman <[log in to unmask]>

Wed, 25 Mar 1998 08:49:27 -0500

53 lines

New Thread

ANSI/IPC-A-610 Revision B - Section 4.1

ANSI/IPC-A-610 Revision B - Section 4.1

Gustafson, Steve @ CLW <[log in to unmask]>

Tue, 10 Mar 1998 05:52:00 -0600

26 lines

Re: ANSI/IPC-A-610 Revision B - Section 4.1

Jack Crawford <[log in to unmask]>

Tue, 10 Mar 1998 13:09:27 -0600

56 lines

Re: ANSI/IPC-A-610 Revision B - Section 4.1

Robisan1 <[log in to unmask]>

Tue, 10 Mar 1998 15:03:57 EST

38 lines

New Thread

Apology to all

Apology to all

Ralph Hersey <[log in to unmask]>

Thu, 5 Mar 1998 11:51:59 -0800

38 lines

New Thread

ass'y

ass'y

[log in to unmask]

Wed, 18 Mar 1998 07:09:13 -0500

41 lines

ass'y

[log in to unmask]

Sat, 21 Mar 1998 08:58:51 -0500

37 lines

New Thread

Assembly - Component Mounting

Assembly - Component Mounting

Jack Bryant <[log in to unmask]>

Tue, 10 Mar 1998 15:33:18 -0800

29 lines

Re: Assembly - Component Mounting

Matthew Park <[log in to unmask]>

Tue, 10 Mar 1998 12:53:10 -0800

63 lines

New Thread

Assembly - Solder reflow

Re: Assembly - Solder reflow

Ed Cosper <[log in to unmask]>

Mon, 23 Mar 1998 11:40:45 -0600

32 lines

Re: Assembly - Solder reflow

Lepsche, Thomas G (NM75) <[log in to unmask]>

Mon, 23 Mar 1998 11:04:59 -0700

57 lines

New Thread

Assembly/Solderability

Assembly/Solderability

David D Hillman <[log in to unmask]>

Mon, 9 Mar 1998 07:39:28 -0600

50 lines

New Thread

ASSY: Intermittent Short

ASSY: Intermittent Short

Christy Graham <[log in to unmask]>

Wed, 11 Mar 1998 11:19:13 -0800

30 lines

Re: ASSY: Intermittent Short

SEM Lab, Inc. <[log in to unmask]>

Wed, 11 Mar 1998 12:22:08 -0600

64 lines

Re: ASSY: Intermittent Short

Aric Parr <[log in to unmask]>

Wed, 11 Mar 1998 15:35:55 EST

92 lines

Re: ASSY: Intermittent Short

Paul Terranova <[log in to unmask]>

Wed, 11 Mar 1998 15:50:11 -0500

64 lines

Re: ASSY: Intermittent Short

SIRGuru <[log in to unmask]>

Thu, 12 Mar 1998 08:51:17 EST

47 lines

New Thread

ASSY: IPC Benchmark Study

ASSY: IPC Benchmark Study

Mark F. Hanrahan <[log in to unmask]>

Sun, 8 Mar 1998 12:11:36 -0500

30 lines

Re: ASSY: IPC Benchmark Study

William E. Johnson <[log in to unmask]>

Sun, 8 Mar 1998 14:43:03 -0800

49 lines

New Thread

ASSY: Level III Testing

ASSY: Level III Testing

[log in to unmask]

Mon, 9 Mar 1998 16:05:19 -0600

34 lines

New Thread

ASSY: PARTS SOLDERABILITY

ASSY: PARTS SOLDERABILITY

Jim Marsico 516-595-5879 <[log in to unmask]>

Thu, 26 Mar 1998 15:34:00 -0400

37 lines

Re: ASSY: PARTS SOLDERABILITY

SteveZeva <[log in to unmask]>

Thu, 26 Mar 1998 19:48:31 EST

73 lines

Re: ASSY: PARTS SOLDERABILITY

Hamilton, Richard -4454 <[log in to unmask]>

Thu, 26 Mar 1998 17:57:06 -0700

130 lines

Re: ASSY: PARTS SOLDERABILITY

John Waite <[log in to unmask]>

Thu, 26 Mar 1998 21:03:35 -0500

162 lines

Re: ASSY: PARTS SOLDERABILITY

Bev Christian <[log in to unmask]>

Sat, 28 Mar 1998 22:52:19 -0500

81 lines

New Thread

ASSY:Preventive Maintenance Cleaning of PWB Assemblies

ASSY:Preventive Maintenance Cleaning of PWB Assemblies

Randy Johnson (Loveland) <[log in to unmask]>

Fri, 6 Mar 1998 09:29:00 -0600

23 lines

Re: ASSY:Preventive Maintenance Cleaning of PWB Assemblies

SteveZeva <[log in to unmask]>

Fri, 6 Mar 1998 21:39:11 EST

80 lines

Re: ASSY:Preventive Maintenance Cleaning of PWB Assemblies

SMITH RUSSELL MSM PO US <[log in to unmask]>

Tue, 10 Mar 1998 19:03:00 +0100

57 lines

New Thread

ASSY:PVA equipment

Re: ASSY:PVA equipment

Larry Davis <[log in to unmask]>

Thu, 12 Mar 1998 15:50:00 -0600

38 lines

Re: ASSY:PVA equipment

MCCOX94 <[log in to unmask]>

Thu, 12 Mar 1998 18:19:08 EST

27 lines

New Thread

ASSY:PVA equipment -Reply

Re: ASSY:PVA equipment -Reply

JON MOORE <[log in to unmask]>

Fri, 13 Mar 1998 09:49:50 -0500

49 lines

Re: ASSY:PVA equipment -Reply

Ron Hayashi <[log in to unmask]>

Fri, 13 Mar 1998 07:51:38 -0800

23 lines

New Thread

ATTN: BUY stamp mark inks

ATTN: BUY stamp mark inks

Indal <[log in to unmask]>

Mon, 9 Mar 1998 16:28:57 +0500

46 lines

New Thread

Automatic Spray Fluxers

Automatic Spray Fluxers

KJohans189 <[log in to unmask]>

Thu, 5 Mar 1998 13:10:39 EST

32 lines

Re: Automatic Spray Fluxers

Aric Parr <[log in to unmask]>

Thu, 5 Mar 1998 13:22:53 EST

62 lines

New Thread

bare board test witness marks

bare board test witness marks

Dudi Banitt <[log in to unmask]>

Tue, 3 Mar 1998 08:05:13 +0200

37 lines

Re: bare board test witness marks

John Haman Jr. <[log in to unmask]>

Tue, 3 Mar 1998 17:31:33 PST

78 lines

New Thread

Bare board testing nd it's impact on assembly

Bare board testing nd it's impact on assembly

Dudi Banitt <[log in to unmask]>

Sun, 1 Mar 1998 08:20:56 +0200

49 lines

Re: Bare board testing nd it's impact on assembly

SteveZeva <[log in to unmask]>

Sun, 1 Mar 1998 10:04:23 EST

79 lines

Re: Bare board testing nd it's impact on assembly

Eddie Brunker <[log in to unmask]>

Mon, 2 Mar 1998 09:49:48 GMT

106 lines

Re: Bare board testing nd it's impact on assembly

HGross1029 <[log in to unmask]>

Mon, 2 Mar 1998 09:00:22 EST

32 lines

Re: Bare board testing nd it's impact on assembly

David Whalley <[log in to unmask]>

Mon, 2 Mar 1998 17:08:33 +0000

73 lines

Re: Bare board testing nd it's impact on assembly

SteveZeva <[log in to unmask]>

Tue, 3 Mar 1998 00:34:57 EST

50 lines

New Thread

bare board witness marks

bare board witness marks

Dudi Banitt <[log in to unmask]>

Mon, 2 Mar 1998 18:54:03 +0200

27 lines

New Thread

BGA package dimensions

BGA package dimensions

Dave Pick -"process engineer" <[log in to unmask]>

Fri, 27 Mar 1998 16:40:06 -0600

24 lines

Re: BGA package dimensions

Charles Elliott <[log in to unmask]>

Mon, 30 Mar 1998 10:00:26 -0500

38 lines

New Thread

BGA Re-balling

BGA Re-balling

KC Chan <[log in to unmask]>

Fri, 6 Mar 1998 16:58:27 +0800

31 lines

New Thread

BGA SIR Patterns

BGA SIR Patterns

Eddie Brunker <[log in to unmask]>

Mon, 16 Mar 1998 11:31:11 GMT

27 lines

Re: BGA SIR Patterns

SIRGuru <[log in to unmask]>

Mon, 16 Mar 1998 12:14:17 EST

48 lines

Re: BGA SIR Patterns

Rod Martens <[log in to unmask]>

Mon, 16 Mar 1998 10:32:50 -0700

74 lines

Re: BGA SIR Patterns

Jim Marsico 516-595-5879 <[log in to unmask]>

Mon, 16 Mar 1998 14:53:00 -0400

27 lines

Re: BGA SIR Patterns

Karen Tellefsen <[log in to unmask]>

Mon, 16 Mar 1998 20:08:14 -0800

55 lines

New Thread

Bonded heatsinks

Bonded heatsinks

Ascot <[log in to unmask]>

Fri, 20 Mar 1998 09:24:40 +0000

32 lines

Re: Bonded heatsinks

Bev Christian <[log in to unmask]>

Mon, 23 Mar 1998 12:33:22 -0500

58 lines

New Thread

Capacitance Formulas in IPC 317

Capacitance Formulas in IPC 317

Olson, Jack C <[log in to unmask]>

Thu, 12 Mar 1998 11:13:29 -0800

63 lines

New Thread

carbon film screening

carbon film screening

Gary R Eckman <[log in to unmask]>

Wed, 11 Mar 1998 21:08:54 -0500

35 lines

Carbon film screening

MJKad <[log in to unmask]>

Thu, 12 Mar 1998 18:08:10 EST

28 lines

New Thread

CARBON INK

CARBON INK

Afri Singh <[log in to unmask]>

Fri, 13 Mar 1998 18:28:40 -0500

23 lines

Re: CARBON INK

Valquirio N. Carvalho <[log in to unmask]>

Sat, 14 Mar 1998 09:15:35 -0500

40 lines

New Thread

Carbon Ink Vs. Gold Finish

Carbon Ink Vs. Gold Finish

Nasir Hanif <[log in to unmask]>

Tue, 24 Mar 1998 08:21:42 -0600

32 lines

Re: Carbon Ink Vs. Gold Finish

Paul Klasek <[log in to unmask]>

Wed, 25 Mar 1998 09:43:07 +1100

63 lines

Re: Carbon Ink Vs. Gold Finish

George Toman <[log in to unmask]>

Wed, 25 Mar 1998 08:52:33 -0500

59 lines

Re: Carbon Ink Vs. Gold Finish

Rexcan Circuits <[log in to unmask]>

Wed, 25 Mar 1998 11:03:26 -0500

51 lines

Re: Carbon Ink Vs. Gold Finish

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 26 Mar 1998 09:24:24 +0300

49 lines

New Thread

carbon ink/film

carbon ink/film

John Portoghese <[log in to unmask]>

Mon, 16 Mar 1998 07:08:00 -0800

22 lines

New Thread

Causes & Corrective Actions for Solder Balls

Causes & Corrective Actions for Solder Balls

Hugh Scott Miller <[log in to unmask]>

Mon, 16 Mar 1998 07:06:30 -0500

38 lines

Re: Causes & Corrective Actions for Solder Balls

Ruben Irizarry <[log in to unmask]>

Mon, 16 Mar 1998 14:12:31 -0700

89 lines

Re: Causes & Corrective Actions for Solder Balls

Ruben Irizarry <[log in to unmask]>

Mon, 16 Mar 1998 14:29:53 -0700

109 lines

Re: Causes & Corrective Actions for Solder Balls

Jerry Cupples <[log in to unmask]>

Mon, 16 Mar 1998 15:33:03 -0600

75 lines

Re: Causes & Corrective Actions for Solder Balls

ETS <[log in to unmask]>

Fri, 20 Mar 1998 09:31:50 -0800

86 lines

New Thread

Chip Resistor Value

Chip Resistor Value

James Patten <[log in to unmask]>

Mon, 9 Mar 1998 13:31:57 -0700

38 lines

New Thread

Chip resistors

Chip resistors

Darcy Parker <[log in to unmask]>

Sat, 7 Mar 1998 14:09:04 -0600

79 lines

Re: Chip resistors

SteveZeva <[log in to unmask]>

Sat, 7 Mar 1998 22:41:48 EST

50 lines

Re: Chip resistors

Charles Barker <[log in to unmask]>

Mon, 9 Mar 1998 13:19:04 -0600

87 lines

New Thread

Chip-Scale Process and Assembly

Chip-Scale Process and Assembly

Stuart Chessen <[log in to unmask]>

Mon, 30 Mar 1998 07:02:03 -0800

50 lines

New Thread

circuit board trace repair

circuit board trace repair

Ed Holton <[log in to unmask]>

Wed, 25 Mar 1998 08:12:48 -0400

33 lines

Re: circuit board trace repair

Ralph Hersey <[log in to unmask]>

Wed, 25 Mar 1998 10:05:06 -0800

65 lines

Re: circuit board trace repair

SteveZeva <[log in to unmask]>

Wed, 25 Mar 1998 16:03:11 EST

37 lines

Re: circuit board trace repair

Collins, Graham <[log in to unmask]>

Thu, 26 Mar 1998 08:12:07 -0400

84 lines

Re: circuit board trace repair

Case, Jeff <[log in to unmask]>

Wed, 25 Mar 1998 16:15:58 -0700

55 lines

New Thread

clarification of wording

clarification of wording

Collins, Graham <[log in to unmask]>

Thu, 26 Mar 1998 09:01:37 -0400

95 lines

Re: clarification of wording

Eddie Brunker <[log in to unmask]>

Thu, 26 Mar 1998 14:02:13 GMT

49 lines

New Thread

Completly Clean

Completly Clean

Kenny Bloomquist <[log in to unmask]>

Wed, 25 Mar 1998 13:03:14 -0800

38 lines

Re: Completly Clean

Maguire, James F <[log in to unmask]>

Wed, 25 Mar 1998 18:15:37 -0800

156 lines

Re: Completly Clean

Eddie Brunker <[log in to unmask]>

Thu, 26 Mar 1998 11:07:26 GMT

64 lines

New Thread

Completly Clean - Handbook Info

Re: Completly Clean - Handbook Info

Jack Crawford <[log in to unmask]>

Thu, 26 Mar 1998 18:56:11 -0600

181 lines

New Thread

Component Land Design

Component Land Design

Charles Elliott <[log in to unmask]>

Tue, 24 Mar 1998 16:48:46 -0500

33 lines

Re: Component Land Design

Yvon Hache <[log in to unmask]>

Wed, 25 Mar 1998 12:13:22 -0800

32 lines

New Thread

Component Land Design - Charles

Component Land Design - Charles

Hurst, Joe <[log in to unmask]>

Wed, 25 Mar 1998 08:01:00 -0500

51 lines

New Thread

Conductor width

Conductor width

Orna and Yehuda <[log in to unmask]>

Fri, 13 Mar 1998 01:39:39 +0200

46 lines

Re: Conductor width

Doug McKean <[log in to unmask]>

Thu, 12 Mar 1998 10:30:47 -0500

82 lines

New Thread

Confirmation of Receipt

Confirmation of Receipt

Undetermined origin c/o LISTSERV administrator <[log in to unmask]>

Tue, 3 Mar 1998 09:20:36 EST

29 lines

New Thread

Conformal Coating Dewetting

Conformal Coating Dewetting

[log in to unmask]

Wed, 11 Mar 1998 17:23:58 EST

44 lines

Re: Conformal Coating Dewetting

Afri Singh <[log in to unmask]>

Thu, 12 Mar 1998 14:36:36 -0500

79 lines

Re: Conformal Coating Dewetting

LeoRoos <[log in to unmask]>

Thu, 12 Mar 1998 17:04:33 EST

39 lines

Re: Conformal Coating Dewetting

Fred2537 <[log in to unmask]>

Fri, 13 Mar 1998 12:06:30 EST

31 lines

New Thread

Conformal Coating equipment

Conformal Coating equipment

MCCOX94 <[log in to unmask]>

Thu, 12 Mar 1998 18:22:22 EST

29 lines

New Thread

Contact resistance

Contact resistance

Gabriela Bogdan <[log in to unmask]>

Wed, 11 Mar 1998 23:06:37 +0000

33 lines

Re: Contact resistance

Bev Christian <[log in to unmask]>

Wed, 11 Mar 1998 16:25:03 -0500

66 lines

contact resistance

Gabriela Bogdan <[log in to unmask]>

Thu, 12 Mar 1998 08:19:13 +0000

24 lines

Re: Contact resistance

David D Hillman <[log in to unmask]>

Thu, 12 Mar 1998 07:47:18 -0600

76 lines

Re: Contact resistance

Rod Martens <[log in to unmask]>

Thu, 12 Mar 1998 08:19:56 -0700

122 lines

Re: Contact resistance

Goldman, Patricia J. <[log in to unmask]>

Thu, 12 Mar 1998 13:24:00 -0500

113 lines

Re: Contact resistance

Gabriela Bogdan <[log in to unmask]>

Sat, 14 Mar 1998 03:47:32 +0000

163 lines

New Thread

copper etching

copper etching

Fred Johnson <[log in to unmask]>

Mon, 23 Mar 1998 20:02:54 +0000

34 lines

Re: copper etching

JSSallo <[log in to unmask]>

Mon, 23 Mar 1998 15:19:26 EST

36 lines

Re: copper etching

Ed Cosper <[log in to unmask]>

Mon, 23 Mar 1998 17:25:16 -0600

75 lines

Re: copper etching

Eltek Ltd. - Process Engineering <[log in to unmask]>

Tue, 24 Mar 1998 07:45:50 +0300

50 lines

Re: copper etching

Paul Gould <[log in to unmask]>

Wed, 25 Mar 1998 19:39:54 -0000

31 lines

Re: copper etching

SMITH RUSSELL MSM PO US <[log in to unmask]>

Fri, 27 Mar 1998 01:11:00 +0100

78 lines

Re: copper etching

David Anderson <[log in to unmask]>

Fri, 27 Mar 1998 13:59:39 -0600

28 lines

New Thread

copper etching -Reply

Re: copper etching -Reply

Fred Johnson <[log in to unmask]>

Mon, 23 Mar 1998 22:17:37 +0000

67 lines

Re: copper etching -Reply

JSSallo <[log in to unmask]>

Mon, 23 Mar 1998 18:13:30 EST

32 lines

Re: copper etching -Reply

RSedlak <[log in to unmask]>

Mon, 23 Mar 1998 20:58:02 EST

32 lines

Re: copper etching -Reply

Thomas E. Waznis <[log in to unmask]>

Mon, 23 Mar 1998 19:50:20 -0800

32 lines

New Thread

Copper foil thickness

Copper foil thickness

QUALITY <[log in to unmask]>

Thu, 26 Mar 1998 12:08:29 +0200

55 lines

Re: Copper foil thickness

Engelmaier <[log in to unmask]>

Thu, 26 Mar 1998 10:49:34 EST

79 lines

Re: Copper foil thickness

Gerald G. Gagnon <[log in to unmask]>

Thu, 26 Mar 1998 11:16:57 -0500

151 lines

New Thread

Copper Foil Weight

Copper Foil Weight

Andy Magee <[log in to unmask]>

Thu, 26 Mar 1998 12:16:15 -0500

43 lines

New Thread

Copper sulfate crystals

Copper sulfate crystals

Ed Cosper <[log in to unmask]>

Mon, 30 Mar 1998 08:58:30 -0600

29 lines

Re: Copper sulfate crystals

Carroll, George (MIS, GEFanuc, NA) <[log in to unmask]>

Mon, 30 Mar 1998 10:05:28 -0500

57 lines

Re: Copper sulfate crystals

JSSallo <[log in to unmask]>

Mon, 30 Mar 1998 11:09:57 EST

28 lines

Re: Copper sulfate crystals

RSedlak <[log in to unmask]>

Mon, 30 Mar 1998 11:27:27 EST

36 lines

Re: Copper sulfate crystals

Rwmpc <[log in to unmask]>

Tue, 31 Mar 1998 00:03:47 EST

32 lines

Re: Copper sulfate crystals

George Bokisa <[log in to unmask]>

Tue, 31 Mar 1998 11:04:38 -0800

47 lines

Re: Copper sulfate crystals

Miscantor <[log in to unmask]>

Tue, 31 Mar 1998 16:37:45 EST

40 lines

Re: Copper sulfate crystals

Padmanabha Anandapuram Halappa <[log in to unmask]>

Wed, 1 Apr 1998 10:17:50 EST

59 lines

New Thread

Copper sulfate crystals -Reply

Copper sulfate crystals -Reply

Fred Johnson <[log in to unmask]>

Mon, 30 Mar 1998 18:22:49 +0100

57 lines

New Thread

Corrosion after electroless tin finish

Re: Corrosion after electroless tin finish

Michael Carano <[log in to unmask]>

Sun, 1 Mar 1998 16:22:41 -0800

55 lines

New Thread

corrosivity HASL v GOLD

Re: corrosivity HASL v GOLD

[log in to unmask][log in to unmask]

Mon, 2 Mar 1998 17:28:40 -0800

67 lines

New Thread

Data Conversion, <*.tif> to photoplotter

Data Conversion, <*.tif> to photoplotter

Ralph Hersey <[log in to unmask]>

Fri, 6 Mar 1998 08:11:04 -0800

46 lines

Re: Data Conversion, <*.tif> to photoplotter

Mike Wilson <[log in to unmask]>

Fri, 6 Mar 1998 08:31:48 -0800

85 lines

Re: Data Conversion, <*.tif> to photoplotter

Lwallig <[log in to unmask]>

Fri, 6 Mar 1998 11:37:58 EST

29 lines

New Thread

Deburring machine

Deburring machine

Padmanabha Anandapuram Halappa <[log in to unmask]>

Mon, 2 Mar 1998 17:58:16 EST

31 lines

New Thread

Delamination

Delamination

Gabriela Bogdan <[log in to unmask]>

Sun, 15 Mar 1998 23:23:46 +0000

40 lines

Re: Delamination

Robisan1 <[log in to unmask]>

Mon, 16 Mar 1998 08:00:40 EST

42 lines

Delamination

Richard MacCutcheon <[log in to unmask]>

Mon, 16 Mar 1998 08:16:00 -0700

66 lines

New Thread

Delco

Re: Delco

HIHAT44 <[log in to unmask]>

Tue, 17 Mar 1998 13:22:23 EST

34 lines

New Thread

DES: Fusing limits of tracks

DES: Fusing limits of tracks

Dominic Bragge <[log in to unmask]>

Mon, 23 Mar 1998 10:31:57 +1100

34 lines

New Thread

DI water

DI water

Thomas C Han <[log in to unmask]>

Tue, 3 Mar 1998 19:01:28 -0800

43 lines

Re: DI water

Bob Mesick <[log in to unmask]>

Wed, 4 Mar 1998 08:46:19 -0600

59 lines

New Thread

dielectric constant

dielectric constant

Olson, Jack C <[log in to unmask]>

Tue, 3 Mar 1998 09:21:15 -0800

33 lines

Re: dielectric constant

Jana Carraway <[log in to unmask]>

Tue, 3 Mar 1998 09:37:14 PST

62 lines

Re: dielectric constant

Mitch Morey <[log in to unmask]>

Tue, 3 Mar 1998 10:28:11 -0800

69 lines

Re: dielectric constant

Ralph Hersey <[log in to unmask]>

Tue, 3 Mar 1998 11:07:16 -0800

125 lines

Re: dielectric constant

Leslie O. Connally <[log in to unmask]>

Tue, 3 Mar 1998 13:29:19 -0800

70 lines

Re: dielectric constant

D. Rooke <[log in to unmask]>

Thu, 5 Mar 1998 23:33:05 -0500

94 lines

New Thread

Direct plating vs Electroless copper

Direct plating vs Electroless copper

rameshl <[log in to unmask]>

Tue, 10 Mar 1998 08:50:55 +0500

38 lines

New Thread

Double Reflow: Component Weight vs. Pad Contact Area Rat io

Re: Double Reflow: Component Weight vs. Pad Contact Area Rat io

Bev Christian <[log in to unmask]>

Mon, 23 Mar 1998 11:50:06 -0500

68 lines

Re: Double Reflow: Component Weight vs. Pad Contact Area Rat io

Brant R. McClelland <[log in to unmask]>

Mon, 23 Mar 1998 14:08:35 -0600

113 lines

New Thread

Double Reflow: Component Weight vs. Pad Contact Area Ratio

Double Reflow: Component Weight vs. Pad Contact Area Ratio

Dave Pick -"process engineer" <[log in to unmask]>

Mon, 23 Mar 1998 09:38:11 -0600

27 lines

Re: Double Reflow: Component Weight vs. Pad Contact Area Ratio

TheITMTeam <[log in to unmask]>

Mon, 23 Mar 1998 23:21:09 EST

29 lines

New Thread

Drill Drawing

Drill Drawing

Clint Cote <[log in to unmask]>

Wed, 18 Mar 1998 12:37:32 -0500

40 lines

Drill Drawing

Richard MacCutcheon <[log in to unmask]>

Wed, 18 Mar 1998 11:08:00 -0700

69 lines

Re: Drill Drawing

John Haman Jr. <[log in to unmask]>

Thu, 19 Mar 1998 07:20:07 -0500

110 lines

Re: Drill Drawing

Don Vischulis <[log in to unmask]>

Thu, 19 Mar 1998 19:48:49 -0600

94 lines

New Thread

Drill format question

Drill format question

Ken Patel <[log in to unmask]>

Thu, 26 Mar 1998 14:34:39 -0800

42 lines

Re: Drill format question

Jeff Seeger <[log in to unmask]>

Thu, 26 Mar 1998 19:56:43 -0500

47 lines

Re: Drill format question

Joseph E. J. Duclos Jr. <[log in to unmask]>

Thu, 26 Mar 1998 20:21:51 -0500

105 lines

Re: Drill format question

Don Vischulis <[log in to unmask]>

Thu, 26 Mar 1998 20:37:21 -0600

93 lines

Re: Drill format question

John Haman Jr. <[log in to unmask]>

Fri, 27 Mar 1998 07:35:47 -0500

95 lines

New Thread

Dross Reduction

Dross Reduction

Alan Kreplick <[log in to unmask]>

Wed, 25 Mar 1998 16:13:50 -0500

37 lines

New Thread

DTP Measurements source

DTP Measurements source

Dennis Gagne <[log in to unmask]>

Thu, 12 Mar 1998 23:21:11 -0500

27 lines

New Thread

Durability of Circuit Boards

Durability of Circuit Boards

[log in to unmask]

Fri, 20 Mar 1998 16:07:05 +0100

55 lines

New Thread

early SMT

Re: early SMT

Agoldn1 <[log in to unmask]>

Tue, 24 Mar 1998 19:46:10 EST

30 lines

New Thread

electrodialytic processes

electrodialytic processes

Mark Malachowski <[log in to unmask]>

Mon, 2 Mar 1998 18:59:14 -0800

27 lines

New Thread

Electroless basket MFG.

Electroless basket MFG.

Ed Cosper <[log in to unmask]>

Wed, 4 Mar 1998 11:18:31 -0600

25 lines

Re: Electroless basket MFG.

Henry Coulter <[log in to unmask]>

Sat, 7 Mar 1998 07:14:45 -0700

26 lines

New Thread

Electroless Copper wastetreatment

Electroless Copper wastetreatment

Jacob Ransborg <[log in to unmask]>

Fri, 13 Mar 1998 22:17:45 +0100

33 lines

Re: Electroless Copper wastetreatment

DDFRITZ <[log in to unmask]>

Fri, 13 Mar 1998 17:02:31 EST

39 lines

Re: Electroless Copper wastetreatment

RSedlak <[log in to unmask]>

Sat, 14 Mar 1998 20:28:49 EST

38 lines

New Thread

Electroless Nickel / gold

Electroless Nickel / gold

COwEv <[log in to unmask]>

Tue, 10 Mar 1998 17:22:03 EST

35 lines

Re: Electroless Nickel / gold

DDFRITZ <[log in to unmask]>

Tue, 10 Mar 1998 18:30:13 EST

44 lines

Re: Electroless Nickel / gold

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 11 Mar 1998 10:22:19 +0200

48 lines

Re: Electroless Nickel / gold

Robisan1 <[log in to unmask]>

Wed, 11 Mar 1998 07:56:58 EST

30 lines

New Thread

electroless nickel vs electrolytic nickel

electroless nickel vs electrolytic nickel

COwEv <[log in to unmask]>

Sat, 14 Mar 1998 16:12:17 EST

44 lines

New Thread

Electroless nickel vs. electrolytic nickel

Electroless nickel vs. electrolytic nickel

Lourdes Mertens <[log in to unmask]>

Wed, 11 Mar 1998 05:31:45 -0700

27 lines

New Thread

Electronic Devices - Age Limits

Electronic Devices - Age Limits

Yves Trudell <[log in to unmask]>

Mon, 23 Mar 1998 11:37:42 -0500

33 lines

Re: Electronic Devices - Age Limits

TOSTEVIN_BC <[log in to unmask]>

Mon, 23 Mar 1998 12:46:13 -0500

68 lines

Re: Electronic Devices - Age Limits

Janice M LePage <[log in to unmask]>

Mon, 23 Mar 1998 10:53:11 -0800

67 lines

New Thread

Electroplated Tin Finish

Re: Electroplated Tin Finish

craig sutton <[log in to unmask]>

Sun, 29 Mar 1998 15:52:32 -0800

32 lines

Re: Electroplated Tin Finish

Don Vischulis <[log in to unmask]>

Sun, 29 Mar 1998 19:19:11 -0600

45 lines

New Thread

ElectroStatics revamps website related to Static Electricty in printed circuit board manufacturing and other electronics markets. (was Re: [TN] Re Air Ion Level Measurement)

ElectroStatics revamps website related to Static Electricty in printed circuit board manufacturing and other electronics markets. (was Re: [TN] Re Air Ion Level Measurement)

Peter Mariani <[log in to unmask]>

Sun, 1 Mar 1998 19:10:11 -0500

111 lines

New Thread

eless Pd

eless Pd

Josh Moody <[log in to unmask]>

Mon, 2 Mar 1998 10:21:07 -0600

39 lines

Re: eless Pd

Gerard O'Brien <[log in to unmask]>

Mon, 2 Mar 1998 15:10:56 -0500

71 lines

New Thread

ENTEK 106A OSP Remaining

ENTEK 106A OSP Remaining

Mike Masters <[log in to unmask]>

Tue, 3 Mar 1998 13:22:29 -0500

38 lines

New Thread

Environmental tests for press-fit components

Environmental tests for press-fit components

Johannes Sivula <[log in to unmask]>

Thu, 19 Mar 1998 13:42:32 +0200

30 lines

New Thread

Ergonomic Inspection Equipment/Scopes

Ergonomic Inspection Equipment/Scopes

[log in to unmask]

Thu, 19 Mar 1998 14:00:37 -0600

35 lines

New Thread

Ergonomic issues in Final I

Ergonomic issues in Final I

Wilber E. Heath <[log in to unmask]>

Wed, 18 Mar 1998 06:37:34 -0600

49 lines

New Thread

Ergonomic issues in Final Inspection

Ergonomic issues in Final Inspection

Mike Medina <[log in to unmask]>

Tue, 17 Mar 1998 16:36:16 -0600

32 lines

Re: Ergonomic issues in Final Inspection

SteveZeva <[log in to unmask]>

Tue, 17 Mar 1998 18:34:41 EST

48 lines

Re: Ergonomic issues in Final Inspection

Ruben Irizarry <[log in to unmask]>

Wed, 18 Mar 1998 08:49:41 -0700

67 lines

Re: Ergonomic issues in Final Inspection

Connie Korth <[log in to unmask]>

Wed, 18 Mar 1998 08:30:27 CST

62 lines

Re: Ergonomic issues in Final Inspection

drilbert <[log in to unmask]>

Wed, 18 Mar 1998 08:07:32 -0800

57 lines

Re: Ergonomic issues in Final Inspection

Richard MacCutcheon <[log in to unmask]>

Wed, 18 Mar 1998 10:40:00 -0700

88 lines

Re: Ergonomic issues in Final Inspection

Jan Ciminello <[log in to unmask]>

Wed, 18 Mar 1998 10:13:39 PST

40 lines

Re: Ergonomic issues in Final Inspection

Doug Webb <[log in to unmask]>

Wed, 18 Mar 1998 10:43:09 -0800

119 lines

Re: Ergonomic issues in Final Inspection

Paul Klasek <[log in to unmask]>

Thu, 19 Mar 1998 08:57:00 +1100

96 lines

Re: Ergonomic issues in Final Inspection

Janice M LePage <[log in to unmask]>

Thu, 19 Mar 1998 08:18:24 -0800

36 lines

New Thread

ESD

ESD

Fred Pescitelli <[log in to unmask]>

Mon, 30 Mar 1998 17:06:11 -0500

31 lines

Re: ESD

SteveZeva <[log in to unmask]>

Mon, 30 Mar 1998 17:51:18 EST

45 lines

Re: ESD

Peter Mariani <[log in to unmask]>

Mon, 30 Mar 1998 18:06:43 -0500

73 lines

Re: ESD

Hamilton, Richard -4454 <[log in to unmask]>

Mon, 30 Mar 1998 16:58:04 -0700

82 lines

Re: ESD

Peter Mariani <[log in to unmask]>

Mon, 30 Mar 1998 19:23:17 -0500

121 lines

Re: ESD

Paul Klasek <[log in to unmask]>

Tue, 31 Mar 1998 11:47:50 +1000

153 lines

ESD

Don Fumia <[log in to unmask]>

Tue, 31 Mar 1998 08:32:36 -0500

48 lines

Re: ESD

Peter Mariani <[log in to unmask]>

Tue, 31 Mar 1998 10:27:12 -0500

189 lines

Re: ESD

Saracino, Glenn (AZ75) <[log in to unmask]>

Tue, 31 Mar 1998 09:41:22 -0600

219 lines

ESD

Darrell Bonzo <[log in to unmask]>

Tue, 31 Mar 1998 15:42:39 -0700

32 lines

New Thread

European Help!

European Help!

Hamilton, Richard -4454 <[log in to unmask]>

Thu, 26 Mar 1998 17:40:46 -0700

35 lines

Re: European Help!

COwEv <[log in to unmask]>

Thu, 26 Mar 1998 20:03:16 EST

30 lines

Re: European Help!

Darrel Therriault <[log in to unmask]>

Thu, 26 Mar 1998 17:28:37 -0800

68 lines

Re: European Help!

Jacob Mozel <[log in to unmask]>

Fri, 27 Mar 1998 10:53:32 +0200

58 lines

Re: European Help!

Colin <[log in to unmask]>

Fri, 27 Mar 1998 03:51:00 -0600

65 lines

Re: European Help!

Graham Naisbitt <[log in to unmask]>

Fri, 27 Mar 1998 08:17:38 -0000

95 lines

Re: European Help!

Chris Wall <[log in to unmask]>

Fri, 27 Mar 1998 07:54:18 -0500

78 lines

Re: European Help!

Devlin, Dan <[log in to unmask]>

Fri, 27 Mar 1998 08:24:28 -0500

61 lines

New Thread

Exposure Frames

Exposure Frames

Padmanabha Anandapuram Halappa <[log in to unmask]>

Thu, 5 Mar 1998 14:44:49 EST

21 lines

Re: Exposure Frames

Wayne Gitlitz <[log in to unmask]>

Thu, 5 Mar 1998 10:01:56 -0800

49 lines

New Thread

Exposure Units

Exposure Units

Mark Betterly <[log in to unmask]>

Thu, 19 Mar 1998 07:20:25 -0500

31 lines

New Thread

Exposure units ?

Exposure units ?

Charles Busa <[log in to unmask]>

Wed, 18 Mar 1998 15:55:00 -0500

31 lines

Re: Exposure units ?

Tom Colton <[log in to unmask]>

Wed, 18 Mar 1998 20:33:01 -0800

52 lines

Re: Exposure units ?

Bert Ohlig <[log in to unmask]>

Thu, 19 Mar 1998 14:15:25 -0800

78 lines

Re: Exposure units ?

SMITH RUSSELL MSM PO US <[log in to unmask]>

Fri, 27 Mar 1998 02:16:00 +0100

72 lines

New Thread

FAB - Barrel Cracking

FAB - Barrel Cracking

Steve Collins <[log in to unmask]>

Mon, 2 Mar 1998 09:30:49 -0700

82 lines

Re: FAB - Barrel Cracking

Robisan1 <[log in to unmask]>

Mon, 2 Mar 1998 12:54:46 EST

38 lines

New Thread

FAB - Heat-sink

FAB - Heat-sink

QUALITY <[log in to unmask]>

Tue, 10 Mar 1998 09:54:58 +0200

33 lines

New Thread

FAB/DES: Electronic data interchange (EDI)

FAB/DES: Electronic data interchange (EDI)

Gregg Klawson <[log in to unmask]>

Thu, 5 Mar 1998 12:33:35 -0500

43 lines

Re: FAB/DES: Electronic data interchange (EDI)

Steve Hawn <[log in to unmask]>

Thu, 5 Mar 1998 09:58:43 -0800

57 lines

Re: FAB/DES: Electronic data interchange (EDI)

Dennis Beerman <[log in to unmask]>

Thu, 5 Mar 1998 13:00:17 -0500

72 lines

Re: FAB/DES: Electronic data interchange (EDI)

Neil Diamond <[log in to unmask]>

Thu, 5 Mar 1998 12:30:32 -0600

65 lines

Re: FAB/DES: Electronic data interchange (EDI)

Jean Cortjens <[log in to unmask]>

Thu, 5 Mar 1998 14:03:09 -0500

177 lines

Re: FAB/DES: Electronic data interchange (EDI)

Neil Diamond <[log in to unmask]>

Thu, 5 Mar 1998 13:38:33 -0600

44 lines

Re: FAB/DES: Electronic data interchange (EDI)

Ed Cosper <[log in to unmask]>

Thu, 5 Mar 1998 16:10:07 -0600

130 lines

Re: FAB/DES: Electronic data interchange (EDI)

MJKad <[log in to unmask]>

Fri, 6 Mar 1998 11:14:52 EST

33 lines

New Thread

fab/design EDI

Re: fab/design EDI

Mitch Morey <[log in to unmask]>

Thu, 5 Mar 1998 10:12:42 -0800

104 lines

New Thread

FAB: Electroless Nickel/Immersion Gold for rotary contac ts

Re: FAB: Electroless Nickel/Immersion Gold for rotary contac ts

Paul Terranova <[log in to unmask]>

Mon, 23 Mar 1998 13:42:35 -0500

67 lines

New Thread

FAB: Electroless Nickel/Immersion Gold for rotary contacts

FAB: Electroless Nickel/Immersion Gold for rotary contacts

Paul Gould <[log in to unmask]>

Mon, 23 Mar 1998 18:14:00 -0000

75 lines

Re: FAB: Electroless Nickel/Immersion Gold for rotary contacts

Paul Klasek <[log in to unmask]>

Tue, 24 Mar 1998 10:59:32 +1100

54 lines

New Thread

FAB: French PCB Specifications

FAB: French PCB Specifications

Paul Gould <[log in to unmask]>

Thu, 12 Mar 1998 14:55:05 +0000

43 lines

New Thread

FAB: Hydraulic press "how to" reference material

FAB: Hydraulic press "how to" reference material

James W. High <[log in to unmask]>

Mon, 16 Mar 1998 09:09:16 -0500

36 lines

Re: FAB: Hydraulic press "how to" reference material

Steves <[log in to unmask]>

Mon, 16 Mar 1998 10:04:46 +0000

25 lines

Re: FAB: Hydraulic press "how to" reference material

Dupriest, Don (MS Mail) <[log in to unmask]>

Tue, 17 Mar 1998 16:54:00 -0600

83 lines

New Thread

FAB: Hydraulic press "how to" reference material -Reply

FAB: Hydraulic press "how to" reference material -Reply

Ron Hayashi <[log in to unmask]>

Mon, 16 Mar 1998 07:54:36 -0800

23 lines

New Thread

FAB: IPC-4101 vs Mil-S-13949

FAB: IPC-4101 vs Mil-S-13949

Sheila Smith <[log in to unmask]>

Fri, 13 Mar 1998 14:11:02 -0500

27 lines

Re: FAB: IPC-4101 vs Mil-S-13949

Hint pwb1 <[log in to unmask]>

Fri, 13 Mar 1998 21:38:50 EST

40 lines

New Thread

FAB: laboratory electroless nickel

FAB: laboratory electroless nickel

James W. High <[log in to unmask]>

Fri, 20 Mar 1998 17:12:41 -0500

34 lines

Re: FAB: laboratory electroless nickel

COwEv <[log in to unmask]>

Fri, 20 Mar 1998 18:24:06 EST

36 lines

Re: FAB: laboratory electroless nickel

Eltek Ltd. - Process Engineering <[log in to unmask]>

Mon, 23 Mar 1998 06:47:37 +0300

48 lines

Re: FAB: laboratory electroless nickel

Goldman, Patricia J. <[log in to unmask]>

Mon, 23 Mar 1998 08:18:00 -0500

63 lines

New Thread

FAB: laboratory electroless nickel -Reply

Re: FAB: laboratory electroless nickel -Reply

David Anderson <[log in to unmask]>

Sat, 21 Mar 1998 16:09:49 -0600

39 lines

New Thread

FAb: Solderlevel

FAb: Solderlevel

Ed Cosper <[log in to unmask]>

Tue, 24 Mar 1998 13:43:34 -0600

39 lines

Re: FAb: Solderlevel

Kathy Palumbo <[log in to unmask]>

Tue, 24 Mar 1998 17:17:13 -0800

78 lines

New Thread

FAb: Solderlevel -Reply

Re: FAb: Solderlevel -Reply

David Anderson <[log in to unmask]>

Tue, 24 Mar 1998 20:10:45 -0600

106 lines

Re: FAb: Solderlevel -Reply

Kathy Palumbo <[log in to unmask]>

Wed, 25 Mar 1998 09:51:23 -0800

156 lines

Re: FAb: Solderlevel -Reply

SteveZeva <[log in to unmask]>

Wed, 25 Mar 1998 15:53:26 EST

46 lines

Re: FAb: Solderlevel -Reply

sahmad <[log in to unmask]>

Wed, 25 Mar 1998 15:27:50 -0700

180 lines

Re: FAb: Solderlevel -Reply

Eddie Brunker <[log in to unmask]>

Thu, 26 Mar 1998 10:09:47 GMT

71 lines

New Thread

FAB:Special Process

FAB:Special Process

Ramadoss Srinivasan <[log in to unmask]>

Tue, 10 Mar 1998 02:11:25 PST

40 lines

New Thread

FAR Chrystal catellation termination Solder Joint Criteri

FAR Chrystal catellation termination Solder Joint Criteri

[log in to unmask]

Wed, 11 Mar 1998 15:04:40 -0500

34 lines

New Thread

footprint

footprint

Chris Johnston <[log in to unmask]>

Fri, 6 Mar 1998 13:49:35 +1000

31 lines

Re: footprint

Lisa Williams <[log in to unmask]>

Fri, 6 Mar 1998 09:35:41 -0600

55 lines

New Thread

FR4 Relative Permittivity

FR4 Relative Permittivity

Hurst, Joe <[log in to unmask]>

Mon, 30 Mar 1998 14:18:00 -0500

45 lines

Re: FR4 Relative Permittivity

Brant R. McClelland <[log in to unmask]>

Mon, 30 Mar 1998 13:46:12 -0600

92 lines

Re: FR4 Relative Permittivity

John Waite <[log in to unmask]>

Mon, 30 Mar 1998 15:01:00 -0500

110 lines

New Thread

FR4 vs Polyimide

FR4 vs Polyimide

Tom Lambert <[log in to unmask]>

Fri, 13 Mar 1998 13:58:25 -0800

25 lines

Re: FR4 vs Polyimide

JSSallo <[log in to unmask]>

Fri, 13 Mar 1998 17:46:57 EST

28 lines

Re: FR4 vs Polyimide

McGlaughlin, Jeffrey A <[log in to unmask]>

Sat, 14 Mar 1998 14:20:49 -0500

53 lines

New Thread

Free European Solder Finish Seminar

Free European Solder Finish Seminar

Bob Willis <[log in to unmask]>

Fri, 27 Mar 1998 19:10:17 -0000

81 lines

New Thread

Fuji SMT Equip.

Fuji SMT Equip.

Ron Offner <[log in to unmask]>

Tue, 17 Mar 1998 13:12:54 -0700

30 lines

New Thread

FW: [CN] Specs for conductor spacing per volt to satisfy FactoryMutual?

FW: [CN] Specs for conductor spacing per volt to satisfy FactoryMutual?

Holly Evans <[log in to unmask]>

Fri, 20 Mar 1998 17:29:54 -0500

48 lines

New Thread

FW: [TN] BGA package dimensions

FW: [TN] BGA package dimensions

Dhawan, Ashok <[log in to unmask]>

Sat, 28 Mar 1998 08:20:28 -0600

51 lines

New Thread

FW: [TN] FAB/DES: Electronic data interchange (EDI)

FW: [TN] FAB/DES: Electronic data interchange (EDI)

Dhawan, Ashok <[log in to unmask]>

Tue, 24 Mar 1998 09:09:16 -0600

82 lines

Re: FW: [TN] FAB/DES: Electronic data interchange (EDI)

Jeff Seeger <[log in to unmask]>

Tue, 24 Mar 1998 13:43:45 -0500

42 lines

Re: FW: [TN] FAB/DES: Electronic data interchange (EDI)

Randy Anderson <[log in to unmask]>

Tue, 24 Mar 1998 22:30:31 -0800

54 lines

New Thread

FW: [TN] mil-c-28809 equivalent

Re: FW: [TN] mil-c-28809 equivalent

Jack Crawford <[log in to unmask]>

Fri, 27 Mar 1998 15:49:47 -0600

94 lines

New Thread

FW: [TN] Read: clarification of wording

FW: [TN] Read: clarification of wording

Dhawan, Ashok <[log in to unmask]>

Fri, 27 Mar 1998 15:34:41 -0600

53 lines

New Thread

FW: [TN] Wafter Diceing Water Req.

FW: [TN] Wafter Diceing Water Req.

Dhawan, Ashok <[log in to unmask]>

Tue, 10 Mar 1998 09:47:32 -0600

101 lines

New Thread

Fwd: [CN] Specs for conductor spacing per volt to satisfy FactoryMutual?

Fwd: [CN] Specs for conductor spacing per volt to satisfy FactoryMutual?

Lisa Williams <[log in to unmask]>

Fri, 20 Mar 1998 09:09:15 -0600

79 lines

New Thread

Gas Tight Testing

Gas Tight Testing

Jack Crawford <[log in to unmask]>

Wed, 25 Mar 1998 14:51:05 -0600

55 lines

New Thread

GDS Translator

GDS Translator

Neil Diamond <[log in to unmask]>

Tue, 17 Mar 1998 08:07:21 -0600

43 lines

Re: GDS Translator

<Gareth Jones> <[log in to unmask]>

Wed, 18 Mar 1998 10:24:14 +0000

77 lines

Re: GDS Translator

SteveZeva <[log in to unmask]>

Fri, 20 Mar 1998 14:18:31 EST

37 lines

Re: GDS Translator

Neil Diamond <[log in to unmask]>

Fri, 20 Mar 1998 13:25:00 -0600

62 lines

Re: GDS Translator

Vivienne Kane <[log in to unmask]>

Sat, 21 Mar 1998 11:14:02 +1000

80 lines

Re: GDS Translator

Ralph Hersey <[log in to unmask]>

Fri, 20 Mar 1998 22:47:28 -0800

68 lines

New Thread

Gen #2: 1997 IPC Roadmap

Gen #2: 1997 IPC Roadmap

J. Warhelere <[log in to unmask]>

Wed, 25 Mar 1998 20:40:17 -0500

239 lines

New Thread

Gen: 1997 IPC Roadmap

Gen: 1997 IPC Roadmap

J. Warhelere <[log in to unmask]>

Mon, 16 Mar 1998 19:56:21 -0500

60 lines

New Thread

Gen: dpmo

Gen: dpmo

[log in to unmask]

Mon, 30 Mar 1998 10:34:22 -0800

32 lines

Re: Gen: dpmo

Jack Crawford <[log in to unmask]>

Mon, 30 Mar 1998 14:13:54 -0600

61 lines

New Thread

Gen: SMTA/IMAPS EXPO '98 Dallas

Gen: SMTA/IMAPS EXPO '98 Dallas

Keith Larson <[log in to unmask]>

Mon, 30 Mar 1998 20:48:40 -0600

106 lines

New Thread

Gen: Solder ppm

Gen: Solder ppm

[log in to unmask]

Mon, 30 Mar 1998 10:59:20 -0800

35 lines

New Thread

Gen: Use of SMT devices

Gen: Use of SMT devices

Ed Cosper <[log in to unmask]>

Mon, 23 Mar 1998 17:17:26 -0600

36 lines

Re: Gen: Use of SMT devices

HGross1029 <[log in to unmask]>

Tue, 24 Mar 1998 08:55:50 EST

31 lines

Re: Gen: Use of SMT devices

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 24 Mar 1998 12:49:00 -0400

23 lines

Re: Gen: Use of SMT devices

Lepsche, Thomas G (NM75) <[log in to unmask]>

Tue, 24 Mar 1998 13:32:44 -0700

41 lines

Gen: Use of SMT Devices

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 25 Mar 1998 07:54:00 PST

48 lines

Re: Gen: Use of SMT devices

Nancy Nelson <[log in to unmask]>

Wed, 25 Mar 1998 21:24:00 CST

42 lines

Re: Gen: Use of SMT devices

Edward J. Valentine <[log in to unmask]>

Fri, 27 Mar 1998 13:12:25 -0800

60 lines

New Thread

Gen: Use of SMT devices -Reply

Gen: Use of SMT devices -Reply

JON MOORE <[log in to unmask]>

Tue, 24 Mar 1998 15:58:42 -0500

56 lines

New Thread

Gerber Question - Thanks

Gerber Question - Thanks

Steve Collins <[log in to unmask]>

Tue, 24 Mar 1998 09:45:41 -0700

26 lines

New Thread

GLASS ARTWORK

Re: GLASS ARTWORK

Modular Components National, Inc. <[log in to unmask]>

Mon, 2 Mar 1998 12:40:45 -0500

79 lines

Re: GLASS ARTWORK

bernie <[log in to unmask]>

Tue, 3 Mar 1998 07:30:40 -0500

119 lines

Re: GLASS ARTWORK

Jana Carraway <[log in to unmask]>

Mon, 2 Mar 1998 16:39:46 PST

186 lines

GLASS ARTWORK

Jana Carraway <[log in to unmask]>

Mon, 2 Mar 1998 17:01:14 PST

34 lines

Re: GLASS ARTWORK

Modular Components National, Inc. <[log in to unmask]>

Wed, 4 Mar 1998 07:40:43 -0500

67 lines

New Thread

Gold -Finger Bevel Issue

Gold -Finger Bevel Issue

Nancy Nelson <[log in to unmask]>

Wed, 25 Mar 1998 21:26:00 CST

28 lines

Re: Gold -Finger Bevel Issue

Kelly Kovalovsky <[log in to unmask]>

Thu, 26 Mar 1998 14:28:23 -0500

69 lines

New Thread

Gold Flash vs Gold Plate on PCB connector Fingers

Gold Flash vs Gold Plate on PCB connector Fingers

Kathy Palumbo <[log in to unmask]>

Tue, 10 Mar 1998 16:23:22 -0800

30 lines

Re: Gold Flash vs Gold Plate on PCB connector Fingers

Paul Klasek <[log in to unmask]>

Wed, 11 Mar 1998 13:26:09 +1100

78 lines

Re: Gold Flash vs Gold Plate on PCB connector Fingers

Ralph Hersey <[log in to unmask]>

Tue, 10 Mar 1998 20:43:00 -0800

70 lines

Re: Gold Flash vs Gold Plate on PCB connector Fingers

David D Hillman <[log in to unmask]>

Wed, 11 Mar 1998 07:23:51 -0600

73 lines

Re: Gold Flash vs Gold Plate on PCB connector Fingers

Rod Martens <[log in to unmask]>

Wed, 11 Mar 1998 08:56:05 -0700

114 lines

New Thread

Gold Porosity

Gold Porosity

Kelly Kovalovsky <[log in to unmask]>

Mon, 23 Mar 1998 16:21:54 -0500

29 lines

Re: Gold Porosity

Paul Terranova <[log in to unmask]>

Tue, 24 Mar 1998 08:57:44 -0500

76 lines

Re: Gold Porosity

Ted Stern <[log in to unmask]>

Tue, 24 Mar 1998 09:24:17 -0800

44 lines

Re: Gold Porosity

Pratap Singh <[log in to unmask]>

Sun, 29 Mar 1998 13:57:14 -0800

58 lines

Re: Gold Porosity

John Waite <[log in to unmask]>

Sun, 29 Mar 1998 15:31:46 -0500

93 lines

New Thread

Goldfingers

Goldfingers

Thomas C Han <[log in to unmask]>

Mon, 9 Mar 1998 15:41:21 -0800

35 lines

New Thread

Grainy copper deposit.

Grainy copper deposit.

Padmanabha Anandapuram Halappa <[log in to unmask]>

Thu, 5 Mar 1998 14:19:11 EST

25 lines

Re: Grainy copper deposit.

Desroches, Charles <[log in to unmask]>

Mon, 9 Mar 1998 11:11:05 -0500

107 lines

Grainy copper deposit.

Padmanabha Anandapuram Halappa <[log in to unmask]>

Wed, 11 Mar 1998 07:54:37 EST

58 lines

New Thread

Grainy copper deposit. -Reply

Grainy copper deposit. -Reply

Fred Johnson <[log in to unmask]>

Thu, 5 Mar 1998 19:18:52 +0000

40 lines

Grainy copper deposit. -Reply

Fred Johnson <[log in to unmask]>

Thu, 12 Mar 1998 15:17:29 +0000

77 lines

New Thread

Greater Boston IPCDC Chapter meeting 25-Mar 6pm

Greater Boston IPCDC Chapter meeting 25-Mar 6pm

Jeff Seeger <[log in to unmask]>

Thu, 19 Mar 1998 19:14:14 -0500

86 lines

New Thread

Haloing Measurement

Haloing Measurement

Rob Carrillo <[log in to unmask]>

Mon, 2 Mar 1998 11:21:57 -0500

69 lines

Re: Haloing Measurement

Ron Payne <[log in to unmask]>

Mon, 2 Mar 1998 09:10:52 -0800

61 lines

New Thread

HANDBOOK OF PRINTED CIRCUIT

HANDBOOK OF PRINTED CIRCUIT

Padmanabha Anandapuram Halappa <[log in to unmask]>

Tue, 17 Mar 1998 17:14:13 EST

24 lines

Re: HANDBOOK OF PRINTED CIRCUIT

LeoRoos <[log in to unmask]>

Tue, 17 Mar 1998 17:00:11 EST

26 lines

Re: HANDBOOK OF PRINTED CIRCUIT

Jean Connick <[log in to unmask]>

Tue, 17 Mar 1998 15:57:18 -0800

52 lines

New Thread

HASL thickness Specification

HASL thickness Specification

Steve Collins <[log in to unmask]>

Thu, 19 Mar 1998 14:06:08 -0700

39 lines

Re: HASL thickness Specification

Eddie Brunker <[log in to unmask]>

Fri, 20 Mar 1998 10:52:48 GMT

83 lines

New Thread

HASL Thickness Specs.

HASL Thickness Specs.

Mark Simmons <[log in to unmask]>

Thu, 19 Mar 1998 17:56:40 -0800

61 lines

New Thread

Heavy metals

Heavy metals

Don Fumia <[log in to unmask]>

Mon, 30 Mar 1998 14:38:51 -0500

34 lines

Re: Heavy metals

David D Hillman <[log in to unmask]>

Mon, 30 Mar 1998 16:27:56 -0500

78 lines

Re: Heavy metals

SMITH RUSSELL MSM PO US <[log in to unmask]>

Tue, 31 Mar 1998 01:17:00 +0200

64 lines

Re: Heavy metals

William E. Johnson <[log in to unmask]>

Mon, 30 Mar 1998 15:22:40 -0800

20 lines

New Thread

Hole Pattern Accuracy

Hole Pattern Accuracy

Blazi, Eric - LYPM <[log in to unmask]>

Fri, 13 Mar 1998 09:57:59 -0500

33 lines

New Thread

holes in aluminium

holes in aluminium

[log in to unmask]

Wed, 4 Mar 1998 06:43:57 -0800

31 lines

New Thread

hot air knife

hot air knife

radelong <[log in to unmask]>

Fri, 6 Mar 1998 08:11:00 -0500

65 lines

New Thread

How to reduce Kirkendall void?

How to reduce Kirkendall void?

Yuen, Mike <[log in to unmask]>

Mon, 16 Mar 1998 15:08:00 CST

29 lines

Re: How to reduce Kirkendall void?

David Anderson <[log in to unmask]>

Tue, 17 Mar 1998 18:24:17 -0600

55 lines

Re: How to reduce Kirkendall void?

David D Hillman <[log in to unmask]>

Wed, 18 Mar 1998 07:32:26 -0600

72 lines

New Thread

Immersion Gold

Immersion Gold

Arlene Infante <[log in to unmask]>

Tue, 17 Mar 1998 15:38:15 -0800

27 lines

Re: Immersion Gold

Paul Klasek <[log in to unmask]>

Wed, 18 Mar 1998 15:40:27 +1100

61 lines

Re: Immersion Gold

Hint pwb1 <[log in to unmask]>

Wed, 18 Mar 1998 15:16:12 EST

31 lines

New Thread

Immersion Gold -Reply

Re: Immersion Gold -Reply

Arlene Infante <[log in to unmask]>

Wed, 18 Mar 1998 07:01:01 -0800

80 lines

New Thread

Immersion Gold -Reply - Reliabillity Test [joints]

Re: Immersion Gold -Reply - Reliabillity Test [joints]

Paul Klasek <[log in to unmask]>

Thu, 19 Mar 1998 10:29:06 +1100

147 lines

New Thread

Immersion gold on flexible circuits

Immersion gold on flexible circuits

[log in to unmask]

Mon, 16 Mar 1998 17:33:20 -0500

25 lines

Re: Immersion gold on flexible circuits

Jean Connick <[log in to unmask]>

Tue, 17 Mar 1998 16:10:02 -0800

56 lines

Re: Immersion gold on flexible circuits

SGriggsy <[log in to unmask]>

Wed, 18 Mar 1998 11:41:07 EST

34 lines

New Thread

IMMERSION NICKEL GOLD SPECS

IMMERSION NICKEL GOLD SPECS

Alan.guttridge <[log in to unmask]>

Mon, 23 Mar 1998 20:27:25 -0000

28 lines

New Thread

IMPEDANCE vs DK/Er vs Frequency

IMPEDANCE vs DK/Er vs Frequency

Joseph E. J. Duclos Jr. <[log in to unmask]>

Mon, 9 Mar 1998 18:15:43 -0500

45 lines

Re: IMPEDANCE vs DK/Er vs Frequency

Lwallig <[log in to unmask]>

Mon, 9 Mar 1998 18:32:52 EST

28 lines

Re: IMPEDANCE vs DK/Er vs Frequency

Lwallig <[log in to unmask]>

Mon, 9 Mar 1998 18:37:13 EST

32 lines

Re: IMPEDANCE vs DK/Er vs Frequency

Stewart, Dougal <[log in to unmask]>

Tue, 10 Mar 1998 09:21:53 -0000

89 lines

Re: IMPEDANCE vs DK/Er vs Frequency

Leslie O. Connally <[log in to unmask]>

Wed, 11 Mar 1998 08:52:32 -0800

81 lines

New Thread

Incircuit testing low residue cca's

Incircuit testing low residue cca's

Simonson, Tom (MN51) <[log in to unmask]>

Tue, 31 Mar 1998 11:41:48 -0600

38 lines

Re: Incircuit testing low residue cca's

Hamilton, Richard -4454 <[log in to unmask]>

Tue, 31 Mar 1998 12:06:44 -0700

83 lines

New Thread

Information about laminate type

Information about laminate type

Tomer_2 <[log in to unmask]>

Mon, 16 Mar 1998 10:12:16 +0000

70 lines

Information about laminate type

Tomer_2 <[log in to unmask]>

Mon, 16 Mar 1998 11:55:02 +0000

70 lines

Re: Information about laminate type

JB <[log in to unmask]>

Tue, 17 Mar 1998 16:15:07 +0800

69 lines

New Thread

Ink marking & Copper thickness device

Ink marking & Copper thickness device

Mark Betterly <[log in to unmask]>

Wed, 18 Mar 1998 10:57:27 -0500

28 lines

New Thread

Innerlayers cleaning

Innerlayers cleaning

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 11 Mar 1998 10:22:23 +0200

35 lines

Re: Innerlayers cleaning

Stewart, Dougal <[log in to unmask]>

Wed, 11 Mar 1998 08:51:18 -0000

70 lines

Re: Innerlayers cleaning

Htter Simon <[log in to unmask]>

Wed, 11 Mar 1998 13:14:35 -0000

49 lines

New Thread

Innerlayers cleaning-reply

Innerlayers cleaning-reply

Paul Gould <[log in to unmask]>

Thu, 12 Mar 1998 14:56:21 +0000

44 lines

New Thread

Internet Message

Internet Message

SUN COAST SUPPLY <[log in to unmask]>

Tue, 17 Mar 1998 11:01:54 -0500

21 lines

New Thread

Interpretation help on SEM analysis done on PCBA

Interpretation help on SEM analysis done on PCBA

Ken Patel <[log in to unmask]>

Tue, 3 Mar 1998 17:04:05 -0800

42 lines

Re: Interpretation help on SEM analysis done on PCBA

JSSallo <[log in to unmask]>

Wed, 4 Mar 1998 02:01:14 EST

28 lines

Re: Interpretation help on SEM analysis done on PCBA

Ted Stern <[log in to unmask]>

Wed, 4 Mar 1998 08:19:44 -0800

72 lines

New Thread

IPC Benchmark Studies

IPC Benchmark Studies

Stephanie Kaplan <[log in to unmask]>

Mon, 9 Mar 1998 14:19:05 -0600

73 lines

New Thread

IPC chat session

IPC chat session

Mitch Morey <[log in to unmask]>

Mon, 2 Mar 1998 14:21:22 -0800

85 lines

New Thread

IPC standard

IPC standard

Anna Björk <[log in to unmask]>

Tue, 31 Mar 1998 10:25:56 +0200

38 lines

Re: IPC standard

Htter Simon <[log in to unmask]>

Tue, 31 Mar 1998 10:34:11 +0100

53 lines

Re: IPC standard

Robisan1 <[log in to unmask]>

Tue, 31 Mar 1998 09:56:24 EST

42 lines

New Thread

IPC-A-610 Questions?

IPC-A-610 Questions?

Sean Hager <[log in to unmask]>

Tue, 17 Mar 1998 16:18:48 -0800

64 lines

Re: IPC-A-610 Questions?

Muller, Mary <[log in to unmask]>

Tue, 17 Mar 1998 16:42:44 -0800

107 lines

Re: IPC-A-610 Questions?

Jack Crawford <[log in to unmask]>

Tue, 17 Mar 1998 19:08:06 -0600

123 lines

Re: IPC-A-610 Questions?

Sean Hager <[log in to unmask]>

Tue, 17 Mar 1998 18:27:48 -0800

24 lines

New Thread

IPC-A-610B

IPC-A-610B

Ardell Tweed <[log in to unmask]>

Tue, 17 Mar 1998 17:08:58 -0600

29 lines

New Thread

IPC-D-275 Coupon A

IPC-D-275 Coupon A

Byrns Nancy <[log in to unmask]>

Tue, 24 Mar 1998 12:58:54 -0500

33 lines

Re: IPC-D-275 Coupon A

SABowles <[log in to unmask]>

Wed, 25 Mar 1998 08:19:11 EST

28 lines

New Thread

IPC-D-356 testing

IPC-D-356 testing

Jim Bauer <[log in to unmask]>

Fri, 27 Mar 1998 15:04:09 -0600

33 lines

Re: IPC-D-356 testing

Mike Holmes x4356 <[log in to unmask]>

Mon, 30 Mar 1998 07:51:06 -0500

54 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Wed, 18 Mar 1998 17:44:28 -0800

47 lines

IPCchat session announcement

[log in to unmask]

Sun, 22 Mar 1998 20:04:08 -0800

47 lines

New Thread

J-001B Question Response.

J-001B Question Response.

WILLIAM G KENYON 302-652-4272 <[log in to unmask]>

Fri, 20 Mar 1998 10:19:41 -0500

74 lines

New Thread

J-STD-001B Question

J-STD-001B Question

Letteri, Maryanne E (FL51) <[log in to unmask]>

Thu, 19 Mar 1998 13:50:39 -0500

46 lines

Re: J-STD-001B Question

Maguire, James F <[log in to unmask]>

Mon, 23 Mar 1998 10:16:50 -0800

91 lines

New Thread

Justification For Environmental Controls

Justification For Environmental Controls

Timothy W. Tuttle <[log in to unmask]>

Tue, 17 Mar 1998 14:14:48 -0500

47 lines

Re: Justification For Environmental Controls

MCCOX94 <[log in to unmask]>

Tue, 17 Mar 1998 14:48:44 EST

39 lines

Re: Justification For Environmental Controls

Jim Marsico 516-595-5879 <[log in to unmask]>

Tue, 17 Mar 1998 15:38:00 -0400

24 lines

New Thread

Kester OSP

Kester OSP

Matthew Park <[log in to unmask]>

Wed, 11 Mar 1998 11:12:04 -0800

33 lines

Re: Kester OSP

Mike Barmuta <[log in to unmask]>

Wed, 11 Mar 1998 14:39:47 -0800

99 lines

Re: Kester OSP

HGross1029 <[log in to unmask]>

Thu, 12 Mar 1998 13:00:53 EST

30 lines

Re: Kester OSP

Michael Carano <[log in to unmask]>

Sat, 14 Mar 1998 08:05:19 -0800

63 lines

New Thread

l. (was Re: [TN] Innerlayers cleaning)

l. (was Re: [TN] Innerlayers cleaning)

Peter Mariani <[log in to unmask]>

Wed, 11 Mar 1998 12:19:16 -0500

99 lines

New Thread

Land Pattern and Component Modeling

Land Pattern and Component Modeling

Anthony Bundrant <[log in to unmask]>

Thu, 26 Mar 1998 09:53:29 -0500

39 lines

Re: Land Pattern and Component Modeling

Brant R. McClelland <[log in to unmask]>

Thu, 26 Mar 1998 09:29:02 -0600

74 lines

Re: Land Pattern and Component Modeling

JoAnn Amerson <[log in to unmask]>

Thu, 26 Mar 1998 10:24:13 +0000

50 lines

Re: Land Pattern and Component Modeling

SteveZeva <[log in to unmask]>

Thu, 26 Mar 1998 13:28:55 EST

36 lines

Re: Land Pattern and Component Modeling

Jim Bauer <[log in to unmask]>

Thu, 26 Mar 1998 12:45:58 -0600

61 lines

Re: Land Pattern and Component Modeling

Brant R. McClelland <[log in to unmask]>

Thu, 26 Mar 1998 13:25:03 -0600

74 lines

Re: Land Pattern and Component Modeling

Jeff Seeger <[log in to unmask]>

Thu, 26 Mar 1998 14:34:08 -0500

43 lines

New Thread

Land Patterns, Geometries for Mentor Graphics

Land Patterns, Geometries for Mentor Graphics

Hurst, Joe <[log in to unmask]>

Fri, 20 Mar 1998 15:35:00 -0500

34 lines

New Thread

Laser Solder Ball bumping

Laser Solder Ball bumping

<Gareth Jones> <[log in to unmask]>

Mon, 23 Mar 1998 16:22:32 +0000

43 lines

Re: Laser Solder Ball bumping

Achim Neu <[log in to unmask]>

Tue, 24 Mar 1998 19:54:12 +0100

64 lines

New Thread

Lawrence R Blumberg/Endicott/IBM is out of the office.

Lawrence R Blumberg/Endicott/IBM is out of the office.

D01ML024/01/M/IBM <[log in to unmask]>

Thu, 5 Mar 1998 01:26:36 -0500

24 lines

New Thread

LCCC on FR4

LCCC on FR4

Tom Obarski x4286 <[log in to unmask]>

Wed, 11 Mar 1998 08:42:58 -0500

51 lines

Re: LCCC on FR4

Leslie O. Connally <[log in to unmask]>

Wed, 11 Mar 1998 08:30:46 -0800

83 lines

Re: LCCC on FR4

Matthew Park <[log in to unmask]>

Wed, 11 Mar 1998 08:35:56 -0800

85 lines

Re: LCCC on FR4

JSSallo <[log in to unmask]>

Wed, 11 Mar 1998 11:56:38 EST

36 lines

Re: LCCC on FR4

[log in to unmask]

Wed, 11 Mar 1998 23:19:52 -0800

72 lines

New Thread

lead coplanarity

lead coplanarity

Bawden, Kim <[log in to unmask]>

Thu, 19 Mar 1998 13:24:14 -0500

34 lines

Re: lead coplanarity

SteveZeva <[log in to unmask]>

Thu, 19 Mar 1998 16:30:51 EST

55 lines

New Thread

leadframe materials

leadframe materials

Jan Vercammen <[log in to unmask]>

Mon, 16 Mar 1998 15:15:50 +0100

41 lines

Re: leadframe materials

TOSTEVIN_BC <[log in to unmask]>

Tue, 17 Mar 1998 19:03:26 -0500

80 lines

Re: leadframe materials

Paul Terranova <[log in to unmask]>

Wed, 18 Mar 1998 10:10:48 -0500

94 lines

Re: leadframe materials

Kathy Palumbo <[log in to unmask]>

Wed, 18 Mar 1998 08:28:11 -0800

130 lines

Re: leadframe materials

Jack Crawford <[log in to unmask]>

Wed, 18 Mar 1998 11:30:57 -0600

152 lines

New Thread

Learning Curves

Re: Learning Curves

Kasprzak, Bill (esd) US <[log in to unmask]>

Thu, 5 Mar 1998 15:25:00 PST

51 lines

New Thread

Looking for Excimer Laser

Looking for Excimer Laser

Chin-Kwan Kim <[log in to unmask]>

Sat, 14 Mar 1998 10:32:30 +0900

29 lines

Re: Looking for Excimer Laser

Jeremy Drake <[log in to unmask]>

Sat, 14 Mar 1998 12:12:03 +0000

54 lines

New Thread

Manufacturability Data for CBGA vs PBCA

Manufacturability Data for CBGA vs PBCA

Harrington, Joseph W <[log in to unmask]>

Mon, 30 Mar 1998 07:40:13 -0800

28 lines

Re: Manufacturability Data for CBGA vs PBCA

Engelmaier <[log in to unmask]>

Tue, 31 Mar 1998 12:32:36 EST

40 lines

New Thread

MATERIAL FOR SALE !!!!GREAT PRICES!!!!!!!

MATERIAL FOR SALE !!!!GREAT PRICES!!!!!!!

Rick4952 <[log in to unmask]>

Mon, 30 Mar 1998 14:54:23 EST

37 lines

New Thread

MATERIAL SOURCE: gold/tin wire solder

MATERIAL SOURCE: gold/tin wire solder

Jack Crawford <[log in to unmask]>

Wed, 11 Mar 1998 11:39:43 -0600

27 lines

New Thread

MATERIAL SOURCE: gold/tin wire solder -Reply

MATERIAL SOURCE: gold/tin wire solder -Reply

Kamalesh Dhanashwar <[log in to unmask]>

Wed, 11 Mar 1998 13:56:22 -0500

34 lines

New Thread

Mating Tin / Gold; SIMMs and sockets

Re: Mating Tin / Gold; SIMMs and sockets

Pratap Singh <[log in to unmask]>

Sun, 1 Mar 1998 07:17:51 -0800

64 lines

New Thread

Message Content Question

Message Content Question

Hamilton, Richard -4454 <[log in to unmask]>

Fri, 20 Mar 1998 09:27:01 -0700

31 lines

Re: Message Content Question

Tenison Stone <[log in to unmask]>

Fri, 20 Mar 1998 10:57:32 -0600

64 lines

Message Content Question

Wilber E. Heath <[log in to unmask]>

Fri, 20 Mar 1998 10:42:57 -0600

22 lines

Re: Message Content Question

Kimmey, Frank <[log in to unmask]>

Fri, 20 Mar 1998 09:12:23 -0800

67 lines

Re: Message Content Question

Mauricio Castro <[log in to unmask]>

Fri, 20 Mar 1998 11:02:53 -0600

58 lines

Re: Message Content Question

Jay DeKing (EMA) <[log in to unmask]>

Fri, 20 Mar 1998 13:37:34 -0500

59 lines

Re: Message Content Question

SteveZeva <[log in to unmask]>

Fri, 20 Mar 1998 14:07:59 EST

28 lines

Re: Message Content Question

Jay DeKing (EMA) <[log in to unmask]>

Fri, 20 Mar 1998 14:17:47 -0500

41 lines

Re: Message Content Question

Hamilton, Richard -4454 <[log in to unmask]>

Fri, 20 Mar 1998 12:33:50 -0700

92 lines

Re: Message Content Question

Vivienne Kane <[log in to unmask]>

Sat, 21 Mar 1998 11:15:45 +1000

74 lines

New Thread

Message Content Question -Reply

Message Content Question -Reply

Sonia Tena <[log in to unmask]>

Fri, 20 Mar 1998 09:33:39 -0800

22 lines

New Thread

Microsection etching solution

Microsection etching solution

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 19 Mar 1998 15:11:25 +0200

29 lines

Re: Microsection etching solution

Robisan1 <[log in to unmask]>

Thu, 19 Mar 1998 09:26:54 EST

44 lines

Re: Microsection etching solution

COwEv <[log in to unmask]>

Fri, 20 Mar 1998 12:29:18 EST

31 lines

Microsection etching solution

Eltek Ltd. - Process Engineering <[log in to unmask]>

Mon, 23 Mar 1998 06:47:40 +0300

30 lines

New Thread

Microsection etching solution -Reply

Microsection etching solution -Reply

Fred Johnson <[log in to unmask]>

Thu, 19 Mar 1998 13:59:00 +0000

59 lines

Re: Microsection etching solution -Reply

Fred Johnson <[log in to unmask]>

Thu, 19 Mar 1998 14:49:57 +0000

63 lines

Microsection etching solution -Reply

Arlene Infante <[log in to unmask]>

Thu, 19 Mar 1998 07:09:45 -0800

51 lines

Re: Microsection etching solution -Reply

Fred Johnson <[log in to unmask]>

Fri, 20 Mar 1998 19:26:00 +0000

49 lines

New Thread

MIL VS IPC CROSS REF

MIL VS IPC CROSS REF

[log in to unmask]

Mon, 16 Mar 1998 16:58:43 -0500

34 lines

MIL VS IPC CROSS REF

Richard MacCutcheon <[log in to unmask]>

Mon, 16 Mar 1998 15:36:00 -0700

62 lines

Re: MIL VS IPC CROSS REF

Lisa Williams <[log in to unmask]>

Mon, 16 Mar 1998 17:04:55 -0600

58 lines

Re: MIL VS IPC CROSS REF

Robisan1 <[log in to unmask]>

Tue, 17 Mar 1998 07:52:38 EST

38 lines

New Thread

mil-c-28809 equivalent

mil-c-28809 equivalent

Mattson, Jeff <[log in to unmask]>

Fri, 27 Mar 1998 08:28:48 -0500

21 lines

Re: mil-c-28809 equivalent

Graham Naisbitt <[log in to unmask]>

Fri, 27 Mar 1998 18:32:24 -0000

67 lines

Re: mil-c-28809 equivalent

Graham Naisbitt <[log in to unmask]>

Sat, 28 Mar 1998 09:17:23 -0000

70 lines

New Thread

MIL-PRF-31032

MIL-PRF-31032

Tom Lambert <[log in to unmask]>

Fri, 27 Mar 1998 10:53:02 -0800

23 lines

New Thread

MIL-STD-171

MIL-STD-171

Steves <[log in to unmask]>

Thu, 5 Mar 1998 13:05:05 +0000

27 lines

Re: MIL-STD-171

Tom Kropski <[log in to unmask]>

Fri, 6 Mar 1998 08:07:40 -0500

54 lines

New Thread

Mixed assemblies and the 'weak knee' associated with HASL

Mixed assemblies and the 'weak knee' associated with HASL

Chan, Marcelo <[log in to unmask]>

Mon, 30 Mar 1998 14:31:20 -0500

28 lines

New Thread

More electroless nickel / gold

More electroless nickel / gold

COwEv <[log in to unmask]>

Wed, 11 Mar 1998 18:08:22 EST

62 lines

Re: More electroless nickel / gold

Robisan1 <[log in to unmask]>

Thu, 12 Mar 1998 10:30:21 EST

40 lines

New Thread

Mound Flexible Circuits Closes 3/13/98

Mound Flexible Circuits Closes 3/13/98

Andy Magee <[log in to unmask]>

Tue, 17 Mar 1998 08:39:17 -0500

53 lines

New Thread

Multiple Passes Through The Reflow Oven

Multiple Passes Through The Reflow Oven

Ryaby, John <[log in to unmask]>

Tue, 17 Mar 1998 09:51:06 -0500

32 lines

Re: Multiple Passes Through The Reflow Oven

Charles Elliott <[log in to unmask]>

Tue, 17 Mar 1998 11:57:18 -0500

51 lines

New Thread

NF C20-631

NF C20-631

paul cathel <[log in to unmask]>

Fri, 13 Mar 1998 11:38:15 -0500

34 lines

New Thread

nitrogen requirements: component storage

nitrogen requirements: component storage

Collins, Graham <[log in to unmask]>

Fri, 27 Mar 1998 14:45:59 -0400

96 lines

New Thread

No Attachments on the TECHNET, Please

No Attachments on the TECHNET, Please

Jack Crawford <[log in to unmask]>

Thu, 26 Mar 1998 19:17:40 -0600

146 lines

Re: No Attachments on the TECHNET, Please

Goldman, Patricia J. <[log in to unmask]>

Fri, 27 Mar 1998 17:08:00 -0500

188 lines

New Thread

NON-THERMALLY RELEIVED VIAS

NON-THERMALLY RELEIVED VIAS

Richard G Smith <[log in to unmask]>

Mon, 2 Mar 1998 17:02:56 -0600

74 lines

Re: NON-THERMALLY RELEIVED VIAS

Robisan1 <[log in to unmask]>

Mon, 2 Mar 1998 19:57:34 EST

38 lines

New Thread

oblong lands

oblong lands

Marletta Tucker <[log in to unmask]>

Tue, 31 Mar 1998 14:13:34 -0600

38 lines

Re: oblong lands

Mark Ross <[log in to unmask]>

Tue, 31 Mar 1998 23:31:02 -0500

62 lines

Re: oblong lands

Gary Ferrari <[log in to unmask]>

Tue, 31 Mar 1998 22:27:05 -0600

67 lines

New Thread

Obsolete FR2 1.60mm 35/35 panels

Obsolete FR2 1.60mm 35/35 panels

JB <[log in to unmask]>

Tue, 17 Mar 1998 17:36:25 +0800

33 lines

New Thread

Odd Number Layup-warpage

Odd Number Layup-warpage

James A Larson <[log in to unmask]>

Tue, 24 Mar 1998 13:00:44 +0000

42 lines

Re: Odd Number Layup-warpage

Eltek Ltd. - Process Engineering <[log in to unmask]>

Wed, 25 Mar 1998 07:18:20 +0300

57 lines

Odd Number Layup-Warpage

Fred Paul <[log in to unmask]>

Wed, 25 Mar 1998 11:46:27 -0800

85 lines

Re: Odd Number Layup-warpage

David R. McGowan <[log in to unmask]>

Sun, 29 Mar 1998 14:07:57 -0500

79 lines

New Thread

oops

Re: oops

Lisa Williams <[log in to unmask]>

Mon, 16 Mar 1998 17:11:16 -0600

380 lines

Re: oops

Sheila and Donna <[log in to unmask]>

Tue, 17 Mar 1998 09:15:07 -0800

147 lines

New Thread

Organic residue in Microetch bath

Organic residue in Microetch bath

[log in to unmask]

Tue, 10 Mar 1998 10:33:04 +0800

33 lines

Re: Organic residue in Microetch bath

Desroches, Charles <[log in to unmask]>

Tue, 10 Mar 1998 09:19:41 -0500

87 lines

Re: Organic residue in Microetch bath

Michael Carano <[log in to unmask]>

Tue, 10 Mar 1998 21:48:48 -0800

56 lines

New Thread

OSP COATED BOARDS

OSP COATED BOARDS

Kathy Palumbo <[log in to unmask]>

Fri, 13 Mar 1998 14:00:07 -0800

52 lines

Re: OSP COATED BOARDS

Poulin, Michel <[log in to unmask]>

Fri, 13 Mar 1998 18:02:22 -0500

99 lines

Re: OSP COATED BOARDS

Kathy Palumbo <[log in to unmask]>

Fri, 13 Mar 1998 17:07:12 -0800

126 lines

Re: OSP COATED BOARDS

Tal-Young Kim <[log in to unmask]>

Mon, 16 Mar 1998 13:13:21 +0900

117 lines

New Thread

Pad Size

Pad Size

Darrel Therriault <[log in to unmask]>

Mon, 23 Mar 1998 12:55:19 -0800

39 lines

New Thread

PAGINA WEB

PAGINA WEB

Circuitos Impresos Profesionales S.A. <[log in to unmask]>

Mon, 2 Mar 1998 17:36:44 +0100

50 lines

Re: PAGINA WEB

Kathy Palumbo <[log in to unmask]>

Fri, 6 Mar 1998 10:13:59 -0800

61 lines

Re: PAGINA WEB

TheITMTeam <[log in to unmask]>

Fri, 6 Mar 1998 14:23:57 EST

24 lines

New Thread

Palladium

Palladium

Dudi Banitt <[log in to unmask]>

Sun, 29 Mar 1998 08:25:46 +0200

28 lines

Re: Palladium

RSedlak <[log in to unmask]>

Sun, 29 Mar 1998 05:27:19 EST

32 lines

Re: Palladium

Jana Carraway <[log in to unmask]>

Mon, 30 Mar 1998 08:05:51 PST

61 lines

Re: Palladium

RSedlak <[log in to unmask]>

Sun, 29 Mar 1998 05:27:19 EST

42 lines

New Thread

palladium joints

palladium joints

TOSTEVIN_BC <[log in to unmask]>

Mon, 30 Mar 1998 13:05:56 -0500

36 lines

New Thread

Palladium Leads

Palladium Leads

Hint pwb1 <[log in to unmask]>

Mon, 30 Mar 1998 17:49:09 EST

35 lines

New Thread

Palladium plated

Palladium plated

Hint pwb1 <[log in to unmask]>

Fri, 27 Mar 1998 17:03:44 EST

41 lines

New Thread

Palladium Plating...

Palladium Plating...

Don Fumia <[log in to unmask]>

Tue, 31 Mar 1998 08:18:21 -0500

54 lines

New Thread

Panel Thickness & Copper Weight device

Panel Thickness & Copper Weight device

Mark Betterly <[log in to unmask]>

Wed, 18 Mar 1998 11:01:42 -0500

28 lines

Re: Panel Thickness & Copper Weight device

Joel Fillion <[log in to unmask]>

Wed, 18 Mar 1998 08:49:34 -0800

52 lines

New Thread

Panelisation software

Panelisation software

Colin <[log in to unmask]>

Thu, 12 Mar 1998 10:57:50 -0600

38 lines

Re: Panelisation software

E.A. Speer <[log in to unmask]>

Thu, 12 Mar 1998 13:52:33 -0500

83 lines

New Thread

Parts Solderability (2)

Parts Solderability (2)

Eddie Brunker <[log in to unmask]>

Fri, 27 Mar 1998 10:50:27 GMT

33 lines

Re: Parts Solderability (2)

Furrow, Robert Gordon (Robert) <[log in to unmask]>

Fri, 27 Mar 1998 08:24:04 -0500

69 lines

Re: Parts Solderability (2)

Rob Schetty <[log in to unmask]>

Fri, 27 Mar 1998 10:56:09 -0500

124 lines

Re: Parts Solderability (2)

SteveZeva <[log in to unmask]>

Fri, 27 Mar 1998 12:21:27 EST

77 lines

Re: Parts Solderability (2)

Bev Christian <[log in to unmask]>

Sat, 28 Mar 1998 23:25:58 -0500

67 lines

New Thread

patterning non-photoimageables

patterning non-photoimageables

Anthony Morrissey <[log in to unmask]>

Fri, 13 Mar 1998 18:50:28 +0000

36 lines

New Thread

PCB assy defect reporting criteria

PCB assy defect reporting criteria

RSIMathis <[log in to unmask]>

Thu, 19 Mar 1998 13:09:15 EST

35 lines

Re: PCB assy defect reporting criteria

MCCOX94 <[log in to unmask]>

Thu, 19 Mar 1998 13:31:34 EST

32 lines

Re: PCB assy defect reporting criteria

Connie Korth <[log in to unmask]>

Thu, 19 Mar 1998 13:08:32 CST

68 lines

Re: PCB assy defect reporting criteria

Darrel Therriault <[log in to unmask]>

Thu, 19 Mar 1998 11:19:47 -0800

69 lines

Re: PCB assy defect reporting criteria

Sean Hager <[log in to unmask]>

Thu, 19 Mar 1998 11:25:02 -0800

94 lines

Re: PCB assy defect reporting criteria

Jack Crawford <[log in to unmask]>

Thu, 19 Mar 1998 13:46:03 -0600

75 lines

Re: PCB assy defect reporting criteria

Collins, Graham <[log in to unmask]>

Thu, 19 Mar 1998 16:14:06 -0400

89 lines

New Thread

PCB assy defect reporting criteria -Reply

PCB assy defect reporting criteria -Reply

Allan Kerr <[log in to unmask]>

Thu, 19 Mar 1998 17:20:11 -0500

62 lines

New Thread

pcb fab info

pcb fab info

Matthew Park <[log in to unmask]>

Fri, 6 Mar 1998 15:01:52 -0800

26 lines

Re: pcb fab info

Lwallig <[log in to unmask]>

Fri, 6 Mar 1998 18:41:23 EST

36 lines

Re: pcb fab info

JSSallo <[log in to unmask]>

Fri, 6 Mar 1998 21:05:09 EST

30 lines

Re: pcb fab info

annie laberge <[log in to unmask]>

Mon, 9 Mar 1998 12:29:26 -0500

56 lines

New Thread

Pd plated boards

Re: Pd plated boards

Hint pwb1 <[log in to unmask]>

Mon, 30 Mar 1998 17:49:10 EST

29 lines

New Thread

Peel force problems

Peel force problems

Brad Kendall <[log in to unmask]>

Tue, 24 Mar 1998 15:13:39 -0400

57 lines

Re: Peel force problems

Steve Schrader <[log in to unmask]>

Tue, 24 Mar 1998 15:28:07 -0500

95 lines

Re: Peel force problems

SteveZeva <[log in to unmask]>

Tue, 24 Mar 1998 17:54:10 EST

56 lines

New Thread

Photoplotting

Photoplotting

Modular Components National, Inc. <[log in to unmask]>

Thu, 19 Mar 1998 13:24:38 -0500

31 lines

New Thread

Piccoli

Piccoli

[log in to unmask]

Thu, 5 Mar 1998 12:09:49 +0100

55 lines

New Thread

Plated through hole reliability

Plated through hole reliability

Miguel Gonzalez M. <[log in to unmask]>

Wed, 4 Mar 1998 20:25:44 -0600

39 lines

New Thread

Plating ?

Plating ?

Zachery D Boettcher <[log in to unmask]>

Fri, 20 Mar 1998 05:14:11 +0000

40 lines

New Thread

Plating Effects on Current Distribution

Plating Effects on Current Distribution

Valerie Webber <[log in to unmask]>

Fri, 13 Mar 1998 09:29:57 -0600

46 lines

Re: Plating Effects on Current Distribution

Doug McKean <[log in to unmask]>

Tue, 17 Mar 1998 12:45:15 -0500

135 lines

New Thread

PLATING FIBER

PLATING FIBER

John Portoghese <[log in to unmask]>

Fri, 27 Mar 1998 08:56:00 -0800

23 lines

Re: PLATING FIBER

David Anderson <[log in to unmask]>

Fri, 27 Mar 1998 16:27:35 -0600

50 lines

Re: PLATING FIBER

David R. McGowan <[log in to unmask]>

Fri, 27 Mar 1998 19:04:29 -0500

50 lines

New Thread

Plating thin, less than .005", via layers

Plating thin, less than .005", via layers

Henry Coulter <[log in to unmask]>

Wed, 25 Mar 1998 10:21:31 -0700

27 lines

Re: Plating thin, less than .005", via layers

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 26 Mar 1998 09:24:26 +0300

38 lines

Re: Plating thin, less than .005", via layers

John Haman Jr. <[log in to unmask]>

Thu, 26 Mar 1998 07:31:28 -0500

61 lines

New Thread

Plating: Shadow Defect

Plating: Shadow Defect

Joel Fillion <[log in to unmask]>

Wed, 18 Mar 1998 15:49:46 -0800

50 lines

Re: Plating: Shadow Defect

RSedlak <[log in to unmask]>

Thu, 19 Mar 1998 11:12:54 EST

50 lines

Re: Plating: Shadow Defect

Joel Fillion <[log in to unmask]>

Thu, 19 Mar 1998 18:07:07 -0800

84 lines

New Thread

Plisters in Multilayer

Plisters in Multilayer

Moitzi Ewald <[log in to unmask]>

Mon, 30 Mar 1998 10:08:07 +0100

28 lines

Re: Plisters in Multilayer

John Haman Jr. <[log in to unmask]>

Mon, 30 Mar 1998 07:42:47 -0500

63 lines

New Thread

Plotting problems

Plotting problems

[log in to unmask]

Fri, 20 Mar 1998 07:01:25 -0800

36 lines

Re: Plotting problems

Peter Mariani <[log in to unmask]>

Fri, 20 Mar 1998 10:37:07 -0500

72 lines

New Thread

polyimide film

polyimide film

User <[log in to unmask]>

Tue, 24 Mar 1998 09:17:02 -0500

26 lines

Re: polyimide film

SABowles <[log in to unmask]>

Tue, 24 Mar 1998 11:40:55 EST

31 lines

New Thread

Post Conformal Coat Soldering

Post Conformal Coat Soldering

Kenny Bloomquist <[log in to unmask]>

Tue, 10 Mar 1998 13:06:03 -0800

55 lines

Re: Post Conformal Coat Soldering

Aric Parr <[log in to unmask]>

Wed, 11 Mar 1998 07:02:42 EST

91 lines

Re: Post Conformal Coat Soldering

[log in to unmask]

Wed, 11 Mar 1998 07:25:00 -0500

36 lines

New Thread

Press fit tooling house for PCB assembly tools

Press fit tooling house for PCB assembly tools

Valli Robert <[log in to unmask]>

Mon, 2 Mar 1998 16:49:00 -0500

46 lines

Re: Press fit tooling house for PCB assembly tools

Kathy Palumbo <[log in to unmask]>

Fri, 6 Mar 1998 10:09:48 -0800

96 lines

New Thread

press-fit connectors

press-fit connectors

Lustig, Steven K.. <[log in to unmask]>

Mon, 30 Mar 1998 11:23:00 -0500

36 lines

Re: press-fit connectors

SteveZeva <[log in to unmask]>

Mon, 30 Mar 1998 12:10:22 EST

62 lines

Re: press-fit connectors

Bev Christian <[log in to unmask]>

Mon, 30 Mar 1998 14:30:53 -0500

71 lines

Re: press-fit connectors

Paul Klasek <[log in to unmask]>

Tue, 31 Mar 1998 08:37:41 +1000

67 lines

Re: press-fit connectors

Don Fumia <[log in to unmask]>

Tue, 31 Mar 1998 07:31:33 -0500

45 lines

Re: press-fit connectors

Dwight Mattix <[log in to unmask]>

Tue, 31 Mar 1998 09:26:59 -0800

79 lines

New Thread

PTH Positional Hole Tolerance

PTH Positional Hole Tolerance

Richard G Smith <[log in to unmask]>

Fri, 13 Mar 1998 07:25:50 -0600

33 lines

Re: PTH Positional Hole Tolerance

Jay DeKing (EMA) <[log in to unmask]>

Fri, 13 Mar 1998 09:00:06 -0500

66 lines

Re: PTH Positional Hole Tolerance

JoAnn Amerson <[log in to unmask]>

Fri, 13 Mar 1998 09:34:59 +0000

37 lines

Re: PTH Positional Hole Tolerance

Ascot <[log in to unmask]>

Fri, 13 Mar 1998 10:09:50 +0000

54 lines

Re: PTH Positional Hole Tolerance

Hamilton, Richard -4454 <[log in to unmask]>

Fri, 13 Mar 1998 10:05:16 -0700

79 lines

Re: PTH Positional Hole Tolerance

Jay Soderberg <[log in to unmask]>

Mon, 16 Mar 1998 15:03:51 -0600

66 lines

New Thread

PTH Positional Hole Tolerance -Reply

PTH Positional Hole Tolerance -Reply

Larry Campbell <[log in to unmask]>

Fri, 13 Mar 1998 07:57:37 -0500

54 lines

New Thread

Pull Strengths

Re: Pull Strengths

Engelmaier <[log in to unmask]>

Thu, 5 Mar 1998 22:57:39 EST

38 lines

New Thread

Punching molds

Punching molds

Khaled Hassan Fouad <[log in to unmask]>

Sun, 22 Mar 1998 23:12:39 +0200

34 lines

Re: Punching molds

Valli Robert <[log in to unmask]>

Mon, 23 Mar 1998 06:12:00 -0500

63 lines

Re: Punching molds

Steve Collins <[log in to unmask]>

Mon, 23 Mar 1998 07:04:30 -0700

60 lines

Re: Punching molds

Ramesh <[log in to unmask]>

Mon, 30 Mar 1998 15:34:58 +0100

74 lines

New Thread

PVA equipment -Reply

Re: PVA equipment -Reply

Nicholas Kane <[log in to unmask]>

Sat, 14 Mar 1998 07:42:50 +1000

80 lines

New Thread

Quality Parameters for Wave Sold

Quality Parameters for Wave Sold

Wilber E. Heath <[log in to unmask]>

Tue, 10 Mar 1998 08:05:43 -0600

28 lines

Re: Quality Parameters for Wave Sold

Kenny Bloomquist <[log in to unmask]>

Tue, 10 Mar 1998 07:31:35 -0800

50 lines

Re: Quality Parameters for Wave Sold

Alan Kreplick <[log in to unmask]>

Tue, 10 Mar 1998 10:27:26 -0500

37 lines

Re: Quality Parameters for Wave Sold

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 11 Mar 1998 08:48:00 -0400

24 lines

New Thread

Quality Parameters for Wave Sold -Reply

Re: Quality Parameters for Wave Sold -Reply

Nick Vinardi <[log in to unmask]>

Tue, 10 Mar 1998 10:50:02 -0500

61 lines

New Thread

Re : Request for Subscriber

Re : Request for Subscriber

Simon Ho Sze Chung <[log in to unmask]>

Thu, 26 Mar 1998 14:39:10 +0800

22 lines

New Thread

Re TraceRepair

Re TraceRepair

Moffitj <[log in to unmask]>

Thu, 26 Mar 1998 10:52:46 EST

39 lines

New Thread

Re28809

Re28809

Moffitj <[log in to unmask]>

Sat, 28 Mar 1998 10:32:41 EST

31 lines

New Thread

Read: clarification of wording

Read: clarification of wording

Dave P Willhard <[log in to unmask]>

Thu, 26 Mar 1998 07:45:54 -0700

44 lines

New Thread

Reliability of Ceramic vs. Plastic IC Packages

Reliability of Ceramic vs. Plastic IC Packages

scott eder <[log in to unmask]>

Fri, 6 Mar 1998 15:08:42 -0500

43 lines

Re: Reliability of Ceramic vs. Plastic IC Packages

Rod Martens <[log in to unmask]>

Fri, 6 Mar 1998 13:42:40 -0700

76 lines

New Thread

Repair: Maximum allowable pad and jumper wires fro repair ?

Repair: Maximum allowable pad and jumper wires fro repair ?

Ken Patel <[log in to unmask]>

Thu, 26 Mar 1998 14:06:55 -0800

36 lines

Re: Repair: Maximum allowable pad and jumper wires fro repair ?

HGross1029 <[log in to unmask]>

Fri, 27 Mar 1998 08:46:21 EST

29 lines

New Thread

REQ: HOLE LOCATION TOLERANCE

REQ: HOLE LOCATION TOLERANCE

starr devere <[log in to unmask]>

Tue, 3 Mar 1998 10:50:11 -0700

30 lines

New Thread

Request for info on Crimping standards or workmanship guidelines

Request for info on Crimping standards or workmanship guidelines

TEM Escher, Gary <[log in to unmask]>

Mon, 2 Mar 1998 16:04:00 -0600

27 lines

Re: Request for info on Crimping standards or workmanship guidelines

Ralph Hersey <[log in to unmask]>

Thu, 5 Mar 1998 07:47:27 -0800

76 lines

New Thread

Response to Sam Mccorkels' question.

Re: Response to Sam Mccorkels' question.

Ed Cosper <[log in to unmask]>

Mon, 16 Mar 1998 17:05:58 -0600

54 lines

New Thread

Returned mail: User unknown

Returned mail: User unknown

Padmanabha Anandapuram Halappa <[log in to unmask]>

Tue, 10 Mar 1998 19:57:14 EST

101 lines

New Thread

revision

revision

[log in to unmask]

Fri, 13 Mar 1998 10:05:37 -0600

39 lines

New Thread

Reward!

Reward!

Lweyle <[log in to unmask]>

Sun, 15 Mar 1998 00:42:47 EST

28 lines

Re: Reward!

friday <[log in to unmask]>

Sun, 15 Mar 1998 10:13:47 -0500

26 lines

New Thread

Re[2]: [TN] Parts Solderability (2)

Re: Re[2]: [TN] Parts Solderability (2)

Eddie Brunker <[log in to unmask]>

Mon, 30 Mar 1998 11:22:38 +0100

150 lines

Re: Re[2]: [TN] Parts Solderability (2)

SteveZeva <[log in to unmask]>

Mon, 30 Mar 1998 09:49:04 EST

73 lines

Re: Re[2]: [TN] Parts Solderability (2)

Bev Christian <[log in to unmask]>

Mon, 30 Mar 1998 14:03:00 -0500

217 lines

Re: Re[2]: [TN] Parts Solderability (2)

Rob Schetty <[log in to unmask]>

Mon, 30 Mar 1998 16:14:13 -0500

258 lines

Re: Re[2]: [TN] Parts Solderability (2)

SEM Lab, Inc. <[log in to unmask]>

Tue, 31 Mar 1998 09:26:11 -0600

187 lines

New Thread

Rinsing blind/small vias

Rinsing blind/small vias

Krisher, Stacey M <[log in to unmask]>

Tue, 24 Mar 1998 14:42:00 -0500

27 lines

Re: Rinsing blind/small vias

drilbert <[log in to unmask]>

Tue, 24 Mar 1998 18:55:48 -0800

49 lines

Re: Rinsing blind/small vias

RSedlak <[log in to unmask]>

Sat, 28 Mar 1998 08:50:24 EST

33 lines

New Thread

Roku-Roku Sangyo

Roku-Roku Sangyo

William E. Johnson <[log in to unmask]>

Thu, 12 Mar 1998 14:24:18 -0800

21 lines

New Thread

sales in the east and south of USA

sales in the east and south of USA

Eddy Chen <[log in to unmask]>

Sun, 15 Mar 1998 01:25:36 +0800

121 lines

New Thread

Secondary reflow during wave

Secondary reflow during wave

Jim Gryga <[log in to unmask]>

Fri, 20 Mar 1998 13:21:53 -0600

29 lines

Re: Secondary reflow during wave

ETS <[log in to unmask]>

Fri, 20 Mar 1998 11:29:58 -0800

58 lines

Re: Secondary reflow during wave

SteveZeva <[log in to unmask]>

Fri, 20 Mar 1998 18:24:10 EST

82 lines

Re: Secondary reflow during wave

Tuan300859 <[log in to unmask]>

Fri, 20 Mar 1998 20:05:33 EST

29 lines

Re: Secondary reflow during wave

Valli Robert <[log in to unmask]>

Sat, 21 Mar 1998 08:45:00 -0500

184 lines

Re: Secondary reflow during wave

Furrow, Robert Gordon (Robert) <[log in to unmask]>

Mon, 23 Mar 1998 09:50:42 -0500

73 lines

Re: Secondary reflow during wave

SteveZeva <[log in to unmask]>

Mon, 23 Mar 1998 15:45:42 EST

43 lines

New Thread

SIGNOFF Technet

SIGNOFF Technet

[log in to unmask]

Tue, 3 Mar 1998 15:45:18 -0800

32 lines

New Thread

Silicone oil environments

Silicone oil environments

Christine Cleveland <[log in to unmask]>

Tue, 10 Mar 1998 09:40:12 -0500

51 lines

Re: Silicone oil environments

Bev Christian <[log in to unmask]>

Tue, 10 Mar 1998 11:09:23 -0500

100 lines

New Thread

Silver Plating

Silver Plating

Ken Corbin <[log in to unmask]>

Sun, 15 Mar 1998 08:48:44 -0500

29 lines

New Thread

Simple Solder Mask Question

Simple Solder Mask Question

Michael Moody <[log in to unmask]>

Thu, 19 Mar 1998 14:10:00 -0600

46 lines

Re: Simple Solder Mask Question

RSIMathis <[log in to unmask]>

Thu, 19 Mar 1998 15:40:58 EST

28 lines

Re: Simple Solder Mask Question

HGross1029 <[log in to unmask]>

Thu, 19 Mar 1998 16:03:07 EST

34 lines

Re: Simple Solder Mask Question

Paul Klasek <[log in to unmask]>

Fri, 20 Mar 1998 09:25:28 +1100

103 lines

Re: Simple Solder Mask Question

Chris Wall <[log in to unmask]>

Fri, 20 Mar 1998 05:14:22 -0500

106 lines

Re: Simple Solder Mask Question

Paul Gould <[log in to unmask]>

Fri, 20 Mar 1998 20:58:16 -0000

61 lines

Re: Simple Solder Mask Question

Jack Crawford <[log in to unmask]>

Fri, 20 Mar 1998 15:18:55 -0600

36 lines

New Thread

Solder splash problem.

Solder splash problem.

Noppadol S. <[log in to unmask]>

Wed, 25 Mar 1998 11:31:25 +0700

58 lines

Re: Solder splash problem.

ETS <[log in to unmask]>

Wed, 25 Mar 1998 10:53:08 -0800

141 lines

New Thread

Solder surface tension measurements.

Solder surface tension measurements.

Papiz, Myron <[log in to unmask]>

Fri, 27 Mar 1998 12:19:00 -0800

26 lines

New Thread

Solder thief

Solder thief

Marie-Josee Lambert <[log in to unmask]>

Tue, 17 Mar 1998 11:21:17 -0500

45 lines

Re: Solder thief

Ecad technologies pvt ltd <[log in to unmask]>

Thu, 19 Mar 1998 07:49:53 +0530

73 lines

Re: Solder thief

SteveZeva <[log in to unmask]>

Thu, 19 Mar 1998 10:57:57 EST

37 lines

New Thread

Solderballs for FBGA

Solderballs for FBGA

Achim Neu <[log in to unmask]>

Tue, 17 Mar 1998 20:32:35 +0100

36 lines

New Thread

soldermask cure

soldermask cure

Mike Johnson <[log in to unmask]>

Wed, 18 Mar 1998 17:49:03 -0600

29 lines

Re: soldermask cure

Jack Crawford <[log in to unmask]>

Wed, 18 Mar 1998 18:00:39 -0600

62 lines

Re: soldermask cure

Chris Wall <[log in to unmask]>

Fri, 20 Mar 1998 05:14:21 -0500

90 lines

Re: soldermask cure

LJFISHER <[log in to unmask]>

Sun, 22 Mar 1998 02:08:22 EST

54 lines

Re: soldermask cure

Nelson, John <[log in to unmask]>

Mon, 23 Mar 1998 07:48:44 -0500

47 lines

New Thread

Soldermask Lamination

Soldermask Lamination

Achim Neu <[log in to unmask]>

Tue, 17 Mar 1998 20:37:14 +0100

34 lines

New Thread

Specs for Wire Crimping

Specs for Wire Crimping

[log in to unmask]

Thu, 26 Mar 1998 15:39:28 -0800

31 lines

Re: Specs for Wire Crimping

Jack Crawford <[log in to unmask]>

Thu, 26 Mar 1998 19:07:45 -0600

70 lines

New Thread

standard

standard

Victor Ezerski <[log in to unmask]>

Fri, 20 Mar 1998 11:16:13 -0500

52 lines

Re: standard

Jay DeKing (EMA) <[log in to unmask]>

Fri, 20 Mar 1998 13:51:44 -0500

94 lines

New Thread

Stencil homogeneity

Stencil homogeneity

Eddie Brunker <[log in to unmask]>

Thu, 12 Mar 1998 10:32:14 GMT

28 lines

Re: Stencil homogeneity

Brad Vanderhoof <[log in to unmask]>

Thu, 12 Mar 1998 02:55:31 PST

59 lines

New Thread

Subj: Solid Solder Deposit Technology

Subj: Solid Solder Deposit Technology

Ron Hollandsworth <[log in to unmask]>

Thu, 12 Mar 1998 09:11:41 -0500

59 lines

Re: Subj: Solid Solder Deposit Technology

Paul Klasek <[log in to unmask]>

Fri, 13 Mar 1998 11:56:12 +1100

141 lines

New Thread

Subscribe< >

Subscribe< >

Bill Garbis <[log in to unmask]>

Fri, 13 Mar 1998 18:07:25 +0000

25 lines

New Thread

Surface Mount Equipment

Surface Mount Equipment

Chris M Ellis <[log in to unmask]>

Wed, 18 Mar 1998 13:40:21 -0700

41 lines

Re: Surface Mount Equipment

Jack Crawford <[log in to unmask]>

Wed, 18 Mar 1998 17:30:47 -0600

64 lines

New Thread

TAB Technology

TAB Technology

Roel A. Robles <[log in to unmask]>

Tue, 31 Mar 1998 11:14:44 +0000

35 lines

New Thread

TAHNKS

TAHNKS

Wilber E. Heath <[log in to unmask]>

Fri, 13 Mar 1998 09:27:17 -0600

27 lines

Re: TAHNKS

Lepsche, Thomas G (NM75) <[log in to unmask]>

Fri, 13 Mar 1998 11:17:17 -0700

56 lines

New Thread

Temp/freq dependancy upon diel const & diss fact

Temp/freq dependancy upon diel const & diss fact

Martin Valfridsson <[log in to unmask]>

Wed, 4 Mar 1998 10:12:20 +0100

37 lines

Re: Temp/freq dependancy upon diel const & diss fact

FRANCEYJ <[log in to unmask]>

Wed, 4 Mar 1998 05:44:30 EST

31 lines

New Thread

tenting via's

Re: tenting via's

Kathy Palumbo <[log in to unmask]>

Wed, 18 Mar 1998 08:25:38 -0800

65 lines

New Thread

tenting vias

tenting vias

Ron Payne <[log in to unmask]>

Wed, 18 Mar 1998 07:58:45 -0800

28 lines

Re: tenting vias

Mitch Morey <[log in to unmask]>

Wed, 18 Mar 1998 08:31:58 -0800

81 lines

Re: tenting vias

Mauricio Castro <[log in to unmask]>

Wed, 18 Mar 1998 14:42:03 -0600

57 lines

New Thread

Test Equipment Compatability

Test Equipment Compatability

[log in to unmask]

Thu, 5 Mar 1998 14:54:54 -0600

40 lines

Re: Test Equipment Compatability

Josh Moody <[log in to unmask]>

Thu, 5 Mar 1998 15:15:28 -0600

77 lines

New Thread

Test, please ignore

Re: Test, please ignore

SBarmash <[log in to unmask]>

Wed, 25 Mar 1998 18:56:18 EST

23 lines

New Thread

The National Legal Video Association-survey

The National Legal Video Association-survey

[log in to unmask]

Thu, 5 Mar 1998 21:12:20 -0800

27 lines

Re: The National Legal Video Association-survey

Jack Crawford <[log in to unmask]>

Thu, 5 Mar 1998 22:58:22 -0600

60 lines

New Thread

Thermal Clad Laminate

Thermal Clad Laminate

Joshua <[log in to unmask]>

Tue, 24 Mar 1998 12:57:15 +0700

28 lines

New Thread

Thermal plane "drill/fill/drill" vendor

Thermal plane "drill/fill/drill" vendor

D'Angelo, Ken <[log in to unmask]>

Sat, 14 Mar 1998 00:21:21 -0500

35 lines

New Thread

Thermal Vias

Thermal Vias

Jana Carraway <[log in to unmask]>

Tue, 24 Mar 1998 15:27:14 PST

31 lines

Re: Thermal Vias

Leslie O. Connally <[log in to unmask]>

Wed, 25 Mar 1998 08:44:59 -0800

68 lines

Re: Thermal Vias

Jim Marsico 516-595-5879 <[log in to unmask]>

Wed, 25 Mar 1998 10:13:00 -0400

24 lines

Re: Thermal Vias

Leslie O. Connally <[log in to unmask]>

Wed, 25 Mar 1998 10:52:07 -0800

53 lines

Re: Thermal Vias

Jana Carraway <[log in to unmask]>

Wed, 25 Mar 1998 10:07:58 PST

106 lines

Re: Thermal Vias

Leslie O. Connally <[log in to unmask]>

Fri, 27 Mar 1998 08:49:08 -0800

142 lines

New Thread

Thick Au + Solder Ball -> What happens?

Thick Au + Solder Ball -> What happens?

Chin-Kwan Kim <[log in to unmask]>

Thu, 19 Mar 1998 09:51:32 +0900

28 lines

New Thread

TI 32 MM Tape

TI 32 MM Tape

Kathy Palumbo <[log in to unmask]>

Fri, 27 Mar 1998 09:13:20 -0800

43 lines

Re: TI 32 MM Tape

SteveZeva <[log in to unmask]>

Fri, 27 Mar 1998 13:48:23 EST

108 lines

New Thread

Tin-Lead Plating Composition on Device Leads

Tin-Lead Plating Composition on Device Leads

SEM Lab, Inc. <[log in to unmask]>

Tue, 3 Mar 1998 09:19:08 -0600

38 lines

Re: Tin-Lead Plating Composition on Device Leads

Rob Schetty <[log in to unmask]>

Tue, 3 Mar 1998 14:36:03 -0500

87 lines

New Thread

Tin/Lead peeling off

Tin/Lead peeling off

[log in to unmask]

Tue, 31 Mar 1998 16:00:16 +0800

37 lines

Re: Tin/Lead peeling off

RSedlak <[log in to unmask]>

Tue, 31 Mar 1998 10:11:17 EST

39 lines

Re: Tin/Lead peeling off

Miscantor <[log in to unmask]>

Tue, 31 Mar 1998 16:27:39 EST

47 lines

Re: Tin/Lead peeling off

Hans Rohr <[log in to unmask]>

Tue, 31 Mar 1998 20:38:56 -0500

52 lines

New Thread

TN:(ASSY) Palladium Plating...

TN:(ASSY) Palladium Plating...

SteveZeva <[log in to unmask]>

Mon, 30 Mar 1998 18:36:49 EST

60 lines

New Thread

Torque Specs

Torque Specs

Darrel Therriault <[log in to unmask]>

Mon, 30 Mar 1998 16:13:15 -0800

38 lines

Re: Torque Specs

drilbert <[log in to unmask]>

Mon, 30 Mar 1998 20:06:26 -0800

57 lines

Re: Torque Specs

Case, Jeff <[log in to unmask]>

Mon, 30 Mar 1998 22:30:33 -0700

70 lines

New Thread

TRAINING

TRAINING

B.R. SHASHIRAJ <[log in to unmask]>

Tue, 3 Mar 1998 13:35:43 +0500

46 lines

New Thread

UNSUBSCRIBE

UNSUBSCRIBE

Lenny Kurup <[log in to unmask]>

Thu, 5 Mar 1998 13:01:33 -0500

21 lines

New Thread

URGENT!!!!!! Residues after Reflow

URGENT!!!!!! Residues after Reflow

Ruben Irizarry <[log in to unmask]>

Tue, 10 Mar 1998 14:22:31 -0700

33 lines

Re: URGENT!!!!!! Residues after Reflow

SteveZeva <[log in to unmask]>

Tue, 10 Mar 1998 13:41:35 EST

29 lines

Re: URGENT!!!!!! Residues after Reflow

TheITMTeam <[log in to unmask]>

Tue, 10 Mar 1998 17:16:56 EST

48 lines

New Thread

Vias filled with solder for ICT testing

Vias filled with solder for ICT testing

MICHAEL DODSON <[log in to unmask]>

Mon, 9 Mar 1998 16:41:26 +0000

40 lines

Re: Vias filled with solder for ICT testing

Hamilton, Richard -4454 <[log in to unmask]>

Tue, 10 Mar 1998 10:01:20 -0700

76 lines

Re: Vias filled with solder for ICT testing

JGibdozer <[log in to unmask]>

Tue, 10 Mar 1998 12:20:16 EST

32 lines

Re: Vias filled with solder for ICT testing

Leslie O. Connally <[log in to unmask]>

Wed, 11 Mar 1998 08:39:49 -0800

72 lines

New Thread

VIAS IN SMT PADS

VIAS IN SMT PADS

Barry Darnell <[log in to unmask]>

Fri, 20 Mar 1998 11:18:31 -0500

34 lines

New Thread

Wafter Diceing Water Req.

Wafter Diceing Water Req.

David D Hillman <[log in to unmask]>

Mon, 9 Mar 1998 08:24:45 -0600

30 lines

Re: Wafter Diceing Water Req.

Mike Masters <[log in to unmask]>

Mon, 9 Mar 1998 10:06:45 -0500

68 lines

Re: Wafter Diceing Water Req.

Jeremy Drake <[log in to unmask]>

Mon, 9 Mar 1998 15:09:13 +0000

49 lines

New Thread

Wave Solder Optimizer Contact

Wave Solder Optimizer Contact

Ron Hollandsworth <[log in to unmask]>

Mon, 16 Mar 1998 09:28:32 -0500

45 lines

New Thread

Wavesoldering Pallets

Wavesoldering Pallets

Mark Warycka <[log in to unmask]>

Sat, 21 Mar 1998 20:45:17 -0500

37 lines

Re: Wavesoldering Pallets

Aric Parr <[log in to unmask]>

Mon, 23 Mar 1998 07:45:38 EST

63 lines

New Thread

What is FR404?

What is FR404?

JB <[log in to unmask]>

Thu, 12 Mar 1998 10:40:41 +0800

35 lines